CN203659854U - Spiral LED packaging lamp filament - Google Patents
Spiral LED packaging lamp filament Download PDFInfo
- Publication number
- CN203659854U CN203659854U CN201320785089.8U CN201320785089U CN203659854U CN 203659854 U CN203659854 U CN 203659854U CN 201320785089 U CN201320785089 U CN 201320785089U CN 203659854 U CN203659854 U CN 203659854U
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- filament
- spirality
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000005538 encapsulation Methods 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000002390 adhesive tape Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000005286 illumination Methods 0.000 abstract description 4
- 238000004020 luminiscence type Methods 0.000 abstract description 3
- 241000589970 Spirochaetales Species 0.000 abstract 1
- 238000005034 decoration Methods 0.000 abstract 1
- 238000013461 design Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model relates to a spiral LED packaging lamp filament. The utility model aims at providing the spiral LED packaging lamp filament so that LED can carry out multi-angle, multi-level three-dimensional luminescence on a spirochete and a comprehensive illumination light source is provided. A technical scheme of the utility model is characterized in that the spiral LED packaging lamp filament comprises a substrate; the substrate is provided with at least one group of LED chips which are connected in parallel or connected in series; a layer of dielectric layer possessing a protection or luminescence function is coated on surfaces of the substrate and the LED chips; electrodes of the LED chips are led out by electrode outgoing lines of two ends of the substrate; the substrate is in a three-dimensional spiral shape. The lamp filament of the utility model is suitable for the general illumination and decoration illumination field.
Description
Technical field
The utility model relates to a kind of LED encapsulation filament, and particularly a kind of spirality LED encapsulating light emitting bar replace incandescent tungsten filament, belongs to general illumination and decorative lighting field.
Background technology
In prior art, the packing forms of LED has several as follows conventionally:
1.Lamp-LED(vertical LED): that Lamp-LED occurs in early days is straight cutting LED, and its encapsulation adopts the form of embedding.The process of embedding is first in LED shaping mold cavity, to inject liquid-state epoxy resin, then inserts the LED support that pressure welding is good, puts into baking oven and allows after epoxy resin cure, and it is moulding that LED is detached from die cavity.
2.SMD-LED(surface mount LED): paster LED is affixed on PCB surface, be applicable to SMT processing, can Reflow Soldering, lighter pcb board and reflector material are adopted, after improvement, remove the heavier carbon steel material pin of straight cutting LED, make to show the epoxy resin that need to fill in reflector still less, object is minification, reduces weight.
3.Side-LED(side-emitting LED): another emphasis of LED encapsulation is lateral emitting encapsulation.Use LED to work as LCD(liquid crystal display if wanted) back light, the lateral emitting of LED need be identical with surface light emitting so, just can make LCD backlight luminescence even.Lumileds company utilizes the design of speculum, by the LED of surface light emitting, utilizes speculum principle to send out into sidelight.
4.TOP-LED(top light emitting LED): top light emitting LED is more common paster type light emitting type.Be mainly used in the backlight and status indicator lamp in Multifunctional ultrathin mobile phone and PDA.
5.High-Power-LED(high-capacity LED): in order to obtain the LED light source of high power, high brightness, aspect LED chip and package design to high-power future development.Such as the encapsulating structure of Norlux series high-power LED is the multi-chip combination that hexagon aluminium sheet is made base (make its non-conductive), aluminium sheet is simultaneously as heat sink.
6.Flip Chip-LED(covers brilliant LED): LED composite packing structure is to be substantially shaped with a plurality of perforation at PCB, the LED chip of a plurality of un-encapsulated is positioned over each perforation place of a side with conductive material, the positive pole of single LED chip and negative contacts be utilize tin ball respectively with substrate surface on conductive material link, and the sealing of all lighting transparent material towards the surface of a side of perforation in a plurality of LED chips, this sealing is to be a hemispheroidal shape to be positioned at each perforation place, belongs to flip-chip bonded structure light-emitting diode.
Above-described several packing forms is the packing forms of point type substantially, and its shortcoming is that light sensation is discontinuous in the time of application, and luminous intensity distribution design is not enough, cannot multi-angle, luminous at many levels.
