CN109244066B - Non-base filament structure, non-base flexible filament, light source and manufacturing method of non-base filament structure - Google Patents
Non-base filament structure, non-base flexible filament, light source and manufacturing method of non-base filament structure Download PDFInfo
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- CN109244066B CN109244066B CN201811191364.7A CN201811191364A CN109244066B CN 109244066 B CN109244066 B CN 109244066B CN 201811191364 A CN201811191364 A CN 201811191364A CN 109244066 B CN109244066 B CN 109244066B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The LED flip chip is connected in series and parallel through the thin film conductive circuit to form a light-emitting circuit, and the free end of the light-emitting circuit forms a connecting end for external electrical connection. The flexible filament without the base material comprises a filament framework without the base material and a fluorescent glue layer coated and packaged outside the filament framework without the base material, and the connecting end is exposed outside the fluorescent glue layer. A light source comprises a base, an envelope and the base-free filament framework, wherein the base-free filament framework is arranged on the base, and the envelope is used for packaging the base-free filament framework. The non-substrate filament framework, the non-substrate flexible filament, the light source and the manufacturing method of the non-substrate filament framework adopt a pure circuit framework, simplify the procedures and realize the illumination purposes of low cost, high heat dissipation and large current.
Description
Technical Field
The invention belongs to the technical field of illumination, and particularly relates to a base-material-free filament framework, a base-material-free flexible filament, a light source and a manufacturing method of the base-material-free filament framework.
Background
Incandescent lamps have a long history and are the earliest appearing lighting lamps. Incandescent lamps have the defects of low energy conversion rate, high energy consumption, short service life and the like, and are contrary to the current environment-friendly development trend and face the elimination crisis. With the global elimination of the release of incandescent lamp roadmaps, LED filament lamps as incandescent lamp substitutes have emerged as an unprecedented development opportunity.
At present, a flexible filament is mostly adopted as a light-emitting element in an LED filament lamp. The flexible filament is formed by serially connecting a plurality of flip-chip LEDs to form HVLEDs modules by using an HVLED technology, and has the advantages of low temperature and low energy consumption. The flexible filament uses a copper foil covered polymer film (FPC, BT, PE and the like) as a base material, is slender, soft and plastic, can be bent to form different shapes, and provides different types of decorative lamps, thus being widely favored by consumers.
Nevertheless, existing flexible filaments suffer from several drawbacks that are difficult to overcome: (1) The flexible substrate is made of high polymer material, and the material price is high; (2) The heat dissipation performance of the flexible substrate is insufficient, so that the existing flexible filament can only work under a small current (generally 10-60 mA) environment, the luminous power is severely limited, and the flexible filament is mostly used as a decorative lamp and is difficult to use as a lighting lamp; (3) One side of the flexible filament is blocked by the flexible substrate, so that the light transmittance is limited, and the real 360-degree light emission cannot be realized.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a base-free filament framework, a base-free flexible filament, a light source and a manufacturing method of the base-free filament framework, and the method adopts a pure circuit framework, simplifies the procedures and realizes the illumination purposes of low cost, high heat dissipation and large current.
The aim of the invention is achieved by the following technical scheme:
The LED flip chip is connected in series and parallel through the thin film conductive circuit to form a light-emitting circuit, and the free end of the light-emitting circuit forms a connecting end for external electrical connection.
As an improvement of the above technical solution, the base-material-free filament architecture further includes a flexible reinforcing rim connected to the light emitting circuit, and the flexible reinforcing rim is used for reinforcing tensile strength of the light emitting circuit.
As a further improvement of the above technical solution, the flexible reinforcing edge extends along the connection direction of the LED flip chip, one end of the flexible reinforcing edge is integrally connected with the light emitting circuit, and the other end of the flexible reinforcing edge is kept separate from the light emitting circuit.
As a further improvement of the technical scheme, the flexible reinforcing side material extends along the connection direction of the LED flip chip, two ends of the flexible reinforcing side material are respectively and integrally connected with the light-emitting circuit, and no current passes through the flexible reinforcing side material.
As a further improvement of the technical scheme, the flexible reinforcing side material is located on the outer peripheral side of the light-emitting circuit, at least one end of the flexible reinforcing side material is integrally connected with the connecting end, and no current passes through the flexible reinforcing side material.
