TW201531645A - Light-emitting device and method of making the same - Google Patents

Abstract

A method of making a light-emitting device comprises: providing a plurality of physically separated supports; providing a first light-emitting unit and a second light-emitting unit respectively mounting on the supports; and changing a relative position between the first light-emitting unit and the second light-emitting unit such that the first light-emitting unit and the second light-emitting unit are substantially not arranged along a line.

Description

Light emitting device and method of manufacturing same

The present invention relates to a method of fabricating a light emitting device.

Light-emitting diode (LED) has good photoelectric characteristics such as low energy consumption, low heat generation, long operating life, shock resistance, small volume, fast response speed, and stable wavelength of output light, so the light-emitting diode is slowly Replace the traditional lighting products. With the development of optoelectronic technology, solid-state lighting has made significant progress in lighting efficiency, operating life and brightness. Therefore, in recent years, light-emitting diodes have been applied to general household lighting. At present, the cost of a light-emitting diode bulb is still higher than that of a conventional incandescent light bulb, and how to reduce the manufacturing cost of the light-emitting diode bulb is still an important issue.

Accordingly, the present invention is directed to a method of fabricating a light emitting device.

A method for manufacturing a light-emitting device, comprising: providing a plurality of physically separated support bodies; providing a first light-emitting element and a second light-emitting element, respectively, being fixed on the support; and changing the first light-emitting element and the second light-emitting The relative positions of the elements are such that the first illuminating element and the second illuminating element are not substantially in line.

The above and other objects, features, and advantages of the present invention will become more apparent and understood.

10, 21‧‧‧ Vehicles

100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100‧‧‧ illuminating devices

101‧‧‧Support bracket

102, 102A, 102B, 102C, 102D‧‧‧ extended bracket

1021‧‧‧First area

1022‧‧‧Second area

1023‧‧‧ hole

1025‧‧‧Contact section

103‧‧‧Connecting bracket

104‧‧‧ intermediate bracket

11‧‧‧First lighting group

12‧‧‧Second lighting group

111, 111A, 121, 121A‧‧‧ lighting unit

20, 20A, 20B, 20C, 20D, 20E, 20F‧‧‧ light-emitting elements

201, 7000‧‧‧ substrate

202‧‧‧Lighting unit

2021, 7001‧‧‧ first type semiconductor layer

2022, 7002‧‧‧ active layer

2023, 7003‧‧‧ second type semiconductor layer

203‧‧‧electrode pad

204‧‧‧Electrical connection structure

205‧‧‧Insulation structure

221‧‧‧ patterned seed layer

2211‧‧‧First area

2212‧‧‧Second area

2213‧‧‧ Third Area

222‧‧‧ patterned metal layer

222A, 222B‧‧‧ metal layer

2221‧‧‧First area

2222‧‧‧Second area

2223‧‧‧ third area

211‧‧‧First Vehicle Division

2111‧‧‧ first surface

2112‧‧‧ second surface

212‧‧‧The Second Vehicle Division

2121‧‧‧ third surface

2122‧‧‧ fourth surface

23‧‧‧Electrical parts

30‧‧‧First cladding structure

301, 401‧‧ ‧ protruding parts

40‧‧‧Second cladding structure

7004‧‧‧First Conductive Department

7005‧‧‧Second Conductive Department

70041, 70051‧‧‧electrode contact surface

7006‧‧‧Protective layer

7008‧‧‧ pores

7015‧‧‧Wire structure

7024‧‧‧First enlarged electrode

7025‧‧‧Second enlarged electrode

7026‧‧‧ first transparent structure

7027‧‧‧Second transparent structure

70241, 70251, 70061, 70062‧‧‧ side

80‧‧‧Base

81‧‧‧ Groove

90, 901‧‧ ‧ lamp shell

902, 91‧‧‧ wire bracket

903‧‧‧Base

904, 92‧‧‧ electrical connectors

1A to 1D are views showing a manufacturing flow chart of a light-emitting device in the first embodiment of the present invention.

2A to 2E are views showing a manufacturing flow chart of a light-emitting device in the second embodiment of the present invention.

Fig. 2F is a view showing a light-emitting device in another embodiment of the present invention.

Fig. 2G is a view showing a light-emitting device in another embodiment of the present invention.

3A-3B are cross-sectional views showing a manufacturing process in which a light-emitting element is disposed between two extended brackets.

Fig. 3C is a cross-sectional view showing a light-emitting element disposed between two extending brackets in another embodiment of the present invention.

Fig. 3D is a cross-sectional view showing a light-emitting element disposed between two extending brackets in another embodiment of the present invention.

Fig. 3E is a cross-sectional view showing a light-emitting element disposed between two extending brackets in another embodiment of the present invention.

4A to 4B are views showing a manufacturing flow chart of a light-emitting device in a third embodiment of the present invention.

Fig. 4C is a view showing a light-emitting device in the third embodiment of the present invention.

Fig. 4D is a view showing a light-emitting device in another embodiment of the present invention.

Fig. 4E is a view showing the light-emitting device of Fig. 4D disposed in a bulb.

Fig. 5A is a view showing the light-emitting element fixed to the carrier in the fourth embodiment of the present invention.

Fig. 5B is a view showing the light-emitting element fixed to the carrier in the fifth embodiment of the present invention.

Fig. 5C is a view showing the light-emitting element fixed to the carrier in the sixth embodiment of the present invention.

Fig. 5D is a view showing a light-emitting device in a sixth embodiment of the present invention.

FIG. 6A is a view showing the light-emitting element fixed in the seventh embodiment of the present invention; Have a schematic diagram.

Fig. 6B is a view showing a light-emitting device in a seventh embodiment of the present invention.

Fig. 6C is a view showing the light-emitting device of Fig. 6B disposed in a bulb.

Figure 6D is a schematic diagram of a circuit.

Figure 6E is a schematic diagram of another circuit.

Fig. 6F is a view showing the light-emitting element of the eighth embodiment of the present invention fixed to a carrier.

Fig. 6G is a view showing the arrangement of the light-emitting device of Fig. 6F in a bulb.

7A to 7B are cross-sectional views showing a part of the manufacturing process of a light-emitting device in a ninth embodiment of the present invention.

Fig. 8 is a view showing the light-emitting element fixed to the carrier in the tenth embodiment of the present invention.

9A to 9F are cross-sectional views showing the manufacturing process of a light-emitting device in an eleventh embodiment of the present invention.

Fig. 9G shows that the light-emitting device of the eleventh embodiment is bonded to a susceptor.

