CN202094119U - Packaging structure for LED light-source module with convex cup structures - Google Patents
Packaging structure for LED light-source module with convex cup structures Download PDFInfo
- Publication number
- CN202094119U CN202094119U CN2011202118584U CN201120211858U CN202094119U CN 202094119 U CN202094119 U CN 202094119U CN 2011202118584 U CN2011202118584 U CN 2011202118584U CN 201120211858 U CN201120211858 U CN 201120211858U CN 202094119 U CN202094119 U CN 202094119U
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- China
- Prior art keywords
- reflector
- circuit board
- led light
- light source
- source module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a high-power LED bulb lamp structure, which belongs to the field of processing of illumination equipment and comprises a lamp holder, a radiator, an LED light source with convex cup structures and a lampshade. The LED light source with the convex cup structures comprises a base with a plurality of reflecting cups, at least one LED chip is arranged at the bottom of each reflecting cup, and the LED chip is adhered to the bottom of the reflecting cup by the aid of insulating cement. The high-power LED bulb lamp structure is characterized in that each reflecting cup is formed by a space surrounded by an annular projection, an opening is arranged on the lateral wall of the reflecting cup, the base is further provided with a circuit board groove concavely, the circuit board groove extends into the openings on the lateral walls of the reflecting cups respectively, a through hole is further arranged below the circuit board groove, a circuit board is embedded in the circuit board groove and extends into the reflecting cups, the LED chips are connected to the circuit board by the aid of leads, and a glue and fluorescent powder mixed layer is coated on the LED chips in the reflecting cups and the circuit board extending into the openings of the reflecting cups.
Description
Technical field
The utility model relates to a kind of lighting apparatus, relates in particular to a kind of high-power LED light source module.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span is long, various low-voltage lighting devices now have been widely used in, traditional led light source module package structure generally comprises a metab with reflector, reflector bottom center at base is provided with some led chips, this led chip is bonded at the bottom center of reflector equably by welding manner or insulating cement, be in series by lead between the led chip or parallel connection after draw, be connected to the wiring board of the reflector outside that is arranged on the metab, make led chip be covered mixed layer inside fully after again the upper surface of led chip being applied glue and fluorescent material mixed layer.In above-mentioned traditional led light source module package structure, because needing lead-in wire between led chip and the wiring board is connected, but led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing, be easy to make between led chip and the wiring board lead-in wire because of the people for bumping disconnected the damage, greatly reduce production efficiency, and it is more complicated that production process also becomes, and increases production cost.
The utility model content
The technical problems to be solved in the utility model is to provide a kind of and can simplifies production process, saves the novel protruding cup structure led light source module package structure of production cost.
The utility model is achieved in that a kind of protruding cup structure led light source module package structure, comprise that one has the base of the reflector of some linear array, the reflector bottom is provided with at least one led chip, this led chip is bonded at the bottom of reflector by insulating cement, it is characterized in that: described reflector is surrounded by an annular projection, the sidewall of this reflector also is respectively equipped with two openings, link to each other by this opening between each reflector, also be concaved with a circuit board slot on the described base, the two ends of this circuit board slot extend to respectively in the opening of the reflector sidewall of two ends end to end, the embedded wiring board that is provided with of described circuit board slot, this wiring board extends in the reflector of two ends end to end, each led chip is connected to wiring board by lead, and the led chip in the described reflector is coated with glue and fluorescent material mixed layer with the top that extends into the wiring board in the reflector opening.
The bottom of described circuit board slot is lower than the bottom of reflector.
The upper surface of described base is provided with a reflector layer of electroplating.
Described base is a strip, and reflector is circular.
Described circuit board slot is " U " font.
Described wiring board is pressed together by a glass flaggy and a line layer to be formed, and the line layer upper surface also is coated with the reflective white paint of one deck.
Described base adopts metal material to be stamped to form through one-shot forming technique.
The utlity model has following advantage: protruding cup structure led light source module package structure of the present utility model adopts above-mentioned with led chip with extend into the wiring board of opening part of reflector and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, lead is from the back pass-out of metab, metab then adopts one-time formed technology to be stamped to form, be convenient in the operation of led chip encapsulation, just can finish in a direct step, improved production efficiency greatly, reduce the damage of lead in the production process, saved production cost.
Description of drawings
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is an overall structure schematic diagram of the present utility model.
Fig. 2 is the structural representation between the utility model base, wiring board and the led chip.
Fig. 3 is the B-B cutaway view of Fig. 2.
Fig. 4 is the A-A cutaway view of Fig. 2.
Embodiment
Come the utility model is described in detail below in conjunction with specific embodiment.