Summary of the invention
The technical problems to be solved in the utility model is: provide a kind of spirality LED encapsulation filament for the problem of above-mentioned existence, make its LED can be on helicoid multi-angle, multilayer stereo luminous, more comprehensively lighting source is provided.
The technical solution adopted in the utility model is: spirality LED encapsulates filament; comprise substrate; it is characterized in that: described substrate is provided with the LED chip of at least one group of serial or parallel connection; substrate and LED chip surface-coated have one deck to have the dielectric layer of protection or lighting function; the electrode of LED chip is drawn by the electrode outlet line of substrate two ends, and described substrate is shaped to three-dimensional spiral shape.
Described filament substrate be conical pallidum or etc. circle helicoid.
Described LED chip is fixed on substrate with transparent adhesive tape and/or conducting resinl.
Described transparent adhesive tape and/conducting resinl is the one in silica gel, modified resin glue, epoxide-resin glue, elargol and sticky copper glue.
The material of described substrate is the one in metal, polymethyl methacrylate, plastics and the silica gel with post forming ability.
The illuminant colour of described LED chip is identical, part is identical or completely different.
The material of described dielectric layer is the one in the luminous arogel of silica gel, epoxide-resin glue and LED.
The electric lead-out wire at described spirality LED encapsulation filament two ends fixes on substrate two ends by glue, ceramic glue, low-melting glass, silver slurry or plastic solid, and electrode outlet line and junction, substrate two ends are provided with connecting elements.
The beneficial effects of the utility model are: the utility model substrate is three-dimensional spiral shape, and on this substrate, be provided with the LED chip of at least one group of serial or parallel connection, compared with prior art, overcome point type and be encapsulated in discontinuous light sensation while application, the deficiency of luminous intensity distribution design when having overcome linear and being encapsulated in application, LED can multi-angle on helicoid, multilayer stereo is luminous.The utility model can improve the luminous intensity distribution design of light fixture in application process, can simplify technique for applying simultaneously.
Brief description of the drawings
Fig. 1 is the structural representation of embodiment 1.
Fig. 1-1st, the front view of Fig. 1.
Fig. 1-2 is the end view of Fig. 1.
Fig. 2 is the structural representation of embodiment 2.
Fig. 2-1st, the front view of Fig. 2.
Fig. 2-2nd, the end view of Fig. 2.
Fig. 3 is the top view cut-away view of Fig. 1.
Fig. 3 A is the A place profile of Fig. 3.
Embodiment
Embodiment 1: as Fig. 1, Fig. 1-1, shown in Fig. 1-2, the utility model comprises a tapered spirochetal substrate 2, this substrate 2 is provided with plural LEDs chip 5, this LED chip transparent adhesive tape, conducting resinl is silica gel such as, modified resin, epoxy resin, elargol or copper glue are fixed on substrate 2, each LED chip 5 is in series or in parallel with each other by chip electric connection line 6, the electrode of the LED chip group that serial or parallel connection forms is drawn by the electrode outlet line 1 at substrate 2 two ends, electrode outlet line 1 passes through glue, ceramic glue, low-melting glass, silver slurry or plastic solid fix on substrate 2 two ends, electrode outlet line 1 is provided with connecting elements 4 with substrate 2 junctions, two ends, as shown in Fig. 3, Fig. 3 A, described substrate 2 and LED chip 5 surface-coated have one deck to have the dielectric layer 3 of protection or lighting function, and its material is silica gel or epoxy resin, can be also the luminous arogel of LED simultaneously.
The substrate 2 of described spirality LED encapsulation filament, its material is not limited to metal, polymethyl methacrylate, PVC, plastics or silica gel.Described substrate 2 has two kinds of manufacture methods, and one is first by planar LED chip package, after having encapsulated, to the filament having encapsulated stretch, the mode such as pushing, mould molding, anchoring carries out the three-dimensionally shaped one-tenth helicoid of secondary, as shown in Figure 1.Another kind is moulding helicoid first, then carries out 3 D stereo LED encapsulation.
