CN202259396U

CN202259396U - High-whiteness substrate based LED light source single-cup module

Info

Publication number: CN202259396U
Application number: CN2011203376329U
Authority: CN
Inventors: 何文铭; 唐秋熙; 童庆锋; 申小飞
Original assignee: FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Current assignee: FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2011-09-09
Filing date: 2011-09-09
Publication date: 2012-05-30
Anticipated expiration: 2021-09-09

Abstract

The utility model provides a high-whiteness substrate based LED light source single-cup module, comprising a base and at least one LED chip, wherein the base comprises a substrate and a reflection cup arranged on the substrate, the LED chip is bonded and fixed at the bottom of the reflection cup through insulating glue, the upper surface of the LED chip is coated with fluorescent powder and a glue layer, and the reflection cup is used for mounting the light emitting surface with whiteness more than or equal to 70, of an LED. The high-whiteness substrate based LED light source single-cup module can enable the manufacture process of the reflection layer on the traditional LED metal base to be reduced, thereby simplifying production process, greatly saving production cost and being helpful for a large scale of industrialized production; the base can be directly manufactured in a mode of prefabrication, and the whiteness of the base is increased, such that the light utilization efficiency of the LED chip is greatly increased, thereby greatly reducing the energy loss in the process of converting light energy into heat energy, and also greatly increasing heat radiation performance; and the LED lamp prepared according to the technical scheme is excellent in safety performance, is non-conducting, and is not easy to be broken, thereby greatly prolonging the service life of the LED lamp.

Description

Single glass of module of high whiteness substrate led light source

Technical field

The utility model relates to a kind of lighting apparatus, relates in particular to a kind of LED lamp.

Background technology

LED is a kind of low voltage light sources, because its power saving, life-span are long, has been widely used in various lighting devices at present; If traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp; Its reflector efficiency is not high; Particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier, as improving its whiteness as the reflector layer of reflector layer or pressing one deck white at its surface brush one deck white paint, but this way; At first its technology is complicated; Production cost is higher, simultaneously, because after having increased one deck reflector layer; Traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.Simultaneously, in traditional led light source module encapsulation construction, be connected owing to need lead-in wire between led chip and the wiring board; But led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing; Be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people; Greatly reduce production efficiency, and production process also becomes more complicated, the increase production cost.

Summary of the invention

The technical problem that the utility model will solve is to provide a kind of and can either saves production cost, enhances productivity, and can keep single glass of module of high whiteness substrate led light source of heat dispersion preferably again.

The technical scheme that the utility model adopts is: single glass of module of a kind of high whiteness substrate led light source; Comprise base and at least one led chip; Said base comprises substrate and is arranged on the reflector on the substrate; Led chip is bonded and fixed at the bottom of reflector through insulating cement, and the upper surface of said led chip is coated with fluorescent material and glue layer, it is characterized in that: said base adopts the pottery of high whiteness or one-body molded the firing of glass to form; Perhaps substrate is to adopt the pottery or the glass of high whiteness to process, and reflector is bonded and fixed on the substrate.

Be used to install light-emitting area whiteness >=70 of LED on the said reflector, be more preferred from >=85, the best is >=88.

Also be provided with sulculus on the said substrate, wiring board is installed in the sulculus, said led chip leads to after serial or parallel connection connects and draws both positive and negative polarity on the wiring board.

Said sulculus is located at the outside of reflector, and extends into the reflector sidewall.

Said sulculus is located at the bottom of reflector, and the below of this sulculus is provided with a through hole and extends base.

