CN201758140U - Novel LED light source module packaging structure - Google Patents
Novel LED light source module packaging structure Download PDFInfo
- Publication number
- CN201758140U CN201758140U CN2010202615188U CN201020261518U CN201758140U CN 201758140 U CN201758140 U CN 201758140U CN 2010202615188 U CN2010202615188 U CN 2010202615188U CN 201020261518 U CN201020261518 U CN 201020261518U CN 201758140 U CN201758140 U CN 201758140U
- Authority
- CN
- China
- Prior art keywords
- reflector
- led chip
- light source
- source module
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
The utility model provides an LED light source module packaging structure, which belongs to the field of processing lighting equipment, and comprises a base with a reflection cup. At least one LED chip is arranged in the center of the bottom of the reflection cup of the base and adhered to the bottom of the reflection cup by insulating adhesive, a glue and fluorescent powder mixed layer is coated on the upper surface of each LED chip, a small hole is arranged at the bottom or on the lateral wall of the reflection cup of the base, and leads connected with the LED chips penetrate through the small hole to extend out of the base.
Description
[technical field]
The utility model relates to a kind of lighting apparatus, relates in particular to a kind of led light source module.
[background technology]
LED is a kind of low voltage light sources, because its power saving, life-span is long, various low-voltage lighting devices now have been widely used in, traditional led light source module encapsulation construction generally comprises a metab with reflector, reflector bottom center at base is provided with some led chips, this led chip is bonded at the bottom center of reflector equably by welding manner or insulating cement, be in series by lead between the led chip or parallel connection after draw, be connected to the wiring board of the reflector outside that is arranged on the metab, make led chip be covered mixed layer inside fully after again the upper surface of led chip being applied glue and fluorescent material mixed layer.In above-mentioned traditional led light source module encapsulation construction, because needing lead-in wire between led chip and the wiring board is connected, but led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing, be easy to make between led chip and the wiring board lead-in wire because of the people for bumping disconnected the damage, greatly reduce production efficiency, and it is more complicated that production process also becomes, and increases production cost.
[utility model content]
The technical problems to be solved in the utility model is to provide a kind of and can simplifies production process, saves the Novel LED light source module encapsulation construction of production cost.
The utility model is achieved in that a kind of Novel LED light source module encapsulation construction, comprise that one has the base of reflector, the reflector bottom center of base is provided with at least one led chip, this led chip is bonded at the bottom of reflector by insulating cement, the upper surface of described led chip is coated with glue and fluorescent material mixed layer, it is characterized in that: the reflector bottom or the sidewall of described base are provided with an aperture, pass the outside of this aperture protuberate basic unit behind the led chip connection lead.
Be provided with insulating trip in the aperture of described base, described led chip leads to insulating trip after serial or parallel connection connects, connect lead on the insulating trip again and pass this aperture.
Described insulating trip is provided with wiring board, and described led chip is connected on this wiring board, and the wiring board on the insulating trip connects lead again and passes this aperture.
The bottom of described reflector is provided with some little reflectors, and described led chip is installed in the little reflector, connects or parallel connection with lead between the led chip.
The upper surface of described base is provided with a reflector layer of electroplating.
Described insulating trip is a glass fiber sheets.
Described base and reflector are circle.
The utlity model has following advantage: adopt above-mentioned with led chip and wiring board and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, improved production efficiency greatly, reduce the damage of lead in the production process, saved production cost.
[description of drawings]
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the overall structure schematic diagram of embodiment one of the present utility model.
Fig. 2 is the A-A cutaway view of Fig. 1.
Fig. 3 is the perspective view of the metab of embodiment one of the present utility model.
Fig. 4 is the overall structure schematic diagram of embodiment two of the present utility model.
Fig. 5 is the B-B cutaway view of Fig. 4.
Fig. 6 is the perspective view of the metab of embodiment two of the present utility model.
[embodiment]
Come the utility model is described in detail below in conjunction with specific embodiment.
See also Fig. 1 to shown in Figure 3, be the described Novel LED light source module encapsulation construction of first embodiment of the present utility model, comprise base 11, led chip 12, insulating cement 13, glue and fluorescent material mixed layer 14, reflector 15, wiring board 16, aperture 17, reflector layer 18.
The central authorities of described base 11 are provided with a reflector 15 and an aperture 17, base 11 and reflector 15 in the present embodiment are circle, described base 11 is that copper is one-body molded, its upper surface has a reflector layer 18 of electroplating, this reflector layer is a silver coating in the present embodiment, the bottom center of reflector 15 is provided with an aperture 17, the periphery of this aperture 17 is provided with some led chips 12, these led chips 12 are bonded at the bottom of reflector 15 by insulating cement 13, the upper surface of described led chip 12 is coated with glue and fluorescent material mixed layer 14, led chip 12 and aperture 17 are all covered, also reserve the position of a wiring board 16 in the described aperture 17, after being installed in wiring board 16 in the aperture 17, drawing behind serial or parallel connection with lead between described some led chips 12 and be connected to wiring board 16, the formation both positive and negative polarity.
See also Fig. 4 to shown in Figure 6, be the described Novel LED light source module encapsulation construction of second embodiment of the present utility model, comprise base 21, led chip 22, insulating cement 23, glue and fluorescent material mixed layer 24, big reflector 25, wiring board 26, aperture 27, reflector layer 28, little reflector 29.