Figures 10A-10C show a top view of the metal layer.

11A to 11D are cross-sectional views showing the manufacturing process of a light-emitting device in a twelfth embodiment of the present invention.

12A to 12C are cross-sectional views showing the light-emitting unit of the present invention.

The present invention will be described with reference to the drawings, in which the same or the same reference numerals are used in the drawings or the description, and in the drawings, the shape or thickness of the elements may be enlarged or reduced. It is to be noted that elements not shown or described in the figures may be in a form known to those skilled in the art.

1A to 1D are diagrams showing a light-emitting device 100 in the first embodiment of the present invention. Manufacturing flow chart. Referring to Fig. 1A, a carrier 10 and a plurality of light emitting elements 20 are provided. The carrier 10 includes a pair of support brackets 101 and a plurality of pairs of extension brackets 102, each pair of extension brackets 102 being arranged in parallel with each other and physically connected to the support brackets 101. A plurality of light-emitting elements 20 are respectively placed and fixed on each pair of extension brackets 102 and the light-emitting elements 20 have a width greater than that of the extension brackets 102. Of course, the light-emitting element 20 can have a width less than or equal to the width of the extension bracket 102, depending on the actual design application. The extension bracket 102 serves as a support to support the light emitting element 20. Referring to FIG. 1B, a first cladding structure 30 is formed on the light-emitting element 20 and the partial extension bracket 102 to completely cover and cover the light-emitting element 20. The partially extended bracket 102 is not covered or covered by the first covering structure 30 and exposed to the external environment (for example, air). Referring to FIG. 1C, a second cladding structure 40 is formed on the first cladding structure 30 and completely covers and covers the first cladding structure 30 to provide further protection (eg, water or dust). Referring to FIG. 1D, the extension bracket 102 and the support bracket 101 are separated to form the light-emitting device 100. In the present embodiment, the light emitting device 100 includes only a pair of extension brackets 102 and a light emitting element 20. It should be noted that the extension bracket 102 and the light-emitting element 20 can be adjusted according to the actual needs of the length of the light-emitting device 100. For example, the length of the light-emitting element 20 is 1 cm and when the light-emitting element 20 is disposed on the extension bracket 102, the design extension The length of the bracket 102 is such that the total length of the light-emitting device is 4 cm; or when the light-emitting element 20 is 0.5 cm, the length of the extension bracket 102 is increased so that the total length of the light-emitting device is still 4 cm; or when the light-emitting element 20 is 3 cm, the extension bracket 102 is designed. The length allows the total length of the illuminating device to be 4 cm. In one embodiment, the substrate is elongated and has a length and a width; the length is at least 10 times greater than the width. It should be noted that the total length of the above-mentioned illuminating device is 4 cm, which is only an illustration and is not intended to limit the present invention.

2A to 2D are views showing a manufacturing flow chart of a light-emitting device 200 in the second embodiment of the present invention. Referring to Figure 2A, a carrier 10 and a plurality of light-emitting elements 20 are provided. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket sets, each of which is arranged in parallel with each other and physically connected to the support brackets 101. Each of the extended bracket sets includes a plurality of extending brackets 102. The plurality of light emitting elements 20 are respectively placed between the two extending brackets 102 and fixed to the two extending brackets 102. In this embodiment, each of the extended bracket sets includes five extending brackets. And four light emitting elements are disposed on the extension bracket). The light emitting elements 20 are electrically connected to each other in series by the extension brackets 102. The extension bracket 102 serves as a support to support the light-emitting elements 20 and the light-emitting elements 20 are arranged on the same line with each other. Referring to FIG. 2B, the first cladding structure 30 is formed on the plurality of light emitting elements 20 and the partial extension brackets 102 to completely cover and cover the light emitting elements 20. The partially extended bracket 102 is not covered or covered by the first covering structure 30 and exposed to the external environment (for example, air). Referring to FIG. 2C, a second cladding structure 40 is formed on the first cladding structure 30 and completely covers and covers the first cladding structure 30 to provide further protection. Referring to FIG. 2D, the extension brackets 102A and the support brackets 101 at opposite ends of each of the extension bracket groups are separated to form the light-emitting device 200. In each of the extended bracket groups, the extension brackets 102B that are not coupled to the support brackets 101 and the light-emitting elements 20 fixed thereto are coupled to each other and are not separated. Referring to FIG. 2E, the bent extension bracket 102B forms an angle (θ ₁ is an acute angle) between the light-emitting elements 20, whereby a light-emitting device 200 having an M-type structure is formed and the light-emitting elements 20 are arranged in a non-identical straight line. on-line. It should be noted that, as shown in FIG. 2E, the light-emitting elements 20 are substantially in the same plane, and one side of the light-emitting unit (see FIG. 3A) faces in the same direction. In other embodiments, the bendable extension bracket 102B positions the light emitting elements 20 in different planes from each other (see FIG. 2F), and one side of the light emitting unit can face in different directions. As shown in FIG. 2G, the light-emitting device 200 may have a diamond shape (θ ₂ is an acute angle and an θ ₃ obtuse angle) or other shapes. Similarly, the bent extension bracket 102B and the partial extension bracket 102A are also not covered or covered by the first cladding structure 30 and the second cladding structure 40 to be exposed to the external environment (for example, air). The number of extension brackets 102 and light-emitting elements 20 can be increased or decreased depending on actual needs or according to the desired shape. The support bracket and the extension bracket comprise a bendable, malleable, malleable, deformable metal. The material of the support bracket may be the same or different from the material of the extension bracket. In this embodiment, the support bracket is used to support the extension bracket, and only the extension bracket is bent, so the support bracket may have lower ductility than the extension bracket. The material of the support bracket may comprise copper, gold, platinum, silver, steel, iron, aluminum or alloys thereof. The material of the extension bracket may comprise copper, gold, platinum, silver, aluminum or alloys thereof. In general, the lattice of a bendable or ductile metal material belongs to a face-centered cubic lattice (FCC); the lattice of a metal material that is less bendable or less ductile is a close-packed hexagonal lattice (HCP) ).

In FIG. 2A, the extension brackets 102 of each of the extended bracket groups are mutually Not connected, the carrier 10 is disposed on a carrier (not shown) such that the support bracket 101 and the extension bracket 102 can be fixed to the carrier. Next, the light-emitting element 20 is fixed to the extension bracket 102. Alternatively, the carrier has a plurality of recesses to define the support bracket 101 and the extension bracket 102 therein. After the light-emitting element 20 is fixed on the extension bracket 102, the carrier board is removed. Thereafter, a first cladding structure and/or a second cladding structure (Fig. 2B and Fig. 2C) are formed. The first cladding structure and the second cladding structure may be formed by dispensing, spraying, or molding (for example, injection molding or extrusion molding).