As a further improvement of the above technical solution, the flexible reinforcing rim material is integrally formed with the thin film conductive circuit.
As a further improvement of the above technical solution, the thin film conductive circuit includes a plurality of conductive circuit units that are independent of each other, the conductive circuit units are electrically connected with each other through the LED flip chip, and the free ends of the conductive circuit units form the connection ends.
As a further improvement of the above technical solution, the thin film conductive circuit has at least one die bonding region, the die bonding region includes a first die bonding region and a second die bonding region which are kept opposite, the first die bonding region and the second die bonding region are respectively disposed on different conductive circuit units, and the first die bonding region and the second die bonding region are electrically connected through the LED flip chip.
As a further improvement of the technical scheme, a light transmission gap is formed between adjacent conductive circuit units, the light transmission gap penetrates through the two side surfaces of the thin film conductive circuit, and the light emitting part of the LED flip chip is positioned in the light transmission gap.
As a further improvement of the above technical solution, the thin film conductive line is a substrate-free conductive line, and the thickness of the substrate-free conductive line is not greater than 0.175mm.
As a further improvement of the above technical solution, the substrate-free conductive line is a copper-clad conductive line or an electroplated conductive line.
As a further improvement of the above technical solution, the filament architecture without base material has at least a first array direction, along which a plurality of LED flip chips are sequentially arranged in a linear array.
As a further improvement of the above technical solution, the filament architecture without base material further has a second array direction, along which a plurality of LED flip chips are sequentially arranged in a linear array.
The base-free flexible filament comprises the base-free filament framework and a fluorescent glue layer coated and packaged outside the base-free filament framework, wherein the connecting end is exposed outside the fluorescent glue layer.
A light source comprising a base, an envelope and the stratless filament architecture of any one of the preceding claims, the stratless filament architecture being disposed on the base, the envelope being for encapsulating the stratless filament architecture.
As an improvement of the technical scheme, the packaging fluorescent glue layer is coated outside the base-free filament framework to form the base-free flexible filament, the base-free flexible filament is bent according to a preset shape and then is arranged on the base, the envelope is used for packaging the base-free flexible filament, and the two ends of the light-emitting circuit are respectively provided with metal terminals for external electric connection.
A method of manufacturing a baseless filament architecture, comprising:
Forming a thin film conductive trace on a releasable substrate;
fixedly welding an LED flip chip on the thin film conductive line to form a light-emitting circuit of the base material-free filament framework;
And peeling the peelable substrate.
As an improvement of the above technical solution, the thin film conductive circuit is directly formed on the peelable substrate by means of cumulative material forming.
As a further improvement of the above technical solution, the "forming a thin film conductive line on a releasable substrate" includes:
accumulating conductive materials on the surface of the strippable base material to form a conductive film layer;
and forming the thin film conductive circuit on the conductive film layer through material removal molding.
As a further improvement of the above technical solution, "peeling the releasable substrate" includes:
dispensing and packaging one side of the light-emitting circuit far away from the strippable base material;
and stripping the strippable base material and dispensing and packaging the side of the light-emitting circuit.
