CN102287672A - LED (Light Emitting Diode) light source module with ceramic-coating base plate - Google Patents
LED (Light Emitting Diode) light source module with ceramic-coating base plate Download PDFInfo
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- CN102287672A CN102287672A CN2011102666225A CN201110266622A CN102287672A CN 102287672 A CN102287672 A CN 102287672A CN 2011102666225 A CN2011102666225 A CN 2011102666225A CN 201110266622 A CN201110266622 A CN 201110266622A CN 102287672 A CN102287672 A CN 102287672A
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Abstract
The invention provides an LED (Light Emitting Diode) light source module with a ceramic-coating base plate. The LED light source module comprises a base and at least one LED chip. The base comprises a base plate and a plurality of straightly arranged light reflecting cups, the light reflecting cups are arranged on the base plate, and the at least one LED chip is fixedly adhered at the bottom of each light reflecting cup through an insulating adhesive, fluorescent powder and an adhesive layer are coated on the upper surface of each LED chip, a ceramic coating is plated on a luminescence surface of each light reflecting cup, the luminescence surface is used for mounting an LED, and the whiteness of the ceramic coating is larger than or equal to 70. According to the LED light source module with the ceramic-coating base plate, disclosed by the invention, the manufacturing process of light reflecting layers on a traditional LED metal base can be reduced, the production technique is simplified, the production cost can be largely saved, and the industrial production in large batch is facilitated; simultaneously, the base can be directly manufactured by a prefabricating manner, the whiteness of the base is improved and the luminescence efficiency of the LED chip is largely increased, thus the loss of the conversion from optical energy to heat can be largely reduced, the heat dissipation performance of the LED chip can be largely improved, and the LED lamp manufactured by the LED chips has good safety and largely prolonged service life, does not conduct electricity and is not easy to be broken.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, various lighting devices now have been widely used in, if traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp, its reflector efficiency is not high, particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier, as improving its whiteness as the reflector layer of reflector layer or pressing one deck white at its surface brush one deck white paint, but this way, at first its technology is complicated, production cost is higher, simultaneously, because after having increased one deck reflector layer, traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.Simultaneously, in traditional led light source module encapsulation construction, because needing lead-in wire between led chip and the wiring board is connected, but led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing, be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people, greatly reduce production efficiency, and production process also becomes more complicated, the increase production cost.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of and can either saves production cost, enhances productivity, and can keep the plating ceramic layer substrate led light source module of heat dispersion preferably again.
The technical solution used in the present invention is: a kind of plating ceramic layer substrate led light source module, comprise base and led chip, described base comprises substrate and the some reflectors arranged in a straight line that have that are arranged on the substrate, the bottom of each reflector is adhesively fixed with at least one led chip by insulating cement, the upper surface of described led chip is coated with fluorescent material and glue layer, it is characterized in that: the light-emitting area that is used to install LED on the described reflector is coated with a ceramic layer, the whiteness of described ceramic layer 〉=70
Described substrate and reflector are to adopt one-body molded making, or reflector is bonded and fixed on the substrate.
The light-emitting area whiteness that is used to install LED on the described reflector is more preferred from 〉=and 85.
Be used on the described reflector to install that the light-emitting area whiteness of LED is best is 〉=88.
The sidewall locations of described adjacent reflector is equipped with opening, forms one group of reflector of strip, also is provided with the circuit board slot on this base, and wiring board is installed in the groove, and described led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
The below of described circuit board slot is provided with a through hole and extends base.
Described circuit board slot is positioned at the reflector at the two ends of base.
The bottom of described circuit board slot is lower than the bottom of reflector.
Described base is a strip, and reflector is circular.
Compared with prior art, the present invention has following advantage: because described substrate and reflector are to adopt that metal material is one-body molded to be made, or after being bonded and fixed at reflector on the substrate, plating high whiteness ceramic layer again handles, the reflector layer production process that can reduce traditional LED to adopt metab and need to increase, both simplify production technology, can save production cost, helped large batch of suitability for industrialized production.The inventor finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to 〉=70, can promote well and get optical efficiency, and the heat dispersion excellence; Its whiteness is 〉=88 best results if lifting is better for 〉=85 effects if promote; Because after the whiteness of base improves, the getting optical efficiency and will promote greatly of led chip, therefore can significantly reduce luminous energy is converted into heat energy loss, so its heat dispersion also will improve greatly; Good, non-conductive with its its security performance of LED lamp of making, also improve greatly non-friable service life.Adopt above-mentioned in addition with led chip and wiring board and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, simplify production technology, can save production cost greatly.
Description of drawings
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the overall structure schematic diagram that the present invention plates ceramic layer substrate led light source module.
Fig. 2 is the A-A generalized section of Fig. 1.
Fig. 3 is the structural representation that the present invention plates the base of ceramic layer substrate led light source module.
Fig. 4 is the A-A generalized section of Fig. 3.
The specific embodiment
The present invention will be described in detail below in conjunction with specific embodiment.