3A-3B only illustrate that a light-emitting element 20 is disposed between the two extension brackets 102. Referring to FIG. 3A, the light-emitting element 20 includes a substrate 201; a plurality of light-emitting units 202 are formed on the substrate 201; and two electrode pads 203 are formed at both ends of the substrate 201 and electrically connected to the plurality of light-emitting units 202. Each of the light emitting units 202 includes a first type semiconductor layer 2021, an active layer 2022, and a second type semiconductor layer 2023. The first type semiconductor layer 2021 and the second type semiconductor layer 2023 are, for example, a cladding layer. Or a confinement layer, which can respectively provide electrons and holes to combine electrons and holes in the active layer 2022 to emit light. In this embodiment, the substrate 201 is a growth substrate and a plurality of light emitting units 202 are collectively epitaxially formed on the substrate 201. The light emitting element 20 further includes an electrical connection structure 204 formed on the substrate 201; and an insulating structure 205 is formed between the electrical connection structure 204 and the light emitting unit 202 and the substrate 201. The electrical connection structure 204 electrically connects the light emitting unit 202 and the electrode pad 203, thereby being connected to each other in series. In another embodiment, the light emitting units 202 can be electrically connected in parallel, in anti-parallel, or in a bridge configuration. It is noted that each of the light emitting units 202 may form a positive and negative electrode (not shown), and the positive and negative electrodes of each of the light emitting units 202 are connected by an electrical connection structure 204 to be connected in series to each other. The electrode pad 203 and the extension bracket 102 may be fixed to each other and electrically connected by a soldering process or an adhesive process. In the soldering process, the material of the electrode pad 203 may be an alloy, a metal or a solder, and the light-emitting element 20 is connected to the extension bracket 102 by a eutectic soldering process. During the adhesive process, an adhesive may be formed between the electrode pad 203 and the extension support 102, such as an anisotropically conductive adhesive (ACA) in the form of a paste or a film, that is, an anisotropically conductive film (anisotropically conductive film). Conductive film (ACF), in combination with pressure and heat, completes electrical bonding and permanently cures and thermally stabilizes the adhesive. The adhesive also contains silver paste or solder paste. In an embodiment, the light emitting unit 202 can be fixed on the substrate 201 with a bonding layer to form the light emitting element 20. The material of the first type semiconductor layer 2021, the active layer 2022, and the second type semiconductor layer 2023 may comprise a group III-V semiconductor material such as Al _x In _y Ga _(1-xy) N or Al _x In _y Ga _{( 1-xy)} P, where 0≦x, y≦1; (x+y)≦1. Depending on the material of the active layer 2022, the light-emitting element 20 can emit red light having a wavelength between 610 nm and 650 nm, green light having a wavelength between 530 nm and 570 nm, or blue light having a wavelength between 450 nm and 490 nm. The method of forming the first type semiconductor layer 2021, the active layer 2022, and the second type semiconductor layer 2023 is not particularly limited, and in addition to the metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) may also be used. Hydride vapor phase deposition (HVPE), evaporation or ion plating.

Referring to FIG. 3A, the first cladding structure 30 completely covers the illuminating element The member 20 covers a portion of the extension bracket 102, whereby the light-emitting element 20 is not exposed and is not in contact with the external environment (air). Further, the first cladding structure 30 is in direct contact with the growth substrate 201. Referring to FIG. 3B, the second cladding structure 40 also completely covers the first cladding structure 30 and covers a portion of the extension bracket 102 to provide further protection. The first cladding structure 30 or/and the second cladding structure 40 may comprise a wavelength converting material, a diffusion powder, heat dissipating particles, or a combination thereof. When the second cladding structure 40 contains the wavelength conversion material, a third cladding structure may be further formed to cover the second cladding structure 40 to achieve the function of waterproofing or dustproof. The number of cladding structures can be varied according to actual needs. The wavelength converting material is configured to absorb the first wavelength light emitted by the light emitting unit 202 to emit light having a second wavelength different from the first wavelength. Wavelength converting materials include, but are not limited to, yellow-green fluorescent powder and red fluorescent powder. The component of the yellow-green phosphor is, for example, aluminum oxide (YAG or TAG), citrate, vanadate, alkaline earth metal selenide, or metal nitride. The components of the red phosphor are, for example, citrate, vanadate, alkaline earth metal sulfide, metal oxynitride, or a mixture of tungsten molybdate salts. The diffusion powder contains inorganic fine particles (for example, cerium oxide) or organic fine particles (for example, high molecular polymer). The heat dissipating particles comprise a metal, a metal oxide (eg, alumina), or a non-metal oxide (eg, boron oxide or boron nitride). In this embodiment, the first cladding structure 30 has a first thickness (t1) (which may be an average thickness, or a maximum and minimum thickness), and the second cladding structure 40 has a second A thickness (t2) is formed on the first cladding structure 30; wherein the second thickness is a uniform thickness, and the first thickness (t1) is greater than the second thickness (t2). In another embodiment, the first thickness can be less than or equal to the second thickness. Alternatively, the second thickness can be a non-uniform thickness. The first cladding structure 30 and the second cladding structure 40 may be formed by dispensing, spraying, or molding (for example, injection molding or extrusion molding). It should be noted that when the first cladding structure 30 and the second cladding structure 40 are formed by dispensing or spraying, the cross section may have an elliptical or semicircular shape (for example, as shown in FIG. 3B). When the first cladding structure 30 and the second cladding structure 40 are formed by a molding method, the cross section may have a rectangular shape (shown in FIG. 3C). The shape of the mold can also be designed such that the first cladding structure 30 or/and the second cladding structure 40 have an elliptical, semi-circular or other shape. Furthermore, the shape of the mold can be designed such that the first cladding structure 30 or/and the second cladding structure 40 have protrusions 301, 401. The positions of the protrusions 301, 401 correspond to each of the light-emitting units 202 to change the light-emitting shape of the light-emitting element 20 (as shown in FIG. 3D). The projections 301, 401 have a semi-circular cross section, but may also have a curved, triangular, trapezoidal, or other polygonal cross section. In another embodiment, as shown in FIG. 3E, the positions of the protruding portions 301 and 401 are not corresponding to the positions of the respective light emitting units 202, that is, the protruding portions 301, 401 and the light emitting units 202 are staggered with each other and substantially not mutually. Overlap, thereby reducing total reflection generated by light at interfaces of different materials to increase light extraction efficiency.