The beneficial effects of the invention are as follows:
(1) The light-emitting circuit with serial-parallel connection is directly built by the thin film conductive circuit and the LED flip chip, a pure circuit structure is realized without any supporting base material, the efficient heat dissipation capability is realized, the low-current bottleneck of the traditional flexible substrate is broken through, and the light-emitting circuit is suitable for the high-current and power requirements in the general lighting field;
(2) The light, thin and soft pure electric circuit structure has good flexibility, so that the filament framework and the flexible filament can be bent at will to form a required shape, and the shape requirement of the LED filament lamp is met;
(3) The free end of the light-emitting circuit is used as a connecting end electrically connected with the outside, and an independent metal terminal is not required to be arranged on the flexible filament, so that the production flow is saved;
(4) The LED flip chip can realize real 360-degree light emission without the base material structure, the light blocking influence of the flexible substrate with the traditional structure is avoided, and the LED flip chip has uniform and three-dimensional light emitting effect.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a front view structure of a filament architecture without a base material according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a partial enlarged structure of a filament architecture without a base material according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a partial enlarged structure of a thin film conductive circuit of a filament architecture without a base material according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an axial structure of a filament architecture without a base material according to an embodiment of the present invention;
fig. 5 is a first schematic structural view of a substrate-less flexible filament according to embodiment 3 of the present invention;
fig. 6 is a second schematic structural view of a substrate-less flexible filament provided in embodiment 3 of the present invention;
Fig. 7 is a schematic view of the structure of the LED filament lamp form of the light source provided in embodiment 4 of the present invention;
Fig. 8 is a flow chart of a method for manufacturing a filament architecture without a base material according to embodiment 5 of the present invention;
Fig. 9 is a schematic diagram of the product structure of step a of the method for manufacturing a base-free filament architecture according to embodiment 5 of the present invention;
Fig. 10 is a flowchart illustrating a step a of a method for manufacturing a filament architecture without a base material according to embodiment 5 of the present invention;
FIG. 11 is a schematic diagram of the structure of the product of step B of the method for manufacturing a filament architecture without substrate according to embodiment 5 of the present invention;
fig. 12 is a flow chart of step C of the manufacturing method of the base-material-free filament architecture provided in embodiment 5 of the present invention;
Description of main reference numerals:
P-light source, P (a) -substrate-free flexible filament, 1000-substrate-free filament architecture, 0100-thin film conductive lines, 0110-conductive line units, 0111-first solid welding area, 0112-second solid welding area, 0120-light transmission gap, 0200-LED flip chip, 0300-connecting end, 0400-flexible reinforcing side material, 2000-fluorescent glue layer, 3000-metal terminal, P (b) -base, P (c) -envelope, S-strippable substrate, S1-plastic film, S2-base plate.
Detailed Description
In order to facilitate an understanding of the present invention, a description will be given more fully below of a non-base filament structure, a non-base flexible filament, a light source, and a method of manufacturing the non-base filament structure, with reference to the accompanying drawings. Preferred embodiments of a stratless filament architecture, stratless flexible filament, light source, and method of manufacturing a stratless filament architecture are shown in the drawings. The non-base filament architecture, the non-base flexible filament, the light source, and the method of manufacturing the non-base filament architecture may be implemented in many different forms and are not limited to the embodiments described herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete with respect to a non-base filament architecture, a non-base flexible filament, a light source, and a method of manufacturing a non-base filament architecture.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the baseless filament architecture, the baseless flexible filament, the light source, and the method of manufacturing the baseless filament architecture is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Example 1
Referring to fig. 1-4 in combination, the present embodiment discloses a non-substrate filament architecture 1000, which includes a thin film conductive line 0100 and at least one LED flip chip 0200. It is understood that the number of LEDs may be one to plural, depending on the actual needs. When the number of the LED flip-chips 0200 is plural, the plural LED flip-chips 0200 are connected in series and parallel through the thin film conductive wire 0100 to form a light emitting circuit. The electrodes of the LED flip-chip 0200 are under, typically soldered in a patch-like manner, to achieve structural connection with the thin film conductive traces 0100. Typically, the soldering process of the LED flip chip 0200 becomes die bonding.
The free end of the light emitting circuit forms a connection end 0300 for external electrical connection. The free end of the light emitting circuit refers to the end where the LED flip chip 0200 series-parallel connection does not occur. The free end of the light emitting circuit is illustratively served by the free end of the thin film conductive trace 0100. Typically, the lighting circuit has two connections 0300 to introduce the electrical energy required for the LED flip chip 0200 in the lighting circuit to be enabled.
The thin film conductive line 0100 is a substrate-free conductive line, and is only composed of conductive lines, so that the thin film conductive line has a pure circuit structure and the defects of the flexible substrate are fundamentally eliminated. The heat dissipation performance of the pure circuit structure is outstanding, and the high-current high-voltage LED lamp can flow through and bear medium and high power, so that the application requirements of the general lighting field are met. Meanwhile, the pure electric circuit structure has flexibility far superior to that of the flexible substrate and is easy to bend to form a required shape.
In the substrate-free configuration, the thin film conductive trace 0100 has a thin and thin thickness, i.e., a trace thickness. Exemplary, the thickness of the substrate-less conductive trace is no greater than 0.175mm (corresponding to a copper-clad trace thickness unit of 5 oz). It is further preferred that the thickness of the substrate-less conductive trace is not greater than 1.5oz. Typically, the thickness of the substrate-free conductive trace includes specifications of 5oz, 1.5oz, 1.0oz, 0.5oz, 0.3oz, etc. It will be appreciated that the substrate-less conductive trace may be freely selected to a desired thickness within the aforementioned range, depending on the actual needs. The 1oz thickness was 35um.