Seeing also Fig. 1 to shown in Figure 4, is a kind of protruding cup structure led light source module package structure described in the utility model, comprises base 11, led chip 12, insulating cement 13, glue and fluorescent material mixed layer 14, reflector 15, wiring board 16, lead 17.Be provided with the reflector 15 of 8 linear array on the described base 11 equably, base 11 in the present embodiment is a strip, reflector 15 is circular, described base 11 adopts metal material to be stamped to form through one-shot forming technique, its upper surface has a reflector layer of electroplating, this reflector layer is a silver coating in the present embodiment, the bottom of reflector 15 is provided with some led chips 12, these led chips 12 are bonded at the bottom of reflector 15 by insulating cement 13, described reflector 15 is surrounded by an annular projection 151, the sidewall of this reflector 15 also is respectively equipped with two openings 152, link to each other by this opening 152 between each reflector 15, also be concaved with a circuit board slot 111 on the described base 11, the two ends of this circuit board slot 111 extend to respectively in the opening 152 of reflector 15 sidewalls of two ends end to end, be embedded with a wiring board 16 in the described circuit board slot 111, this wiring board 16 extends in the reflector 15 of two ends end to end, led chip 12 is connected to wiring board 16 by lead 17, and led chip 12 in the described reflector 15 and the top that extends into the wiring board 16 in the opening 152 of reflector 15 are coated with glue and fluorescent material mixed layer 14.Described wiring board 16 is " U " font, and is sandwich construction, is pressed together by a glass flaggy and a line layer and forms, and the line layer upper surface also is coated with the reflective white paint of one deck.The bottom of described circuit board slot 111 is lower than the bottom of reflector 15, after wiring board 16 is installed, the upper surface of wiring board 16 is just equal with the bottom surface of reflector 15, during the encapsulation of led light source module the lead of wiring board 16 is drawn from the two ends of base, so just can and extend into the wiring board of opening part of reflector and the lead between them with led chip, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, improved production efficiency greatly, reduce the damage of lead in the production process, saved production cost.
In the foregoing description, described base can be selected metal material such as aluminium sheet, the copper coin etc. of various high heat radiations, adopt the mould of making in advance to utilize one-shot forming technique, stamp out the solid shapes such as the reflector that is protruding cup-shaped, opening, circuit board slot and through hole that need, can enhance productivity greatly; And the shape of base also is not limited to strip, can do squarely or other shapes, still can reach aforesaid utility model purpose.
Claims (7)
1. protruding cup structure led light source module package structure, comprise that one has the base of the reflector of some linear array, the reflector bottom is provided with at least one led chip, this led chip is bonded at the bottom of reflector by insulating cement, it is characterized in that: described reflector is surrounded by an annular projection, the sidewall of this reflector also is respectively equipped with two openings, link to each other by this opening between each reflector, also be concaved with a circuit board slot on the described base, the two ends of this circuit board slot extend to respectively in the opening of the reflector sidewall of two ends end to end, the embedded wiring board that is provided with of described circuit board slot, this wiring board extends in the reflector of two ends end to end, each led chip is connected to wiring board by lead, and the led chip in the described reflector is coated with glue and fluorescent material mixed layer with the top that extends into the wiring board in the reflector opening.
2. protruding cup structure led light source module package structure according to claim 1, it is characterized in that: the bottom of described circuit board slot is lower than the bottom of reflector.
3. protruding cup structure led light source module package structure according to claim 1 is characterized in that: the upper surface of described base is provided with a reflector layer of electroplating.
4. protruding cup structure led light source module package structure according to claim 1, it is characterized in that: described base is a strip, reflector is circular.
5. protruding cup structure led light source module package structure according to claim 1, it is characterized in that: described circuit board slot is " U " font.
6. protruding cup structure led light source module package structure according to claim 1 is characterized in that: described wiring board is pressed together by a glass flaggy and a line layer to be formed, and the line layer upper surface also is coated with the reflective white paint of one deck.
7. protruding cup structure led light source module package structure according to claim 1 is characterized in that: described base adopts metal material to be stamped to form through one-shot forming technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202118584U CN202094119U (en) | 2011-06-22 | 2011-06-22 | Packaging structure for LED light-source module with convex cup structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202118584U CN202094119U (en) | 2011-06-22 | 2011-06-22 | Packaging structure for LED light-source module with convex cup structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202094119U true CN202094119U (en) | 2011-12-28 |
Family
ID=45369168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202118584U Expired - Lifetime CN202094119U (en) | 2011-06-22 | 2011-06-22 | Packaging structure for LED light-source module with convex cup structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202094119U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244074A (en) * | 2011-06-22 | 2011-11-16 | 福建省万邦光电科技有限公司 | Package structure of LED (light emitting diode) light source module of convex cup structure |
-
2011
- 2011-06-22 CN CN2011202118584U patent/CN202094119U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244074A (en) * | 2011-06-22 | 2011-11-16 | 福建省万邦光电科技有限公司 | Package structure of LED (light emitting diode) light source module of convex cup structure |
| CN102244074B (en) * | 2011-06-22 | 2015-12-16 | 福建省万邦光电科技有限公司 | Convex cup structure LED light source module package structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20111228 Effective date of abandoning: 20151216 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |