CN109065524A - LED module, flexible filament, light source and LED module manufacturing method - Google Patents
LED module, flexible filament, light source and LED module manufacturing method Download PDFInfo
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- CN109065524A CN109065524A CN201810730874.0A CN201810730874A CN109065524A CN 109065524 A CN109065524 A CN 109065524A CN 201810730874 A CN201810730874 A CN 201810730874A CN 109065524 A CN109065524 A CN 109065524A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A kind of LED module, including at least one LED unit, the LED unit include: metallic support, including the first metallic object and the second metallic object being oppositely arranged；Light emitting module, including insulative bridge and LED chip, the insulative bridge connect first metallic object and second metallic object for bridge-type, and the LED chip is for being electrically connected first metallic object and second metallic object；When the LED unit is a plurality of, the LED unit realizes series/parallel connection by the metallic support.A kind of flexibility filament, is packaged in the fluorescent adhesive layer outside the LED module including LED module described in any of the above item and coating.LED module, flexible filament, light source and LED module manufacturing method provided by the invention break through the limitation of chip selection using metal modular structure, simplify process, reduce circuit design manufacture difficulty, realize the lighting use of low cost, high heat dissipation, high current.
Description
Technical field
The invention belongs to lighting technical fields, specifically, are related to a kind of LED module, flexible filament, light source and LED
Module making method.
Background technique
Incandescent lamp has a long history, and is the illuminator occurred earliest.Incandescent lamp there are energy transformation ratios low, energy consumption
It high, the defects of service life is short, is runed counter to the environmentally friendly development trend in the present age, crisis on the verge of being replaced.With the superseded incandescent lamp in the whole world
The publication of route map, the LED filament lamp as incandescent lamp substitute have welcome unprecedented opportunity to develop.
Currently, LED filament lamp mostly uses flexible filament as light-emitting component.Flexible filament utilizes HVLED technology, by more
LED chip connects to form HVLEDs mould group, has the advantages that low temperature low energy consumption.Flexible filament is with the laminating macromolecule membrane of copper foil
(FPC, BT, PE etc.) is base material, elongated flexible and have plasticity, it is bent to form different moulding, different type is provided
Decorative lamp, thus the extensive favor by consumer.
Nevertheless, existing flexibility filament haves the defects that some to be difficult to overcome: (1) flexible base board must be by macromolecule material
Material is made, and material price is high；(2) flexible base board heat dissipation performance is insufficient, and existing flexible filament is made to be only capable of working in low current
Under (generally 10-60mA) environment, luminous power critical constraints mostly are difficult to make as illuminator as decorative lamp purposes
With；(3) printed circuit is complicated, and yields is low；(4) flip-chip must be used, to guarantee LED chip connection under flexible state
Reliability, chip selection are limited；(5) flexible filament both ends need to increase independent metal terminal, increase production stage at
This.
Meanwhile the flexible preferable flexibility of filament, while reducing filament moulding difficulty, the sizing difficulty of filament is corresponding
It improves.Existing LED filament lamp needs to carry out button silk to flexible filament using molybdenum filament to fix, not only increases production process, but also hold
Easily flexible filament is polluted.And molybdenum filament also will cause to filament it is luminous block, packing colloid damage, long-term use process
There are the undesirable hidden danger of electric property.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of LED module, flexible filament, light source and LED modules
Manufacturing method breaks through the limitation of chip selection using metal modular structure, simplifies process, reduces circuit design manufacture difficulty, real
The now lighting use of low cost, high heat dissipation, high current.
The purpose of the present invention is achieved through the following technical solutions:
A kind of LED module, including at least one LED unit, the LED unit include:
Metallic support, including the first metallic object and the second metallic object being oppositely arranged；
Light emitting module, including insulative bridge and LED chip, the insulative bridge connect first metallic object and institute for bridge-type
The second metallic object is stated, the LED chip is for being electrically connected first metallic object and second metallic object；
When the LED unit is a plurality of, the LED unit realizes series/parallel connection by the metallic support.
As an improvement of the above technical solution, to include the first solid welding zone consolidate welding zone with second to the metallic support, and described the
One solid welding zone and the first metallic object integrally connected, the described second solid welding zone and the second metallic object integrally connected, it is described
First solid welding zone is realized by the LED chip with the described second solid welding zone and is electrically connected.
As a further improvement of the above technical scheme, the described first solid welding zone is all set in institute with the described second solid welding zone
It states in insulative bridge.
As a further improvement of the above technical scheme, the LED module at least has the first array direction, along described
A burst of column direction, a plurality of LED units are successively in line array.
As a further improvement of the above technical scheme, along first array direction, the first metal of adjacent LED units
It keeps conllinear respectively between body, between the second metallic object, keeps between the first metallic object of adjacent LED unit or the second metal
Integrally connected between body.
As a further improvement of the above technical scheme, it is mutually not connected to along first array direction, adjacent LED units
The first metallic object be truncated by the first Metal Substrate, discrete second metallic object is by the second metal in adjacent LED units
Base is truncated, first Metal Substrate and second Metal Substrate separation light emitting module two sides.
As a further improvement of the above technical scheme, the LED module also has second array direction, along described second
Array direction, the second metallic object integrally connected of the first metallic object of the LED unit and adjacent LED unit.
As a further improvement of the above technical scheme, the insulative bridge has first for containing the LED chip
Receiving portion, the first receiving portion of first receiving portion both ends are separately connected first metallic object and second metallic object, institute
The first receiving portion side is stated to keep opening.
As a further improvement of the above technical scheme, the insulative bridge has and is disposed opposite to each other with first receiving portion
Second receiving portion, second receiving portion keep opening far from the side of first receiving portion.
As a further improvement of the above technical scheme, second receiving portion is opened on each to side of the insulative bridge
Wall.
As a further improvement of the above technical scheme, the LED chip of the light emitting module is a plurality of, and described in separation
The not same surface of insulative bridge.
As a further improvement of the above technical scheme, the insulative bridge is made of transparent plastic.
As a further improvement of the above technical scheme, the light emitting module further includes non-luminescent electronic component, described
Non-luminescent electronic component is electrically connected the two in first metallic object, second metallic object and the LED chip.
As a further improvement of the above technical scheme, the LED chip of the light emitting module is by non-luminescent electronic component
It replaces and forms non-luminescent module, the light emitting module of the LED unit is replaced by the non-luminescent module and forms non-luminescent list
Member, the LED unit realize that series/parallel is connect by the metallic support with the non-luminescent unit.
As a further improvement of the above technical scheme, the LED module further includes for encapsulating the non-luminescent module
Encapsulation glue-line.
As a further improvement of the above technical scheme, the LED module further includes for encapsulating the light emitting module
Encapsulate glue-line.
As a further improvement of the above technical scheme, there is the bending part for being easy to bend between the LED unit, it is described
First metallic object and the bending part integrally connected and/or second metallic object and the bending part integrally connected.
A kind of flexibility filament, is packaged in outside the LED module including LED module described in any of the above item and coating
Fluorescent adhesive layer, the free end of the LED module keep exposed and form the metal terminal for being externally electrically connected, the LED
The free end of mould group is that one end keeps free first metallic object or the second metallic object.
A kind of light source, including LED module described in pedestal, big envelope and any of the above item, the LED module is set to described
On pedestal, the big envelope is for sealing the LED module.
As an improvement of the above technical solution, coating encapsulates fluorescent adhesive layer and forms flexible filament outside the LED module,
The flexibility filament is set on the pedestal after bending according to preset shape, and the big envelope is for sealing the flexible filament, institute
The free end for stating LED module both ends keeps exposed and forms the metal terminal for being externally electrically connected, the LED module both ends
Free end be that one end keeps free first metallic object or the second metallic object.
A kind of LED module manufacturing method, comprising:
Profiled metallic, the metal framework have at least one metallic support, and the metallic support has opposite set
The first metallic object and the second metallic object set；
Insulative bridge is formed between the first metallic object and the second metallic object of the metallic support；
In the die bond for realizing LED chip in the insulative bridge；
Material processing and forming is removed to the metal framework, so as to form series/parallel between adjacent metallic support
Circuit structure.
As an improvement of the above technical solution, the LED module manufacturing method further include: to the insulative bridge Jing Guo die bond into
Row glue dispensing and packaging.
The beneficial effects of the present invention are:
(1) metallic support of LED unit is formed with the first metallic object and the second metallic object, and further connection forms LED
The metal architecture of mould group realizes structure support and high efficiency and heat radiation with cheap metal material, breaks through the low electricity of conventional flex substrate
Bottleneck is flowed, the high current and power requirement of general illumination field are adapted to；
(2) light emitting module is electrically connected with the metallic support that the first metallic object and the second metallic object are formed, is realized with metal
Water conservancy diversion and can any strap circuits, save the process of printed circuit, reduce cost, discharge flexible base board structure to circuit design
Constraint, arbitrariness with circuit design and easily expands characteristic, flexible filament also no setting is required independent metal terminal and save
Production procedure；
(3) metallic support has preferable flexibility and easy constancy in LED size environment, makes LED module and flexibility
Filament can arbitrarily be bent to form required moulding, meet the moulding needs of LED filament lamp, and sizing can be realized without molybdenum filament,
Molybdenum filament bring is avoided to adversely affect；
(4) insulative bridge and LED chip form independent independent light emitting module, and insulative bridge has light transmission features and guarantees LED
360 ° of chip shine, and insulative bridge provides reliable structural defence for LED chip, and LED chip connection is reliable under flexible state
Property guaranteed always, breach chip selection limitation, positive cartridge chip and flip-chip are applicable.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the cascaded structure schematic diagram for the LED module that the embodiment of the present invention 1 provides；
Fig. 2 is the parallel-connection structure schematic diagram for the LED module that the embodiment of the present invention 1 provides；
Fig. 3 is the vertical view axonometric schematic diagram of the LED unit for the LED module that the embodiment of the present invention 1 provides；
Fig. 4 is the flip-chip scheme of installation for the LED module that the embodiment of the present invention 1 provides；
Fig. 5 is the blind hole structure schematic diagram of the first receiving portion of the LED module that the embodiment of the present invention 1 provides；
Fig. 6 is the horizontal type LED die bond structural schematic diagram for the LED module that the embodiment of the present invention 1 provides；
Fig. 7 is that the LED unit for the LED module that the embodiment of the present invention 1 provides looks up axonometric schematic diagram；
Fig. 8 is the package structure diagram of the LED unit for the LED module that the embodiment of the present invention 1 provides；
Fig. 9 is the two-sided die bond structural schematic diagram of the LED unit for the LED module that the embodiment of the present invention 1 provides；
Figure 10 is the blank schematic diagram with second array direction for the LED module that the embodiment of the present invention 1 provides；
Figure 11 is the finished product schematic with second array direction for the LED module that the embodiment of the present invention 1 provides；
Figure 12 is the knot of the luminescence unit with non-luminescent electronic component for the LED module that the embodiment of the present invention 1 provides
Structure schematic diagram；
Figure 13 is the structural schematic diagram of the non-luminescent unit for the LED module that the embodiment of the present invention 1 provides；
Figure 14 is the structural schematic diagram after the removal part fluorescent glue for the flexible filament that the embodiment of the present invention 2 provides；
Figure 15 is the structural schematic diagram for the light source that the embodiment of the present invention 3 provides；
Figure 16 is the step flow chart for the LED module manufacturing method that the embodiment of the present invention 4 provides；
Figure 17 is the first knot of the metal framework that the step A for the LED module manufacturing method that the embodiment of the present invention 4 provides is obtained
Structure schematic diagram；
Figure 18 is the second knot of the metal framework that the step A for the LED module manufacturing method that the embodiment of the present invention 4 provides is obtained
Structure schematic diagram；
Figure 19 is that the first structure for the product that the step B for the LED module manufacturing method that the embodiment of the present invention 4 provides is obtained is shown
It is intended to；
Figure 20 is that the second structure of the product that the step B for the LED module manufacturing method that the embodiment of the present invention 4 provides is obtained is shown
It is intended to.