The thin film conductive trace 0100 can be made of different conductive materials. Illustratively, thin film conductive trace 0100 is made of a conductive metal, such as copper, silver, or other alloy type. According to the different conductive materials, the thin film conductive line 0100 is formed by a corresponding forming method. Typically, the forming process includes cumulative material forming (e.g., casting, additive manufacturing, coating, electroplating, etc.), removed material forming (e.g., stamping, milling, wire cutting, etching, laser cutting, etc.), and the like.
The substrate-less conductive lines are illustratively copper-clad conductive lines. The copper-clad conductive line can be formed by directly coating copper on a substrate according to a serial-parallel circuit layout, or by removing material after coating copper on the substrate into a layer (such as etching, laser cutting, etc.).
The substrate-less conductive traces are illustratively plated conductive traces. The electroplated conductive line can be formed by directly electroplating a metal material on the substrate according to a serial-parallel circuit layout, or can be formed by removing materials (such as etching, laser cutting and the like) after electroplating the metal material on the substrate into a layer.
Illustratively, thin film conductive trace 0100 includes a plurality of conductive trace elements 0110 that are independent of each other. It will be appreciated that the different conductive trace units 0110 remain separated from one another before the LED flip chip 0200 is die bonded, and the internal circuitry of the same conductive trace unit 0110 remains integrally connected. The conductive line units 0110 are electrically connected through the LED flip chip 0200 respectively to form a light-emitting circuit with a complete circuit structure.
Wherein the free ends of conductive trace elements 0110 form connection terminals 0300. The free end of the conductive line unit 0110 is the end of the conductive line unit 0110 which is not connected with the LED flip chip 0200, and forms an open type wire structure for external connection.
Illustratively, thin film conductive trace 0100 has at least one die attach region formed between adjacent conductive trace elements 0110 for die attach of LED flip chip 0200, thereby enabling circuit connection of adjacent conductive trace elements 0110.
Illustratively, the die attach region includes a first die attach region 0111 and a second die attach region 0112 that remain opposite, with the electrical connection between the first die attach region 0111 and the second die attach region 0112 being made through the LED flip chip 0200. The first bonding area 0111 and the second bonding area 0112 belonging to the same die bonding area are respectively disposed on different conductive line units 0110. It is understood that any conductive trace unit 0110 may have one to a plurality of first bonding pads 0111 and/or second bonding pads 0112, depending on the desired series-parallel circuit configuration.
Illustratively, a light transmissive gap 0120 is formed between adjacent conductive trace units 0110. The light-transmitting gap 0120 penetrates through the two side surfaces of the thin film conductive line 0100, and the light-emitting part of the LED flip chip 0200 is located in the light-transmitting gap 0120. In other words, the light emitting diode of the LED flip chip 0200 is located in the light transmission gap 0120. In 360-degree circumference taking the connecting line between the first welding area 0111 and the second welding area 0112 as the axis, the LEDs are directly exposed on the outer surface of the light-emitting circuit, and the light is directly transmitted outwards without being blocked, so that the real 360-degree light emission is realized.
It is understood that the plurality of LED flip chips 0200 form the required light emitting array according to different array rules. Exemplarily, the stratless filament architecture 1000 has at least a first array direction. Along the first array direction, the plurality of LED flip chips 0200 are sequentially arranged in a straight line array, and a light emitting circuit is correspondingly formed according to the serial-parallel connection relation.
Exemplarily, the baseless filament architecture 1000 also has a second array direction. Along the second array direction, the plurality of LED flip chips 0200 are sequentially arranged in a linear array, and the light emitting circuit is correspondingly formed according to the serial-parallel connection relation. It is understood that the first array direction and the second array direction are not parallel to each other, forming a staggered distribution structure. The first array direction and the second array direction are typically perpendicular to each other, and a distribution angle may be used.
