CN103032735A - LED (Light-Emitting Diode) lamp tube - Google Patents
LED (Light-Emitting Diode) lamp tube Download PDFInfo
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- CN103032735A CN103032735A CN2012105372139A CN201210537213A CN103032735A CN 103032735 A CN103032735 A CN 103032735A CN 2012105372139 A CN2012105372139 A CN 2012105372139A CN 201210537213 A CN201210537213 A CN 201210537213A CN 103032735 A CN103032735 A CN 103032735A
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- led
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- emitting source
- lamp tube
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Abstract
The invention relates to an LED (Light-Emitting Diode) lamp tube which is characterized by comprising a transparent lamp tube, an LED illumination module and end covers, wherein the LED illumination module is arranged in the transparent lamp tub; both ends of the transparent lamp tube are respectively provided with stems; the end covers cover the peripheries of the stems; the stems are in vacuum seal fit with the transparent lamp tube; and vacuum sealed cavities formed by the stems and the transparent lamp tube are filled with inert gas. The LED lamp tube has the beneficial effects that 1, the stems are in vacuum seal fit with the transparent lamp tube and the inert gas is filled, so that heat of the LED illumination module arranged in the transparent lamp tube is rapidly dissipated by the inert gas, the rising amplitude of temperature rising is reduced and the service life is prolonged; 2, a radiator is avoided being used, the weight is reduced and cost is reduced; 3, in an LED light emitting source, except an LED chip, other components and fixing glue are all made of light transmitting materials, thus favorably enabling a light emitting angle of the LED chip to be equal to 4pi, avoiding dizziness and improving use comfort.
Description
Technical field
The present invention relates to a kind of LED spot.
Background technology
Existing LED spot comprises fluorescent tube, is arranged on radiator and LED light emitting source in the fluorescent tube, and the LED light emitting source is electrically connected with drive circuit, and drive circuit is arranged in the radiator.Fluorescent tube adopts bar shaped heat sink section bar and PC to go out striation splicing composition, and bar shaped heat sink section bar and PC go out striation to be fixed by draw-in groove.The LED light emitting source is fixed on the bar shaped heat sink section bar by aluminium base.
There is following technological deficiency in existing LED spot:
1, bar shaped heat sink section bar and PC go out striation and fix by draw-in groove, and sealing is poor, can not vacuumize, and the heat conduction rate variance of air, the heat that produces when causing the work of drive circuit and LED light emitting source can't in time distribute, and temperature rise is higher, affects service life.
2, the led chip in the LED light emitting source is fixedly the time, its substrate is connected with aluminium base (led chip die bond support) by materials such as silver slurry or gold-tin alloys, this has reduced the light extraction efficiency of led chip so that the light overwhelming majority of directive aluminium base (led chip die bond support) is absorbed by the led chip immobilization material.
3, lighting angle is 120 °, and the illumination comfortableness is relatively poor, and dazzle is serious.
Summary of the invention
The object of the present invention is to provide a kind of LED spot, stem stem cooperates with the vacuum seal of printing opacity fluorescent tube, and filling inert gas, make the LED illumination module that places in the printing opacity fluorescent tube by the inert gas quick heat radiating, reduce the rising amplitude of temperature rise, improve service life, simultaneously, avoid using radiator, reduce weight, reduce cost.
The present invention solves the technical scheme that the prior art problem adopts: a kind of LED spot, it is characterized in that comprising the printing opacity fluorescent tube, be arranged on the LED illumination module in the printing opacity fluorescent tube, the two ends of described printing opacity fluorescent tube are respectively equipped with stem stem, be located at the end cap of stem stem periphery, described stem stem cooperates with the vacuum seal of printing opacity fluorescent tube, is filled with inert gas in the vacuum-sealed cavity that described stem stem and printing opacity fluorescent tube form.Stem stem cooperates with the vacuum seal of printing opacity fluorescent tube, and filling inert gas (inert gas is low viscosity high thermal conductivity gas), make the LED illumination module that places in the printing opacity fluorescent tube by the inert gas quick heat radiating, reduce the rising amplitude of temperature rise, improve service life, simultaneously, avoid using radiator, reduce the installation of parts, reduce weight, reduce cost.