The first cladding structure 30 comprises an epoxy resin, a silicone resin (for example: PDMS), Silicone rubber, silicone resin, elastic PU, porous PU, acrylic rubber, or glass. The second cladding structure 40 comprises an epoxy resin, a silicone resin (for example: PDMS), a silicone rubber, a silicone resin, an elastic PU, a porous PU, an acrylic rubber, or a glass. The materials of the first cladding structure 30 and the second cladding structure 40 may be the same or different. It should be noted that when the light-emitting device has a multi-layered cladding structure, the materials of the cladding structures of each layer may be the same or different.

4A to 4C are views showing a manufacturing flow chart of a light-emitting device 300 in the third embodiment of the present invention. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket sets, each of which is arranged in parallel with each other and physically connected to the support brackets 101. Each of the extended stent sets includes a plurality of extension brackets 102. The carrier 10 further includes a plurality of connections Bracket 103. The connection brackets 103 are arranged in a direction parallel to the support brackets 101 and physically connected to the extension brackets 102, whereby the carrier 10 forms a net structure. A plurality of light-emitting elements 20 are respectively placed between the two extension brackets 102 and fixed to the two extension brackets 102. The light emitting elements 20 can be electrically connected to each other by the extension bracket 102. In the present embodiment, the light-emitting element 20 is not disposed on the connection bracket 103. The extension bracket 102 or/and the connection bracket 103 can support the light emitting element 20 as a support and the light emitting elements 20 are arranged on the same line with each other. Referring to FIG. 4B, a first cladding structure 30 is formed on the plurality of light emitting elements 20 and the partial extension brackets 102 to completely cover and cover the light emitting elements 20. The partial extension bracket 102 and the connection bracket 103 are exposed to the external environment (for example, air). In this embodiment, the first cladding structure 30 can comprise a wavelength converting material, a diffusion powder, heat dissipating particles, or a combination thereof. Optionally, the second cladding structure 40 (not shown) may also completely enclose the first cladding structure 30 and cover a portion of the extension bracket 102 to provide further protection. Next, the extension brackets 102A and the support brackets 101 at opposite ends of each of the extended bracket groups are separated, and the connection brackets 103 are selectively separated, thereby forming the light-emitting devices 300 of different shapes. For example, in this embodiment, referring to FIG. 4C, the light-emitting device 300 includes four light-emitting elements 20 arranged in parallel with each other and on the same plane but on different straight lines and electrically connected; then, referring to FIG. 4D, the connection bracket is bent. 103 causes the extension bracket 102C to approach the direction of the extension bracket 102B, whereby the light-emitting elements 20 are not in the same plane with each other and have one side of the light-emitting unit facing in different directions. Alternatively, the bendable extension bracket 102 or/and the connection bracket 103 align the light emitting elements 20 with each other. Of course, in another embodiment, the extension bracket 102 or/and the attachment bracket 103 can be selectively cut and the uncut extension bracket 102 or/and the connection bracket 103 can be bent depending on the desired shape. Similarly, the bent extension bracket 102 and the connection bracket 103 are not covered or covered by the first covering structure 3 and exposed to the external environment (for example, air).

Fig. 4E is a view showing the light-emitting device of Fig. 4D disposed in a bulb. The light bulb includes a lamp housing 90, a light emitting device 300, a wire holder 91, and an electrical connector 92. The wire holder 91 is electrically connected to the light emitting device 300 such that the light emitting elements 20 are connected to each other in series. In addition, the wire holder 91 is also used to support the light emitting device 300 such that the light emitting device 300 can be located at a specific position within the bulb in a predetermined shape. The light emitting element 20 emits light in various directions. The bulb is provided with a full illumination of an illumination angle greater than 270 degrees. The wire holder 91 contains copper, gold, platinum, silver, steel, iron, aluminum or an alloy thereof. The electrical connector 92 is for electrical connection with an external circuit. The electrical connector 92 can be a helical (eg, E12, E14, E72, etc.) base or a connector (eg, B22) base.

Figure 5A shows a light-emitting element 20 in the fourth embodiment of the present invention. A schematic view of the carrier 10. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket sets, each of which is arranged in parallel with each other and physically connected to the support brackets 101. Each of the extended stent sets includes a plurality of extension brackets 102. It should be noted that the extension bracket 102 connected to the support bracket 101 has a T-shape, and the extension bracket 102 not connected to the support bracket 101 has a cross shape, that is, each extension bracket 102 has a first area 1021 and a The second region 1022 and the width of the second region 1022 are greater than the width of the first region 1021. A plurality of light-emitting elements 20 are respectively placed between the two extension brackets 102 and fixed to the first region 1021 of the two extension brackets 102. By the design of the width of the second region 1022, the heat dissipation area of the light-emitting device 400 can be increased, thereby helping the heat generated by the light-emitting element 20 to pass to the outside. Similarly, as in FIG. 2A, since the extension brackets 102 of each extension bracket group are not connected to each other, the carrier 10 is disposed on a carrier board (not shown) such that the support bracket 101 and the extension bracket 102 can be fixed to On the carrier board. Next, the light-emitting element 200 is fixed on the extension bracket 102. Alternatively, the carrier has a plurality of recesses to define the support bracket 101 and the extension bracket 102 therein. After the light-emitting element 200 is fixed on the extension bracket 102, the carrier board is removed. Thereafter, referring to FIGS. 2B-2G, the first cladding structure 30 or/and the second cladding structure 40 may be formed; then, the extension bracket 102 and the support bracket 101 are separated and the extension bracket 102 is bent to form a light having a predetermined structure. Device.