Example 2
Referring to fig. 1 to 4 in combination, on the basis of embodiment 1, this embodiment further discloses a specific structure of a base-free filament architecture 1000. Illustratively, the baseless filament architecture 1000 further includes a flexible reinforcing rim 0400 connected to the light emitting circuit, the flexible reinforcing rim 0400 being configured to enhance the tensile strength of the light emitting circuit to avoid breakage of the light emitting circuit (particularly the thin-film conductive trace 0100) when bent or peeled from the substrate. Meanwhile, the flexible reinforced side material 0400 has good flexibility and is easy to bend and shape. Illustratively, the flexible reinforcing rim 0400 is of thin-film construction, has a thin thickness, and may be in the shape of a sheet, wire, or the like.
The flexible reinforcing rim 0400 extends in a direction that is consistent with the desired enhanced tensile strength. Illustratively, the flexible reinforcing rim 0400 extends along the connection direction (or array direction) of the LED flip-chip 0200. For example, the flexible reinforcing rim 0400 extends in the first array direction. Wherein, flexible reinforcing rim material 0400 keeps being connected with at least one end of light-emitting circuit, and the connection between the two does not exert an influence to the circuit structure of light-emitting circuit.
For example, the flexible reinforcing rim 0400 has one end integrally connected with the light-emitting circuit and the other end kept separate from the light-emitting circuit. Here, the flexible reinforcing rim 0400 may be made of a metal material (e.g., copper wire) or an insulating material (e.g., plastic).
For another example, two ends of the flexible reinforced edge 0400 are respectively connected with the light-emitting circuit integrally, and no current passes through the flexible reinforced edge 0400. Here, insulation is maintained between the flexibility enhancing edge 0400 and the light emitting circuit. Illustratively, the flexible reinforcing rim 0400 is made of an insulating material (e.g., plastic).
Illustratively, the flexible reinforced edge 0400 is integrally formed with the thin-film conductive trace 0100, resulting in a light-emitting circuit having more excellent structural strength. For example, the flexible reinforced edge 0400 and the thin-film conductive line 0100 are formed from the same metal material by the same forming process, i.e., in the form of copper-clad conductive lines and plated conductive lines as described above.
It is understood that the flexible reinforcement rim 0400 can be connected to both the connection end 0300 of the light emitting circuit and the conductive trace element 0110. In the former configuration, the flexible reinforcing rim 0400 is exemplarily located at the outer circumferential side of the light emitting circuit, at least one end of the flexible reinforcing rim 0400 is integrally connected with the connection end 0300, and no current passes through the flexible reinforcing rim 0400. In the latter configuration, the flexible reinforcement rim 0400 is positioned between adjacent conductive trace units 0110, with one end connected to one conductive trace unit 0110 and the other end kept connected or disconnected from the other conductive trace unit 0110, and no current passes through the flexible reinforcement rim 0400.
Supplement the explanation, the flexibility that traditional flexible filament had makes filament molding degree of difficulty reduce, and the design degree of difficulty of filament is corresponding to be improved. Correspondingly, the conventional LED filament lamp needs to adopt molybdenum wires to fix the flexible filaments, so that the production process is increased, and pollution to the flexible filaments is easily caused. And molybdenum wires can also cause luminous shielding of filaments and damage of packaging colloid, and hidden dangers of poor electrical performance exist in the long-term use process.
Exemplarily, the flexible reinforced edge 0400 is further used for increasing the plasticity of the light-emitting circuit, so that the base material-free filament support has good plasticity, is easy to keep the current modeling, meets the modeling requirement of the LED filament lamp, can realize shaping without molybdenum wires, and avoids adverse effects caused by the molybdenum wires. Illustratively, the flexible reinforcing rim 0400 is a thin-film structure made of a plastic material (such as a plastic metal of low-carbon steel, copper, aluminum, or the like, a non-metal plastic material of plastic, rubber, or the like) having good plasticity at room temperature, so that the current shape is easily maintained.
Example 3
Referring to fig. 5-6, the present embodiment discloses a flexible filament P (a) without substrate, which includes a filament structure 1000 without substrate described in embodiment 1 or 2 and a fluorescent glue layer 2000 coated and encapsulated outside the filament structure 1000 without substrate. The relative positions of the connecting end 0300 and the fluorescent glue layer 2000 are different according to different application requirements.
Referring to fig. 5, in a first example, the connection end 0300 is exposed outside the fluorescent glue layer 2000, so as to implement external circuit connection. In this configuration, the connection end 0300 has a flexible structure, and is easily attached.
