CN203596350U - Bar-shaped LED module structure - Google Patents
Bar-shaped LED module structure Download PDFInfo
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- CN203596350U CN203596350U CN201320747043.7U CN201320747043U CN203596350U CN 203596350 U CN203596350 U CN 203596350U CN 201320747043 U CN201320747043 U CN 201320747043U CN 203596350 U CN203596350 U CN 203596350U
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- bar
- substrate
- led module
- led chip
- shaped led
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Abstract
The utility model belongs to the LED lighting field and relates to a bar-shaped LED module structure which is characterized by comprising an elongated substrate with a flat upper surface; LED chips fixed on the upper surface; connectors in connection with the electrodes of the LED chips to connect the LED chips to form a complete load loop; and a fluorescent layer cooperatively arranged on the upper surface of the substrate and covering the LED chips and the connectors, wherein the cross section of the long side edge of the upper surface of the substrate is a circular bead. The bar-shaped LED module structure possesses the characteristics of rapid moulding and a complete lighting light output function. The circular bead allows the fluorescent layer to be limited in the edge on the upper surface by means of self tension in spraying moudling, hereby avoiding irregular shapes and nonuniform shiners caused by outflow of the fluorescent layer. The bar-shaped LED module structure is especially suitable for the rapid painting process and guarantees moulding high efficiency.
Description
Technical field
The utility model relates to the parts of LED lighting field, specifically a kind of structure of bar-shaped LED module.
Background technology
LED has started to popularize in lighting field, and the good performance of its high-luminous-efficiency, Mechanical Reliability, safe spectrum etc. makes the light fixture of a large amount of LED light sources start to substitute the light fixture of conventional incandescent, fluorescent lamp manufacture.But LED still has its defect in this class light fixture, one of them obvious problem is that the luminous volume of LED is little, single light source luminous flux is low, therefore in the time needing the light fixture of enough luminous fluxes, must need multiple LED light source dense distribution on substrate, occupy the light-emitting area of certain area, could obtain the large area light emitting effect of similar conventional light source.
Wherein having the common type of a class is exactly the LED light fixture for substituting elongate tubular fluorescent lighting fixture, and its LED light source often dense distribution, on strip LED module, is simulated the luminous shape of long tube.Consider the luminous flux that long-tube fluorescent lamp tool is larger, the quantity of its LED light source is more.Traditional mode adopts the modes such as the LED light source particle SMT technique of many encapsulation to be welded on rectangular substrate, to form LED module.This method light efficiency is low, radiating effect is bad, and cannot omit single led packaging cost, and process velocity is slow.
Utility model content
Low for existing strip LED module light efficiency, radiating effect is bad, the defect that process velocity is slow, single package cost is high, the utility model proposes a kind of structure of bar-shaped LED module, its technical scheme is as follows:
A structure for bar-shaped LED module, it comprises:
Substrate, strip, has a smooth upper surface;
LED chip, is fixed on described upper surface;
Connector, is connected in the electrode of described LED chip, and this LED chip is connected to complete load circuit; And
Fluorescence coating, is matched with the upper surface of described substrate, covers described LED chip and connector;
Wherein, its long limit edge cross section of the upper surface of described substrate is fillet.
As the improvement of this programme, can there is following embodiment:
In preferred embodiment, described substrate is single layer structure.
In preferred embodiment, described connector form is the nation's alignment that is connected across this LED chip, and its part between described LED chip is suspended on described upper surface.
In preferred embodiment, its long limit marginal texture of the upper surface of described substrate is stamping forming contraction marginal texture.
In preferred embodiment, the upper surface of described substrate also has the enclosure wall colloid of this fluorescence coating length of constraint in the end positions of its length direction, and this enclosure wall colloid runs through the Width of this upper surface, is matched with this upper surface.
The beneficial effect that this programme brings has:
1. have the feature of rapid shaping, LED module has complete illumination light output function.The form of fillet makes fluorescence coating in the time of spray mo(u)lding, rely on self tension force to be limited in the edge of upper surface, prevent fluorescence coating because overflow the inhomogeneous situation of out-of-shape, luminous element causing, be particularly suitable for the technique of brushing fast, ensured the high efficiency of module moulding.
2. this structure level is few, and thermally conductive pathways is short, can obtain higher light efficiency and good radiating effect, has omitted the single package requirement of LED chip, provides cost savings.、
Accompanying drawing explanation
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail:
Fig. 1 is the schematic top plan view of the utility model one embodiment;
Fig. 2 is the cross-sectional schematic of AA part in Fig. 1;
Fig. 3 is the cross-sectional schematic of BB part in Fig. 1.
Embodiment
As shown in Figure 1 to Figure 3, the schematic diagram of the utility model one embodiment;
The structure of a kind of bar-shaped LED module of this programme, it comprises the substrate 10 of a strip, this substrate 10 is entire body metal material, has good heat conduction and reflecting effect.It has a smooth upper surface 12; On upper surface 12, be fixed with LED chip 20, there is insulating cement 21 between the two.