As depicted in figs. 1 and 2, it is a kind of structural representation that plates ceramic layer substrate led light source module, comprise base 10 and some led chips 20, as shown in Figure 3 and Figure 4, described base 10 comprises substrate 1 and the some reflectors arranged in a straight line 2 that have that are arranged on the substrate 1, sidewall 22 positions of adjacent reflector 2 are equipped with opening 21, therefore form one group of reflector of strip, the bottom of the reflector at the two ends of this base 10 is respectively equipped with circuit board slot 3, the bottom of described circuit board slot 3 is lower than the bottom of reflector 2, is convenient to after wiring board is installed equal with the reflector bottom.Led chip 20 is bonded and fixed at the bottom of one group of reflector 2 of strip by insulating cement, the upper surface of described led chip 20 is coated with fluorescent material and glue layer 40, wiring board 30 is installed in the circuit board slot 3, described led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity, base described in the present embodiment is a strip, and reflector is circle.
Described substrate 1 and reflector 2 are to adopt one-body molded making, or reflector 2 is bonded and fixed on the substrate 1.The light-emitting area that is used to install led chip on the described reflector 2 is coated with a ceramic layer 23, the whiteness of described ceramic layer 23 〉=70; Be more preferred from 〉=85; The best is 〉=88.
In addition, can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description, supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production, all leads all are encapsulated in fluorescent material and the glue layer, better must reach purpose of the present invention.
Because traditional general whiteness of LED metab is all less than 70, therefore in actual production, need light-emitting area thereon to increase the reflector layer production process, but do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The present invention adopts the ceramic layer that plates high whiteness on the light-emitting area of reflector, can be according to producing the prefabricated size that processes needs of needs, both met the requirement of whiteness 〉=70, can improve heat dispersion again, adopt above-mentioned in addition with led chip and wiring board and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production, can adopt prefabricated mode directly to produce base simultaneously, production efficiency will improve greatly.
Claims (9)
1. one kind is plated ceramic layer substrate led light source module, comprise base and led chip, described base comprises substrate and the some reflectors arranged in a straight line that have that are arranged on the substrate, the bottom of each reflector is adhesively fixed with at least one led chip by insulating cement, the upper surface of described led chip is coated with fluorescent material and glue layer, it is characterized in that: the light-emitting area that is used to install LED on the described reflector is coated with a ceramic layer, the whiteness of described ceramic layer 〉=70.
2. plating ceramic layer substrate led light source module according to claim 1 is characterized in that: described substrate and reflector are to adopt one-body molded making, or reflector is bonded and fixed on the substrate.
3. plating ceramic layer substrate led light source module according to claim 1 is characterized in that: the light-emitting area whiteness that is used to install LED on the described reflector is more preferred from 〉=and 85.
4. plating ceramic layer substrate led light source module according to claim 1 is characterized in that: be used on the described reflector to install that the light-emitting area whiteness of LED is best is 〉=88.
5. plating ceramic layer substrate led light source module according to claim 1, it is characterized in that: the sidewall locations of described adjacent reflector is equipped with opening, form one group of reflector of strip, also be provided with the circuit board slot on this base, wiring board is installed in the groove, and described led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
6. plating ceramic layer substrate led light source module according to claim 5, it is characterized in that: the below of described circuit board slot is provided with a through hole and extends base.
7. plating ceramic layer substrate led light source module according to claim 6, it is characterized in that: described circuit board slot is positioned at the reflector at the two ends of base.
8. plating ceramic layer substrate led light source module according to claim 5, it is characterized in that: the bottom of described circuit board slot is lower than the bottom of reflector.
9. plating ceramic layer substrate led light source module according to claim 1, it is characterized in that: it is characterized in that: described base is a strip, reflector is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102666225A CN102287672A (en) | 2011-09-09 | 2011-09-09 | LED (Light Emitting Diode) light source module with ceramic-coating base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102666225A CN102287672A (en) | 2011-09-09 | 2011-09-09 | LED (Light Emitting Diode) light source module with ceramic-coating base plate |
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| CN102287672A true CN102287672A (en) | 2011-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102666225A Pending CN102287672A (en) | 2011-09-09 | 2011-09-09 | LED (Light Emitting Diode) light source module with ceramic-coating base plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109519735A (en) * | 2017-09-19 | 2019-03-26 | 盐城金意光电科技有限公司 | A kind of LED polishing mould group production method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1601768A (en) * | 2003-09-22 | 2005-03-30 | 福建省苍乐电子企业有限公司 | LED structure |
| US20060226777A1 (en) * | 2005-04-07 | 2006-10-12 | Cunningham David W | Incandescent lamp incorporating extended high-reflectivity IR coating and lighting fixture incorporating such an incandescent lamp |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
| CN102106002A (en) * | 2008-08-21 | 2011-06-22 | 松下电器产业株式会社 | Light source for lighting |
-
2011
- 2011-09-09 CN CN2011102666225A patent/CN102287672A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1601768A (en) * | 2003-09-22 | 2005-03-30 | 福建省苍乐电子企业有限公司 | LED structure |
| US20060226777A1 (en) * | 2005-04-07 | 2006-10-12 | Cunningham David W | Incandescent lamp incorporating extended high-reflectivity IR coating and lighting fixture incorporating such an incandescent lamp |
| CN102106002A (en) * | 2008-08-21 | 2011-06-22 | 松下电器产业株式会社 | Light source for lighting |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
Non-Patent Citations (1)
| Title |
|---|
| 吴建锋等: "氧化铝陶瓷激光泵浦腔的研制", 《硅酸盐通报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109519735A (en) * | 2017-09-19 | 2019-03-26 | 盐城金意光电科技有限公司 | A kind of LED polishing mould group production method |
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Application publication date: 20111221 |