Referring to fig. 6, in a second example, a connection terminal 0300 is provided with a metal terminal 3000 for external electrical connection. Wherein, the connection portion of the metal terminal 3000 and the connection end 0300 is wrapped by the fluorescent glue layer 2000, and one end of the metal terminal 3000 far away from the connection end 0300 is exposed outside the fluorescent glue layer 2000.
The fluorescent glue layer 2000 is formed by coating and curing fluorescent glue. The fluorescent glue can be formed by blending fluorescent powder (nitride, gallate, YAG, rare earth aluminate and the like) and packaging glue (silica gel, epoxy resin and the like), and good light transmission is ensured.
In the embodiment in which the flexible reinforcing side material 0400 is a thin film structure made of plastic material, the substrate-free flexible filament P (a) has good plasticity, is easy to keep the current shape, meets the shape requirement of the LED filament lamp, can realize the shape without molybdenum wires, and avoids the adverse effect caused by the molybdenum wires.
Example 4
Referring to fig. 7, the present embodiment discloses a light source P, which includes a base P (b), an envelope P (c), and the non-base filament structure 1000 described in the embodiments, wherein the non-base filament structure 1000 is disposed on the base P (b), and the envelope P (c) is used for packaging the non-base filament structure 1000. The base P (b) is used to realize external conduction to supply the electric power required by the light source P. It will be appreciated that the light source P is of a wide variety including bulb, T-tube, panel, etc.
The light source P is illustratively in the form of an LED filament lamp. The package fluorescent glue layer 2000 is coated on the exterior of the filament structure 1000 without substrate to form the flexible filament P (a) without substrate described in embodiment 3, the flexible filament P (a) without substrate is bent according to a preset shape and then is disposed on the base P (b), the envelope P (c) is used for packaging the flexible filament P (a) without substrate, and the connection end 0300 is provided with the metal terminal 3000 for external electrical connection.
In the embodiment where the flexible reinforcing rim 0400 is a thin-film structure made of plastic material, the LED filament lamp is easy to maintain the current shape, and the shaping of the substrate-free flexible filament P (a) can be realized without molybdenum wires, so that adverse effects caused by the molybdenum wires are avoided.
Example 5
Referring to fig. 8, the present embodiment discloses a method for manufacturing a base-free filament architecture 1000 for manufacturing the base-free filament architecture 1000 described in embodiment 1 or 2, the method includes steps a to C:
Step A: thin film conductive traces 0100 are formed on the releasable substrate S. The film conductive trace 0100 can be formed by a number of methods, including cumulative material forming (e.g., casting, additive manufacturing, coating, plating, etc.), subtractive material forming (e.g., stamping, milling, wire cutting, etching, laser cutting, etc.), and the like. Fig. 9 shows the structure of the product obtained in step a.
The film conductive line 0100 has a plurality of molding materials, and can be metal such as copper and iron, flexible alloy with surface plated with conductive material, and the like. It is added that the number of the thin film conductive lines 0100 formed simultaneously may be one to plural. Additionally, the conductive trace elements 0110 of the thin film conductive traces 0100 are independent of each other and are commonly held on the releasable substrate S.
The purpose of the releasable substrate S is at least to provide a basis for the formation of the thin film conductive traces 0100. The peelable substrate S is easy to peel, and may be a plastic film (such as a PET film, etc.), a substrate S2 (such as a plastic plate, etc.), or a combination of a plastic film S1 and a substrate S2 (where the plastic film S1 is located between the substrate S2 and the film conductive trace 0100). The releasable substrate S was heat-resistant and physically stable, and maintained stable in structure during processing before release.
Illustratively, thin film conductive trace 0100 is formed directly on releasable substrate S by cumulative material forming. For example, the thin film conductive trace 0100 is a copper-clad conductive trace, which is directly coated with copper on the releasable substrate S according to a serial-parallel circuit layout. For another example, the thin film conductive line 0100 is an electroplated conductive line, which is formed by directly electroplating a metal material on a substrate according to a serial-parallel circuit layout.
Referring to fig. 10, exemplary thin film conductive trace 0100 is formed by a combination of cumulative material forming and subtractive material forming. Correspondingly, the step A comprises the steps A1 to A2:
step A1: and forming a conductive film layer by accumulating conductive material on the surface of the strippable base material S. The thickness of the conductive film layer is the thickness of the thin film conductive line 0100. Illustratively, the conductive material may be formed on the surface of the releasable substrate S by coating or plating.