As further improving and replenishing technique scheme, the present invention adopts following technical measures: described LED illumination module comprise LED light emitting source, the wiring board that is electrically connected with the LED light emitting source, with the driver that described wiring board is electrically connected, it is crystalline ceramics, nontransparent pottery or glass or epoxy resin that described wiring board adopts material.Driver directly places in the printing opacity fluorescent tube, is conducive to improve security reliability, and simplifies external structure.
Led chip on the described LED light emitting source directly loads in the circuit board by fixing glue and at the light transmission medium layer of led chip outer surface embedding semicircle column type or arc; Perhaps, described LED light emitting source comprises substrate strip, is loaded in led chip on the substrate strip by fixing glue, sealing is mounted with the transparent core pipe of the substrate strip of led chip, is filled with the light transmission medium layer in the described transparent core pipe, and the electrode of described led chip is drawn by transparent core pipe two ends.In present patent application, substrate strip is the led chip fixed support.
Described LED light emitting source is at least two strings, and every described led chip lighting angle is 4 π.
Described light transmission medium layer material is transparent silica gel, epoxy resin, and the material of described transparent core pipe is crystalline ceramics or clear glass, and described fixing glue is transparent silica gel or epoxy resin, and the material of described substrate strip is pottery or clear glass.The pottery here comprises crystalline ceramics and nontransparent whiteware, and optional one gets final product.
Described inert gas is helium, hydrogen or hydrogen helium gas mixture, and its air pressure is 0.5 to 2 standard atmospheric pressure at room temperature.
Described printing opacity fluorescent tube is transparent glass tube or transparent ground glass pipe.The transparent color that does not limit glass tube here can be transparent milk white.
Be provided with a stem stem with blast pipe and electric lead-out wire in each described end cap, the outer end of each described end cap arranges conducting terminal, the other end of described driver connects conducting terminal, and described wiring board comprises respectively the wire mark circuit that is connected with actuator electrical with the LED light emitting source.Blast pipe is used for the printing opacity fluorescent tube is carried out application of vacuum, and the printing opacity fluorescent tube of vacuum is filled inert gas.
Led chip on the described LED light emitting source is plural pieces, is filled with light conversion material in the described light transmission medium layer, perhaps, applies light conversion material on the described transparent core pipe wall body.Have two kinds of techniques can obtain high-quality white light: one, select the multiple photochromic led chip of varying number can obtain the white light of high color rendering index (CRI).Its two, be the led chip of blue light-emitting or ultraviolet light, by being converted into white light take fluorescent material as light-converting material.
The beneficial effect that the present invention has: 1, stem stem cooperates with the vacuum seal of printing opacity fluorescent tube, and fills inert gas, makes the LED illumination module that places in the printing opacity fluorescent tube by the inert gas quick heat radiating, reduces the rising amplitude of temperature rise, improves service life.2, avoid using radiator, reduce weight, reduce cost.3, in the LED light emitting source except led chip, remaining component and fixing glue all adopt light-transmitting materials, being conducive to the led chip lighting angle is 4 π, avoids dizzy, improves comfort.
Description of drawings
Fig. 1 is a kind of structural representation of the present invention.
Fig. 2 is the plan structure schematic diagram of Fig. 1.
Fig. 3 is another kind of structural representation of the present invention.
Fig. 4 is the structural representation of looking up of Fig. 1.
Fig. 5 is the sectional structure schematic diagram of led chip among Fig. 1.
Fig. 6 is the sectional structure schematic diagram of led chip among Fig. 2.
Fig. 7 is that substrate strip adopts the shown light distribution schematic diagram of transparent material in the structure shown in Figure 5.
Fig. 8 is that substrate strip adopts the shown light distribution schematic diagram of nontransparent whiteware in the structure shown in Figure 5.
Fig. 9 is a kind of thermal resistance schematic diagram of the present invention.
Figure 10 is a kind of thermal resistance topological diagram of the present invention.
