CN201887044U - Encapsulating structure for LED light source module - Google Patents
Encapsulating structure for LED light source module Download PDFInfo
- Publication number
- CN201887044U CN201887044U CN201020551487XU CN201020551487U CN201887044U CN 201887044 U CN201887044 U CN 201887044U CN 201020551487X U CN201020551487X U CN 201020551487XU CN 201020551487 U CN201020551487 U CN 201020551487U CN 201887044 U CN201887044 U CN 201887044U
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- CN
- China
- Prior art keywords
- metal substrate
- led chip
- reflector
- light source
- source module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides an encapsulating structure for an LED light source module, which belongs to the field of processing lighting equipment. The encapsulating structure comprises a metal substrate, a circuit board, a reflective cup and an LED chip, wherein, the circuit board is embedded in the lower surface of the metal substrate; at least one reflective cup is fixedly arranged on the upper surface of the metal substrate; a small hole that is led to the upper surface of the circuit board is formed at the bottom of the reflective cup; at least one LED chip is installed inside each reflective cup; the LED chip is stuck to the metal substrate positioned at the bottom of the reflective cup except the small hole through insulating cement; a mixed layer combining glue with fluorescent powders is applied on the upper surface of the LED chip; and the LED chip penetrates the small hole through a lead, and then is connected with the circuit board.
Description
[technical field]
The utility model relates to a kind of lighting apparatus, relates in particular to a kind of led light source module.
[background technology]
LED is a kind of low voltage light sources, because its power saving, life-span is long, various low-voltage lighting devices now have been widely used in, the encapsulating structure of the multi-chip LED light source module that traditional high-power LED chip or degree of integration are higher generally adopts metal substrate to realize, concrete structure generally adopts at the high-thermal conductive metal with reflector (as copper, aluminium etc.) as substrate, again insulating barrier and circuit articulamentum are compounded in the basic unit, form whole composite base plate, led chip is installed by central authorities at reflector, led chip is connected to the circuit articulamentum, again the upper surface of led chip is applied a glue and the fluorescent material mixed layer is finished encapsulation.In above-mentioned traditional led light source module encapsulation construction, because needing lead-in wire between led chip and the circuit articulamentum is connected, but led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing, be easy to make the lead-in wire between led chip and the wiring board to damage for bumping to break because of the people, greatly reduce production efficiency, and it is more complicated that production process also becomes, increase production cost, and because traditional metal substrate need adopt large-area insulating barrier, cause the heat dispersion of whole encapsulating structure relatively poor, be unfavorable for the life-span of product.
[utility model content]
The technical problems to be solved in the utility model is to provide a kind of heat dispersion better, and can save the Novel LED light source module package structure of production cost.
The utility model is achieved in that a kind of Novel LED light source module package structure, comprise metal substrate, wiring board, reflector and led chip, it is characterized in that: described wiring board is arranged on the lower surface of metal substrate, the upper surface of metal substrate is fixed with at least one reflector, the bottom of reflector is provided with an aperture that can lead to the upper surface of wiring board, at least one led chip is installed in each reflector, this led chip removes on the metal substrate of aperture with external position by the bottom that insulating cement is bonded at reflector, the upper surface of described led chip is coated with glue and fluorescent material mixed layer, and led chip is connected on the wiring board after passing aperture by lead.
The lower surface of described metal substrate is provided with an elongate slots, and described wiring board is embedded in this elongate slots.
The upper surface of described metal substrate is provided with a reflector layer of electroplating.
Described reflector is a ring-type, makes by injection moulding or the some mode of moulding, perhaps by rheo-die-casting moulding on metal substrate.
One end of described metal substrate is provided with at least one buckle, and the opposite position of the other end is provided with adaptive with it draw-in groove.
The utlity model has following advantage: adopt above-mentioned packaged type, can make led chip and wiring board and the lead between them, all be encapsulated in below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, improved production efficiency greatly, reduce the damage of lead in the production process, saved production cost; Owing to wiring board is embedded in the pregroove marks at the back side that is installed in metal substrate, both simplified production process greatly, can fix securely again; Because led chip can directly be fixed on the metal substrate, can improve heat dispersion widely simultaneously, improve the life-span of product.
[description of drawings]
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the Facad structure schematic diagram of led light source module package structure of the present utility model.
Fig. 2 is the structure schematic diagram of led light source module package structure of the present utility model.
Fig. 3 is the leading flank structural representation of led light source module package structure of the present utility model.
