CN102306647A - LED (light emitting diode) illuminant multi-cup module of base plate with a ceramic plated layer - Google Patents
LED (light emitting diode) illuminant multi-cup module of base plate with a ceramic plated layer Download PDFInfo
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- CN102306647A CN102306647A CN201110266614A CN201110266614A CN102306647A CN 102306647 A CN102306647 A CN 102306647A CN 201110266614 A CN201110266614 A CN 201110266614A CN 201110266614 A CN201110266614 A CN 201110266614A CN 102306647 A CN102306647 A CN 102306647A
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Abstract
The invention provides an LED (light emitting diode) illuminant multi-cup module of a base plate with a plated ceramic layer. The module comprises a base and LED chips; the base comprises a substrate and a plurality of light reflection cups arranged on the substrate; the LED chips are bonded and fixed on the bottom parts of the light reflection cups through insulation paste; fluorescent powder and a glue layer are coated on the upper surfaces of the LED chips; the ceramic layer is coated on a luminous surface on each light reflection cup for mounting the LED, wherein the whiteness of the ceramic layer is greater than or equal to 70. According to the invention, the manufacturing procedure of the light reflection layer on the traditional LED metal base can be reduced, not only is the production process simplified, but also the production cost can be saved greatly, which is good for large batch of industrial production, simultaneously the base can be produced directly by adopting a ready-made mode, because the ceramic layer with high whiteness is coated on the light reflection cups of the base, the light taking efficiency of the LED chips is improved greatly, the loss from the light energy to heat energy can be reduced greatly, the heat radiation performance is improved greatly, the safety performance of an LED lamp manufactured by the module is good, the LED lamp is not conducting, is difficult to be smashed, and the service life is also prolonged greatly.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, has been widely used in various lighting devices at present; If traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp; Its reflector efficiency is not high; Particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier, as improving its whiteness as the reflector layer of reflector layer or pressing one deck white at its surface brush one deck white paint, but this way; At first its technology is complicated; Production cost is higher, simultaneously, because after having increased one deck reflector layer; Traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.Simultaneously, in traditional led light source module encapsulation construction, be connected owing to need lead-in wire between led chip and the wiring board; But led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing; Be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people; Greatly reduce production efficiency, and production process also becomes more complicated, the increase production cost.
Summary of the invention
The technical problem that the present invention will solve is to provide a kind of and can either saves production cost, enhances productivity, and can keep many glasss of modules of plating ceramic layer substrate led light source of heat dispersion preferably again.
The technical scheme that the present invention adopts is: many glasss of modules of a kind of plating ceramic layer substrate led light source; Comprise base and led chip; Said base comprises substrate and is arranged on several reflectors on the substrate, and the bottom of each reflector is adhesively fixed with at least one led chip through insulating cement, and the upper surface of said led chip is coated with fluorescent material and glue layer; It is characterized in that: the light-emitting area that is used to install LED on the said reflector is coated with a ceramic layer, the whiteness of said ceramic layer >=70.
Said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.
The whiteness of said ceramic layer is more preferred from >=and 85.
Whiteness the best of said ceramic layer is >=88.
The sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
The below of said circuit board slot is provided with a through hole and extends base.
The bottom of said circuit board slot is lower than the bottom of reflector.
Said base and reflector are circle.
Said reflector is 6, and said circuit board slot is " king " font.
Compared with prior art; The present invention has following advantage: because said substrate and reflector are to adopt that metal material is one-body molded to be processed, or after being bonded and fixed at reflector on the substrate, plate high whiteness ceramic layer processing again; The reflector layer production process that can reduce traditional LED to adopt metab and need to increase; Both simplify production technology, can save production cost, helped large batch of suitability for industrialized production.The inventor finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to >=70, can promote well and get optical efficiency, and heat dispersion is excellent; Its whiteness is >=88 best results if lifting is better for >=85 effects if promote; Because after the whiteness of base improves, the getting optical efficiency and will promote greatly of led chip, therefore can significantly reduce luminous energy is converted into heat energy loss, so its heat dispersion also will improve greatly; Good, non-conductive with its its security performance of LED lamp of processing, also improve greatly non-friable useful life.Adopt above-mentioned in addition with led chip and wiring board and the lead between them; All be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Simplify production technology, can save production cost greatly.
Description of drawings
Combine embodiment that the present invention is further described with reference to the accompanying drawings.
Fig. 1 is the overall structure sketch map that the present invention plates many glasss of modules of ceramic layer substrate led light source.
Fig. 2 is the A-A generalized section of Fig. 1.
Fig. 3 is the structural representation that the present invention plates the base of many glasss of modules of ceramic layer substrate led light source.
Fig. 4 is the B-B generalized section of Fig. 3.
Embodiment
Come the present invention is carried out detailed explanation below in conjunction with specific embodiment.
As depicted in figs. 1 and 2, be a kind of structural representation that plates many glasss of modules of ceramic layer substrate led light source, comprise base 10 and some led chips 20; Like Fig. 3 and shown in Figure 4, said base 10 comprises substrate 1 and is arranged on several reflectors 2 on the substrate 1, and led chip 20 is bonded and fixed at the bottom of reflector 2 through insulating cement; The upper surface of said led chip 20 is coated with fluorescent material and glue layer 40, and the sidewall of said reflector 2 also is provided with opening 21, and the outside at reflector 2 on the substrate 1 also is provided with circuit board slot 3; Said circuit board slot 3 is " king " font; And extend into reflector sidewall 22, wiring board 30 is installed in the circuit board slot 3, said led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity; Base described in the present embodiment and reflector are circle, and said reflector is 6.