Main element symbol description:
P- light source, P (a)-flexibility filament, 1000-LED mould group, 0100-LED unit, 0110- metallic support, 0111- the
One metallic object, the second metallic object of 0112-, 0113- first consolidate welding zone, and 0114- second consolidates welding zone, 0120- light emitting module, 0121-
Insulative bridge, the first receiving portion of 0121a-, the second receiving portion of 0121b-, 0121c- normal society plastic cement, 0122-LED chip, 0122a- gold
Line, 0130- encapsulate glue-line, the non-luminescent unit of 0200-, the non-luminescent module of 0210-, the non-luminescent electronic component of 0211-, 0300-
Bending part, 2000- fluorescent adhesive layer, 3000- metal terminal, P (b)-pedestal, P (c)-big envelope, S- metal framework, the-the first gold of S (a)
Belong to base, the-the second Metal Substrate of S (b), S (c)-forms hole location, S (d)-location hole, S (e)-reference opening, S (f)-dowel.
Specific embodiment
To facilitate the understanding of the present invention, below with reference to relevant drawings to LED module, flexible filament, light source and LED module
Manufacturing method is described more fully.LED module, flexible filament, light source and LED module manufacturing method are given in attached drawing
Preferred embodiment.But LED module, flexible filament, light source and LED module manufacturing method can pass through many different forms
To realize, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes to LED module, soft
The disclosure of property filament, light source and LED module manufacturing method is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper",
There is no intermediary elements.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are
For illustrative purposes.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Saying in LED module, flexible filament, light source and LED module manufacturing method herein
Term used in bright book, which is only for the purpose of describing specific embodiments, is not intended to limit the present invention.Made herein
Term " and/or " it include any and all combinations of one or more related listed items.
Embodiment 1
Fig. 1~4 are please referred to, the present embodiment discloses a kind of LED module 1000, including at least one LED unit 0100.
Wherein, LED unit 0100 includes metallic support 0110 and light emitting module 0120.Wherein, metallic support 0110 includes the first metal
Body 0111 and the second metallic object 0112, substantially series-parallel bracket.First metallic object 0111 is set relatively with the second metallic object 0112
It sets and 0120 two sides of light emitting module of living apart, the structure and electrical connection both realized by light emitting module 0120 make LED unit 0100
Form complete circuit structure.
Wherein, LED unit 0100 can be for one to a plurality of.When LED unit 0100 is a plurality of, LED unit 0100
Array structure is formed according to the default regularity of distribution.More typically, array structure include "-" type array structure, circumference array construction,
The types such as square array construction, triangular array construction.
When LED unit 0100 is a plurality of, adjacent LED unit 0100 is realized by respective metallic support 0110
Series/parallel connection.Exemplarily, LED unit 0100 by the first metallic object 0111 thereon or the second metallic object 0112 with it is adjacent
The first metallic object 0111 or the second metallic object 0112 for connecing LED unit 0100 realize series/parallel connection.Exemplarily, adjacent to close
System includes being connected in series or being connected in parallel.It is appreciated that adjacent refer to adjacent between LED unit 0100 and keep connection.
Referring to Fig. 1, two 0100 one end of LED unit connection with series relationship, the other end disconnect, such as " the two
The first metallic object 0111 between integrally connected, remain open between second metallic object 0112 of the two " or " first gold medal of the two
Belong to and being remained open between body 0111, integrally connected between second metallic object 0112 of the two " or " the first metallic object of one
Both 0111 and the 0112 integrally connected of the second metallic object, the second metal of the first metallic object 0111 of one and the two
Body 0112 remains open ".
Referring to Fig. 2,0100 both ends of LED unit with parallel relationship distinguish integrally connected and form parallel-connection structure, example
Such as " 0111 integrally connected of the first metallic object of the first metallic object 0111 of one and the two, the second metallic object of one
Both 0112 and the 0112 integrally connected of the second metallic object ".Under the form, it is in parallel that LED unit 0100 can form double units
Or multiple-unit parallel-connection structure.
Light emitting module 0120 includes insulative bridge 0121 and LED chip 0122.Insulative bridge 0121 connects the first gold medal for bridge-type
Belong to body 0111 and the second metallic object 0112, realize that the structure of the latter two is fixed, and provides structural defence to LED chip 0122；LED
Chip 0122 realizes circuit communication for being electrically connected the first metallic object 0111 and the second metallic object 0112.Wherein, bridge-type connects
Refer to the connection structure shaped like bridge.