Step A2: and forming a thin film conductive line 0100 on the conductive film layer by removing material and molding. The material removal molding process includes etching, laser cutting, etc. to remove excess conductive material from the conductive film layer, thereby forming thin film conductive trace 0100.
Illustratively, in embodiments where the non-substrate filament architecture 1000 has a flexible reinforcing rim 0400, the flexible reinforcing rim 0400 is molded over the peelable substrate S along with the thin-film conductive lines 0100.
And (B) step (B): LED flip chip 0200 is soldered on thin film conductive trace 0100 to form a light emitting circuit of the baseless filament architecture 1000. As previously described, thin film conductive trace 0100 has at least one die attach region. In the die bonding region, a gap is formed between adjacent conductive trace units 0110 to form a first die bonding region 0111 and a second die bonding region 0112 of the die bonding region. The two ends of the LED flip chip 0200 are respectively welded to the first solid welding area 0111 and the second solid welding area 0112 in a reflow welding mode and other welding modes, so that bridge type electric connection is formed. Fig. 11 shows the structure of the product obtained in step B.
Step C: the releasable substrate S is peeled off. Even if the releasable substrate S is separated from the light-emitting circuit, a non-substrate filament arrangement 1000 is obtained. It will be appreciated that the order in which the stripping of the releasable substrate S is performed will vary depending on the product to be produced.
Referring to fig. 12, step C illustratively includes C1-2 for further manufacturing the base-free flexible filament P (a) described in example 3:
Step C1: dispensing and packaging are carried out on one side of the light-emitting circuit far away from the strippable substrate S. The packaging material is fluorescent glue, and the fluorescent glue is coated and cured by dispensing, so that the fluorescent glue is wrapped on one side surface of the base material-free filament architecture 1000 to form a first side glue layer.
Step C2: the releasable substrate S is peeled off and the side of the light emitting circuit is spot-glued and packaged. After peeling, one side surface of the original peelable substrate S of the substrate-less flexible filament P (a) has not yet been encapsulated. At this time, dispensing coating and curing are performed with a fluorescent glue from the side, so that the fluorescent glue is wrapped on the surface of the side of the substrate-free flexible filament P (a), and the fluorescent glue layer 2000 on the second side is formed. The first side adhesive layer and the second side adhesive layer are glued and connected to form the fluorescent adhesive layer 2000 which is completely wrapped outside the substrate-free flexible filament P (a).
It is added that in the first example, the connection end 0300 is exposed outside the fluorescent glue layer 2000, so as to implement external circuit connection. In this form, the product of step C2 is shown in fig. 5.
In addition, in the second example, the connection end 0300 is provided with a metal terminal 3000 for external electrical connection. Accordingly, before performing step C1, the metal terminal 3000 is disposed at the connection end 0300. In step C1-2, one end of the metal terminal 3000 is coated and cured by fluorescent glue, and the other end remains exposed. Wherein, the metal terminal 3000 and the connecting end 0300 can be fixed by welding, so as to ensure the electrical conduction between the two. In this form, the product of step C2 is shown in fig. 6.
Any particular values in all examples shown and described herein are to be construed as merely illustrative and not a limitation, and thus other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
The above examples merely represent a few embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the present invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of the invention should be assessed as that of the appended claims.
