CN202253005U - Substrate LED down lamp with high whiteness - Google Patents
Substrate LED down lamp with high whiteness Download PDFInfo
- Publication number
- CN202253005U CN202253005U CN201120337623XU CN201120337623U CN202253005U CN 202253005 U CN202253005 U CN 202253005U CN 201120337623X U CN201120337623X U CN 201120337623XU CN 201120337623 U CN201120337623 U CN 201120337623U CN 202253005 U CN202253005 U CN 202253005U
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- Prior art keywords
- led
- substrate
- reflector
- high whiteness
- base
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- Expired - Fee Related
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Abstract
The utility model provides a substrate LED down lamp with high whiteness, which includes a lamp bracket, a radiator, a lamp shade, an LED light source module and a transparent cover, wherein the LED light source module is installed in the lamp shade; the transparent cover is further installed at an opening below the lamp shade; the radiator is also installed on the lamp shade; and the lamp bracket is installed at the outer part of the lamp shade. The substrate LED down lamp with high whiteness is characterized in that the LED light source module includes a base and an LED chip; the base includes a substrate and at least one reflective cup arranged on the substrate; at least one LED chip is bonded and fixed at the bottoms of the reflective cups through insulating gel; fluorescent powder and a adhesive layer are coated on the upper surfaces of the LED chips; and the whiteness of the luminous surface arranged on the reflective cups and used for installing the LEDs is not less than 70. Through adopting the structure, the manufactured LED lamp has an excellent safety performance, is non-conductive, not easy to break and light, can greatly save the manufacturing cost, and facilitates the mass industrialized production.
Description
Technical field
The utility model relates to a kind of lighting apparatus, relates in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, has been widely used in various lighting devices at present, and traditional LED bulb lamp all adopts the die casting fin of band dentation, and production technology is complicacy, and production cost is higher; Simultaneously, traditional led light source module encapsulation construction generally comprise one have a reflector metab, its heat dispersion is relatively poor, particularly can't solve the heat dissipation problem of high-power LED light source module.
Summary of the invention
The technical problem that the utility model will solve is to provide a kind of and can either saves production cost, can keep the high whiteness substrate LED Down lamp of heat dispersion preferably again.
The technical scheme that the utility model adopts is: a kind of high whiteness substrate LED Down lamp, comprise lamp bracket, radiator, lampshade, led light source module and translucent cover, and said led light source module is installed in the lampshade; Translucent cover also is equipped with at the lower opening place of lampshade, and radiator also is installed on the lampshade, and lamp bracket is installed in the outside of lampshade; It is characterized in that: said led light source module; Comprise base and led chip, said base comprises substrate and is arranged at least one reflector on the substrate, and the bottom of reflector is adhesively fixed with at least one led chip through insulating cement; The upper surface of said led chip is coated with fluorescent material and glue layer; Said base adopts the pottery of high whiteness or one-body molded the firing of glass to form, and perhaps substrate is to adopt the pottery or the glass of high whiteness to process, and reflector is bonded and fixed on the substrate.
Be used to install light-emitting area whiteness >=70 of LED on the said reflector, be more preferred from >=85, the best is >=88.
The sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
The below of said circuit board slot is provided with a through hole and extends base.
The bottom of said circuit board slot is lower than the bottom of reflector.
Said base and reflector are circle.
Compared with prior art, the utlity model has following advantage: after employing had the LED base plate for packaging of high whiteness, the heat dispersion of led light source module improves, and was non-conductive, non-friable; Its security performance of LED lamp of processing is good, and weight lightens, and can save production cost greatly, helps large batch of suitability for industrialized production.
Description of drawings
Combine embodiment that the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the STRUCTURE DECOMPOSITION sketch map of the high whiteness substrate of the utility model LED Down lamp.
Fig. 2 is the structural representation of the led light source module of the high whiteness substrate of the utility model LED Down lamp.
Fig. 3 is the A-A generalized section of Fig. 2.
Fig. 4 is the structural representation of the base of led light source module.
Fig. 5 is the B-B generalized section of Fig. 4.
The specific embodiment
Come the utility model is carried out detailed explanation below in conjunction with specific embodiment.