Fig. 5B is a view showing the light-emitting element 20 on the carrier 10 in the fifth embodiment of the present invention. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket sets, each of which is arranged in parallel with each other and physically connected to the support brackets 101. Each of the extended stent sets includes a plurality of extension brackets 102. The carrier 10 further includes a plurality of connection brackets 103. The connection brackets 103 are arranged in a direction parallel to the support brackets 101 and physically connected to the extension brackets 102, whereby the carrier 10 forms a net structure. A plurality of light-emitting elements 20 are respectively placed between the two extension brackets 102 and fixed to Two extension brackets 102 are provided. The light emitting elements 20 can be electrically connected to each other by the extension bracket 102. In the present embodiment, the light-emitting element 20 is not disposed on the connection bracket 103. The extension bracket 102 or/and the connection bracket 103 can serve as a support to support the light-emitting elements 20 and the light-emitting elements 20 are arranged on the same line with each other. As shown in FIG. 5A, the extension bracket 102 connected to the support bracket 101 has a T-shape, and the extension bracket 102 not connected to the support bracket 101 has a cross shape, that is, each extension bracket 102 has a first area 1021 and a The second region 1022 and the width of the second region 1022 are greater than the width of the first region 1021. A plurality of light-emitting elements 20 are respectively placed between the two extension brackets 102 and fixed to the first region 1021 of the two extension brackets 102. By the design of the width of the second region 1022, the heat dissipation area of the light-emitting device 400 can be increased, thereby helping the heat generated by the light-emitting element 20 to pass to the outside. Of course, the width of the connection bracket 103 can also be designed, and the heat generated by the light-emitting element 20 can also be transmitted to the outside. Similarly, referring to FIGS. 4B-4D, the first cladding structure 30 or/and the second cladding structure 40 may be formed; then, the extension bracket 102 and the connection bracket 103 may be selectively separated and the extension bracket 102 or bent may be bent. And the bracket 103 is connected to form a light-emitting device having a predetermined structure.

Figure 5C is a view showing the light-emitting element 20 in the sixth embodiment of the present invention. With a schematic diagram on 10. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket sets, each of which is arranged in parallel with each other and physically connected to the support brackets 101. Each of the extended stent sets includes a plurality of extension brackets 102. The light emitting element 20 includes a first light emitting group 20A and a second light emitting group 20B. The first illumination group 20A is placed and fixed between the two extension brackets 102 of each extension bracket group; the second illumination group 20B is perpendicular to the first illumination group 20A and disposed on two extensions of the adjacent extension bracket group. Between the supports 102, the light-emitting elements 20 form a net structure and can be electrically connected to each other in a bridge manner. The first lighting group 20A is arranged in a first direction (D1), and the second lighting group 20B is arranged in a second direction (D2), and the first direction is perpendicular to the second direction. Likewise, a first cladding structure 30 or/and a second cladding structure 40 can be formed; then the extension bracket 102 is selectively separated and the extension bracket 102 is bent to form a light emitting device having a predetermined structure. Referring to FIG. 5D, the light-emitting device 600 is electrically connected in a bridge manner and has one side of the light-emitting unit facing the same direction. As shown in Figure 5A, the extension bracket The design of 102 also helps with heat dissipation.

Fig. 6A is a view showing the light-emitting element 20 of the seventh embodiment of the present invention on the carrier 10. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket sets, each of which is arranged in parallel with each other and physically connected to the support brackets 101. Each of the extended stent sets includes a plurality of extension brackets 102. In this embodiment, four extended bracket groups are taken as an example, and each of the extended bracket groups includes three extending brackets 102 and two light emitting elements 20 are disposed on the extending bracket 102. The carrier 10 further includes a plurality of connection brackets 103. The connecting brackets 103 are arranged in a direction parallel to the supporting bracket 101 and physically connected to the extending bracket 102. It should be noted that the connection bracket 103 only connects the adjacent two extension bracket groups. Next, the extension bracket 102 and the support bracket 101 are separated to form a light-emitting device 700. As shown in FIG. 6B, the bent extension bracket 102 or/and the connection bracket 103 causes the light-emitting device 700 to have a predetermined shape. The light emitting device 700 includes two sets of extended brackets and four light emitting elements 20. As shown in FIG. 6C, the light emitting device 700 is disposed in a candle light. The candle lamp comprises a lamp housing 901, a wire holder 902, a base 903 and an electrical connector 904. The electrical connector 904 can be a helical (eg, E12, E14, E72, etc.) base, or a connector (eg, B22) base.

The light emitting device 700 is fixed to and electrically connected to the wire holder 902 by the extension bracket 102. The wire holder 902 is also used to support the light emitting device 700 such that the light emitting device 700 can be positioned at a specific position within the candle light in a predetermined shape. Fig. 6D is a circuit diagram showing the light-emitting device 700 in Fig. 6C. The light-emitting elements 20C, 20D are connected in parallel; the light-emitting elements 20E, 20F are connected in parallel; after that, they are connected in series to each other. Alternatively, the light-emitting device 700 can be electrically connected to an AC power source and FIG. 6E shows another circuit diagram of the light-emitting device 700. When the current cycle is under, the light-emitting elements 20C, 20F emit light; under the negative cycle, the light-emitting elements 20D, 20E Will shine.

Fig. 6F is a view showing the light-emitting element 20 of the eighth embodiment of the present invention on the carrier 10. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket sets, each of which is arranged in parallel with each other and physically connected to the support brackets 101. Each of the extended stent sets includes a plurality of extension brackets 102. The extension bracket 102 has a first area 1021 and a second area 1022 and the width or area of the second area 1022 is greater than the width or area of the first area 1021. The second area 1022 is physically connected to the support bracket 101 Pick up. Similarly, as in FIG. 2A, since the extension brackets 102 of each extension bracket group are not connected to each other, the carrier 10 is disposed on a carrier board (not shown) such that the support bracket 101 and the extension bracket 102 can be fixed to On the carrier board. Next, the light-emitting element 20 is fixed to the extension bracket 102. Alternatively, the carrier has a plurality of recesses to define the support bracket 101 and the extension bracket 102 therein. After the light-emitting element 20 is fixed on the extension bracket 102, the carrier board is removed. Next, the extension bracket 102 and the support bracket 101 are separated to form a light-emitting device 800, and the extension bracket 102 is bent so that the light-emitting device 800 becomes a predetermined shape. As shown in Fig. 6G, the light emitting device 800 is disposed in a candle light. In this embodiment, since the second region 1022 of the extension bracket has a large area, in addition to increasing the heat dissipation area of the light-emitting device 800, the light-emitting device 800 can be directly fixed to the base 903 as a support. The candle light also includes a lamp housing 901 and an electrical connector 904.

7A to 7B are views showing a light-emitting device 900 according to a ninth embodiment of the present invention. Schematic diagram of the manufacturing process. 7A is similar to FIG. 1C except that the contact portion 1025 of the extension bracket 102 and the support bracket 101 has a tapered structure, whereby the connection strength between the extension bracket 102 and the support bracket 101 is smaller than that of the first embodiment. . Therefore, as shown in Fig. 7B, when a force is applied to the contact portion 1025, the extension bracket 102 and the support bracket 101 can be easily separated. The process flow can be simplified by the arrangement of the contact portion 1025. Furthermore, the extension bracket 102 further includes a hole 1023. A connecting wire (not shown) can pass through the hole 1023 and secure the light emitting device 900 within a light bulb. Alternatively, when a plurality of light-emitting devices 900 are disposed in a light bulb, the connecting wires may pass through the holes of each of the light-emitting devices 900, thereby fixing and supporting each of the light-emitting devices in a predetermined shape. The connecting wires comprise metal, and the plurality of light emitting devices can be connected in parallel, in series, or in series.