Fig. 4 is the right flank structural representation of led light source module package structure of the present utility model.
Fig. 5 is the syndeton schematic diagram between metal substrate, wiring board and the led chip of led light source module package structure of the present utility model.
Fig. 6 is the A-A cutaway view of Fig. 1.
[embodiment]
Come the utility model is described in detail below in conjunction with specific embodiment.
See also Fig. 1 to shown in Figure 6, it is led light source module package structure described in the utility model, comprise metal substrate 1, wiring board 2, reflector 3 and led chip 4, be provided with the groove 11 of a strip in the lower surface centre position of described metal substrate 1, be embedded with wiring board 2 in the groove 11, wiring board 2 is provided with ready made connecting circuit, the two ends that the two ends of wiring board 2 lead to metal substrate 1 respectively form both positive and negative polarity, the rheo-die-casting moulding on metal substrate 1 of described reflector 3, the bottom of reflector 3 is provided with an aperture 12 that can lead to the upper surface of wiring board 2, in each reflector 3 some led chips 4 are installed, led chip 4 removes on the metal substrate 1 of aperture 12 with external position by the bottom that insulating cement is bonded at reflector 3, the upper surface of described led chip 4 is coated with glue and fluorescent material mixed layer 5, and led chip 4 is connected on the wiring board after passing aperture 12 by lead 6.The upper surface of described metal substrate 1 is provided with a reflector layer 7 of electroplating, this reflector layer adopts silver coating in the present embodiment, described reflector 3 is a ring-type, what adopt in the present embodiment is circular reflector, this reflector 3 is fixed on the metal substrate 1 after also making by injection moulding or the some mode of moulding, in this patent, the lower surface of described metal substrate 1 also can not be provided with groove, and the lower surface that only needs wiring board 2 directly to be fixedly installed on metal substrate 1 also can be realized the utility model purpose.Also can adopt square reflector to realize in the utility model simultaneously.One end of described metal substrate 1 is provided with a buckle wide outside and narrow inside 8, the opposite position of the other end is provided with the draw-in groove 9 that shape is identical with it, also a plurality of such buckles and draw-in groove structure can be set at two ends, so just can easily a plurality of same modules be snapped together, as using on the purposes of long strip type lamp bar.
Claims (5)
1. led light source module package structure, comprise metal substrate, wiring board, reflector and led chip, it is characterized in that: described wiring board is arranged on the lower surface of metal substrate, the upper surface of metal substrate is fixed with at least one reflector, the bottom of reflector is provided with an aperture that can lead to the upper surface of wiring board, at least one led chip is installed in each reflector, this led chip removes on the metal substrate of aperture with external position by the bottom that insulating cement is bonded at reflector, the upper surface of described led chip is coated with glue and fluorescent material mixed layer, and led chip is connected on the wiring board after passing aperture by lead.
2. led light source module package structure according to claim 1 is characterized in that: the lower surface of described metal substrate is provided with an elongate slots, and described wiring board is embedded in this elongate slots.
3. led light source module package structure according to claim 1 is characterized in that: the upper surface of described metal substrate is provided with a reflector layer of electroplating.
4. led light source module package structure according to claim 1 is characterized in that: described reflector is a ring-type, makes by injection moulding or the some mode of moulding, perhaps by rheo-die-casting moulding on metal substrate.
5. led light source module package structure according to claim 1 is characterized in that: an end of described metal substrate is provided with at least one buckle, and the opposite position of the other end is provided with adaptive with it draw-in groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020551487XU CN201887044U (en) | 2010-09-30 | 2010-09-30 | Encapsulating structure for LED light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020551487XU CN201887044U (en) | 2010-09-30 | 2010-09-30 | Encapsulating structure for LED light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201887044U true CN201887044U (en) | 2011-06-29 |
Family
ID=44184593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020551487XU Expired - Fee Related CN201887044U (en) | 2010-09-30 | 2010-09-30 | Encapsulating structure for LED light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201887044U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013113204A1 (en) * | 2012-02-03 | 2013-08-08 | 北京莱易龙光电科技有限公司 | Light source module for led light box |
| CN106876375A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated form RGB LED displays |
-
2010
- 2010-09-30 CN CN201020551487XU patent/CN201887044U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013113204A1 (en) * | 2012-02-03 | 2013-08-08 | 北京莱易龙光电科技有限公司 | Light source module for led light box |
| CN106876375A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated form RGB LED displays |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 Termination date: 20150930 |
|
| EXPY | Termination of patent right or utility model |