CN202253002U

CN202253002U - Light-emitting diode (LED) light source module with substrate coated with ceramic layer

Info

Publication number: CN202253002U
Application number: CN2011203376032U
Authority: CN
Inventors: 何文铭; 唐秋熙; 童庆锋; 申小飞
Original assignee: FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Current assignee: FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2011-09-09
Filing date: 2011-09-09
Publication date: 2012-05-30
Anticipated expiration: 2021-09-09

Abstract

The utility model provides a light-emitting diode (LED) light source module with a substrate coated with a ceramic layer. The LED light source module with the substrate coated with the ceramic layer comprises a base and LED chips. The base comprises the substrate and a plurality of linearly arranged reflector cups which are arranged on the substrate. At least one LED chip is fixedly bonded at the bottom of each reflector cup through insulating glue. Fluorescent powder and a glue layer are coated on the upper surface of each LED chip. The ceramic layer is coated on luminous surfaces of the reflector cups for installing LEDs. The whiteness of the ceramic layer is larger than or equal to 70. The LED light source module with the substrate coated with the ceramic layer has the advantages that the manufacturing process of a light reflecting layer on the traditional LED metallic base can be reduced, the production process is simplified, the production cost can be greatly saved and the large-scale industrial production is facilitated; the base can be directly produced by adopting a prefabricating method; and since the light extraction efficiency of the LED chips is greatly improved after the whiteness of the base is improved, the loss caused by conversion from optical energy into heat energy can be greatly improved, the radiating performance is greatly improved, the safety of an LED lamp made of the LED light source module is good, the LED lamp does not conduct electricity, the LED lamp is not apt to be broken and the service life is also greatly improved.

Description

Plating ceramic layer substrate led light source module

Technical field

The utility model relates to a kind of lighting apparatus, relates in particular to a kind of LED lamp.

Background technology

LED is a kind of low voltage light sources, because its power saving, life-span are long, has been widely used in various lighting devices at present; If traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp; Its reflector efficiency is not high; Particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier, as improving its whiteness as the reflector layer of reflector layer or pressing one deck white at its surface brush one deck white paint, but this way; At first its technology is complicated; Production cost is higher, simultaneously, because after having increased one deck reflector layer; Traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.Simultaneously, in traditional led light source module encapsulation construction, be connected owing to need lead-in wire between led chip and the wiring board; But led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing; Be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people; Greatly reduce production efficiency, and production process also becomes more complicated, the increase production cost.

Summary of the invention

The technical problem that the utility model will solve is to provide a kind of and can either saves production cost, enhances productivity, and can keep the plating ceramic layer substrate led light source module of heat dispersion preferably again.

The technical scheme that the utility model adopts is: a kind of plating ceramic layer substrate led light source module; Comprise base and led chip; Said base comprises substrate and is arranged on the some reflectors arranged in a straight line that have on the substrate; The bottom of each reflector is adhesively fixed with at least one led chip through insulating cement, and the upper surface of said led chip is coated with fluorescent material and glue layer, it is characterized in that: the light-emitting area that is used to install LED on the said reflector is coated with the ceramic layer of a high whiteness.

Said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.

Be used to install light-emitting area whiteness >=70 of LED on the said reflector, be more preferred from >=85, the best is >=88.

The sidewall locations of said adjacent reflector is equipped with opening, forms one group of reflector of strip, also is provided with the circuit board slot on this base, and wiring board is installed in the groove, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.

The below of said circuit board slot is provided with a through hole and extends base.

Said circuit board slot is positioned at the reflector at the two ends of base.

The bottom of said circuit board slot is lower than the bottom of reflector.

Said base is a strip, and reflector is circular.

Compared with prior art; The utlity model has following advantage:, or after being bonded and fixed at reflector on the substrate, plate high whiteness ceramic layer processing again because said substrate and reflector are to adopt that metal material is one-body molded to be processed; The reflector layer production process that can reduce traditional LED to adopt metab and need to increase; Both simplify production technology, can save production cost, helped large batch of suitability for industrialized production.The utility model people finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to >=70, he can promote well and get optical efficiency, and heat dispersion is excellent; Its whiteness is >=88 best results if lifting is better for >=85 effects if promote; Because after the whiteness of base improves, the getting optical efficiency and will promote greatly of led chip, therefore can significantly reduce luminous energy is converted into heat energy loss, so its heat dispersion also will improve greatly; Good, non-conductive with its its security performance of LED lamp of processing, also improve greatly non-friable service life.Adopt above-mentioned in addition with led chip and wiring board and the lead between them; All be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Simplify production technology, can save production cost greatly.

