CN206093582U - High radiating LED circuit board bulb module - Google Patents
High radiating LED circuit board bulb module Download PDFInfo
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- CN206093582U CN206093582U CN201620821977.4U CN201620821977U CN206093582U CN 206093582 U CN206093582 U CN 206093582U CN 201620821977 U CN201620821977 U CN 201620821977U CN 206093582 U CN206093582 U CN 206093582U
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- led
- circuit board
- bulb module
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- module
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 238000003466 welding Methods 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 239000007787 solid Substances 0.000 claims abstract description 8
- 230000004888 barrier function Effects 0.000 claims description 24
- 239000006185 dispersion Substances 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000010354 integration Effects 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 description 14
- 239000002585 base Substances 0.000 description 9
- 239000006071 cream Substances 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 7
- 239000003292 glue Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000037237 body shape Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a high radiating LED circuit board bulb module, include: metal carrier plate, an insulating layer. The metallic circuit layer, the solder mask, with LED component or LED component and other power supply apparatus of welding on the metallic circuit layer. Characterized by only is provided with insulating layer, circuit layer and solder mask at circuit part and welding LED component or LED component and other power supply apparatus's position, and all the other parts are exposed outside the metallic carrier large tracts of land, form a high radiating LED circuit board bulb module, with 1, perhaps more than 1 high heat dissipation LED circuit board bulb module erect arrange in the bulb, or with 1, or more than 1 erect in the bulb after making up into the solid geometry physique after high heat dissipation LED circuit board bulb module is bent or is bent, form a LED bulb of making with high radiating LED circuit board bulb module. The utility model discloses a high radiating LED circuit board bulb module, the heat that makes its LED component and other power supply apparatus produce conduct fast and distribute away the effectual heat dissipation problem of having solved LED for exposing around the metallic carrier of outer large tracts of land is followed to LED's light efficiency has been improved.
Description
Technical field
This utility model is related to wiring board art and LED applications, and in particular to a kind of LED circuit board lamp of high radiating
Bubble module.
Background technology
LED circuit board bulb module on the market, is generally all in welding LED element or LED element and other electricity now
The heat radiating metal base plate of the component side of source device side by insulating barrier, circuit layer and solder mask multilayer barrier, or by insulating barrier, electricity
Road floor, solder mask and packaging plastic water resistance gear.The only metal basal board not being blocked does not have the back side of circuit, and area of dissipation is inadequate
Greatly, radiate bad, so as to cause the light efficiency of LED not high.
In order to overcome the shortcomings of the defect of the above, the LED circuit board bulb module of high radiating of the present utility model, only in unit
Part face is provided with partial insulative layer, circuit layer and solder mask, and remainder will be metallic carrier large-area exposed outside component side,
Make the heat that its LED element and other power supply apparatus are produced rapidly be conducted to the large-area metal of exposed multiaspect to carry
Body, distributes, and greatly increases the radiating of the module of LED, so as to improve the light efficiency and service life of LED
Utility model content
This utility model is related to a kind of LED circuit board bulb module of high radiating, including：Metallic carrier plate；Insulating barrier；Gold
Category circuit layer；Solder mask；With the LED element or LED element and other power supply apparatus being welded on metal circuitry.Its feature
It is that the position of circuit part and welding LED element or LED element and other power supply apparatus is provided with insulating barrier, circuit layer only
And solder mask, remainder by it is metallic carrier large-area it is exposed outside, form a kind of LED circuit board bulb mould of high radiating
Group, the high-heat-dispersion LED wiring board bulb module of 1 or more than 1 is erect be placed in bulb or by 1, or
The high-heat-dispersion LED wiring board bulb module that person is more than 1 is bent into, or bending after be combined into solid geometry body after erect
In bulb, LED bulb made by a kind of LED circuit board bulb module with high radiating is formed..High radiating of the present utility model
LED circuit board bulb module so as to the heat that LED element and other power supply apparatus are produced rapidly is conducted to exposed
Large-area metallic carrier is distributed from surrounding, effectively solves the heat dissipation problem of LED, so as to improve the light efficiency of LED.
A kind of LED circuit board bulb module of high radiating is provided according to this utility model, including：Metallic carrier plate；Absolutely
Edge layer；Metal circuitry；Solder mask；The LED element being welded on metal circuitry pad or LED element and other power devices
Part；Wherein, a part of region is provided with insulating barrier, circuit layer, solder mask and element layer only, remainder is big by metallic carrier
Area is exposed outside component side, forms the high-heat-dispersion LED wiring board bulb module of multiaspect radiating.