The illuminant colour of the described LED chip 5 that is arranged on the serial or parallel connection on substrate 2 is identical, part is identical or completely different.LED chip is the LED chip of identical or different illuminant colour, for example, be identical blue light, ultraviolet light or other monochromatic light; Also can be different colors, to obtain not homochromy mixed light; Select the LED of the multiple illuminant colour of varying number also can obtain the white light of high color rendering index (CRI).
Embodiment 2: as shown in Fig. 2, Fig. 2-1, Fig. 2-2, the present embodiment and embodiment 1 structure are basic identical, difference is only, and described substrate 2 is for waiting circle helicoid, and the filament of making upper and lower (or left and right) is for waiting round helicoid.It completes mode and is that the LED that first carries out straight line wire encapsulates, and carries out spirality integer by mould to it after having encapsulated.
Each embodiment that the claimed scope of the utility model is not limited to introduce herein, all various forms of conversion of doing based on the utility model claim and description and replacement, all belongs to the scope that the utility model patent contains.
Claims (8)
1. a spirality LED encapsulation filament; comprise substrate (2); it is characterized in that: described substrate (2) is provided with the LED chip (5) of at least one group of serial or parallel connection; substrate (2) and LED chip (5) surface-coated have one deck to have the dielectric layer (3) of protection or lighting function; the electrode of LED chip (5) is drawn by the electrode outlet line (1) at substrate (2) two ends, and described substrate (2) is shaped to three-dimensional spiral shape.
2. spirality LED encapsulation filament according to claim 1, is characterized in that: described filament substrate (2) is for conical pallidum or wait and justify helicoid.
3. according to spirality LED encapsulation filament described in claim 1 or 2, it is characterized in that: described LED chip (5) transparent adhesive tape and/or conducting resinl are fixed on substrate (2).
4. spirality LED encapsulates filament according to claim 3, it is characterized in that: described transparent adhesive tape and/or conducting resinl are the one in silica gel, modified resin glue, epoxide-resin glue, elargol and sticky copper glue.
5. according to spirality LED encapsulation filament described in claim 1 or 2, it is characterized in that: the material of described substrate (2) is the one in metal, polymethyl methacrylate, plastics and the silica gel with post forming ability.
6. according to spirality LED encapsulation filament described in claim 1 or 2, it is characterized in that: the illuminant colour of described LED chip (5) is identical, part is identical or completely different.
7. according to spirality LED encapsulation filament described in claim 1 or 2, it is characterized in that: the material of described dielectric layer (3) is the one in the luminous arogel of silica gel, epoxide-resin glue and LED.
8. spirality LED encapsulates filament according to claim 1, it is characterized in that: the electrode outlet line (1) at described spirality LED encapsulation filament two ends fixes on substrate (2) two ends by glue, ceramic glue, low-melting glass, silver slurry or plastic solid, and electrode outlet line (1) is provided with connecting elements (4) with substrate (2) junction, two ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320785089.8U CN203659854U (en) | 2013-12-02 | 2013-12-02 | Spiral LED packaging lamp filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320785089.8U CN203659854U (en) | 2013-12-02 | 2013-12-02 | Spiral LED packaging lamp filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203659854U true CN203659854U (en) | 2014-06-18 |
Family
