CN102287660A - Light emitting diode (LED) bulb with plastic case for high-whiteness base plate - Google Patents
Light emitting diode (LED) bulb with plastic case for high-whiteness base plate Download PDFInfo
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- CN102287660A CN102287660A CN2011102665966A CN201110266596A CN102287660A CN 102287660 A CN102287660 A CN 102287660A CN 2011102665966 A CN2011102665966 A CN 2011102665966A CN 201110266596 A CN201110266596 A CN 201110266596A CN 102287660 A CN102287660 A CN 102287660A
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- led
- reflector
- plastic casing
- substrate
- light source
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a light emitting diode (LED) bulb with a plastic case for a high-whiteness base plate, which comprises a lamp head, the plastic case, a support frame, an LED light source module, a power supply part and a transparent cover, wherein the LED light source module comprises a base and an LED chip, the base comprises a base plate and at least one reflecting cup arranged on the base plate, the bottom of the reflecting cup is glued and fixed with at least one LED chip through insulating glue, fluorescent powder and a glue water layer are coated on the upper surface of the LED chip, and the whiteness of the luminous surface used for installing LEDs on the reflecting cup is greater than or equal to 70. When the structure is adopted, the manufactured LED lamp has the advantages of good safety performance, nonconductivity, cracking difficulty and reduced weight, in addition, the production cost can be greatly saved, and the large-scale industrialized production is favorably realized.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, now has been widely used in various lighting devices, and traditional LED bulb lamp all adopts the die casting fin of band dentation, and production technology is complexity, and production cost is higher; Simultaneously, traditional led light source module encapsulation construction generally comprises a metab with reflector, and its heat dispersion is relatively poor, particularly can't solve the heat dissipation problem of high-power LED light source module.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of and can either saves production cost, can keep the high whiteness substrate LED bulb lamp of the band plastic casing of heat dispersion preferably again.
The technical solution used in the present invention is: a kind of high whiteness substrate LED bulb lamp with plastic casing, comprise lamp holder, support, the led light source module, power unit and translucent cover, the led light source module connects power unit by electric wire, translucent cover also is equipped with in the surface of light source outside of led light source module, it is characterized in that: described LED bulb lamp also comprises a plastic casing, the fixedly connected plastic casing of one end of described support, the fixedly connected lamp holder of the other end, plastic casing is set in the outside of led light source module, described led light source module, comprise base and led chip, described base comprises substrate and at least one reflector that is arranged on the substrate, the bottom of reflector is adhesively fixed with at least one led chip by insulating cement, the upper surface of described led chip is coated with fluorescent material and glue layer, is used to install light-emitting area whiteness 〉=70 of LED on the described reflector.
Described base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to make, and reflector is bonded and fixed on the substrate.
The light-emitting area whiteness that is used to install LED on the described reflector is more preferred from 〉=and 85.
Be used on the described reflector to install that the light-emitting area whiteness of LED is best is 〉=88.
The sidewall of described reflector also is provided with opening, also be concaved with a circuit board slot on the described base, this circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and described led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
The below of described circuit board slot is provided with a through hole and extends base.
The bottom of described circuit board slot is lower than the bottom of reflector.
Described base and reflector are circle.
Compared with prior art, the present invention has following advantage: after employing has the LED base plate for packaging of high whiteness, getting optical efficiency is greatly improved, therefore the heat dispersion of led light source module improves greatly, can save the heat spreader structures in traditional LED, directly adopt plastic casing, make whole lamp outside non-conductive, non-friable; Its security performance of LED lamp of making is good, and weight lightens, and can save production cost greatly, helps large batch of suitability for industrialized production.
Description of drawings
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the overall appearance schematic diagram of the high whiteness substrate LED bulb lamp of band plastic casing of the present invention.
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of the high whiteness substrate LED bulb lamp of band plastic casing of the present invention.
Fig. 3 is the structural representation of led light source module of the high whiteness substrate LED bulb lamp of band plastic casing of the present invention.
Fig. 4 is the A-A generalized section of Fig. 3.
Fig. 5 is the structural representation of the base of led light source module.
Fig. 6 is the B-B generalized section of Fig. 5.
The specific embodiment
The present invention will be described in detail below in conjunction with specific embodiment.
As shown in Figure 1, a kind of high whiteness substrate LED bulb lamp with plastic casing, comprise lamp holder 100, plastic casing 200, support 300, led light source module 400, power unit 500 and translucent cover 600, the fixedly connected plastic casing 200 of one end of described support 300, the fixedly connected lamp holder 100 of the other end, plastic casing 200 is set in the outside of led light source module 400, led light source module 400 connects power unit 500 by electric wire 501, and translucent cover 600 also is equipped with in the surface of light source outside of led light source module 400.
As shown in Figures 2 and 3, it is the structural representation of many glasss of modules of a kind of high whiteness substrate led light source, comprise base 10 and some led chips 20, as shown in Figure 4 and Figure 5, described base 10 comprises substrate 1 and several reflectors 2 that are arranged on the substrate 1, led chip 20 is bonded and fixed at the bottom of reflector 2 by insulating cement, the upper surface of described led chip 20 is coated with fluorescent material and glue layer 40, the sidewall 22 of described reflector 2 also is provided with opening 21, outside at reflector 2 on the substrate 1 also is provided with circuit board slot 3, described circuit board slot 3 is " king " font, and extend into reflector sidewall 22, wiring board 30 is installed in the circuit board slot 3, described led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity, base described in the present embodiment and reflector are circle, and described reflector is 6.