The central authorities of described base 21 are provided with a reflector 25 and an aperture 27, base 21 and reflector 21 in the present embodiment are circle, described base 21 is that copper is one-body molded, its upper surface has a reflector layer 28 of electroplating, this reflector layer is a silver coating in the present embodiment, the bottom center of reflector 25 is provided with an aperture 27, the periphery of this aperture 27 is provided with some little reflectors 29, in each little reflector 29 led chip 22 is installed all, these led chips 22 are bonded at the bottom of little reflector 29 by insulating cement 23, the upper surface of each led chip 22 all is coated with glue and fluorescent material mixed layer 24, each led chip 22 is all covered, also reserve the position of a wiring board 26 in the described aperture 27, after being installed in wiring board 26 in the aperture 27, draw behind serial or parallel connection with lead between described each led chip 22 and be connected to wiring board 16, form both positive and negative polarity.
Among above-mentioned two embodiment, also can an insulating trip only be set in aperture uses for the led chip outconnector, led chip series connection or back in parallel are led on the insulating trip with lead, draw lead to wiring board from insulating trip again, then can wiring board is external outside base.In addition, described aperture not only can be arranged on central authorities or other any positions of the bottom of reflector, also can be arranged on the sidewall of reflector, to get final product in the aperture that after all led chip connection in series-parallel lead is caused on the sidewall again, so still can realize avoiding in process of production the lead of led chip to damage easily and bump disconnected utility model purpose.Described base also is not limited to circle simultaneously, can do shapes such as squarely or strip, still can reach aforesaid utility model purpose.
Claims (7)
1. Novel LED light source module encapsulation construction, comprise that one has the base of reflector, the reflector bottom center of base is provided with at least one led chip, this led chip is bonded at the bottom of reflector by insulating cement, the upper surface of described led chip is coated with glue and fluorescent material mixed layer, it is characterized in that: the reflector bottom or the sidewall of described base are provided with an aperture, pass the outside of this aperture protuberate basic unit behind the led chip connection lead.
2. Novel LED light source module encapsulation construction according to claim 1 is characterized in that: be provided with insulating trip in the aperture of described base, described led chip leads to insulating trip after serial or parallel connection connects, connect lead on the insulating trip again and pass this aperture.
3. Novel LED light source module encapsulation construction according to claim 2 is characterized in that: described insulating trip is provided with wiring board, and described led chip is connected on this wiring board, and the wiring board on the insulating trip connects lead again and passes this aperture.
4. Novel LED light source module encapsulation construction according to claim 2 is characterized in that: the bottom of described reflector is provided with some little reflectors, and described led chip is installed in the little reflector, connects or parallel connection with lead between the led chip.
5. Novel LED light source module encapsulation construction according to claim 1 is characterized in that: the upper surface of described base is provided with a reflector layer of electroplating.
6. Novel LED light source module encapsulation construction according to claim 1 is characterized in that: described insulating trip is a glass fiber sheets.
7. Novel LED light source module encapsulation construction according to claim 1 is characterized in that: described base and reflector are circle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202615188U CN201758140U (en) | 2010-07-16 | 2010-07-16 | Novel LED light source module packaging structure |
| PCT/CN2010/077507 WO2012006817A1 (en) | 2010-07-16 | 2010-09-30 | Packaging structure for led light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202615188U CN201758140U (en) | 2010-07-16 | 2010-07-16 | Novel LED light source module packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201758140U true CN201758140U (en) | 2011-03-09 |
Family
ID=43645430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202615188U Expired - Fee Related CN201758140U (en) | 2010-07-16 | 2010-07-16 | Novel LED light source module packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN201758140U (en) |
| WO (1) | WO2012006817A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958388A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light source module encapsulating structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093829A (en) * | 2006-06-20 | 2007-12-26 | 常州东村电子有限公司 | Structure for packaging integration type power model light emitting diode |
| CN100456504C (en) * | 2006-08-30 | 2009-01-28 | 牟小波 | Ultra-high power illumination LED metallic packaging structure |
| TW200847469A (en) * | 2007-05-23 | 2008-12-01 | Tysun Inc | Substrates of curved surface for light emitting diodes |
| CN101182919A (en) * | 2007-12-17 | 2008-05-21 | 杨振行 | High power LED lamp |
| CN101677116B (en) * | 2008-09-19 | 2011-06-08 | 上海科学院 | Encapsulating method and encapsulating module for LED chip |
-
2010
- 2010-07-16 CN CN2010202615188U patent/CN201758140U/en not_active Expired - Fee Related
- 2010-09-30 WO PCT/CN2010/077507 patent/WO2012006817A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958388A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light source module encapsulating structure |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012006817A1 (en) | 2012-01-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: FUJIAN WANBAN OPTOELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FUJIAN ZHONGKE WANBAN OPTRONICS CO., LTD. Effective date: 20110322 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20110322 Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Patentee after: Fujian Wanban optoelectronic Technology Co., Ltd. Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Patentee before: Fujian Zhongkewanbang Photoelectric Shares Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110309 Termination date: 20140716 |
|
| EXPY | Termination of patent right or utility model |