Figure 8A shows a light-emitting element 20 in the tenth embodiment of the present invention. With a schematic diagram on 10. A plurality of light-emitting elements 20 are respectively placed between the two extension brackets 102 and fixed to the two extension brackets 102. The light emitting elements 20 are electrically connected to each other in series by the extension brackets 102. The extension bracket 102 serves as a support to support the light-emitting elements 20 and the light-emitting elements 20 are arranged on the same line with each other. Furthermore, a first covering structure 30 (not shown) may be formed on the plurality of light emitting elements 20 and the partial extension brackets 102 to completely cover and cover the light emitting elements 20. The partially extended bracket 102 is not covered or covered by the first covering structure 30 It is exposed to the outside environment (for example: air). A second cladding structure 40 (not shown) may completely cover and enclose the first cladding structure 30 to provide further protection. In this embodiment, the carrier 10 further includes a connecting bracket 103 arranged in a direction parallel to the supporting bracket 101; and an intermediate bracket 104 for physically connecting the extending brackets 102, 102D and the connecting bracket 103, This carrier 10 forms a net structure. In addition, the partial extension bracket 102D is only used to provide support, and the light-emitting element 20 is not disposed thereon. The contact portion of the connection bracket 103 and the extension brackets 102, 102D has a tapered structure, and the contact portion of the intermediate bracket 104 and the extension brackets 102, 102D and the connection bracket 103 also has a tapered structure. When a force is applied to the contact portion, the connection bracket 103 and the extension brackets 102, 102D can be easily separated, thereby forming a light-emitting device. The arrangement of the intermediate bracket 104 also simplifies the process flow.

9A to 9F are diagrams showing a light-emitting device of an eleventh embodiment of the present invention A cross-section of the manufacturing process for 1000. Referring to FIG. 9A, a lithography process can be utilized to form a patterned seed structure 221 on a carrier 21. The patterned seed structure 221 includes a first region 2211, a second region 2212, and a third region 2213. The first region 2211 and the third region 2213 comprise a plurality of seed layers physically separated from each other. The second region 2212 is disposed between the first region 2211 and the third region 2213 and electrically connects the first region 2211 and the third region 2213 (refer to FIG. 10A). Referring to FIG. 9B, similarly, a lithography process can be used to form a patterned metal layer 222 on the corresponding patterned seed structure 221, the area of the metal layer 222 and the shape and shape of the seed crystal structure 221 Essentially equal. The metal layer 222 also includes a first region 2221 corresponding to the first region 2211 of the seed structure 221; a second region 2222 corresponding to the second region 2212 of the seed structure 221; and a third region 2223 corresponding to A third region 2213 of the seed structure 221 . Referring to FIG. 9C, a first light-emitting group 11 includes a plurality of light-emitting units 111 respectively disposed in a first region 2221 of the metal layer 222; and a second light-emitting group 12 includes a plurality of light-emitting units 121 respectively disposed on the metal layer 222. The third region 2223; the second region 2222 of the metal layer 222 is not provided with the light emitting units 111, 121. By designing the relative positions of the metal layers, the light-emitting units 111, 112 disposed thereon can be connected to each other in series, parallel, serial-to-serial connection, bridge connection, or reverse parallel connection. Referring to FIG. 9D, an etching step is performed to remove the crystal Structure 221 . In this embodiment, the seed layer width (or area) of the second region 2212 of the seed crystal structure 221 is smaller than the line width (or area) of the seed layer of the first region 2211 (refer to FIG. 10A), when When the two regions 2212 are completely etched or removed, only a portion of the first region 2211 is etched and a portion is still formed on the carrier 21, whereby the light emitting units 111, 121 are still fixed to the carrier 21. Moreover, because the second region 2212 of the seed crystal structure 221 is completely etched or removed, the second region 2222 of the metal layer 222 assumes a floating state, that is, the second region 2222 of the metal layer 222 is not in direct contact with the carrier 21. However, it is still electrically connected to the first region 2221 and the third region 2223 of the metal layer 222. In contrast, the first region 2211 of the seed structure 221 is not completely etched or removed, so the first region 2221 of the metal layer 222 is still attached to the carrier 21 without exhibiting a floating state. It should be noted that after the step of removing the seed crystal structure 221, the line width (area) of the first region 2211 (the third region 2213) of the seed crystal structure 221 is smaller than the first region 2221 of the metal layer 222 formed thereon. Line width (area) of (third region 2223). The metal layer 222 and the corresponding seed crystal structure 221 together form a T-shaped cross section. Referring to FIGS. 9E and 10B, the carrier 21 is cut to form a first carrier portion 211 and a second carrier portion 212 with respect to the position of the second region 2222 of the suspended metal layer 222. The first carrier portion 211 has a first surface 2111 and a second surface 2112. The second carrier portion 212 has a third surface 2121 and a fourth surface 2122. The first lighting group 11 is located on the second surface 2112 and the second lighting group 12 is located on the fourth surface 2122. Referring to FIG. 9F, the relative positions of the first lighting group 11 and the second lighting group 12 are changed such that the first lighting group 11 and the second lighting group 12 are not substantially in the same line. In addition, since the second region 2222 of the metal layer 222 is suspended and malleable, when the relative positions of the first light-emitting group 11 and the second light-emitting group 12 are changed, the second region 2222 of the metal layer 222 is stretched. And bending and causing a change in shape (refer to Fig. 10C). It should be noted that the second region 2222 of the metal layer 222 is electrically connected to the first region 2221 and the third region 2223 of the metal layer 222 after the stretching step. In this embodiment, the first lighting group 11 and the second lighting group 12 face different directions and are electrically connected to each other in series. The first surface 2111 and the third surface 2121 are parallel to each other and face each other. It should be noted that the first surface 2111 (the second surface 2212) and the third surface 2121 (the fourth surface 2122) are substantially in the same line before the step of changing the relative position, but after the step of changing the relative position, the first surface 2111 (No. The two surfaces 2212) are not in the same line as the third surface 2121 (fourth surface 2122). Moreover, before the step of changing the relative position, the metal layer 222A located in the first carrier portion 211 and the metal layer 222B located in the second carrier portion face in the same direction and are located on the same side of the carrier 21, but change the relative position. After the step, the metal layer 222A and the metal layer 222B face different directions. Since the metal layers 222A, 222B face different directions, the light emitting device 1000 can be considered to be electrically connected to external circuits (eg, a power supply, a circuit board, or an electronic component) on different sides of the same side of the carrier. For example, as shown in FIG. 9G, a pedestal 80 has a pair of grooves 81. The light emitting device 700 is bonded to the corresponding recess 81 with metal layers 222A, 222B to form an electrical connection. In an embodiment, the base 80 can be a circuit board in the light bulb, and the light emitting device 1000 can be a light strip in the light bulb.

