CN202252995U - Ceramic-layer-plated substrate LED (light-emitting diode) bulb lamp with hollow radiator - Google Patents
Ceramic-layer-plated substrate LED (light-emitting diode) bulb lamp with hollow radiator Download PDFInfo
- Publication number
- CN202252995U CN202252995U CN2011203374770U CN201120337477U CN202252995U CN 202252995 U CN202252995 U CN 202252995U CN 2011203374770 U CN2011203374770 U CN 2011203374770U CN 201120337477 U CN201120337477 U CN 201120337477U CN 202252995 U CN202252995 U CN 202252995U
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- led
- reflector
- ceramic layer
- hollow out
- light source
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a ceramic layer-plated substrate LED (light-emitting diode) bulb lamp with a hollow radiator. The ceramic layer-plated substrate LED bulb lamp comprises a lamp cap, the hollow radiator, a support, an LED light source module, a power supply part and a transparent cover, wherein the LED light source module comprises a base and an LED chip, the base comprises a substrate and at least one reflective cup arranged on the substrate, at least one LED chip is bonded and fixed on the bottom of the reflective cup through an insulating adhesive, fluorescent powder and a glue layer are coated on the upper surface of the LED chip, a ceramic layer is plated on the light-emitting surface for mounting an LED on the reflective cup, and the whiteness of the ceramic layer is not less than 70. The LED lamp produced by adopting the structure has the advantages of having good safety performance and non-conductive property, being less prone to breaking, becoming lighter in weight, greatly saving production cost and being conductive to large-batch industrial production.
Description
Technical field
The utility model relates to a kind of lighting apparatus, relates in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, has been widely used in various lighting devices at present, and traditional LED bulb lamp all adopts the die casting fin of band dentation, and production technology is complicacy, and production cost is higher; Simultaneously, traditional led light source module encapsulation construction generally comprise one have a reflector metab, its heat dispersion is relatively poor, particularly can't solve the heat dissipation problem of high-power LED light source module.
Summary of the invention
The technical problem that the utility model will solve is to provide a kind of and can either saves production cost, can keep the plating ceramic layer substrate LED bulb lamp of the band hollow out radiator of heat dispersion preferably again.
The technical scheme that the utility model adopts is: a kind of plating ceramic layer substrate LED bulb lamp with the hollow out radiator, comprise lamp holder, support, led light source module, power unit and translucent cover, and the led light source module connects power unit through electric wire; Translucent cover also is equipped with in the surface of light source outside of led light source module; Said LED bulb lamp also comprises a hollow out radiator, and an end of said support is fixedly connected the hollow out radiator, and the other end is fixedly connected lamp holder; The hollow out radiator muff-joint is located at the outside of led light source module; It is characterized in that: said led light source module, comprise base and led chip, said base comprises substrate and is arranged at least one reflector on the substrate; The bottom of reflector is adhesively fixed with at least one led chip through insulating cement; The upper surface of said led chip is coated with fluorescent material and glue layer, and the light-emitting area that is used to install LED on the said reflector is coated with a high whiteness ceramic layer, the whiteness of said ceramic layer >=70.
Said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.
The whiteness of said ceramic layer is more preferred from >=and 85.
Whiteness the best of said ceramic layer is >=88.
The sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
The below of said circuit board slot is provided with a through hole and extends base.
The bottom of said circuit board slot is lower than the bottom of reflector.
Said base and reflector are circle.
Compared with prior art; The utlity model has following advantage: after employing has the LED base plate for packaging of high whiteness, get optical efficiency and be greatly improved, so the heat dispersion of led light source module improves greatly; Owing to adopt the hollow out radiator; Can make the led light source module directly with air contact heat radiation, can also make whole lamp outside non-conductive, non-friable; Its security performance of LED lamp of processing is good, and weight lightens, and can save production cost greatly, helps large batch of suitability for industrialized production.
Description of drawings
Combine embodiment that the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the overall appearance sketch map of the plating ceramic layer substrate LED bulb lamp of the utility model band hollow out radiator.
Fig. 2 is the STRUCTURE DECOMPOSITION sketch map of the plating ceramic layer substrate LED bulb lamp of the utility model band hollow out radiator.
Fig. 3 is the structural representation of led light source module of the plating ceramic layer substrate LED bulb lamp of the utility model band hollow out radiator.
Fig. 4 is the A-A generalized section of Fig. 3.
Fig. 5 is the structural representation of the base of led light source module.
Fig. 6 is the B-B generalized section of Fig. 5.
The specific embodiment
Come the utility model is carried out detailed explanation below in conjunction with specific embodiment.
Like Fig. 1, shown in 2; A kind of plating ceramic layer substrate LED bulb lamp with the hollow out radiator; Comprise lamp holder 100, hollow out radiator 200, support 300, led light source module 400, power unit 500 and translucent cover 600; One end of said support 300 is fixedly connected hollow out radiator 200, and the other end is fixedly connected lamp holder 100, and hollow out radiator 200 is set in the outside of led light source module 400; Led light source module 400 connects power unit 500 through electric wire, and translucent cover 600 also is equipped with in the surface of light source outside of led light source module 400.
