CN108695428A - A kind of LED light source and preparation method thereof of the soft or hard combination without substrate - Google Patents
A kind of LED light source and preparation method thereof of the soft or hard combination without substrate Download PDFInfo
- Publication number
- CN108695428A CN108695428A CN201710218629.7A CN201710218629A CN108695428A CN 108695428 A CN108695428 A CN 108695428A CN 201710218629 A CN201710218629 A CN 201710218629A CN 108695428 A CN108695428 A CN 108695428A
- Authority
- CN
- China
- Prior art keywords
- line layer
- led light
- light source
- luminescence chips
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title description 2
- 238000004020 luminiscence type Methods 0.000 claims abstract description 26
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000009413 insulation Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 229910052742 iron Inorganic materials 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000004568 cement Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011122 softwood Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a kind of LED light source of the soft or hard combination without substrate, the LED light source includes insulation glue-line, line layer and LED luminescence chips, the LED luminescence chips are fixed on the line layer by die bond mode, and it is electrically connected with the line layer, the position that the line layer surrounding does not connect LED luminescence chips is coated by the insulation glue-line, and the line layer is by copper sheet or the electric conductor of iron plate material by being stamped and formed out.The present invention is stamped and formed out line layer since the LED light source is passed through using copper sheet or iron plate electric conductor, due to by the direct die bond of LED luminescence chips in the line layer, it is not necessary that holder/substrate is in addition arranged, the line layer had not only served as conducting wire but also had served as holder/substrate, moreover it is possible to rapid cooling.Such design not only so that manufacture craft was easy, but also saved material, moreover it is possible to improve the service life of product.Such LED light source is novel in design, simple in structure, low manufacture cost, and is suitble to produce in enormous quantities.
Description
Technical field
The present invention relates to field of LED illumination, and in particular to a kind of soft or hard combination is without the LED light source of substrate and its making side
Method.
Background technology
LED lamp panel has very important application in the prior art, is typically that multiple LED are joined together to form
Circuit, lamp plate in the prior art are typically the structure that substrate adds insulating layer that line layer is added to add solder mask again, the material of this substrate
Matter has FPC, FR, Metal Substrate etc., FPC to belong to softwood matter, and hardness is low, weak heat-dissipating;FR and Metal Substrate belong to hard material, cannot be bent,
Without flexibility, be not suitable for irregular place.And the above structure is more complex, and cost of manufacture is higher.
Invention content
(One)Technical problems to be solved
The technical problem to be solved in the present invention is to provide a kind of no substrate, line layer works as substrate, radiates immediately, can form not similar shape
Shape, it is neither too hard, nor too soft, the inaccessiable hardness of soft lamp plate was not only solved, but also the inaccessiable deflection degree of hard lamp plate can be solved, that is, provided
A kind of LED light source of the soft or hard combination without substrate, while the production method that this kind of LED light source is provided.
(Two)Technical solution
In order to solve the above technical problems, the technical solution adopted in the present invention is as follows:
A kind of LED light source of the soft or hard combination without substrate, including insulation glue-line, line layer and LED luminescence chips, the LED shine
Chip is fixed on the line layer by die bond mode, and is electrically connected with the line layer, and the line layer surrounding does not connect
The position for connecing LED luminescence chips is coated by the insulation glue-line, and the line layer is passed through by copper sheet or the electric conductor of iron plate material
It is stamped and formed out.
Further, for convenience of radiating, at least one section of the line layer is exposed, i.e., is not coated by the insulation glue-line.
Further, the LED light source is strip.
Based on above-mentioned LED light source, the present invention also provides the production methods of the LED light source, including:
Circuit making step:Iron plate or copper sheet electric conductor are stamped and formed out circuit on press machine;
Wiring board forming step:The circuit made and insulating cement are molded by injection molding machine and squeezed, formation is coated by insulating cement
Wiring board, the pad position of LED luminescence chips is reserved on the wiring board, the pad position includes positive and negative anodes;
Die bond step:LED luminescence chips are fixed on to the positive or negative pole of pad position by bonder;
Bonding wire step:By another pole of LED luminescence chips and pad position(Positive or negative pole)Welding;
Encapsulation step:LED luminescence chips are encapsulated.
Further, the exposed partial line for heat dissipation is reserved on the wiring board that the wiring board forming step is formed
Road.
(Three)Advantageous effect
The present invention is compared to the prior art, has the advantages that:
The LED light source is passed through using copper sheet or iron plate electric conductor is stamped and formed out line layer, since LED luminescence chips is directly solid
Crystalline substance had not only served as conducting wire but also had served as holder/substrate in the line layer without in addition setting holder/substrate, the line layer, moreover it is possible to
Rapid cooling.So kind design not only so that manufacture craft was easy, but also save material, moreover it is possible to improve the service life of product.It is such
LED light source is novel in design, simple in structure, low manufacture cost, and is suitble to produce in enormous quantities, has practicability.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of LED light source of the soft or hard combination without substrate of the present invention.
1- insulation glue-lines;
2- line layers;
3-LED luminescence chips.