As shown in Figure 1; A kind of high whiteness substrate LED Down lamp comprises lamp bracket 100, radiator 200, lampshade 300, led light source module 400, power unit (not shown) and translucent cover 500, and said led light source module 400 is installed in the lampshade 300; Translucent cover 500 also is equipped with at the lower opening place of lampshade 300; The position of dress led light source module 400 also is equipped with radiator 200 on the lampshade 300, and lamp bracket is installed in the outside of lampshade 300, and led light source module 400 connects power unit through electric wire.
As shown in Figures 2 and 3, be the structural representation of many glasss of modules of a kind of high whiteness substrate led light source, comprise base 10 and some led chips 20; Like Fig. 4 and shown in Figure 5, said base 10 comprises substrate 1 and is arranged on several reflectors 2 on the substrate 1, and led chip 20 is bonded and fixed at the bottom of reflector 2 through insulating cement; The upper surface of said led chip 20 is coated with fluorescent material and glue layer 40, and the sidewall 22 of said reflector 2 also is provided with opening 21, and the outside at reflector 2 on the substrate 1 also is provided with circuit board slot 3; Said circuit board slot 3 is " king " font; And extend into reflector sidewall 22, wiring board 30 is installed in the circuit board slot 3, said led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity; Base described in the present embodiment and reflector are circle, and said reflector is 6.
Said base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to process, and reflector is bonded and fixed on the substrate.Be used to install light-emitting area whiteness >=70 of LED on the said reflector, be more preferred from >=85, the best is >=88.
In addition; Can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description; Supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production; All leads all are encapsulated in fluorescent material and the glue layer the better purpose that must reach the utility model.
Because traditional general whiteness of LED metab is all less than 70; Therefore in actual production, need light-emitting area above that to increase the reflector layer production process; But do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The utility model adopts the pottery or the glass base of high whiteness, according to the prefabricated size that processes needs of production needs, has both met the requirement of whiteness >=70; Can improve heat dispersion again, adopt above-mentionedly in addition, all be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer led chip and wiring board and the lead between them; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production; Simultaneously can adopt prefabricated mode Direct Production base, production efficiency will improve greatly.
Claims (5)
1. one kind high whiteness substrate LED Down lamp comprises lamp bracket, radiator, lampshade, led light source module and translucent cover, and said led light source module is installed in the lampshade; Translucent cover also is equipped with at the lower opening place of lampshade, and radiator also is installed on the lampshade, and lamp bracket is installed in the outside of lampshade; It is characterized in that: said led light source module, comprise base and led chip, said base comprises substrate and is arranged at least one reflector on the substrate; The bottom of reflector is adhesively fixed with at least one led chip through insulating cement; The upper surface of said led chip is coated with fluorescent material and glue layer,, said base adopts the pottery of high whiteness or one-body molded the firing of glass to form; Perhaps substrate is to adopt the pottery or the glass of high whiteness to process, and reflector is bonded and fixed on the substrate.
2. high whiteness substrate LED Down lamp according to claim 1; It is characterized in that: the sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
3. high whiteness substrate LED Down lamp according to claim 2, it is characterized in that: the below of said circuit board slot is provided with a through hole and extends base.
4. high whiteness substrate LED Down lamp according to claim 2, it is characterized in that: the bottom of said circuit board slot is lower than the bottom of reflector.
5. high whiteness substrate LED Down lamp according to claim 1, it is characterized in that: said base and reflector are circle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120337623XU CN202253005U (en) | 2011-09-09 | 2011-09-09 | Substrate LED down lamp with high whiteness |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120337623XU CN202253005U (en) | 2011-09-09 | 2011-09-09 | Substrate LED down lamp with high whiteness |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202253005U true CN202253005U (en) | 2012-05-30 |
Family
ID=46114246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201120337623XU Expired - Fee Related CN202253005U (en) | 2011-09-09 | 2011-09-09 | Substrate LED down lamp with high whiteness |
Country Status (1)
Country | Link |
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CN (1) | CN202253005U (en) |
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2011
- 2011-09-09 CN CN201120337623XU patent/CN202253005U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20150909 |
|
EXPY | Termination of patent right or utility model |