Claims (10)
1. The base material-free filament framework is characterized by comprising a thin film conductive circuit and a plurality of LED flip chips, wherein the LED flip chips are connected in series and parallel through the thin film conductive circuit to form a light-emitting circuit, and the free end of the light-emitting circuit forms a connecting end for external electrical connection; the base material-free filament architecture further comprises a flexible reinforcing side material connected to the light-emitting circuit, wherein the flexible reinforcing side material is used for reinforcing the tensile strength of the light-emitting circuit; the flexible reinforced edge extends along the connection direction of the LED flip chip, two ends of the flexible reinforced edge are respectively and integrally connected with the light-emitting circuit, and no current passes through the flexible reinforced edge; the thin film conductive circuit comprises a plurality of mutually independent conductive circuit units, wherein the conductive circuit units are respectively and electrically connected through the LED flip chip, and the free ends of the conductive circuit units form the connecting ends; the thin film conductive circuit is provided with at least one die bonding area, the die bonding area comprises a first die bonding area and a second die bonding area which are kept opposite, the first die bonding area and the second die bonding area are respectively arranged on different conductive circuit units, and the first die bonding area and the second die bonding area are electrically connected through the LED flip chip; a light transmission gap is formed between adjacent conductive circuit units, the light transmission gap penetrates through the surfaces of two sides of the thin film conductive circuit, and a light emitting part of the LED flip chip is positioned in the light transmission gap; the flexible reinforcing side material extends along the connection direction of the LED flip chip, a connecting line between two electrodes of the LED flip chip extends along the extension direction of the flexible reinforcing side material, one end of the flexible reinforcing side material is integrally connected with the light-emitting circuit, and the other end of the flexible reinforcing side material is kept separate from the light-emitting circuit; the flexible reinforcing side material is positioned on the outer peripheral side of the light-emitting circuit, at least one end of the flexible reinforcing side material is integrally connected with the connecting end, and no current passes through the flexible reinforcing side material; the base material-free filament framework is provided with at least a first array direction and a second array direction, the LED flip chips are sequentially arranged in a straight line along the first array direction, and the LED flip chips are sequentially arranged in a straight line along the second array direction.
2. The stratless filament architecture of claim 1 wherein the flexible reinforcing rim is integrally formed with the thin film conductive trace.
3. The stratless filament architecture of claim 1 wherein the thin film conductive trace is a stratless conductive trace having a thickness of no greater than 0.175mm.
4. The stratless filament architecture of claim 3 wherein the stratless conductive trace is a copper-clad conductive trace or a plated conductive trace.
5. A baseless flexible filament comprising the baseless filament structure of any of claims 1-4 and a phosphor paste layer coating and encapsulating the exterior of the baseless filament structure;
The connecting end is exposed out of the fluorescent glue layer and is used for external electrical connection;
or the connecting end is provided with a metal terminal for external electric connection, the metal terminal and the connecting part of the connecting end are wrapped by the fluorescent glue layer, and one end of the metal terminal, which is far away from the connecting end, is exposed outside the fluorescent glue layer.
6. A light source comprising a base, an envelope and the stratless filament arrangement of any one of claims 1-4, the stratless filament arrangement being disposed on the base, the envelope being for encapsulating the stratless filament arrangement.
7. The light source of claim 6, wherein the outer portion of the filament frame is coated with a fluorescent glue layer to form a filament without base material, the filament without base material is bent according to a preset shape and then is arranged on the base, the envelope is used for packaging the filament without base material, and the connection end is provided with a metal terminal for external electrical connection.
8. A method of manufacturing a baseless filament construction using the baseless filament construction of any of claims 1-4, further comprising:
Forming a thin film conductive trace on a releasable substrate;
fixedly welding an LED flip chip on the thin film conductive line to form a light-emitting circuit of the base material-free filament framework;
peeling the releasable substrate;
dispensing and packaging one side of the light-emitting circuit far away from the strippable base material;
and stripping the strippable base material and dispensing and packaging the side of the light-emitting circuit.
9. The method of claim 8, wherein the thin film conductive trace is formed directly on the releasable substrate by cumulative material forming.
10. The method of claim 8, wherein forming thin film conductive traces on a releasable substrate comprises:
accumulating conductive materials on the surface of the strippable base material to form a conductive film layer;
and forming the thin film conductive circuit on the conductive film layer through material removal molding.
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| CN109945096B (en) * | 2019-04-24 | 2024-08-13 | 深圳市欣上科技有限公司 | High-reliability lamp strip using LED flip chip and light-emitting device |
| CN111256057A (en) * | 2020-01-21 | 2020-06-09 | 重庆慧库科技有限公司 | Lamp belt |
| WO2022099836A1 (en) * | 2020-11-14 | 2022-05-19 | 杭州杭科光电集团股份有限公司 | Full-circumferential led light-emitting wire, packaging method therefor, light source, and lamp |
| CN114512582A (en) * | 2020-11-14 | 2022-05-17 | 杭州杭科光电集团股份有限公司 | Full-ambient light LED light emitting wire, packaging method thereof, light source and lamp |
| WO2024016582A1 (en) * | 2022-07-21 | 2024-01-25 | 杭州杭科光电集团股份有限公司 | Substrate for light-emitting module, light-emitting module and lamp |
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