A kind of LED circuit board bulb module of high radiating is additionally provided according to this utility model, including：It is arranged on centre
Metallic carrier plate；It is separately positioned on the insulating barrier on metallic carrier plate two sides；The metallic circuit being separately positioned on the insulating barrier of two sides
Layer；It is separately positioned on the solder mask on two sides；The LED element being respectively welded on the metal circuitry pad of two sides or LED element and
Other power supply apparatus；Wherein, on the two sides of the metallic carrier plate, portion is provided with insulating barrier, circuit layer and resistance only
Layer and element layer, remainder form the high-heat-dispersion LED line of multiaspect radiating by metallic carrier large area exposed outside component side
Road plate bulb module.
According to a preferred embodiment of the present utility model, the LED bulb wiring board module of described a kind of high radiating, its
It is characterised by, described LED element is LED flip chip or is packaged LED surface mount elements.
According to a preferred embodiment of the present utility model, the LED bulb wiring board module of described a kind of high radiating, its
Be characterised by, described LED element is the positive cartridge chips of LED, it is conducting on circuit land by bonding wire welding, described weldering
Line is bonding wire connection conducting between bonding wire, and/or chip and pad between chip.
According to a preferred embodiment of the present utility model, the LED bulb wiring board module of described a kind of high radiating, its
It is characterised by, described metallic carrier plate is aluminum or aluminium alloy or copper or copper alloy or the copper after plating.
According to a preferred embodiment of the present utility model, the wiring board bulb module of described a kind of high radiating, which is special
Levy and be, described other power supply apparatus are paster power supply apparatus, be in same wiring board with the welding conducting of LED element together paster
On, form the LED circuit board bulb module of light source device and power supply apparatus integration.
According to a preferred embodiment of the present utility model, the wiring board bulb module of described a kind of high radiating, which is special
Levy and be, described other source elements are paster source element, and/or pin source element, and surface mount elements and LED element are together
On the surface of same wiring board, pin member is welded in pad hole, and the back metal at pad hole for paster welding conducting
Carrier has been removed by or is the insulation board of having pasted a small pieces, and formation is light source device and power supply apparatus integration
LED circuit board bulb module.
According to a preferred embodiment of the present utility model, described high-heat-dispersion LED wiring board bulb module, its feature exist
In the module wiring board on LED circuit board bulb module is provided with the flexible circuit board that an extension is stretched out, and described extension is stretched
The flexible circuit board for going out is directly welded at the wiring position on power circuit plate, forms the wiring board of light source and power supply integration
Bulb module.
According to a preferred embodiment of the present utility model, described high-heat-dispersion LED wiring board bulb module, its feature exist
In the high-heat-dispersion LED wiring board bulb module of 1 or more than 1 being erect and is placed in bulb.
According to a preferred embodiment of the present utility model, described high-heat-dispersion LED wiring board bulb module, its feature exist
In the high-heat-dispersion LED wiring board bulb module of 1 or more than 1 is bent into after solid geometry body or bending
It is erected in bulb after being combined into solid geometry body.
According to a preferred embodiment of the present utility model, described high-heat-dispersion LED wiring board bulb module, its feature exist
In, the metallic carrier plate, according to design requirement, at the corresponding position of bending or be in the exposed position of metallic carrier plate
The formation of excision small part metal is easy to bending or is easy to the hole of ventilation and heat in advance at the place of putting.
According to a preferred embodiment of the present utility model, the LED circuit board bulb module of described a kind of high radiating, its
It is characterised by, when the metal circuitry being separately positioned on the insulating barrier of two sides needs two sides circuit turn-on, takes by-pass plate
Edge, the conducting of welding metal conductor or soldered elements conducting.
According to a preferred embodiment of the present utility model, the LED circuit board bulb module of described a kind of high radiating, its
It is characterised by, when the metal circuitry being separately positioned on the insulating barrier of two sides needs two sides circuit turn-on, two sides circuit layer passes through
Dielectric layers assist side peripheral bond bonds together together or in the middle of assist side, and abutting edge is without metallic carrier
Plate, abutting edge have the pad adjacent to each other that both sides are opened, the conducting of two pad scolding tin or weldering conductor conducting.