Like Fig. 3 and shown in Figure 4, be the structural representation of many glasss of modules of a kind of high whiteness substrate led light source, comprise base 10 and some led chips 20; Like Fig. 5 and shown in Figure 6, said base 10 comprises substrate 1 and is arranged on several reflectors 2 on the substrate 1, and led chip 20 is bonded and fixed at the bottom of reflector 2 through insulating cement; The upper surface of said led chip 20 is coated with fluorescent material and glue layer 40, and the sidewall 22 of said reflector 2 also is provided with opening 21, and the outside at reflector 2 on the substrate 1 also is provided with circuit board slot 3; Said circuit board slot 3 is " king " font; And extend into reflector sidewall 22, wiring board 30 is installed in the circuit board slot 3, said led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity; Base described in the present embodiment and reflector are circle, and said reflector is 6.
Said substrate 1 is to adopt one-body molded processing with reflector 2, or reflector 2 is bonded and fixed on the substrate 1.The light-emitting area that is used to install led chip on the said reflector 2 is coated with the ceramic layer 23 of a high whiteness, the whiteness of said ceramic layer 23 >=70; Be more preferred from >=85; The best is >=88.
In addition; Can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description; Supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production; All leads all are encapsulated in fluorescent material and the glue layer the better purpose that must reach the utility model.
Because traditional general whiteness of LED metab is all less than 70; Therefore in actual production, need light-emitting area above that to increase the reflector layer production process; But do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The utility model adopts the base of the ceramic layer that is coated with high whiteness; Getting optical efficiency is greatly improved; Therefore the heat dispersion of led light source module improves greatly, owing to adopt the hollow out radiator, can make the led light source module directly with air contact heat radiation; Can also make whole lamp outside non-conductive, non-friable; Its security performance of LED lamp of processing is good, and weight lightens, and can save production cost greatly, helps large batch of suitability for industrialized production.Adopt above-mentioned in addition with led chip and wiring board and the lead between them; All be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer, can be in the operation of led chip encapsulation just can direct step completion, both can simplify production technology; Can also save a large amount of production costs; Help large batch of suitability for industrialized production, can adopt prefabricated mode Direct Production base simultaneously, production efficiency will improve greatly.
Claims (6)
1. plating ceramic layer substrate LED bulb lamp with the hollow out radiator; Comprise lamp holder, support, led light source module, power unit and translucent cover, the led light source module connects power unit through electric wire, and translucent cover also is equipped with in the surface of light source outside of led light source module; Said LED bulb lamp also comprises a hollow out radiator; One end of said support is fixedly connected the hollow out radiator, and the other end is fixedly connected lamp holder, and the hollow out radiator muff-joint is located at the outside of led light source module; It is characterized in that: said led light source module; Comprise base and led chip, said base comprises substrate and is arranged at least one reflector on the substrate, and the bottom of reflector is adhesively fixed with at least one led chip through insulating cement; The upper surface of said led chip is coated with fluorescent material and glue layer, and the light-emitting area that is used to install LED on the said reflector is coated with the ceramic layer of a high whiteness.
2. the plating ceramic layer substrate LED bulb lamp of band hollow out radiator according to claim 1 is characterized in that: said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.
3. the plating ceramic layer substrate LED bulb lamp of band hollow out radiator according to claim 1; It is characterized in that: the sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
4. the plating ceramic layer substrate LED bulb lamp of band hollow out radiator according to claim 3, it is characterized in that: the below of said circuit board slot is provided with a through hole and extends base.
5. the plating ceramic layer substrate LED bulb lamp of band hollow out radiator according to claim 3, it is characterized in that: the bottom of said circuit board slot is lower than the bottom of reflector.
6. the plating ceramic layer substrate LED bulb lamp of band hollow out radiator according to claim 1, it is characterized in that: said base and reflector are circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203374770U CN202252995U (en) | 2011-09-09 | 2011-09-09 | Ceramic-layer-plated substrate LED (light-emitting diode) bulb lamp with hollow radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203374770U CN202252995U (en) | 2011-09-09 | 2011-09-09 | Ceramic-layer-plated substrate LED (light-emitting diode) bulb lamp with hollow radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202252995U true CN202252995U (en) | 2012-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203374770U Expired - Fee Related CN202252995U (en) | 2011-09-09 | 2011-09-09 | Ceramic-layer-plated substrate LED (light-emitting diode) bulb lamp with hollow radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202252995U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD831862S1 (en) | 2015-03-04 | 2018-10-23 | Hengdian Group Tospo Lighting Co., Ltd. | LED lamp |
-
2011
- 2011-09-09 CN CN2011203374770U patent/CN202252995U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD831862S1 (en) | 2015-03-04 | 2018-10-23 | Hengdian Group Tospo Lighting Co., Ltd. | LED lamp |
| USD853603S1 (en) | 2015-03-04 | 2019-07-09 | Hengdian Group Tospo Lighting Co., Ltd. | Lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160412 Address after: 351100, Fujian, Chengxiang province Putian District Flower Village 324 National Road 113 kilometers, Putian Combs Photoelectric Technology Co., Ltd. Building 8 Patentee after: MCOB OPTOELECTRONICS TECHNOLOGY CO., LTD. Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Patentee before: Fujian Wanban optoelectronic Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20150909 |
|
| EXPY | Termination of patent right or utility model |