CN203596366U - LED module structure easy to process - Google Patents

LED module structure easy to process Download PDF

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Publication number
CN203596366U
CN203596366U CN201320745974.3U CN201320745974U CN203596366U CN 203596366 U CN203596366 U CN 203596366U CN 201320745974 U CN201320745974 U CN 201320745974U CN 203596366 U CN203596366 U CN 203596366U
Authority
CN
China
Prior art keywords
substrate
led
led chip
easy
led module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320745974.3U
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Chinese (zh)
Inventor
吴鼎鼎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd filed Critical FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201320745974.3U priority Critical patent/CN203596366U/en
Application granted granted Critical
Publication of CN203596366U publication Critical patent/CN203596366U/en
Priority claimed from PCT/CN2014/091581 external-priority patent/WO2015074551A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model belongs to the LED lighting field, relating to an LED module structure easy to process which is characterized by comprising a substrate in a flat type long strip shape, two ends of the substrate being single layer metal conductors; LED chips cooperatively fixed on the upper surface of the substrate through insulation paste, the electrodes facing upwards; bonding lines connected among the LED chips and above the upper surface; and a fluorescent powder layer cooperating on the upper surface and covering the LED chips and the bonding lines, wherein two ends of the substrate are correspondingly communicating with the input terminal of a load loop where the LED chips are located. According to the utility model, a scheme of a long strip LED module convenient to cascade is formed; the substrate is easy to cascade along the length direction through a fusion welding mode to form a connecting whole body with mechanical strength; compared with a traditional PCB substrate, the LED module structure has a faster connection speed, does not need extra materials such as soldering tin and reduces cost.

Description

A kind of LED modular structure that is easy to processing
Technical field
The utility model belongs to LED lighting field, is specifically related to a kind of structure of LED module.
Background technology
The development of LED light source makes its application at lighting field more and more extensive.Its photochromic effect, useful life, fail safe etc. all have obvious advantage compared with conventional light source.Existing LED still has the defect of self, and because its luminous density is higher, so luminous element volume is often very little, single led luminous flux is also little.
For obtaining the effect of traditional lighting utensil, in the application of LED light source in light fixture, often adopt the formal distribution of many dense arrangement on the surface of substrate, to obtain the effect of similar large area light emitting, especially, even need the substrate mounting having set multiple, to such an extent as to obtain larger light source scale and light-emitting area.
This wherein has a class is long tube type lamp.For obtaining the illumination effect of long-tube fluorescent lamp, LED light source need to longitudinally be distributed on substrate, more multiple substrates are together in series, and obtains the module of length-specific and power.Mostly existing implementation is, with the state of the single led module composition module of PCB substrate, in different schemes, to be together in series by different quantity.Conventionally, existing mode is all used PCB as substrate, in the time that needs carry out multiple series connection, uses the extra accessory such as wire, metal tape to carry out electric, mechanical connection, its structure cause operation compared with loaded down with trivial details, consumptive material is many.
Utility model content
The problem long for the existing bar-shaped LED module cascade process time, consumptive material is many, the utility model proposes a kind of LED modular structure that is easy to processing, and its technical scheme is as follows:
A LED modular structure that is easy to processing, it comprises:
Substrate, plate strip, its two ends are single-layer metal conductor;
LED chip, is fixedly tied in the upper surface of described substrate by insulating cement, its electrode direction upward;
Nation's alignment, is connected between described LED chip, the top of described upper surface; And
Phosphor powder layer, is matched with described upper surface, covers described LED chip and binding line;
Wherein, the corresponding connection of load circuit input at the two ends of described substrate and this LED chip place.
The improvement that this programme can have is as follows:
In preferred embodiment, the part of described binding line between described LED chip has the canned paragraph that is fixed on this upper surface, and this canned paragraph is fixed on substrate by stator.
In preferred embodiment, the part of described nation alignment between described LED chip is suspended on described upper surface.
In preferred embodiment, described substrate entire body is single-layer metal structure, has been communicated with one end of this LED chip place load circuit.
In preferred embodiment, this substrate has multi-disc, along its Width parallel connection, and has each other gap, by the affixed one-tenth full wafer of linkage section.
The beneficial effect that this programme brings has: formed the strip LED module scheme of being convenient to cascade, the mode (laser, butt-joint etc.) that is easy to realize by fusion weld is together in series substrate along its length and forms the connecting overall with mechanical strength, than the substrate of traditional PCB plate mode, its connection speed is fast, and do not need the extra consumptive materials such as scolding tin, provide cost savings.
Accompanying drawing explanation
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail:
Fig. 1 is the schematic top plan view of the utility model embodiment mono-;
Fig. 2 is the cross-sectional schematic of AA part in Fig. 1;
Fig. 3 is the cross-sectional schematic of BB part in Fig. 1;
Fig. 4 is the part schematic top plan view of the utility model embodiment bis-;
Fig. 5 is the cross-sectional schematic of CC part in Fig. 4;
Fig. 6 is integrity profile schematic top plan view embodiment illustrated in fig. 4.
Embodiment
Embodiment mono-:
As shown in Figure 1 to Figure 3, the schematic diagram of the utility model embodiment mono-.
This programme comprises a strip, plate substrate 10, and its two ends 18 and 19 are the form of single-layer metal conductor.On substrate 10, fixed LED chip 20, LED chip 20 is the upper surfaces 12 that are fixedly tied in substrate 10 by insulating cement 21, and its electrode direction upward.
With nation's alignment 30 be connected between LED chip 20, the top of upper surface 12, make the load circuit (series and parallel and combination thereof) of all LED chip 20 completes.Finally there is a phosphor powder layer 50, be matched with upper surface 12, cover LED chip 20 and binding line 30.Wherein, the two ends 18,19 of substrate 10 are communicated with the load circuit input at this LED chip place, as the two ends of the load that on whole substrate 10, LED chip 20 forms.
So, purchase into the strip LED module scheme of being convenient to cascade, in the time that needs are connected multi-piece substrate 10, can substrate 10 be together in series along its length and form the connecting overall with mechanical strength by the mode of fusion weld (laser, butt-joint etc.), than the substrate 10 of traditional PCB plate mode, its connection speed is fast, and does not need the extra consumptive materials such as scolding tin, provides cost savings.
This programme also has some other feature:
The part of nation's alignment 30 between LED chip 20 is suspended on upper surface 12, and this form contributes to the quick routing of nation's alignment 30, can utilize phosphor powder layer 50 to stablize the overhanging portion of nation's alignment as immobilization material simultaneously.
Embodiment bis-:
As shown in Figures 4 to 6, the schematic diagram of the utility model embodiment bis-.
The present embodiment is a multi-disc complex, and as shown in Figure 6, multiple substrates 10 are along its Width parallel connection, and there is each other gap 14, by the affixed one-tenth full wafer of linkage section 13, after the monomer of the multi-disc parts on it fixedly complete, link section 13 is cut into monomer, more longitudinally connect.The multi-disc nation that this shape is beneficial to LED chip 20 determines and batch production.
The LED chip 20 of this programme is similar with embodiment mono-, and different is that the part of binding line 30 between LED chip 20 has the canned paragraph that is fixed on this upper surface, is fixed on substrate 10 by stator 31.Stator 31 can be conductor material, and the directly quick routing of nation's alignment 30 thereon.This structure makes nation's alignment 30 overall structures more firm.
This programme substrate 10 entire bodies are single-layer metal structure, and the load circuit one end at LED chip 20 places is connected in substrate 10; The other end is drawn by a transition chip 60.Transition chip 60 keeps insulation with substrate 10.Substrate 10 structures of this form are simpler, and the mechanical strength longitudinally connecting is higher.
The above, it is only the utility model preferred embodiment, therefore can not limit according to this scope that the utility model is implemented, the equivalence of doing according to the utility model the scope of the claims and description changes and modifies, and all should still belong in the scope that the utility model contains.

Claims (5)

1. a LED modular structure that is easy to processing, is characterized in that: it comprises:
Substrate, plate strip, its two ends are single-layer metal conductor;
LED chip, is fixedly tied in the upper surface of described substrate by insulating cement, its electrode direction upward;
Nation's alignment, is connected between described LED chip, the top of described upper surface; And
Phosphor powder layer, is matched with described upper surface, covers described LED chip and binding line;
Wherein, the corresponding connection of load circuit input at the two ends of described substrate and this LED chip place.
According to claim 1 a kind of be easy to processing LED modular structure, it is characterized in that: the part of described binding line between described LED chip has the canned paragraph that is fixed on this upper surface, and this canned paragraph is fixed on substrate by stator.
According to claim 1 a kind of be easy to processing LED modular structure, it is characterized in that: the part of described nation alignment between described LED chip is suspended on described upper surface.
4. according to a kind of LED modular structure that is easy to processing described in claim 1 or 2 or 3, it is characterized in that: described substrate entire body is single-layer metal structure, be communicated with one end of this LED chip place load circuit.
According to claim 4 a kind of be easy to processing LED modular structure, it is characterized in that: this substrate has multi-disc along its Width parallel connection, and thering is each other gap, by the affixed one-tenth full wafer of linkage section.
CN201320745974.3U 2013-11-21 2013-11-21 LED module structure easy to process Expired - Fee Related CN203596366U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320745974.3U CN203596366U (en) 2013-11-21 2013-11-21 LED module structure easy to process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201320745974.3U CN203596366U (en) 2013-11-21 2013-11-21 LED module structure easy to process
PCT/CN2014/091581 WO2015074551A1 (en) 2013-11-21 2014-11-19 Led module structure, and manufacturing process for led module

Publications (1)

Publication Number Publication Date
CN203596366U true CN203596366U (en) 2014-05-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320745974.3U Expired - Fee Related CN203596366U (en) 2013-11-21 2013-11-21 LED module structure easy to process

Country Status (1)

Country Link
CN (1) CN203596366U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015074551A1 (en) * 2013-11-21 2015-05-28 何文铭 Led module structure, and manufacturing process for led module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015074551A1 (en) * 2013-11-21 2015-05-28 何文铭 Led module structure, and manufacturing process for led module

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140514

Termination date: 20161121

CF01 Termination of patent right due to non-payment of annual fee