It is appreciated that insulative bridge 0121 has insulating properties, and structure enhancing is formed to metallic support 0110.Exemplarily,
Insulative bridge 0121 is molded by plastic material.Color, ingredient and the light transmittance of plastic material are depending on practical use, such as thoroughly
Bright PC (polycarbonate), white PPA (polyphthalamide), black PPA (polyphthalamide) etc..
Exemplarily, insulative bridge 0121 is made of opaque plastic, and light emitting module 0120 is encapsulated by fluorescent glue and realized
360 ° shine.Another kind demonstration, light emitting module 0120 are still encapsulated by fluorescent glue, and insulative bridge 0121 is made of transparent plastic, and is had
Good light transmittance and further enhance 360 ° of illumination effects.
Exemplarily, the solid welding zone 0113 of the setting of insulative bridge 0,121 first and the second solid welding zone 0114, the first solid welding zone 0113
With 0111 integrally connected of the first metallic object, the second solid 0112 integrally connected of welding zone 0114 and the second metallic object, the first solid welding zone
0113 and second solid welding zone 0114 realized and be electrically connected by LED chip 0122.0,122 1 pole of LED chip is welded in the first solid weldering
Area 0113, another pole are welded in the second solid welding zone 0114, guarantee circuit communication.
Exemplarily, the first solid welding zone 0113 and the second solid welding zone 0114 are all set in insulative bridge 0121, are located at insulation
The surface of bridge 0121 is in order to die bond.Further, with normal society plastic cement between the first solid welding zone 0113 and the second solid welding zone 0114
0121c is separated, and guarantees structure separation between the two.Normal society plastic cement 0121c is constructed with plastic channels or protrusion construction shape
At between the first solid welding zone 0113 and the second solid welding zone 0114, and both make to keep insulation for both separating.
Under aforementioned structure, the type of LED chip 0122 is no longer limited, can adopt the forms such as positive cartridge chip or flip-chip.
The electrode of positive cartridge chip is usually welded in a manner of gold thread upper；And the electrode of flip-chip is under, usually in a manner of patch
It is welded.
Referring to Fig. 1, the first solid welding zone 0113 is crystal bonding area, and the second solid welding zone 0114 is weldering in positive cartridge chip example
Line area.Positive cartridge chip is adhered to crystal bonding area by crystal-bonding adhesive (insulating cement), and the two poles of the earth of positive cartridge chip pass through gold thread 0122a respectively and weld
It is connected to crystal bonding area and wire welding area.
Referring to Fig. 4, the first solid welding zone 0113 and the second solid welding zone 0114 are crystal bonding area in flip-chip example.
One pole of flip-chip is adhered to the first solid welding zone 0113 by crystal-bonding adhesive (conducting resinl), and another pole is viscous by crystal-bonding adhesive (conducting resinl)
It is connected to the second solid welding zone 0114.
The effect of supplementary explanation, the first solid welding zone 0113 and the second solid welding zone 0114 also resides in, and provides arbitrary extension design
The space of circuit avoids the complicated design and process of printed circuit existing for conventional flex substrate.
Exemplarily, the first solid welding zone 0113 can be sequentially distributed with the second solid welding zone 0114 along the first array direction, also may be used
Vertical along the first array direction is sequentially distributed.The former forms vertical type LED die bond structure (such as Fig. 1~2), and the latter forms horizontal type
LED die bond structure (such as Fig. 6).
As previously mentioned, LED module 1000 has array structure when LED unit 0100 is a plurality of.Exemplarily, LED
Mould group 1000 at least has the first array direction, to form basic array structure.Correspondingly, along the first array direction, plural number
A LED unit 0100 successively linear array, and connection is correspondingly formed according to series/parallel connection relationship.
Exemplarily, between the first array direction, the first metallic object 0111 of adjacent LED units 0100, the second metal
It keeps conllinear between body 0112 respectively, keeps between the first metallic object 0111 of adjacent LED unit 0100 or the second metallic object
Integrally connected between 0112.
Supplementary explanation is kept between adjacent LED unit 0100, and studying carefully is to realize to connect by mutual first metallic object 0111
It connects or connection is realized by mutual second metallic object 0112, the string between LED unit 0100 depending on keeping adjoining is simultaneously
Join circuit connecting relation.
Under aforementioned collinear relationship, successively a straight line is collectively formed in the first metallic object 0111 of the LED unit 0100 of array,
Another straight line is collectively formed in second metallic object 0112.Exemplarily, along the first array direction, adjacent LED units 0100 mutually not
First metallic object 0111 of connection is truncated by the first Metal Substrate S (a) according to circuit connecting relation, adjacent LED units 0100
In discrete second metallic object 0112 be truncated by the second Metal Substrate S (b) according to circuit connecting relation.In other words, it goes
Before material means truncation, successively the first metallic object 0111 of the LED unit 0100 of array belongs to the group of the first Metal Substrate S (a)
At part, the second metallic object 0112 belongs to the component part of the second Metal Substrate S (b).Exemplarily, the first solid welding zone 0113 is also fallen within
The component part of first Metal Substrate S (a), the second solid welding zone 0114 also fall within the component part of the second solid welding zone 0114.
Wherein, the first Metal Substrate S (a) and the second Metal Substrate S (b) separation 0120 two sides of light emitting module.First Metal Substrate S
(a) numerous with the adoptable shape of the second Metal Substrate S (b), including the types such as sheet, strip, plate, bulk.First Metal Substrate S
(a) it can be the metals such as copper and iron, also can be the flexible alloys of coating surface conductive material.