Said substrate 1 is to adopt one-body molded processing with reflector 2, or reflector 2 is bonded and fixed on the substrate 1.The light-emitting area that is used to install led chip on the said reflector 2 is coated with a ceramic layer 23, the whiteness of said ceramic layer 23 >=70; Be more preferred from >=85; The best is >=88.
In addition; Can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description; Supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production; All leads all are encapsulated in fluorescent material and the glue layer, better must reach the object of the invention.
Because traditional general whiteness of LED metab is all less than 70; Therefore in actual production, need light-emitting area above that to increase the reflector layer production process; But do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The present invention is employed in the ceramic layer that plates high whiteness on the light-emitting area of reflector, can both meet the requirement of whiteness >=70 according to the prefabricated size that processes needs of production needs; Can improve heat dispersion again, adopt above-mentionedly in addition, all be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer led chip and wiring board and the lead between them; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production; Simultaneously can adopt prefabricated mode Direct Production base, production efficiency will improve greatly.
Claims (9)
1. one kind is plated many glasss of modules of ceramic layer substrate led light source; Comprise base and led chip; Said base comprises substrate and is arranged on several reflectors on the substrate, and the bottom of each reflector is adhesively fixed with at least one led chip through insulating cement, and the upper surface of said led chip is coated with fluorescent material and glue layer; It is characterized in that: the light-emitting area that is used to install LED on the said reflector is coated with a ceramic layer, the whiteness of said ceramic layer >=70.
2. many glasss of modules of plating ceramic layer substrate led light source according to claim 1 is characterized in that: said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.
3. many glasss of modules of plating ceramic layer substrate led light source according to claim 1 is characterized in that: the whiteness of said ceramic layer is more preferred from >=and 85.
4. many glasss of modules of plating ceramic layer substrate led light source according to claim 1 is characterized in that: the whiteness of said ceramic layer is best for >=88.
5. many glasss of modules of plating ceramic layer substrate led light source according to claim 1; It is characterized in that: the sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
6. many glasss of modules of plating ceramic layer substrate led light source according to claim 5, it is characterized in that: the below of said circuit board slot is provided with a through hole and extends base.
7. many glasss of modules of plating ceramic layer substrate led light source according to claim 5, it is characterized in that: the bottom of said circuit board slot is lower than the bottom of reflector.
8. many glasss of modules of plating ceramic layer substrate led light source according to claim 1, it is characterized in that: said base and reflector are circle.
9. many glasss of modules of plating ceramic layer substrate led light source according to claim 1, it is characterized in that: said reflector is 6, said circuit board slot is " king " font.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110266614A CN102306647A (en) | 2011-09-09 | 2011-09-09 | LED (light emitting diode) illuminant multi-cup module of base plate with a ceramic plated layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110266614A CN102306647A (en) | 2011-09-09 | 2011-09-09 | LED (light emitting diode) illuminant multi-cup module of base plate with a ceramic plated layer |
Publications (1)
| Publication Number | Publication Date |
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| CN102306647A true CN102306647A (en) | 2012-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110266614A Pending CN102306647A (en) | 2011-09-09 | 2011-09-09 | LED (light emitting diode) illuminant multi-cup module of base plate with a ceramic plated layer |
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| CN (1) | CN102306647A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022331A (en) * | 2012-11-28 | 2013-04-03 | 福建省万邦光电科技有限公司 | Light-emitting diode (LED) encapsulation structure for integrated package |
| CN103090227A (en) * | 2012-12-29 | 2013-05-08 | 瑞安市亿星新能源有限公司 | Light emitting diode (LED) lighting board and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958388A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light source module encapsulating structure |
| TW201112388A (en) * | 2009-09-25 | 2011-04-01 | Shin Zu Shing Co Ltd | Light emitting diode packaging structure with composite structure substrate |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
| CN102106002A (en) * | 2008-08-21 | 2011-06-22 | 松下电器产业株式会社 | Light source for lighting |
| US20110182085A1 (en) * | 2010-01-26 | 2011-07-28 | Samsung Led Co., Ltd. | Led module and backlight unit having the same |
-
2011
- 2011-09-09 CN CN201110266614A patent/CN102306647A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102106002A (en) * | 2008-08-21 | 2011-06-22 | 松下电器产业株式会社 | Light source for lighting |
| TW201112388A (en) * | 2009-09-25 | 2011-04-01 | Shin Zu Shing Co Ltd | Light emitting diode packaging structure with composite structure substrate |
| US20110182085A1 (en) * | 2010-01-26 | 2011-07-28 | Samsung Led Co., Ltd. | Led module and backlight unit having the same |
| CN101958388A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light source module encapsulating structure |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022331A (en) * | 2012-11-28 | 2013-04-03 | 福建省万邦光电科技有限公司 | Light-emitting diode (LED) encapsulation structure for integrated package |
| CN103022331B (en) * | 2012-11-28 | 2016-11-23 | 福建省万邦光电科技有限公司 | The LED encapsulation structure of integration packaging |
| CN103090227A (en) * | 2012-12-29 | 2013-05-08 | 瑞安市亿星新能源有限公司 | Light emitting diode (LED) lighting board and manufacturing method thereof |
| CN103090227B (en) * | 2012-12-29 | 2017-07-11 | 瑞安市亿星新能源有限公司 | LED luminescent screens and its manufacture method |
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Application publication date: 20120104 |
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