According to a preferred embodiment of the present utility model, the LED circuit board bulb module of described a kind of high radiating, its
It is characterised by, when the metal circuitry being separately positioned on the insulating barrier of two sides needs two sides circuit turn-on, takes at least one of which
Circuit layer and insulating barrier assist side edge stretch out metallic carrier plate shape into flexible circuit, bend by-pass edges of boards edge, welding
Conducting is formed on the solder joint of the another side for being conducting to wiring board.
In the following description to the drawings and specific embodiments, one or more embodiments of the present utility model will be illustrated
Details.
Description of the drawings
By reading this specification in conjunction with the following drawings, feature of the present utility model, objects and advantages will become more to show
And be clear to, accompanying drawing is briefly described as follows.
Fig. 1 is the floor map of the LED circuit board bulb module of the luminous high radiating of one side.
Schematic cross-sections of the Fig. 2 for " Fig. 1 ".
Fig. 3 is the LED circuit board bulb module of the high radiating of another kind of lighting at two sides, with metallic conductor by-pass edges of boards
Two sides circuit is welded the floor map of conducting by edge.
Schematic cross-sections of the Fig. 4 for " Fig. 3 ".
It is flexible that LED circuit board bulb modules of the Fig. 5 for the high radiating of lighting at two sides, wherein two sides all extensions simultaneously draw one
Wiring board, extends the wiring board drawn and is bonded together beyond metallic carrier plate, weld the circuit on conducting two sides by via
Floor map.
Schematic cross-sections of the Fig. 6 for " Fig. 5 ".
Fig. 7 is the LED circuit board bulb module of the high radiating of another kind of lighting at two sides, and it is soft that one side therein extends extraction one
Property wiring board, bend around another side, the floor map with the circuit welding conducting of another side.
Schematic cross-sections of the Fig. 8 for " Fig. 7 ".
Fig. 9 is the floor map that the LED circuit board bulb module of the high radiating of LED is only welded with one side.
Figure 10 is that high-heat-dispersion LED wiring board bulb module erects the schematic perspective view being placed in bulb.
Figure 11 is with being erected in lamp after being combined into solid geometry body after two high-heat-dispersion LED wiring board bulb module bendings
Schematic perspective view in bubble.
Figure 12 is that the LED circuit board bulb module of the high radiating that the one side of " Fig. 9 " is welded with LED is bent into solid geometry body
The schematic perspective view being erected in bulb afterwards.
Specific embodiment
This utility model will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that described below is merely illustrative and describes some sides of being preferable to carry out
Formula, does not have any restriction to claim of the present utility model.
Specific embodiment one
In Fig. 1, Fig. 2, mark (1) is wiring board, is made up of insulating barrier, circuit layer and solder mask；Mark (2) is LED
Element；Mark (3) is heat radiating metal carrier board；Mark (3.1) is the exposed region of heat radiating metal carrier board.
As shown in Figure 1, Figure 2, shown in Fig. 9, in the one side of heat radiating metal carrier board (3), only in welding LED element (2) or
LED element (2) and the corresponding region portion of other power supply apparatus, leave one and least a portion of are pasted onto heat radiating metal carrier board (3)
On wiring board (1) so as to heat radiating metal carrier board (3) front major part region (3.1) it is exposed outside, while heat radiating metal
The back side of carrier board (3) all it is exposed outside, its concrete manufacture method is as follows：
1st, first in single side floppy copper-clad plate backside coating last layer glue, then with designing and producing previously according to engineering data
Good mould punching, removes the single side floppy copper-clad plate at exposed region (3.1) place, then is attached on aluminium sheet, with the temperature of 180 degree,
120kg pressure hot pressing 120 seconds, with 150 DEG C of temperature baking-curing 60 minutes, is fabricated to a kind of aluminium base and covers Copper base material.
2nd, cover in Copper base material in aluminium base, only printing alkali resistant etching circuit ink, baking-curing, then in alkali on copper face
Property etching production line on etch circuit, then with the ink retreating liquid stripping circuit ink of the aluminum of erosion containing resistance, then silk-screen hinders on the line
Weldering, baking-curing, following OSP surface anti-oxidations are processed, and are punched profile, are fabricated to a kind of aluminum-based circuit board.