It is appreciated that under the application size environment of LED, the first metallic object 0111 and the second metallic object 0112 all have compared with
Good flexibility and plasticity.Characteristic based on metal material, the first metallic object 0111 and the second metallic object 0112 have both preferably
Easy sizing characteristics, be easy to keep current moulding.
Fig. 3~5 are please referred to, exemplarily, insulative bridge 0121 has first for containing LED chip 0122 to accommodate
Portion 0121a, the first both ends receiving portion 0121a are separately connected the first metallic object 0111 and the second metallic object 0112.First receiving portion
The side 0121a keeps opening, and to carry out die bond to LED chip 0122, and guarantees the good light transmission of LED chip 0122.
The effect of first receiving portion 0121a at least that, form the encirclement to LED chip 0122 and protect, guarantee LED chip
The reliability of 0122 connection.Exemplarily, the first solid welding zone 0113 and the second solid welding zone 0114 are all set in the first receiving portion
The surface of 0121a.
It is appreciated that side keeps open and has to open referring to Fig. 4, the first receiving portion 0121a can be straight groove structure
It is open-ended and be separately connected the first metallic object 0111 and the second metallic object 0112 to put formula；Referring to Fig. 5, the first receiving portion
0121a is also possible to blind hole structure, and side keeps open and forms slot in end, so that the first solid welding zone 0113 and second is solid
0114 grafting of welding zone is passed through.
Referring to Fig. 8, supplementary explanation, the first receiving portion 0121a realizes encapsulation by fluorescent glue and forms encapsulation glue-line 0130.
It encapsulates glue-line 0130 and is used for encapsulating light emitting module 0120, form bowl construction, protect LED chip 0122 and guarantee translucent effect.
Exemplarily, packaged type is glue dispensing and packaging.Wherein, fluorescent glue can be by fluorescent powder (nitride, gallate, YAG, rare earth aluminium
Hydrochlorate etc.) it is reconciled with packaging plastic (silica gel, epoxy resin etc.).
Fig. 3 and Fig. 7 are please referred to, exemplarily, insulative bridge 0121, which has, to be disposed opposite to each other with the first receiving portion 0121a
Second receiving portion 0121b.Wherein, the second receiving portion 0121b keeps opening far from the side of the first receiving portion 0121a.In other words,
The tow sides of first receiving portion 0121a and the second receiving portion 0121b separation insulative bridge 0121.The one of second receiving portion 0121b
Aspect effect is, compresses a side surface and LED chip 0122 the distance between of the insulative bridge 0121 far from LED chip 0122,
Enhance light transmittance and improves 360 ° of light emission luminance.It is appreciated that the second receiving portion 0121b can be slot type structure (such as straight trough, ten
Word slot etc.), it also can be blind hole structure.
Exemplarily, the second receiving portion 0121b is opened on each to side wall of insulative bridge 0121, form multidirectional opening and into one
Step enhancing three-dimensional transparent degree.For example, the second receiving portion 0121b is cross-shaped groove structure, it is open respectively in four walls of insulative bridge 0121,
Form multidirectional light transmission effect.
Referring to Fig. 8, supplementary explanation, the second receiving portion 0121b realizes encapsulation by fluorescent glue and forms encapsulation glue-line 0130.
Exemplarily, packaged type is glue dispensing and packaging.Wherein, fluorescent glue can be by fluorescent powder (nitride, gallate, YAG, rare earth aluminium
Hydrochlorate etc.) it is reconciled with packaging plastic (silica gel, epoxy resin etc.).The light that LED chip 0122 issues is via encapsulation glue-line 0130
It is overflowed together from the surface of the second receiving portion 0121b and respectively to opening, realizes 360 ° omnibearing luminous.
The quantity of the LED chip 0122 of light emitting module 0120 can be for one to a plurality of.Exemplarily, light emitting module 0120
LED chip 0122 is a plurality of, and the not same surface for insulative bridge 0121 of living apart.For example, referring to Fig. 9, the first receiving portion
LED chip 0122 is respectively set in 0121a and the second receiving portion 0121b, to form two-sided die bond structure, makes 360 ° comprehensive
Stereo luminous effect is still good.Another kind demonstration, the LED chip 0122 positioned at the same side of insulative bridge 0121 also can be a plurality of.
Exemplarily, LED module 1000 also has second array direction, along second array direction, the of LED unit 0100
0112 integrally connected of the second metallic object of one metallic object 0111 and adjacent LED unit 0100.It is appreciated that the first array direction with
Second array direction is not parallel to each other, and forms the structure that is interspersed.Exemplarily, the first array direction and second array direction are mutual
Vertically.
Figure 10 shows the blank structure chart of the LED module 1000 with the first array direction Yu second array direction, root
Material processing and forming is removed to blank according to required series/parallel circuit structure, the serial/parallel of LED module 1000 can be obtained
Join circuit structure.Figure 11 shows a kind of finished product structure of LED module 1000 with exemplary circuit configuration.
Figure 12 is please referred to, exemplarily, light emitting module 0120 further includes non-luminescent electronic component 0211.Non-luminescent electronics
Component 0211 is electrically connected the first metallic object 0111, the second metallic object 0112 and the two in LED chip 0122, forms connection
Circuit.In other words, LED chip 0122 and non-luminescent electronic component 0211 coexist in same insulative bridge 0121, and the two is formed
Required series/parallel connection structure.Wherein, the quantity of non-luminescent electronic component 0211 can be and real respectively for one to a plurality of
Existing circuit connection.