Specific implementation mode
With reference to the accompanying drawings and examples, the specific implementation mode of the present invention is described in further detail.Following reality
Example is applied for illustrating the present invention, but is not limited to the scope of the present invention.
A kind of LED light source of the soft or hard combination without substrate as shown in Figure 1, including insulation glue-line, line layer and the luminous cores of LED
Piece, the LED luminescence chips are fixed on the line layer by die bond mode, and are electrically connected with the line layer, the line
The position that road floor surrounding does not connect LED luminescence chips is coated by the insulation glue-line, and the line layer is by copper sheet or iron plate material
The electric conductor of matter is by being stamped and formed out.
Further, for convenience of radiating, at least one section of the line layer is exposed, i.e., is not coated by the insulation glue-line.
Further, the LED light source is strip.
Based on above-mentioned LED light source, the present invention also provides the production methods of the LED light source, including:
Circuit making step:Iron plate or copper sheet electric conductor are stamped and formed out circuit on press machine;
Wiring board forming step:The circuit made and insulating cement are molded by injection molding machine and squeezed, formation is coated by insulating cement
Wiring board, the pad position of LED luminescence chips is reserved on the wiring board, the pad position includes positive and negative anodes;
Die bond step:LED luminescence chips are fixed on to the positive or negative pole of pad position by bonder;
Bonding wire step:By another pole of LED luminescence chips and pad position(Positive or negative pole)Welding;
Encapsulation step:LED luminescence chips are encapsulated.
Further, the exposed partial line for heat dissipation is reserved on the wiring board that the wiring board forming step is formed
Road.
The present invention without other by the direct die bond of LED luminescence chips due to, in the line layer, being arranged holder/substrate, institute
It states line layer not only to have served as conducting wire but also served as holder/substrate, moreover it is possible to rapid cooling.So kind design both so that manufacture craft was easy,
Material is saved again, moreover it is possible to improve the service life of product.Such LED light source is novel in design, simple in structure, low manufacture cost, and
It is suitble to produce in enormous quantities, there is practicability.
Certainly, the specific application example that the above is only the present invention, is not limited in any way protection scope of the present invention.It removes
Outside above-described embodiment, the present invention can also have other embodiment.All technical sides formed using equivalent substitution or equivalent transformation
Case is all fallen within scope of the present invention.
Claims (6)
1. a kind of LED light source of the soft or hard combination without substrate, it is characterised in that:The LED light source include insulation glue-line, line layer and
LED luminescence chips, the LED luminescence chips are fixed on the line layer by die bond mode, and electrically connect with the line layer
It connects, the position that the line layer surrounding does not connect LED luminescence chips is coated by the insulation glue-line, and the line layer is by copper sheet
Or the electric conductor of iron plate material is by being stamped and formed out.
2. a kind of LED light source of the soft or hard combination without substrate according to claim 1, it is characterised in that:The line layer is extremely
Rare one section exposed, convenient for heat dissipation.
3. according to a kind of LED light source of the soft or hard combination without substrate of claim 1-2 any one of them, which is characterized in that described
LED light source is strip.
4. a kind of LED light strip, which is characterized in that including claim 1-2 any one of them LED light sources.
5. a kind of production method of the LED light source as described in claim 1-2 any one, including:
Circuit making step:Iron plate or copper sheet electric conductor are stamped and formed out circuit on press machine;
Circuit sheet metal forming:The circuit made and insulating cement are molded by injection molding machine and squeezed, the line coated by insulating cement is formed
Road plate is reserved with the pad position of LED luminescence chips on the wiring board, and the pad position includes positive and negative anodes;
Die bond step:LED luminescence chips are fixed on to the positive or negative pole of pad position by bonder;
Bonding wire step:By another pole of LED luminescence chips and pad position(Positive or negative pole)Welding;
Encapsulation:LED luminescence chips are encapsulated.