FIG. 10A shows a top view of the metal layer 222 before the step of changing the relative positions of the first light-emitting group 11 and the second light-emitting group 12 (corresponding to the 9D picture, but in order to make the figure clear, only the metal layer is drawn 222). The second region 2222 of the metal layer 222 has a plurality of meanders. Figure 10B shows a top view after cutting the carrier 21. Referring to FIG. 10C, the first carrier portion 211 and the second carrier portion 211 are moved in opposite directions, whereby the second region 2222 of the metal layer 222 is elongated and compared to the 10A map, the second region 2222 The meandering portion has a large radius of curvature, that is, the meandering portion is relatively flat. Further, in FIG. 10C, the distance between the first carrier portion 211 and the second carrier portion 211 is larger than the distance between the first carrier portion 211 and the second carrier portion 211 in FIG. 10B. In Fig. 10C, only the second region 2222 of the stretched but unbent metal layer 222 is shown, and then the second region 2222 of the metal layer 222 can be bent to form the light emitting device 1000 in Fig. 9F. In another embodiment, the second region 2222 of the metal layer 222 can be directly bent to form the light emitting device 1000 of the 9F. In another embodiment, the pattern of the second region 2222 of the unstretched metal layer 222 may be helical, serrated, or semi-circular.

11A to 11D are cross-sectional views showing a manufacturing process of a light-emitting device 1100 of the twelfth embodiment. Referring to FIG. 11A, the light-emitting device 1100 includes a carrier 21; a patterned metal layer 222 is formed on the carrier 21, and the first light-emitting group 11 and the second light-emitting group 12 are disposed on the patterned metal layer 222. Each of the light-emitting groups includes a plurality of light-emitting units 111, 121 electrically connected to each other. Among the first lighting group 11, the lighting unit 111A closest to the second lighting group 12 and the second lighting group 12, the lighting unit 121A closest to the first lighting group 11, between the two lighting units 111A, 121A The spacing (D ₁ ) is greater than the spacing (D ₂ ) between the first lighting group 11 or the second lighting group 12 adjacent to the lighting units 111, 121. Referring to FIG. 11B, an extendable and flexible conductive member 23 is disposed between the light emitting units 111A, 121A and electrically connected to the light emitting units 111A, 121A. Referring to FIG. 11C, the carrier 21 is cut relative to the position of the conductive member 23 to form a first carrier portion 211 and a second carrier portion 212. The first carrier portion 211 and the second carrier portion 212 are not connected to each other and separated by a distance. Further, a portion of the conductive member 23 is not connected to the carrier 21 and assumes a floating state. The first carrier portion 211 has a first surface 2111 and a second surface 2112. The second carrier portion 212 has a third surface 2121 and a fourth surface 2122. The first lighting group 11 is located on the second surface 2112 and the second lighting group 12 is located on the fourth surface 2122. Referring to FIG. 11D, the relative positions of the first lighting group 11 and the second lighting group 12 are changed such that the first lighting group 11 and the second lighting group 12 are not substantially in the same line. Further, since the conductive member 23 is suspended and malleable, when the relative positions of the first light-emitting group 11 and the second light-emitting group 12 are changed, the conductive member 23 is stretched and bent to cause a shape change. It should be noted that the conductive member 23 is electrically connected to the first light-emitting group 11 and the second light-emitting group 12 after the stretching step. In this embodiment, the first lighting group 11 and the second lighting group 12 face different directions and are electrically connected to each other in series. The first surface 2111 and the third surface 2121 are parallel to each other and face each other. It should be noted that the first surface 2111 (the second surface 2212) and the third surface 2121 (the fourth surface 2122) are substantially in the same line before the step of changing the relative position, but after the step of changing the relative position, the first surface 2111 (second surface 2212) and third surface 2121 (fourth surface 2122) are not in the same line. Moreover, before the step of changing the relative position, the metal layer 222A located in the first carrier portion 211 and the metal layer 222B located in the second carrier portion face in the same direction and are located on the same side of the carrier 21, but change the relative position. After the step, the metal layer 222A and the metal layer 222B face different directions. Since the metal layers 222A, 222B face different directions, the light emitting device 1000 can be considered to be electrically connected to external circuits (eg, a power supply, a circuit board, or an electronic component) on different sides of the same side of the carrier 21. Similarly, as shown in Fig. 9G, the light-emitting device 1100 is also connected to the recess of the substrate 80 and disposed in the bulb. The conductive member 23 can be fixed to the carrier 21 by wire bonding or surface bonding technology (SMT). The upper view pattern of the conductive member 23 before unstretching may be braided, spiral, serrated, or semicircular.

The carriers 10, 21 comprise an organic material, an inorganic material, or a combination thereof. Organic materials such as epoxy resin (Epoxy), polyammonium (PI), benzocyclobutene (BCB), perfluorocyclobutane (PFCB), Su8, acrylic resin (Acrylic Resin), polymethacrylic acid Methyl ester (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), polyetherimide, Fluorocarbon Polymer. Inorganic materials such as sapphire, zinc oxide, diamond, glass, quartz or aluminum nitride. The carriers 10, 21 can be transparent or opaque. The metal layer comprises copper, gold, platinum, silver, aluminum or alloys thereof. The seed layer comprises titanium, copper or an alloy thereof. The conductive member comprises copper, gold, platinum, silver, aluminum or an alloy thereof.