Description of drawings

Combine embodiment that the utility model is further described with reference to the accompanying drawings.

Fig. 1 is the overall structure sketch map of the utility model plating ceramic layer substrate led light source module.

Fig. 2 is the A-A generalized section of Fig. 1.

Fig. 3 is the structural representation of the base of the utility model plating ceramic layer substrate led light source module.

Fig. 4 is the A-A generalized section of Fig. 3.

The specific embodiment

Come the utility model is carried out detailed explanation below in conjunction with specific embodiment.

As depicted in figs. 1 and 2; Be a kind of structural representation that plates ceramic layer substrate led light source module, comprise base 10 and some led chips 20, like Fig. 3 and shown in Figure 4; Said base 10 comprises substrate 1 and is arranged on the some reflectors arranged in a straight line 2 that have on the substrate 1; Sidewall 22 positions of adjacent reflector 2 are equipped with opening 21, therefore form one group of reflector of strip, and the bottom of the reflector at the two ends of this base 10 is respectively equipped with circuit board slot 3; The bottom of said circuit board slot 3 is lower than the bottom of reflector 2, is convenient to after wiring board is installed equal with the reflector bottom.Led chip 20 is bonded and fixed at the bottom of one group of reflector 2 of strip through insulating cement; The upper surface of said led chip 20 is coated with fluorescent material and glue layer 40; Wiring board 30 is installed in the circuit board slot 3; Said led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity, and base described in the present embodiment is a strip, and reflector is circle.

Said substrate 1 is to adopt one-body molded processing with reflector 2, or reflector 2 is bonded and fixed on the substrate 1.The light-emitting area that is used to install led chip on the said reflector 2 is coated with a ceramic layer 23, the whiteness of said ceramic layer 23 >=70; Be more preferred from >=85; The best is >=88.

In addition; Can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description; Supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production; All leads all are encapsulated in fluorescent material and the glue layer the better purpose that must reach the utility model.

Because traditional general whiteness of LED metab is all less than 70; Therefore in actual production, need light-emitting area above that to increase the reflector layer production process; But do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The utility model is employed in the ceramic layer that plates high whiteness on the light-emitting area of reflector, can both meet the requirement of whiteness >=70 according to the prefabricated size that processes needs of production needs; Can improve heat dispersion again, adopt above-mentionedly in addition, all be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer led chip and wiring board and the lead between them; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production; Simultaneously can adopt prefabricated mode Direct Production base, production efficiency will improve greatly.

Claims

1. one kind is plated ceramic layer substrate led light source module; Comprise base and led chip; Said base comprises substrate and is arranged on the some reflectors arranged in a straight line that have on the substrate; The bottom of each reflector is adhesively fixed with at least one led chip through insulating cement, and the upper surface of said led chip is coated with fluorescent material and glue layer, it is characterized in that: the light-emitting area that is used to install LED on the said reflector is coated with the ceramic layer of a high whiteness.

2. plating ceramic layer substrate led light source module according to claim 1 is characterized in that: said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.

3. plating ceramic layer substrate led light source module according to claim 1; It is characterized in that: the sidewall locations of said adjacent reflector is equipped with opening; Form one group of reflector of strip; Also be provided with the circuit board slot on this base, wiring board is installed in the groove, said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.

4. plating ceramic layer substrate led light source module according to claim 3, it is characterized in that: the below of said circuit board slot is provided with a through hole and extends base.

5. plating ceramic layer substrate led light source module according to claim 4, it is characterized in that: said circuit board slot is positioned at the reflector at the two ends of base.

6. plating ceramic layer substrate led light source module according to claim 4, it is characterized in that: the bottom of said circuit board slot is lower than the bottom of reflector.

7. plating ceramic layer substrate led light source module according to claim 1, it is characterized in that: it is characterized in that: said base is a strip, reflector is circular.