CN102287661A - Light emitting diode (LED) down lamp for ceramic layer plating base plate - Google Patents
Light emitting diode (LED) down lamp for ceramic layer plating base plate Download PDFInfo
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- CN102287661A CN102287661A CN2011102666136A CN201110266613A CN102287661A CN 102287661 A CN102287661 A CN 102287661A CN 2011102666136 A CN2011102666136 A CN 2011102666136A CN 201110266613 A CN201110266613 A CN 201110266613A CN 102287661 A CN102287661 A CN 102287661A
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- ceramic layer
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- reflector
- down lamp
- lamp
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Abstract
The invention provides a light emitting diode (LED) down lamp for a ceramic layer plating base plate, which comprises a lamp holder, a heat radiator, a lamp cover, an LED light source module and a transparent cover, wherein the LED light source module is arranged in the lamp cover, the opening part under the lamp cover is also provided with the transparent cover, the heat radiator is also arranged on the lamp cover, and the lamp holder is arranged outside the lamp cover. The LED down lamp is characterized in that the LED light source module comprises a base and an LED chip, the base comprises a base plate and at least one reflecting cup arranged on the base plate, the bottom of the reflecting cup is glued and fixed with at least one LED chip through insulating glue, fluorescent powder and a glue water layer are coated on the upper surface of the LED chip, a ceramic layer is plated on a luminous surface which is used for installing LEDs on the reflecting cup, and the whiteness of the ceramic layer is greater than or equal to 70. When the structure is adopted, the manufactured LED lamp has the advantages of good safety performance, nonconductivity, cracking difficulty and reduced weight, in addition, the production cost can be greatly saved, and the large-scale industrialized production is favorably realized.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, now has been widely used in various lighting devices, and traditional LED bulb lamp all adopts the die casting fin of band dentation, and production technology is complexity, and production cost is higher; Simultaneously, traditional led light source module encapsulation construction generally comprises a metab with reflector, and its heat dispersion is relatively poor, particularly can't solve the heat dissipation problem of high-power LED light source module.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of and can either saves production cost, can keep the plating ceramic layer substrate LED Down lamp of heat dispersion preferably again.
The technical solution used in the present invention is: a kind of plating ceramic layer substrate LED Down lamp, comprise lamp bracket, radiator, lampshade, led light source module and translucent cover, described led light source module is installed in the lampshade, translucent cover also is equipped with at the lower opening place of lampshade, radiator also is installed on the lampshade, lamp bracket is installed in the outside of lampshade, it is characterized in that: described led light source module, comprise base and led chip, described base comprises substrate and at least one reflector that is arranged on the substrate, the bottom of reflector is adhesively fixed with at least one led chip by insulating cement, the upper surface of described led chip is coated with fluorescent material and glue layer, the light-emitting area that is used to install LED on the described reflector is coated with a ceramic layer, the whiteness of described ceramic layer 〉=70.
Described substrate and reflector are to adopt one-body molded making, or reflector is bonded and fixed on the substrate.
The whiteness of described ceramic layer is more preferred from 〉=and 85.
Whiteness the best of described ceramic layer is 〉=88.
The sidewall of described reflector also is provided with opening, also be concaved with a circuit board slot on the described base, this circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and described led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
The below of described circuit board slot is provided with a through hole and extends base.
The bottom of described circuit board slot is lower than the bottom of reflector.
Described base and reflector are circle.
Compared with prior art, the present invention has following advantage: after employing had the LED base plate for packaging of high whiteness, the heat dispersion of led light source module improves, and was non-conductive, non-friable; Its security performance of LED lamp of making is good, and weight lightens, and can save production cost greatly, helps large batch of suitability for industrialized production.
Description of drawings
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the STRUCTURE DECOMPOSITION schematic diagram that the present invention plates ceramic layer substrate LED Down lamp.
Fig. 2 is the structural representation that the present invention plates the led light source module of ceramic layer substrate LED Down lamp.
Fig. 3 is the A-A generalized section of Fig. 2.
Fig. 4 is the structural representation of the base of led light source module.
Fig. 5 is the B-B generalized section of Fig. 4.
The specific embodiment
The present invention will be described in detail below in conjunction with specific embodiment.
As shown in Figure 1, a kind of plating ceramic layer substrate LED Down lamp, comprise lamp bracket 100, radiator 200, lampshade 300, led light source module 400, power unit (not shown) and translucent cover 500, described led light source module 400 is installed in the lampshade 300, translucent cover 500 also is equipped with at the lower opening place of lampshade 300, the position of dress led light source module 400 also is equipped with radiator 200 on the lampshade 300, and lamp bracket is installed in the outside of lampshade 300, and led light source module 400 connects power unit by electric wire.
As shown in Figures 2 and 3, a kind of structural representation that plates many glasss of modules of ceramic layer substrate led light source, comprise base 10 and some led chips 20, as shown in Figure 4 and Figure 5, described base 10 comprises substrate 1 and several reflectors 2 that are arranged on the substrate 1, led chip 20 is bonded and fixed at the bottom of reflector 2 by insulating cement, the upper surface of described led chip 20 is coated with fluorescent material and glue layer 40, the sidewall 22 of described reflector 2 also is provided with opening 21, outside at reflector 2 on the substrate 1 also is provided with circuit board slot 3, described circuit board slot 3 is " king " font, and extend into reflector sidewall 22, wiring board 30 is installed in the circuit board slot 3, described led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity, base described in the present embodiment and reflector are circle, and described reflector is 6.