The huge number of non-luminescent electronic component 0211, including IC (integrated circuit), resistance, capacitor
Etc. types.When non-luminescent electronic component 0211 has more pin configurations, the first solid welding zone 0113 and/or the second solid welding zone
0114 forms corresponding pin connection line, to carry out solid weldering connection.
Figure 13 is please referred to, exemplarily, the LED chip 0122 of light emitting module 0120 is replaced by non-luminescent electronic component 0211
It changes and forms non-luminescent module 0210, the light emitting module 0120 of LED unit 0100 is replaced by non-luminescent module 0210 and formed non-
Luminescence unit 0200, LED unit 0100 realize that series/parallel is connect by metallic support 0110 with non-luminescent unit 0200.
In other words, non-luminescent module 0210 has phase with light emitting module 0120, non-luminescent unit 0200 and LED unit 0100
Same construction, difference are to replace LED chip 0122 with non-luminescent electronic component 0211.Also that is, non-luminescent module 0210 with
Non-luminescent unit 0200 is free of LED chip 0122, is only for forming required connection circuit.Specifically, non-luminescent module 0210
Forms the structure of such as light emitting module 0120 with insulative bridge 0121 by non-luminescent electronic component 0211, non-luminescent unit 0200 is by non-
Light emitting module 0210 and metallic support 0110 form the structure such as LED unit.Supplementary explanation, LED unit 0100 above-mentioned it is each
Class construction feature is equally applicable to non-luminescent unit 0200.
Exemplarily, encapsulation glue-line 0130 is also used to encapsulate non-luminescent module 0210, forms bowl construction.Encapsulate glue-line
Ingredient is fluorescent glue, is formed by fluorescent glue point adhesive curing.
Referring to Fig. 6, exemplarily, keep between the first metallic object 0111 of connection, between the second metallic object 0112, the
Between one metallic object 0111 and the second metallic object 0112, it is respectively formed the bending part 0300 that bending can occur.Filament framework 1000
Bending deformation can occur in bending part 0300, obtain good flexibility, deformability is strong.Exemplarily, bending part 0300 is
The interconnecting piece of truncation is not given in first Metal Substrate S (a) or the second Metal Substrate S (b), there is metal rigidity, lamp can be stably kept
The specific shape that 1000 bending of guide frame structure obtains, sizing characteristics are good.
Supplementary explanation, the shape of the first metallic object 0111, the second metallic object 0112 and bending part 0300 is according to actual needs
Depending on.When bending deformation does not occur, the first metallic object 0111, the second metallic object 0112 can be respectively provided with flat with bending part 0300
Straight structure (such as without bending straight) or other bending shapes (such as arch).
Embodiment 2
Figure 14 is please referred to, the present embodiment discloses a kind of flexibility filament P (a), the LED mould introduced including above embodiments 1
Group 1000 and coating are packaged in fluorescent adhesive layer 2000 LED module 1000 outside, the free end holding of LED module 1000 it is exposed and
The metal terminal 3000 for being externally electrically connected is formed, the free end of LED module 1000 is that one end keeps free first gold medal
Belong to body 0111 or the second metallic object 0112.Wherein, fluorescent adhesive layer 2000 is solidified by fluorescent glue coating.
It is appreciated that fluorescent adhesive layer 2000 is realized to the fully wrapped around of LED module 1000, only in LED module 1000 from
It is not wrapped up by end.It is constructed for example, LED module 1000 forms "-" type along the first array direction array by LED unit 0100.It mends
Explanation is filled, when flexible filament P (a) bends, forms bending part 0300 between adjacent LED unit 0100.
As previously mentioned, under the application size environment of LED, the first metallic object 0111 and the second metallic object 0112 all have compared with
Good flexibility and plasticity, makes flexible filament P (a) be easy to bend moulding.Characteristic and fluorescent glue based on metal material are squeezed
Pressure effect, flexible filament P (a) have both preferable easy sizing characteristics, are easy to keep current moulding.
Embodiment 3
Figure 15 is please referred to, the present embodiment discloses a kind of light source P, including pedestal P (b), big envelope P (c) are introduced with embodiment 1
LED module 1000, LED module 1000 is set on pedestal P (b), and big envelope P (c) is for encapsulating LED module 1000.Pedestal P
(b) for realizing external conduction, with electric energy needed for supplying light source P.It is appreciated that the huge number of light source P, including ball bubble
The types such as (LED filament lamp), T pipe, panel.
Exemplarily, the form of light source P is LED filament lamp.In the application of LED filament lamp, coated outside LED module 1000
It encapsulates fluorescent adhesive layer 2000 and forms the flexible filament P (a) that embodiment 2 is introduced, flexible filament P (a) is bent according to preset shape
After be set on pedestal P (b), big envelope P (c) is for encapsulating flexible filament P (a).Exemplarily, big envelope P (c) is transparent or at least portion
It is point transparent, keep flexible filament P (a) visible and plays decoration function.For example, big envelope P (c) can be made of transparent glass.
As previously mentioned, flexibility filament P (a) has ideal plasticity and easy sizing characteristics, not only it is easy to bend moulding, but also easily
In keeping current moulding, makes LED filament lamp no setting is required molybdenum filament, avoid molybdenum filament bring from adversely affecting, with long-term use process
Electric property is good, service life is considerable.