Described base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to make, and reflector is bonded and fixed on the substrate.Be used to install light-emitting area whiteness 〉=70 of LED on the described reflector, be more preferred from 〉=85, the best is 〉=88.
In addition, can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description, supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production, all leads all are encapsulated in fluorescent material and the glue layer, better must reach purpose of the present invention.
Because traditional general whiteness of LED metab is all less than 70, therefore in actual production, need light-emitting area thereon to increase the reflector layer production process, but do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The present invention gets optical efficiency and be greatly improved, so the heat dispersion of led light source module improves greatly after adopting and having the LED base plate for packaging of high whiteness, can save the heat spreader structures in traditional LED, directly adopt plastic casing, make whole lamp outside non-conductive, non-friable; Its security performance of LED lamp of making is good, and weight lightens, and can save production cost greatly, helps large batch of suitability for industrialized production.Adopt above-mentioned in addition with led chip and wiring board and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production, can adopt prefabricated mode directly to produce base simultaneously, production efficiency will improve greatly.
Claims (8)
1. high whiteness substrate LED bulb lamp with plastic casing, comprise lamp holder, support, the led light source module, power unit and translucent cover, the led light source module connects power unit by electric wire, translucent cover also is equipped with in the surface of light source outside of led light source module, it is characterized in that: described LED bulb lamp also comprises a plastic casing, the fixedly connected plastic casing of one end of described support, the fixedly connected lamp holder of the other end, plastic casing is set in the outside of led light source module, described led light source module, comprise base and led chip, described base comprises substrate and at least one reflector that is arranged on the substrate, the bottom of reflector is adhesively fixed with at least one led chip by insulating cement, and the upper surface of described led chip is coated with fluorescent material and glue layer, is used to install light-emitting area whiteness 〉=70 of LED on the described reflector.
2. the high whiteness substrate LED bulb lamp of band plastic casing according to claim 1 is characterized in that: described base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to make, and reflector is bonded and fixed on the substrate.
3. the high whiteness substrate LED bulb lamp of band plastic casing according to claim 1 is characterized in that: the light-emitting area whiteness that is used to install LED on the described reflector is more preferred from 〉=and 85.
4. the high whiteness substrate LED bulb lamp of band plastic casing according to claim 1 is characterized in that: be used on the described reflector to install that the light-emitting area whiteness of LED is best is 〉=88.
5. the high whiteness substrate LED bulb lamp of band plastic casing according to claim 1, it is characterized in that: the sidewall of described reflector also is provided with opening, also be concaved with a circuit board slot on the described base, this circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, described led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
6. the high whiteness substrate LED bulb lamp of band plastic casing according to claim 5, it is characterized in that: the below of described circuit board slot is provided with a through hole and extends base.
7. the high whiteness substrate LED bulb lamp of band plastic casing according to claim 5, it is characterized in that: the bottom of described circuit board slot is lower than the bottom of reflector.
8. the high whiteness substrate LED bulb lamp of band plastic casing according to claim 1, it is characterized in that: described base and reflector are circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102665966A CN102287660A (en) | 2011-09-09 | 2011-09-09 | Light emitting diode (LED) bulb with plastic case for high-whiteness base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102665966A CN102287660A (en) | 2011-09-09 | 2011-09-09 | Light emitting diode (LED) bulb with plastic case for high-whiteness base plate |
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| Publication Number | Publication Date |
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| CN102287660A true CN102287660A (en) | 2011-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102665966A Pending CN102287660A (en) | 2011-09-09 | 2011-09-09 | Light emitting diode (LED) bulb with plastic case for high-whiteness base plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105444121A (en) * | 2015-12-21 | 2016-03-30 | 佛山贝利安照明科技有限公司 | Integral reflective housing structure of LED (Light-Emitting Diode) lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5534718A (en) * | 1993-04-12 | 1996-07-09 | Hsi-Huang Lin | LED package structure of LED display |
| CN101006031A (en) * | 2004-08-18 | 2007-07-25 | 株式会社德山 | Ceramic substrate for mounting light-emitting device and method for producing same |
| JP2008098544A (en) * | 2006-10-16 | 2008-04-24 | Yohohama Electron Kk | Super-wide light distribution type led lamp |
| CN201184510Y (en) * | 2008-04-05 | 2009-01-21 | 倪正敏 | Energy-saving environment protection illuminating bulb |
| CN101749553A (en) * | 2008-12-11 | 2010-06-23 | 上海恒烁光电科技有限公司 | Packaging module of low-power light emitting diode (LED) luminescent chip |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
-
2011
- 2011-09-09 CN CN2011102665966A patent/CN102287660A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5534718A (en) * | 1993-04-12 | 1996-07-09 | Hsi-Huang Lin | LED package structure of LED display |
| CN101006031A (en) * | 2004-08-18 | 2007-07-25 | 株式会社德山 | Ceramic substrate for mounting light-emitting device and method for producing same |
| JP2008098544A (en) * | 2006-10-16 | 2008-04-24 | Yohohama Electron Kk | Super-wide light distribution type led lamp |
| CN201184510Y (en) * | 2008-04-05 | 2009-01-21 | 倪正敏 | Energy-saving environment protection illuminating bulb |
| CN101749553A (en) * | 2008-12-11 | 2010-06-23 | 上海恒烁光电科技有限公司 | Packaging module of low-power light emitting diode (LED) luminescent chip |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105444121A (en) * | 2015-12-21 | 2016-03-30 | 佛山贝利安照明科技有限公司 | Integral reflective housing structure of LED (Light-Emitting Diode) lamp |
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Application publication date: 20111221 |
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