The detailed structure of the light-emitting units 111 and 121 may have a structure as shown in Figs. 12A to 12C in addition to the structure as shown in Fig. 3A. The light emitting units 111 and 112 include a substrate 7000, a first type semiconductor layer 7001, an active layer 7002, and a second type semiconductor layer 7003. The first type semiconductor layer 7001 and the second type semiconductor layer 7003 are, for example, cladding layers. A cladding layer or a confinement layer may respectively provide electrons and holes to combine electrons and holes in the active layer 7002 to emit light. A first conductive portion 7004 and a second conductive portion 7005 are formed on the second type semiconductor layer 7003 and the first type semiconductor layer 7001, respectively. The light emitting diode unit 2000 is a flip chip type light emitting diode. There is an aperture 7008 between the first conductive portion 7004 and the second conductive portion 7005, and the first conductive portion 7004 has an electrode contact surface 70041 and the second conductive portion 7005 has an electrode contact surface 70051; the electrode contact surface 70041 and the electrode contact surface The 70051 is located substantially at the same level. A transparent colloid covers the substrate 7000, the first type semiconductor layer 7001, the active layer 7002, and the second type semiconductor layer 7003 and is filled into the holes 7008 to form a first transparent structure 7026. In another embodiment, the transparent colloid does not completely fill the voids 7008, so air is formed between the first conductive portion 7004 and the second conductive portion 7005. The first transparent structure 7026 has a surface 70261 that is substantially flush with the electrode contact faces 70041, 70051. Next, a protective layer 7006 is formed on the surface of the first transparent structure 7026 and exposes the first conductive portion 7004 and the second conductive portion 7005. The first enlarged electrode portion 7024 and the second enlarged electrode portion 7025 are formed on the first conductive portion 7004 and the second conductive portion 7005, respectively, and are also formed on the protective layer 7006. The light-emitting units 111 and 121 are in direct contact with the metal layer 222 by the first enlarged electrode portion 7024 and the second enlarged electrode portion 7025 to form an electrical connection. In this embodiment, one side edge 70241 of the first enlarged electrode portion 7024 is not flush with one side 70061 of the protective layer 7006; the other side edge 70251 of the second enlarged electrode portion 7025 is not associated with the other of the protective layer 7006. The side 70062 is flush. In another embodiment, one side edge 70041 of the first enlarged electrode portion 7024 can be flush with one side 70061 of the protective layer 7006; one side edge 70251 of the second enlarged electrode portion 7025 can be combined with the other side of the protective layer 7006. The side 70062 is flush. The light emitting unit further includes a second transparent structure 7027 formed on the first transparent structure 7026. In another embodiment, the light emitting unit may not have the second transparent structure 7027. The first transparent structure 7026 or the second transparent structure 7027 comprises epoxy resin (Epoxy), polyammonium (PI), benzocyclobutene (BCB), perfluorocyclobutane (PFCB), SU8, acrylic resin ( Acrylic Resin), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), polyetherimide, fluorocarbon polymer , alumina (Al ₂ O ₃ ), SINR, spin-on glass (SOG). The second transparent structure 7027 comprises Sapphire, Diamond, Glass, Epoxy, quartz, Acrylic Resin, SiO _x , Alumina ( Al ₂ O ₃ ), zinc oxide (ZnO), or silicone (Silicone). The protective layer 7006 is transparent and non-conductive but has a high thermal conductivity (for example, a carbon-like drill), or may also contain a high reflectance substance (for example, titanium dioxide, ceria or alumina). The first transparent structure 7026 or/and the second transparent structure 7027 can comprise a wavelength converting material, a diffusion powder, heat dissipating particles, or a combination thereof.

The light emitting unit of Fig. 12B has a similar structure to the light emitting structure of Fig. 12A Structure. The light-emitting unit of Fig. 12A includes only one light-emitting diode, however, the light-emitting unit of Fig. 12B includes a plurality of light-emitting diodes. In this embodiment, each of the light emitting diodes has a respective substrate 7000. In other embodiments, as shown in FIG. 3A, a plurality of light emitting diodes are collectively epitaxially formed on a substrate. The light-emitting diodes are electrically connected to each other by an electrical connection structure 204 (series, parallel or series-parallel). In this embodiment, the second conductive portion 7005 of the light emitting diode and the first conductive portion 7004 of the adjacent light emitting diode are directly contacted by a wire structure 7015 and formed in series connection. The first transparent structure 7026 covers a plurality of light emitting diodes. It should be noted that only the first enlarged electrode portion 7024 and the second enlarged electrode portion 7025 are electrically connected to the metal layer 222, so that a plurality of light emitting diodes can be made to emit light.

The light emitting unit of Fig. 12C has a similar structure to the light emitting structure of Fig. 12B The structure is different. In the light-emitting unit of FIG. 12B, each of the light-emitting diodes has a respective first enlarged electrode portion 7024 and a second enlarged electrode portion 7025, and is not electrically connected to each other. By designing the metal layer 222, a plurality of light emitting diodes in the light emitting unit are electrically connected to each other on the carrier, and electrical connections can be made in series, in parallel, in parallel, or in a bridge structure.

It should be noted that the above described illuminating device can be regarded as a small illuminating Light bar, when disposed in a lighting device (for example: A-type bulb, B-type bulb, searchlight, bean lamp, tube or lamp), the extension bracket 102 or metal layer can be electrically connected with the circuit structure of the bulb . According to different needs, the illuminating device can have different structures by extending the bracket 102 or/and the connecting bracket 103 to achieve the effect of the full illumination of the illuminating device.

It should be understood that the above embodiments of the present invention, where appropriate, They may be combined or replaced with each other, and are not limited to the specific embodiments described. The examples of the invention are intended to be illustrative only and not to limit the scope of the invention. Any obvious modifications or variations of the present invention are possible without departing from the spirit and scope of the invention.

102A, 102B‧‧‧ Extended bracket

20‧‧‧Lighting elements

200‧‧‧Lighting device

Claims (10)

A method of manufacturing a light-emitting device, comprising: providing a plurality of physically separated support bodies; providing a first light-emitting element and a second light-emitting element, respectively, being fixed to the support bodies; and changing the first light-emitting elements The position relative to the second illuminating element is such that the first illuminating element and the second illuminating element are not substantially in line. The method of claim 1, wherein the changing step comprises bending at least one of the supports. The manufacturing method according to claim 1, wherein the first light-emitting element and the second light-emitting element are electrically connected to each other by the support. The manufacturing method of claim 1, wherein one of the plurality of supports has a tapered structure. The manufacturing method of claim 1, wherein the support comprises a metal. The manufacturing method of claim 1, wherein the support has a one-sided cubic lattice. The manufacturing method according to claim 1, wherein before the changing step, a covering material is formed to coat the first light emitting element and the second light emitting element. The manufacturing method of claim 7, wherein the first light-emitting element comprises a substrate, and a plurality of light-emitting layers are collectively epitaxially formed on the substrate. The manufacturing method of claim 8, wherein the covering material is in direct contact with the substrate. The manufacturing method of claim 7, wherein the support body has a portion not covered by the covering material.