Compared with prior art; The utlity model has following advantage: owing to substrate and reflector adopt with pottery or glass through one-body molded fire the high whiteness LED base that forms after; The reflector layer production process that can adopt prefabricated mode Direct Production base can reduce traditional LED employing metab and need to increase; Both simplify production technology, can save production cost, helped large batch of suitability for industrialized production.The utility model people finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to >=70, he can promote well and get optical efficiency, and heat dispersion is excellent; Its whiteness is >=88 best results if lifting is better for >=85 effects if promote; Because after the whiteness of base improves, the getting optical efficiency and will promote greatly of led chip, therefore can significantly reduce luminous energy is converted into heat energy loss, so its heat dispersion also will improve greatly; Good, non-conductive with its its security performance of LED lamp of processing, also improve greatly non-friable useful life.Adopt above-mentioned in addition with led chip and wiring board and the lead between them; All be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Simplify production technology, can save production cost greatly.

Description of drawings

Combine embodiment that the utility model is further described with reference to the accompanying drawings.

Fig. 1 is the overall structure sketch map of single glass of module of the utility model high whiteness substrate led light source.

Fig. 2 is the A-A generalized section of Fig. 1.

Fig. 3 is the structural representation of the base of single glass of module of the utility model high whiteness substrate led light source.

Fig. 4 is the B-B generalized section of Fig. 3.

Embodiment

Come the utility model is carried out detailed explanation below in conjunction with specific embodiment.

As depicted in figs. 1 and 2, be the structural representation of single glass of module of a kind of high whiteness substrate led light source, comprise base 10 and some led chips 20; Like Fig. 3 and shown in Figure 4, said base 10 comprises substrate 1 and is arranged on the reflector 2 on the substrate 1, and led chip 20 is bonded and fixed at the bottom of reflector 2 through insulating cement; The upper surface of said led chip 20 is coated with fluorescent material and glue layer 40; Also be provided with sulculus 3 on the said substrate 1, said sulculus 3 is located at the outside of reflector 2, and extends into reflector sidewall 22; Wiring board 30 is installed in the sulculus 3, and said led chip 20 leads on the wiring board 30 after serial or parallel connection connects and draws both positive and negative polarity.

Said base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to process, and reflector is bonded and fixed on the substrate.Be used to install light-emitting area whiteness >=70 of LED on the said reflector, be more preferred from >=85, the best is >=88.

Therefore traditional general whiteness of LED metab needs light-emitting area above that to increase the reflector layer production process in actual production all less than 70, but do like this heat dispersion of LED base is reduced greatly, and increase production process, has also increased production cost.The utility model adopts the pottery or the glass base of high whiteness, according to the prefabricated size that processes needs of production needs, has both met the requirement of whiteness >=70; Can improve heat dispersion again, adopt above-mentionedly in addition, all be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer led chip and wiring board and the lead between them; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production; Simultaneously can adopt prefabricated mode Direct Production base, production efficiency will improve greatly.

In addition; Sulculus 3 in the foregoing description also can be located at the bottom of reflector 2; And below this sulculus 3, be provided with a through hole and extend base; Supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can reach the purpose of the utility model equally.

Claims

1. single glass of module of one kind high whiteness substrate led light source; Comprise base and at least one led chip, said base comprises substrate and is arranged on the reflector on the substrate, and led chip is bonded and fixed at the bottom of reflector through insulating cement; The upper surface of said led chip is coated with fluorescent material and glue layer; It is characterized in that: said base adopts the pottery of high whiteness or one-body molded the firing of glass to form, and perhaps substrate is to adopt the pottery or the glass of high whiteness to process, and reflector is bonded and fixed on the substrate.

2. single glass of module of high whiteness substrate led light source according to claim 1 is characterized in that: also be provided with sulculus on the said substrate, wiring board is installed in the sulculus, said led chip leads to after serial or parallel connection connects and draws both positive and negative polarity on the wiring board.

3. single glass of module of high whiteness substrate led light source according to claim 2, it is characterized in that: said sulculus is located at the outside of reflector, and extends into the reflector sidewall.

4. single glass of module of high whiteness substrate led light source according to claim 2, it is characterized in that: said sulculus is located at the bottom of reflector, and the below of this sulculus is provided with a through hole and extends base.