Embodiment 4
Figure 16 is please referred to, the present embodiment discloses a kind of LED module manufacturing method, the LED introduced for manufacturing embodiment 1
Mould group 1000, the manufacturing method the following steps are included:
Step A: profiled metallic S, metal framework S have at least one metallic support 0110, and metallic support 0110 has
There are the first metallic object 0111 and the second metallic object 0112 being oppositely arranged.The forming method of metal framework S is numerous, and main includes tired
Product material molding (such as casting, increasing material manufacturing), removal material form (such as punching press, milling, wire cutting, etching, laser cutting
Deng) etc. types.The moulding material of metal framework S is numerous, can be the metals such as copper and iron, can also be coating surface conductive material
The types such as flexible alloys.Supplementary explanation, the quantity of the metal framework S of synchronous forming can be for one to a plurality of.
It is appreciated that between the first metallic object 0111 of adjacent metallic support 0110, between the second metallic object 0112, both
Integrally connected can be kept respectively and forms the first Metal Substrate S (a) and the second metal for keeping opposite and being respectively provided with Construction integration
Base S (b) (shown in Figure 17) can also realize separation and be formed in the on-off relationship in series/parallel circuit structure (shown in Figure 18).
In latter state (separated state), adjacent metallic support 0110 is still held in same metal frame by dowel S (f)
On frame S, to carry out following process.
Figure 17 shows the first construction of the obtained metal framework S of step A, metal framework S, which has, keeps opposite first
Metal Substrate S (a) and the second Metal Substrate S (b).First Metal Substrate S (a) and the second Metal Substrate S (b) keeps connecting in end, and in
Middle part forms at least one molding hole location S (c), in case insulative bridge 0121 is formed.Wherein, the shape root of hole location S (c) is formed
It is determined according to design requirement.It is appreciated that any corresponding the first metallic object for being located at a metallic support 0110 of molding hole location S (c)
0111 and second between metallic object 0112.Further, the first solid welding zone 0113 and the second solid welding zone 0114 protrude from molding hole
The inside of position S (c), to be exposed to the surface of insulative bridge 0121.
Figure 18 shows the first construction for the metal framework S that step A is obtained, in metal framework S, adjacent metallic support
0110 is connected holding by dowel S (f).First metallic object 0111 of any metallic support 0110 and the second metallic object
Molding hole location S (c) is formed between 0112, in case insulative bridge 0121 is formed.
Exemplarily, there is location hole S (d) and reference opening S (e), location hole S (d) are used on metal framework S processed
Cheng Shixian positioning, reference opening S (e) are used to provide processing reference in subsequent removal material forming process.
Step B: insulative bridge is formed between the first metallic object 0111 and the second metallic object 0112 of metallic support 0110
0121.For example, forming insulative bridge 0121 in molding hole location S (c).Wherein, insulative bridge 0121 can also be rabbeted by injection molding
Structure realization is fixedly connected with metal framework S's.Figure 18 is please referred to, exemplarily, insulative bridge 0121 is in molding hole location S (c) note
It is moulded into type, through the two sides of metal framework S.Supplementary explanation, the first solid welding zone 0113 should keep naked with the second solid welding zone 0114
Dew.
Exemplarily, the structure that Figure 19 shows Figure 17 passes through the product structure that step B is obtained；Exemplarily, Figure 20 shows
The structure for having gone out Figure 18 passes through the product structure that step B is obtained.
Exemplarily, insulative bridge 0121 is covered in molding hole location S (c), and can there are default gaps.In subsequent encapsulation
Process, the permeable default gap of fluorescent glue, further increases light transmittance, guarantees 360 ° of illumination effects.
Step C: in the die bond for realizing LED chip 0122 in insulative bridge 0121.The die bond of different types of LED chip 0122
Mode is introduced in embodiment 1, and details are not described herein again.After the completion of die bond, light emitting module 0120 is formed.
Step D: being removed material processing and forming to metal framework S, so as to be formed between adjacent metallic support 0110
Series/parallel circuit structure, to form the LED module 1000 being made of the LED unit 0100 with series/parallel connection relationship.
Wherein, the huge number of material processing and forming is removed, including punching press, machine cuts (milling, wire cutting etc.), etching, laser are cut
The different types such as cut.
In the embodiment of the first Metal Substrate S (a) above-mentioned and the second Metal Substrate S (b), according to filament framework 1000
Series/parallel circuit structure forms first metallic object 0111 and the second metallic object 0112 with different on-off structures.Through this mistake
Journey, the first Metal Substrate S (a) are separated with the second Metal Substrate S (b) realization, form at least one metallic support 0110, filament framework
Thus 1000 are also formed.Exemplarily, machining locus is preset by reference opening S (e).
Between the first metallic object 0111 of aforementioned adjacent metallic support 0110, it is separated between the second metallic object 0112
Embodiment in, step C is used to remove dowel S (f) between adjacent metallic support 0110, makes adjacent metallic support
0110 forms different connection relationships, obtains the final form of series/parallel circuit structure, filament framework 1000 is made thus to be formed.
Exemplarily, after executing step C completion die bond, it may also include step E: the insulative bridge 0121 Jing Guo die bond carried out
Glue dispensing and packaging.Plastic packaging is carried out to the insulative bridge 0121 (i.e. light emitting module 0120) Jing Guo die bond with fluorescent glue, forms bowl structure
It makes, to realize the protection to LED chip 0122.Exemplarily, reference opening S (e) and for fill encapsulation glue, realize encapsulation.
In all examples being illustrated and described herein, any occurrence should be construed as merely illustratively, without
It is as limitation, therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitation of the scope of the invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.Therefore, protection scope of the present invention should be determined by the appended claims.