3rd, the method for mounting soldered elements using traditional SMT, uses steel mesh in aluminum-based circuit board in the weldering of soldered elements
Tin cream is stamped on disk, then LED element is mounted on SMT chip mounters and is printed on the pad of tin cream, crossed Reflow Soldering and LED element is welded
It is connected in aluminum-based circuit board, is fabricated to a kind of LED circuit board bulb module of high radiating, then by height radiating as shown in Figure 9
LED circuit board bulb module be bent into top for one or eight pyramids, bottom is the high radiating of a few body bodily forms of one or eight prisms
LED circuit board bulb module, reassemble assembling in the bulb, be fabricated to a kind of LED circuit board bulb of high radiator structure
LED bulb made by module (as shown in figure 12).The LED circuit board bulb module of this high radiator structure so as to LED element and
The heat that other power supply apparatus are produced rapidly is conducted to the large-area heat radiating metal carrier board (3) of exposed positive and negative
Distribute, effectively raise the radiating of LED, so as to improve the light efficiency and service life of LED.
Specific embodiment two
In Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, mark (1) is wiring board, by insulating barrier, circuit layer and solder mask group
Into；Metallic conductor of the mark (1.1) for by-pass edges of boards edge；Mark (1.2) extends for two sides draws beyond metallic carrier plate
The flexible circuit board being bonded together；Mark (1.3) is to be welded by via, two sides is extended and is drawn beyond metallic carrier plate
The structure of the flexible circuitry plate weld conducting being bonded together；Mark (1.4) is that one side extends the flexible circuit board drawn, bending
Around another side, the structure with the circuit welding conducting of another side；Mark (2) is LED element；Mark (3) is carried for heat radiating metal
Body plate；Mark (3.1) is the exposed region of heat radiating metal carrier board.Its another kind of concrete manufacture method is as follows：
1st, will prepare to be attached to each single side floppy circuit board on heat radiating metal carrier board (3) two sides, overleaf apply and be covered with one
Layer glue, then with the mould punching designed and produced previously according to engineering data, removes the single side floppy at exposed region (3.1) place
Circuit plate part.
2nd, heat radiating metal carrier board (3) is punched with mould and removes the part aluminum being not required to.
3rd, the single side floppy wiring board para-position after be punched two is attached to two of the heat radiating metal carrier board (3) after being punched
Face, with the temperature of 180 degree, 120kg pressure hot pressing 120 seconds, with 150 DEG C of temperature baking-curing 60 minutes, following OSP surfaces
Anti-oxidation process, is punched profile, is fabricated to a kind of two-sided road plate of aluminium base line.
4th, first need to be led on another side edge two sides in the one side SMT attachment welding LED element of aluminium base double-sided wiring board first
Red glue is sticked at logical pad hole, is then stamped on the pad of soldered elements with steel mesh in the one side of aluminium base double-sided wiring board
Tin cream, also stamps tin cream at via, then is mounted on LED element with SMT chip mounters and is printed on the pad of tin cream, crosses Reflow Soldering
LED element is welded in aluminum-based circuit board, Kong Liyi parts plug tin welding is simultaneously turned on.Then tear red glue off, it is double in aluminium base
The another side steel mesh of face wiring board stamps tin cream on the pad of soldered elements, also stamps tin cream simultaneously, then use at via
LED element is mounted on and is printed on the pad of tin cream by SMT chip mounters, crosses Reflow Soldering and LED element is welded in aluminum-based circuit board,
Simultaneously the wiring board on heat radiating metal carrier board (3) two sides is welded to connect conducting by via, is fabricated to as described below several
The LED circuit board bulb module of the high radiating of lighting at two sides, for example：
As shown in Figure 3, Figure 4, it is on the two sides of heat radiating metal carrier board (3), only first in welding LED element (2) or LED
Part (2) and the corresponding region portion of other power supply apparatus, stay one it is least a portion of be pasted onto on heat radiating metal carrier board (3) lead
Electric line plate (1) so as to which two sides major part region (3.1) of heat radiating metal carrier board (3) is exposed outside, uses metallic conductor respectively
(1.1) by-pass edges of boards edge is by the positive pole and positive pole, negative pole and negative pole of the wiring board (1) on heat radiating metal carrier board (3) two sides
Welding conducting, forms a kind of LED circuit board bulb module of the high radiating of lighting at two sides.