Upward, connector 30 is connected in the electrode of each LED chip 20 to the electrode part of LED chip 20, according to the demand of its series and parallel, this LED chip 20 is connected to complete load circuit.Upper surface 12 at whole substrate 10 is combined with one deck fluorescence coating 50, and this fluorescence coating 50 has covered LED chip 20 and connector 30.Especially, be fillet 11 in upper surface 12 its long limit edge cross section of substrate 10.
This programme has the feature of rapid shaping, and the substrate 10 that first LED chip 20 is directly mounted on conductive and heat-conductive has just completed its setting of fixing and dispelling the heat; Then connector 30 makes all LED chips 20 complete electrical connection, complete load circuit; Last fluorescence coating 50 covers the processing that completes optics and spectrum aspect thereon, makes this LED module have complete illumination light output function.The form of fillet 11 makes fluorescence coating 50 in the time of spray mo(u)lding, rely on self tension force to be limited in the edge of upper surface 12, prevent fluorescence coating 50 because overflow the inhomogeneous situation of out-of-shape, luminous element causing, be particularly suitable for the technique of brushing fast, ensured the high efficiency of module moulding.On the other hand, this structure level is few, and thermally conductive pathways is short, can obtain higher light efficiency and good radiating effect, has omitted the single package requirement of LED chip 20, provides cost savings.
This programme also has some other feature:
The structure that substrate 10 is single-layer metal.Further cut down cost and the structure of substrate 10, its heat-conducting effect, mechanical strength etc. are guaranteed.Connector 30 forms are the nation's alignment that is connected across this LED chip 20, its part between LED chip 20 is suspended on upper surface 12, this structure further shortens the moulding process time of whole module, because can realizing quick routing with routing device, the electrical connections of LED chip 20 connects, coordinate the overall brushing technique of fluorescence coating 50, large area moulding module at short notice, has the advantage of batch production.
Consider the shaping speed of fillet 11, upper surface 12 its long limit marginal textures of substrate 10 are stamping forming contraction marginal texture, be that substrate 10 its diel in the time of moulding is punch forming from top to down, its fillet 11 is plastic, this shape does not need polishing, for the shape that substrate 10 upper surface 12 edges shrink, high conformity.
At the upper surface 12 of substrate 10, the end positions of its length direction also has the enclosure wall colloid 60 of these fluorescence coating 50 length of constraint, this enclosure wall colloid 60 runs through the Width of this upper surface 12, be matched with this upper surface, coordinate above-mentioned edge, whole upper surface 12 is to the constrained effect of fluorescence coating tool, therefore, and the high conformity of fluorescence coating 50 moulding in the time simultaneously producing in enormous quantities.
The above, it is only the utility model preferred embodiment, therefore can not limit according to this scope that the utility model is implemented, the equivalence of doing according to the utility model the scope of the claims and description changes and modifies, and all should still belong in the scope that the utility model contains.
Claims (5)
1. a structure for bar-shaped LED module, is characterized in that: it comprises:
Substrate, strip, has a smooth upper surface;
LED chip, is fixed on described upper surface;
Connector, is connected in the electrode of described LED chip, and this LED chip is connected to complete load circuit; And
Fluorescence coating, is matched with the upper surface of described substrate, covers described LED chip and connector;
Wherein, its long limit edge cross section of the upper surface of described substrate is fillet.
2. a kind of structure of bar-shaped LED module according to claim 1, is characterized in that: described substrate is single layer structure.
3. a kind of structure of bar-shaped LED module according to claim 1, is characterized in that: described connector form is the nation's alignment that is connected across this LED chip, and its part between described LED chip is suspended on described upper surface.
4. according to the structure of a kind of bar-shaped LED module described in claim 1 or 2 or 3, it is characterized in that: its long limit marginal texture of the upper surface of described substrate is stamping forming contraction marginal texture.
5. a kind of structure of bar-shaped LED module according to claim 4, it is characterized in that: the upper surface of described substrate also has the enclosure wall colloid of this fluorescence coating length of constraint in the end positions of its length direction, this enclosure wall colloid runs through the Width of this upper surface, is matched with this upper surface.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320747043.7U CN203596350U (en) | 2013-11-21 | 2013-11-21 | Bar-shaped LED module structure |
PCT/CN2014/091581 WO2015074551A1 (en) | 2013-11-21 | 2014-11-19 | Led module structure, and manufacturing process for led module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320747043.7U CN203596350U (en) | 2013-11-21 | 2013-11-21 | Bar-shaped LED module structure |
Publications (1)
Publication Number | Publication Date |
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CN203596350U true CN203596350U (en) | 2014-05-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201320747043.7U Expired - Fee Related CN203596350U (en) | 2013-11-21 | 2013-11-21 | Bar-shaped LED module structure |
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CN (1) | CN203596350U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015074551A1 (en) * | 2013-11-21 | 2015-05-28 | 何文铭 | Led module structure, and manufacturing process for led module |
-
2013
- 2013-11-21 CN CN201320747043.7U patent/CN203596350U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015074551A1 (en) * | 2013-11-21 | 2015-05-28 | 何文铭 | Led module structure, and manufacturing process for led module |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140514 Termination date: 20161121 |
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CF01 | Termination of patent right due to non-payment of annual fee |