6. production method according to claim 5, which is characterized in that on the wiring board that the wiring board forming step is formed
It is reserved with the exposed part circuit for heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710218629.7A CN108695428A (en) | 2017-04-05 | 2017-04-05 | A kind of LED light source and preparation method thereof of the soft or hard combination without substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710218629.7A CN108695428A (en) | 2017-04-05 | 2017-04-05 | A kind of LED light source and preparation method thereof of the soft or hard combination without substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108695428A true CN108695428A (en) | 2018-10-23 |
Family
ID=63842648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710218629.7A Pending CN108695428A (en) | 2017-04-05 | 2017-04-05 | A kind of LED light source and preparation method thereof of the soft or hard combination without substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108695428A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109630913A (en) * | 2018-10-26 | 2019-04-16 | 江门市中阳光电科技有限公司 | The manufacturing method of light emitting device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201293282Y (en) * | 2008-11-03 | 2009-08-19 | 弘凯光电(深圳)有限公司 | LED support and LED luminous structure |
| CN101793352A (en) * | 2009-02-02 | 2010-08-04 | 林柏廷 | Manufacturing method for integral LED light source module |
| CN201655842U (en) * | 2010-04-20 | 2010-11-24 | 杭州威利广光电科技股份有限公司 | Surface mounted devices light-emitting diode encapsulating structure |
| CN202613354U (en) * | 2012-06-29 | 2012-12-19 | 泉州市博泰半导体科技有限公司 | Novel two-side illumination light source direct insertion bracket |
| CN202695439U (en) * | 2012-05-21 | 2013-01-23 | 王定锋 | LED die set with LED chip directly encapsulated on rigid-flexible circuit board |
| CN204130528U (en) * | 2014-08-26 | 2015-01-28 | 桂林电子科技大学 | A kind of lead frame posture high-power LED light source module |
| CN106455472A (en) * | 2016-07-28 | 2017-02-22 | 王定锋 | Method for manufacturing high heat radiation LED circuit board bulb module group |
| CN206711918U (en) * | 2017-04-05 | 2017-12-05 | 广州武宏科技股份有限公司 | A kind of LED light source of soft or hard combination without substrate and the LED using the light source |
-
2017
- 2017-04-05 CN CN201710218629.7A patent/CN108695428A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201293282Y (en) * | 2008-11-03 | 2009-08-19 | 弘凯光电(深圳)有限公司 | LED support and LED luminous structure |
| CN101793352A (en) * | 2009-02-02 | 2010-08-04 | 林柏廷 | Manufacturing method for integral LED light source module |
| CN201655842U (en) * | 2010-04-20 | 2010-11-24 | 杭州威利广光电科技股份有限公司 | Surface mounted devices light-emitting diode encapsulating structure |
| CN202695439U (en) * | 2012-05-21 | 2013-01-23 | 王定锋 | LED die set with LED chip directly encapsulated on rigid-flexible circuit board |
| CN202613354U (en) * | 2012-06-29 | 2012-12-19 | 泉州市博泰半导体科技有限公司 | Novel two-side illumination light source direct insertion bracket |
| CN204130528U (en) * | 2014-08-26 | 2015-01-28 | 桂林电子科技大学 | A kind of lead frame posture high-power LED light source module |
| CN106455472A (en) * | 2016-07-28 | 2017-02-22 | 王定锋 | Method for manufacturing high heat radiation LED circuit board bulb module group |
| CN206711918U (en) * | 2017-04-05 | 2017-12-05 | 广州武宏科技股份有限公司 | A kind of LED light source of soft or hard combination without substrate and the LED using the light source |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109630913A (en) * | 2018-10-26 | 2019-04-16 | 江门市中阳光电科技有限公司 | The manufacturing method of light emitting device |
| CN109630913B (en) * | 2018-10-26 | 2021-01-08 | 江门市中阳光电科技有限公司 | Method for manufacturing light emitting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7615799B2 (en) | Light-emitting diode package structure | |
| TWI231609B (en) | High heat-conductive PCB type surface mounted light emitting diode | |
| JP2020502779A (en) | QFN surface mount type RGB-LED package module and method of manufacturing the same | |
| KR200329900Y1 (en) | Adhesive type led lead frame | |
| US20110084303A1 (en) | Radiant heat structure for pin type power led | |
| CN103545436B (en) | Process for sapphire-based LED encapsulation structure and method for packing thereof | |
| CN104600187B (en) | Heat radiation structure of high illumination surface adhesive LED | |
| CN206758464U (en) | A kind of LED packaged light sources based on ceramic substrate | |
| CN107706175A (en) | Deflection high brightness LED | |
| CN108695428A (en) | A kind of LED light source and preparation method thereof of the soft or hard combination without substrate | |
| US20080042157A1 (en) | Surface mount light emitting diode package | |
| CN206711918U (en) | A kind of LED light source of soft or hard combination without substrate and the LED using the light source | |
| TWM327089U (en) | LED chip package structure | |
| CN107331756A (en) | A kind of radiator and chip integrative packaging light-source structure | |
| CN210920978U (en) | Rigid metal plate luminous support | |
| CN203836739U (en) | Silicon-substrate LED road lamp light source module | |
| CN206340574U (en) | A kind of QFN surface-adhered types RGB LED package supports | |
| CN100555629C (en) | Package structure for LED | |
| CN206419687U (en) | A kind of Novel LED light | |
| CN109244066B (en) | Non-base filament structure, non-base flexible filament, light source and manufacturing method of non-base filament structure | |
| CN203596351U (en) | LED-COB (chip on board) light source | |
| KR101190970B1 (en) | Method for producing electro-thermal separation type light emitting diode support structure | |
| CN103647006B (en) | A kind of LED-COB light source and preparation method thereof | |
| CN203398156U (en) | LED substrate based on hard alumina materials | |
| CN102299248B (en) | Manufacturing method for improving LED (light emitting diode) packaging support and packaging structure manufactured by using method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 511440 No. 1, No. 6, Lifeng Avenue, Lianhuashan Industrial Park, Shilou Town, Panyu District, Guangzhou City, Guangdong Province Applicant after: Golf technology (Guangzhou) Co.,Ltd. Address before: No.9, Zhongjiazhuang North Road, Shigang East Village, Dalong street, Panyu District, Guangzhou City, Guangdong Province Applicant before: GUANGZHOU WOHOO TECH Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181023 |
|
| WD01 | Invention patent application deemed withdrawn after publication |