Claims (22)
1. a kind of LED module characterized by comprising
At least one LED unit, the LED unit include metallic support and light emitting module；
The metallic support includes the first metallic object and the second metallic object being oppositely arranged；
The light emitting module includes insulative bridge and LED chip, and the insulative bridge connects first metallic object and institute for bridge-type
The second metallic object is stated, the LED chip is for being electrically connected first metallic object and second metallic object；
When the LED unit is a plurality of, series/parallel connection is realized by the metallic support between adjacent LED unit.
2. LED module according to claim 1, which is characterized in that the metallic support includes the first solid welding zone and second
Gu welding zone, the described first solid welding zone and the first metallic object integrally connected, the described second solid welding zone and second metallic object
Integrally connected, the described first solid welding zone are realized by the LED chip with the described second solid welding zone and are electrically connected.
3. LED module according to claim 2, which is characterized in that the described first solid welding zone and the described second solid welding zone are equal
It is set in the insulative bridge.
4. LED module according to claim 1, which is characterized in that the LED module at least has the first array direction,
Along first array direction, a plurality of LED units are successively in line array.
5. LED module according to claim 4, which is characterized in that along first array direction, adjacent LED units
Keep conllinear respectively between first metallic object, between the second metallic object, keep between the first metallic object of adjacent LED unit or
Integrally connected between second metallic object.
6. LED module according to claim 5, which is characterized in that along first array direction, adjacent LED units
Discrete first metallic object is truncated by the first Metal Substrate, in adjacent LED units discrete second metallic object by
Second Metal Substrate is truncated, first Metal Substrate and second Metal Substrate separation light emitting module two sides.
7. LED module according to claim 4, which is characterized in that the LED module also has second array direction, edge
The second array direction, the second metallic object integrally connected of the first metallic object of the LED unit and adjacent LED unit.
8. LED module according to claim 1, which is characterized in that the insulative bridge has for containing the LED chip
The first receiving portion, the first receiving portion of first receiving portion both ends is separately connected first metallic object and second metal
Body, first receiving portion side keep opening.
9. LED module according to claim 8, which is characterized in that the insulative bridge has and the first receiving portion phase
The second receiving portion of setting is carried on the back, second receiving portion keeps opening far from the side of first receiving portion.
10. LED module according to claim 9, which is characterized in that second receiving portion is opened on the insulative bridge
Respectively to side wall.
11. LED module according to claim 1, which is characterized in that the LED chip of the light emitting module is a plurality of, and
The not same surface for the insulative bridge of living apart.
12. LED module according to claim 1, which is characterized in that the insulative bridge is made of transparent plastic.
13. LED module according to claim 1, which is characterized in that the light emitting module further includes non-luminescent electronics member device
Part, the non-luminescent electronic component are electrically connected in first metallic object, second metallic object and the LED chip
The two.
14. LED module according to claim 1, which is characterized in that the LED chip of the light emitting module is by non-luminescent electricity
Sub- component is replaced and forms non-luminescent module, and the light emitting module of the LED unit is replaced by the non-luminescent module and formed
Non-luminescent unit, the LED unit realize that series/parallel is connect by the metallic support with the non-luminescent unit.
15. LED module according to claim 14, which is characterized in that further include for encapsulating the non-luminescent module
Encapsulate glue-line.
16. LED module according to claim 1, which is characterized in that further include the encapsulation for encapsulating the light emitting module
Glue-line.
17. LED module according to claim 1, which is characterized in that have the folding for being easy to bend between the LED unit
Turn of bilge, first metallic object integrally connect with the bending part integrally connected and/or second metallic object with the bending part
It connects.
18. a kind of flexibility filament, which is characterized in that including the described in any item LED modules of claim 1-17 and coating encapsulation
Fluorescent adhesive layer outside the LED module, the free end at the LED module both ends keep exposed and are formed for externally electrical
The metal terminal of connection, the free end at the LED module both ends are that one end keeps free first metallic object or the second metallic object.
19. a kind of light source, which is characterized in that including pedestal, big envelope and the described in any item LED modules of claim 1-17, institute
It states LED module to be set on the pedestal, the big envelope is for sealing the LED module.
20. light source according to claim 19, which is characterized in that coating encapsulation fluorescent adhesive layer outside the LED module and
Flexible filament is formed, the flexibility filament is set on the pedestal after bending according to preset shape, and the big envelope is for sealing institute
Flexible filament is stated, the free end at the LED module both ends keeps exposed and forms the metal terminal for being externally electrically connected, institute
The free end for stating LED module both ends is that one end keeps free first metallic object or the second metallic object.
21. a kind of LED module manufacturing method characterized by comprising
Profiled metallic, the metal framework have at least one metallic support, and the metallic support, which has, to be oppositely arranged
First metallic object and the second metallic object；
Insulative bridge is formed between the first metallic object and the second metallic object of the metallic support；
In the die bond for realizing LED chip in the insulative bridge；
Material processing and forming is removed to the metal framework, so as to form series/parallel circuit between adjacent metallic support
Structure.
22. LED module manufacturing method according to claim 21, which is characterized in that further include: to the insulation Jing Guo die bond
Bridge carries out glue dispensing and packaging.
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| CN201810730874.0A CN109065524A (en) | 2018-07-05 | 2018-07-05 | LED module, flexible filament, light source and LED module manufacturing method |
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| CN201810730874.0A CN109065524A (en) | 2018-07-05 | 2018-07-05 | LED module, flexible filament, light source and LED module manufacturing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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