As shown in Figure 5, Figure 6, it is on the two sides of heat radiating metal carrier board (3), only first in welding LED element (2) or LED
Part (2) and the corresponding region portion of other power supply apparatus, stay one it is least a portion of be pasted onto on heat radiating metal carrier board (3) lead
Electric line plate (1) so as to which two sides major part region (3.1) of heat radiating metal carrier board (3) is exposed outside, in heat radiating metal carrier
The two sides of plate (3) extends the flexible circuit board (1.2) drawn and be bonded together beyond metallic carrier plate (3), by via
Welding, forms conducting structure (1.3) and will bear in the positive pole of the wiring board (1) on heat radiating metal carrier board (3) two sides and positive pole respectively
Pole and negative pole welding conducting, form the LED circuit board bulb module of the high radiating of another kind of lighting at two sides.
As shown in Figure 7, Figure 8, it is on the two sides of heat radiating metal carrier board (3), only first in welding LED element (2) or LED
Part (2) and the corresponding region portion of other power supply apparatus, stay one it is least a portion of be pasted onto on heat radiating metal carrier board (3) lead
Electric line plate (1) so as to which two sides major part region (3.1) of heat radiating metal carrier board (3) is exposed outside, in heat radiating metal carrier
The one side of plate (3) extends draws a flexible circuit board (1.4), bends around another side, welds with the circuit of another side, respectively will
In the positive pole and positive pole of the wiring board (1) on heat radiating metal carrier board (3) two sides, negative pole and negative pole welding conducting, form another kind of
The LED circuit board bulb module of the high radiating of lighting at two sides.
Then high-heat-dispersion LED wiring board bulb module direct-assembling is installed in the bulb, is fabricated to the high radiating of one kind
LED bulb (as shown in Figure 10) made by the LED circuit board bulb module of structure, in addition also can be by two high-heat-dispersion LED circuits
Plate bulb module is first bent into the LED circuit board bulb module of L geometrical body dress respectively, then by two L geometrical bodies
LED circuit board bulb module is combined into an X geometrical body, and then assembling is installed in the bulb, is fabricated to the high radiating of one kind
The LED bulb (as shown in figure 11) of X geometrical body shape modules made by the LED circuit board bulb module of structure.
The LED circuit board bulb module of several high radiator structures described above so as to LED element and other power supply apparatus
The heat of generation is rapidly conducted to the large-area heat radiating metal carrier board (3) of exposed positive and negative and distributes, effectively
The heat dissipation problem for solving LED, so as to improve the light efficiency of LED.
A kind of specific embodiment of the LED circuit board bulb module of high radiating is entered to this utility model above in association with accompanying drawing
Detailed description is gone.It will be understood by those skilled in the art, however, that the above is merely illustrative and describes some tools
Body embodiment, to this with the scope of new scope, especially claim, not with any restriction.
Claims (14)
1. the LED circuit board bulb module of a kind of high radiating, including：
Metallic carrier plate；
Insulating barrier；
Metal circuitry；
Solder mask；
The LED element being welded on metal circuitry pad or LED element and power supply apparatus；
Wherein, a part of region is provided with insulating barrier, circuit layer, solder mask and element layer only, remainder is by metallic carrier
Large area is exposed outside component side, forms the high-heat-dispersion LED wiring board bulb module of multiaspect radiating.
2. the LED circuit board bulb module of a kind of high radiating, including：
It is arranged on the metallic carrier plate of centre；
It is separately positioned on the insulating barrier on metallic carrier plate two sides；
The metal circuitry being separately positioned on the insulating barrier of two sides；
It is separately positioned on the solder mask on two sides；
The LED element being respectively welded on the metal circuitry pad of two sides or LED element and power supply apparatus；
Wherein, on the two sides of the metallic carrier plate, portion is provided with insulating barrier, circuit layer and solder mask and element only
Layer, remainder form the high-heat-dispersion LED wiring board bulb mould of multiaspect radiating by metallic carrier large area exposed outside component side
Group.
3. the LED circuit board bulb module of a kind of high radiating according to claim 1 and 2, it is characterised in that described
LED element is LED flip chip or is packaged LED surface mount elements.
4. the LED circuit board bulb module of a kind of high radiating according to claim 1 and 2, it is characterised in that described
LED element is the positive cartridge chips of LED, is conducting on circuit land by bonding wire welding, and described bonding wire is welded between chip
Bonding wire connection conducting between line, and/or chip and pad.
5. a kind of LED circuit board bulb module of high radiating according to claim 1 and 2, it is characterised in that described gold
Category carrier board is aluminum or aluminium alloy or copper or copper alloy or the copper after plating.