ID=50926213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320785089.8U Expired - Lifetime CN203659854U (en) | 2013-12-02 | 2013-12-02 | Spiral LED packaging lamp filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203659854U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015081804A1 (en) * | 2013-12-02 | 2015-06-11 | 张晓峰 | Spiral led filament and light bulb using spiral led filament |
| CN105465625A (en) * | 2015-12-31 | 2016-04-06 | 苏州瀚墨材料技术有限公司 | Illuminating device |
| WO2016058539A1 (en) * | 2014-10-15 | 2016-04-21 | 新照明设计有限公司 | Substrate used for led encapsulation, three-dimensional led encapsulation, bulb comprising three-dimensional led encapsulation and manufacturing method therefor |
| CN105570700A (en) * | 2015-12-31 | 2016-05-11 | 苏州瀚墨材料技术有限公司 | Lighting device |
| CN105650496A (en) * | 2015-12-31 | 2016-06-08 | 苏州瀚墨材料技术有限公司 | Illuminating device |
| WO2017114480A1 (en) * | 2015-12-31 | 2017-07-06 | 常君斌 | Illumination device in ecological breeding |
-
2013
- 2013-12-02 CN CN201320785089.8U patent/CN203659854U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015081804A1 (en) * | 2013-12-02 | 2015-06-11 | 张晓峰 | Spiral led filament and light bulb using spiral led filament |
| WO2016058539A1 (en) * | 2014-10-15 | 2016-04-21 | 新照明设计有限公司 | Substrate used for led encapsulation, three-dimensional led encapsulation, bulb comprising three-dimensional led encapsulation and manufacturing method therefor |
| JP2017532793A (en) * | 2014-10-15 | 2017-11-02 | シム ライティング デザイン カンパニー リミテッド | Substrate used for LED sealing, three-dimensional LED sealing body, light bulb having three-dimensional LED sealing body, and manufacturing method thereof |
| JP2019117936A (en) * | 2014-10-15 | 2019-07-18 | シム ライティング デザイン カンパニー リミテッド | Substrate used in led encapsulation, three-dimensional led encapsulant, light bulb with three-dimensional led encapsulant, and manufacturing method of these |
| US10563824B2 (en) | 2014-10-15 | 2020-02-18 | Sim Lighting Design Company Limited | Substrate used for LED encapsulation, three-dimensional LED encapsulation, bulb comprising three-dimensional LED encapsulation and manufacturing method therefor |
| CN105465625A (en) * | 2015-12-31 | 2016-04-06 | 苏州瀚墨材料技术有限公司 | Illuminating device |
| CN105570700A (en) * | 2015-12-31 | 2016-05-11 | 苏州瀚墨材料技术有限公司 | Lighting device |
| CN105650496A (en) * | 2015-12-31 | 2016-06-08 | 苏州瀚墨材料技术有限公司 | Illuminating device |
| WO2017114480A1 (en) * | 2015-12-31 | 2017-07-06 | 常君斌 | Illumination device in ecological breeding |
| WO2017114483A1 (en) * | 2015-12-31 | 2017-07-06 | 常君斌 | Illumination device in ornamental breeding |
| CN105650496B (en) * | 2015-12-31 | 2019-03-01 | 中山市伯特利灯饰有限公司 | Lighting device |
| CN105465625B (en) * | 2015-12-31 | 2019-03-05 | 苏州瀚墨材料技术有限公司 | Lighting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG RUIDISHENG OPTOELECTRONICS CO., LTD. Free format text: FORMER OWNER: ZHANG XIAOFENG Effective date: 20150402 Owner name: YANG RUILONG GE TIEHAN Effective date: 20150402 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ge Tiehan Inventor before: Zhang Xiaofeng |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 315400 NINGBO, ZHEJIANG PROVINCE TO: 310015 HANGZHOU, ZHEJIANG PROVINCE Free format text: CORRECT: INVENTOR; FROM: ZHANG XIAOFENG TO: GE TIEHAN |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150402 Address after: Hangzhou City, Zhejiang province Gongshu District 310015 Cambridge Street No. 10, building 3, Kang Road, 1 building 139-152 room 2 building 239-252 room Patentee after: ZHEJIANG LEDISON OPTOELECTRONICS Co.,Ltd. Patentee after: Yang Ruilong Patentee after: Ge Tiehan Address before: 315400 Swan Bay, Yuyao pear Road, Zhejiang, 33-207 Patentee before: Zhang Xiaofeng |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: ANHUI HANGKE PHOTOELECTRIC Co.,Ltd. Assignor: ZHEJIANG LEDISON OPTOELECTRONICS Co.,Ltd. Contract record no.: X2020330000015 Denomination of utility model: Spiral LED package lamp filament Granted publication date: 20140618 License type: Common License Record date: 20200401 |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140618 |