Described substrate 1 and reflector 2 are to adopt one-body molded making, or reflector 2 is bonded and fixed on the substrate 1.The light-emitting area that is used to install led chip on the described reflector 2 is coated with a ceramic layer 23, the whiteness of described ceramic layer 23 〉=70; Be more preferred from 〉=85; The best is 〉=88.
In addition, can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description, supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production, all leads all are encapsulated in fluorescent material and the glue layer, better must reach purpose of the present invention.
Because traditional general whiteness of LED metab is all less than 70, therefore in actual production, need light-emitting area thereon to increase the reflector layer production process, but do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The present invention adopts the pottery or the glass base of high whiteness, according to producing the prefabricated size that processes needs of needs, both met the requirement of whiteness 〉=70, can improve heat dispersion again, adopt above-mentioned in addition with led chip and wiring board and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production, can adopt prefabricated mode directly to produce base simultaneously, production efficiency will improve greatly.
Claims (8)
1. one kind is plated ceramic layer substrate LED Down lamp, comprise lamp bracket, radiator, lampshade, led light source module and translucent cover, described led light source module is installed in the lampshade, translucent cover also is equipped with at the lower opening place of lampshade, radiator also is installed on the lampshade, lamp bracket is installed in the outside of lampshade, it is characterized in that: described led light source module, comprise base and led chip, described base comprises substrate and at least one reflector that is arranged on the substrate, the bottom of reflector is adhesively fixed with at least one led chip by insulating cement, the upper surface of described led chip is coated with fluorescent material and glue layer, the light-emitting area that is used to install LED on the described reflector is coated with a ceramic layer, the whiteness of described ceramic layer 〉=70.
2. plating ceramic layer substrate LED Down lamp according to claim 1 is characterized in that: described substrate and reflector are to adopt one-body molded making, or reflector is bonded and fixed on the substrate.
3. plating ceramic layer substrate LED Down lamp according to claim 1 is characterized in that: the whiteness of described ceramic layer is more preferred from 〉=and 85.
4. plating ceramic layer substrate LED Down lamp according to claim 1 is characterized in that: the whiteness of described ceramic layer is best for 〉=88.
5. plating ceramic layer substrate LED Down lamp according to claim 1, it is characterized in that: the sidewall of described reflector also is provided with opening, also be concaved with a circuit board slot on the described base, this circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, described led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
6. plating ceramic layer substrate LED Down lamp according to claim 5, it is characterized in that: the below of described circuit board slot is provided with a through hole and extends base.
7. plating ceramic layer substrate LED Down lamp according to claim 5, it is characterized in that: the bottom of described circuit board slot is lower than the bottom of reflector.
8. plating ceramic layer substrate LED Down lamp according to claim 1, it is characterized in that: described base and reflector are circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102666136A CN102287661A (en) | 2011-09-09 | 2011-09-09 | Light emitting diode (LED) down lamp for ceramic layer plating base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102666136A CN102287661A (en) | 2011-09-09 | 2011-09-09 | Light emitting diode (LED) down lamp for ceramic layer plating base plate |
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| Publication Number | Publication Date |
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| CN102287661A true CN102287661A (en) | 2011-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102666136A Pending CN102287661A (en) | 2011-09-09 | 2011-09-09 | Light emitting diode (LED) down lamp for ceramic layer plating base plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016155140A1 (en) * | 2015-03-27 | 2016-10-06 | 吴鼎鼎 | Led lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009295578A (en) * | 2008-06-02 | 2009-12-17 | Advanced Optoelectronic Technology Inc | Photocatalyst illuminating device |
| KR100956057B1 (en) * | 2009-10-06 | 2010-05-07 | 송민훈 | Led lamp |
| CN201748237U (en) * | 2010-08-31 | 2011-02-16 | 史杰 | Light-emitting diode (LED) recessed light |
| CN201795325U (en) * | 2010-07-23 | 2011-04-13 | 浙江大发灯具有限公司 | Multipurpose led down lamp |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
| CN102106002A (en) * | 2008-08-21 | 2011-06-22 | 松下电器产业株式会社 | Light source for lighting |
-
2011
- 2011-09-09 CN CN2011102666136A patent/CN102287661A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009295578A (en) * | 2008-06-02 | 2009-12-17 | Advanced Optoelectronic Technology Inc | Photocatalyst illuminating device |
| CN102106002A (en) * | 2008-08-21 | 2011-06-22 | 松下电器产业株式会社 | Light source for lighting |
| KR100956057B1 (en) * | 2009-10-06 | 2010-05-07 | 송민훈 | Led lamp |
| CN201795325U (en) * | 2010-07-23 | 2011-04-13 | 浙江大发灯具有限公司 | Multipurpose led down lamp |
| CN201748237U (en) * | 2010-08-31 | 2011-02-16 | 史杰 | Light-emitting diode (LED) recessed light |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
Non-Patent Citations (1)
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| 吴建锋 等: ""氧化铝陶瓷激光泵浦腔的研制"", 《硅酸盐通报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016155140A1 (en) * | 2015-03-27 | 2016-10-06 | 吴鼎鼎 | Led lamp |
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Application publication date: 20111221 |