6. a kind of LED circuit board bulb module of high radiating according to claim 1 and 2, it is characterised in that the power supply
Device is paster power supply apparatus, be with LED element together paster welding conducting on same wiring board, formed light source device and
The LED circuit board bulb module of power supply apparatus integration.
7. a kind of LED circuit board bulb module of high radiating according to claim 1 and 2, it is characterised in that the power supply
Element is paster source element, and/or pin source element, and paster welding is turned on same together for surface mount elements and LED element
The surface of wiring board, pin member are welded in pad hole, and the back metal carrier at pad hole have been removed by or
It is the insulation board for having pasted a small pieces, formation is the integrated LED circuit board bulb module of light source device and power supply apparatus.
8. the LED circuit board bulb module of a kind of high radiating according to claim 1 and 2, it is characterised in that in LED line
Module wiring board on the plate bulb module of road is provided with the flexible circuit board that an extension is stretched out, the described soft electricity for stretching out
Road plate is directly welded at the wiring position on power circuit plate, forms the wiring board bulb module of light source and power supply integration.
9. the LED circuit board bulb module of a kind of high radiating according to claim 1 and 2, it is characterised in that by 1, or
The high-heat-dispersion LED wiring board bulb module that person is more than 1 is erect and is placed in bulb.
10. the LED circuit board bulb module of a kind of high radiating according to claim 1 and 2, it is characterised in that by 1,
Or the high-heat-dispersion LED wiring board bulb module of more than 1 be bent into solid geometry body or bending after be combined into solid
It is erected in bulb after geometrical body.
A kind of LED circuit board bulb module of 11. high radiatings according to claim 1 and 2, it is characterised in that the gold
Category carrier board, according to design requirement, at the corresponding position of bending or be to be cut at the exposed position of metallic carrier plate in advance
Except bending is easy in the formation of small part metal or is easy to the hole of ventilation and heat.
The LED circuit board bulb module of 12. a kind of high radiatings according to claim 2, it is characterised in that be separately positioned on
When metal circuitry on the insulating barrier of two sides needs two sides circuit turn-on, by-pass edges of boards edge, welding metal conductor is taken to lead
The conducting of logical or soldered elements.
The LED circuit board bulb module of 13. a kind of high radiatings according to claim 2, it is characterised in that be separately positioned on
When metal circuitry on the insulating barrier of two sides needs two sides circuit turn-on, two sides circuit layer is by outside dielectric layers assist side
Enclose bond together or assist side in the middle of bond together, abutting edge without metallic carrier plate, abutting edge have both sides open
Pad adjacent to each other, the conducting of two pad scolding tin or weldering conductor conducting.
The LED circuit board bulb module of 14. a kind of high radiatings according to claim 2, it is characterised in that be separately positioned on
When metal circuitry on the insulating barrier of two sides needs two sides circuit turn-on, take at least one of which circuit layer and insulating barrier in circuit
Edges of boards edge stretches out metallic carrier plate shape into flexible circuit, bends by-pass edges of boards edge, and welding is conducting to the another side of wiring board
Solder joint on formed conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620821977.4U CN206093582U (en) | 2016-07-28 | 2016-07-28 | High radiating LED circuit board bulb module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620821977.4U CN206093582U (en) | 2016-07-28 | 2016-07-28 | High radiating LED circuit board bulb module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206093582U true CN206093582U (en) | 2017-04-12 |
Family
ID=58467979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620821977.4U Expired - Fee Related CN206093582U (en) | 2016-07-28 | 2016-07-28 | High radiating LED circuit board bulb module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206093582U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455472A (en) * | 2016-07-28 | 2017-02-22 | 王定锋 | Method for manufacturing high heat radiation LED circuit board bulb module group |
-
2016
- 2016-07-28 CN CN201620821977.4U patent/CN206093582U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455472A (en) * | 2016-07-28 | 2017-02-22 | 王定锋 | Method for manufacturing high heat radiation LED circuit board bulb module group |
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Effective date of registration: 20171122 Address after: 244000 Tongling Jinqiao Industrial Park, Tongling, Anhui Patentee after: TONGLING GUOZHAN ELECTRONIC CO.,LTD. Address before: 516000 Guangdong city of Huizhou province Chen Chen Jiang Town Industrial Zone (Huizhou Avenue - State Electronics Co. Ltd.) Patentee before: Wang Dingfeng |
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Granted publication date: 20170412 |
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| CF01 | Termination of patent right due to non-payment of annual fee |