The number in the figure explanation:
1, the printing opacity fluorescent tube, 2, blast pipe, 3, the electricity lead-out wire, 4, stem stem, 5, the LED illumination module, 6, conducting terminal, 7, end cap, 8, wiring board, 9, the LED light emitting source, 10, driver, 11, electric connection line, 12, the alternating current input line, 13, the vacuum seal cavity, 14, the wire mark circuit, 15, LED light emitting source installed surface, 16, led chip, 17, gold thread, 18, LED light emitting source electrode, 19, driver circuit, 20, the driver installed surface, 21, driver alternating current input line, 22, the light transmission medium layer, 23, light-converting material, 24, the led chip fixing glue, 25, LED light-emitting section upper surface emergent light, 26, LED light-emitting section lower surface emergent light, 27, substrate strip, 28, transparent pipe, 29, inert gas, 30, air.
The specific embodiment
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Embodiment: a kind of LED spot, such as Fig. 1 or shown in Figure 3, it comprises that printing opacity fluorescent tube 1(printing opacity fluorescent tube is transparent glass tube or transparent ground glass pipe), be arranged on the LED illumination module 5 in the printing opacity fluorescent tube 1, LED illumination module 5 comprises LED light emitting source 9, the wiring board 8 that is electrically connected with the LED light emitting source, the driver 10 that is electrically connected with wiring board, and it is crystalline ceramics or glass or epoxy resin that wiring board 8 adopts materials.LED illumination module 5 is at least one group (generally, take two groups or more scheme as good), when LED illumination module 5 is two groups or more, faces mutually between the LED illumination module 5 and links to each other by electric connection line 11.Driver 10 links to each other with electric lead-out wire 3 through alternating current input line 12, and electric lead-out wire 3 links to each other with conducting terminal 6, to connect external power source, connects external power and can light LED illumination module 5.As shown in Figure 4, the driver circuit 19 on the driver 10 is loaded on the driver installed surface 20 of wiring board 8, and driver alternating current input line 21 is connected with electric lead-out wire 3.As shown in Figure 3, LED light emitting source electrode 18 is electrically connected with wire mark circuit 14 and is fixing.
As shown in Figure 2, the wire mark circuit 14 that printing is made is loaded on the LED light emitting source installed surface 15 of wiring board 8, led chip 16 directly is loaded on the LED light-emitting section installed surface 15 by fixing glue, be electrically connected by gold thread 17 and wire mark circuit 14 between the led chip 16, LED light emitting source 9 is connected with driver lines output by the LED light-emitting section circuit 14 of wiring board 8.Led chip 16 obtains not homochromy mixed light for identical or different photochromic chip; Perhaps, select the multiple photochromic LED of varying number to obtain the white light of high color rendering index (CRI).Led chip 16 also can be blue light-emitting or ultraviolet light, and need to be that light-converting material is converted into white light in order to fluorescent material.
The two ends of printing opacity fluorescent tube 1 are respectively equipped with stem stem 4, be located at the end cap 7 of stem stem 4 peripheries, stem stem 4 cooperates with 1 vacuum seal of printing opacity fluorescent tube, be filled with inert gas 29 in the vacuum-sealed cavity 13 that stem stem 4 and printing opacity fluorescent tube 1 form, printing opacity fluorescent tube 1 outside be air 30(as shown in Figure 9, do not comprise driver among the figure).Generally, inert gas is helium, hydrogen or hydrogen helium gas mixture, and its air pressure is 0.5 to 2 standard atmospheric pressure at room temperature.Be provided with a stem stem 4 with blast pipe 2 and electric lead-out wire 3 in each end cap 7, the outer end of each end cap 7 arranges conducting terminal 6, and wiring board comprises the wire mark circuit 14 that is electrically connected with LED light emitting source 9 and driver 10 respectively.As shown in figure 10, cylindrical material thermal resistance calculation formula:
R wherein
ThBe thermal resistance, l is the cylindrical material axial length, and K is material thermal conductivity.Series resistances: R
Th=R
Th1+ R
Th2+ ... + R
Thn, thermal resistance in parallel:
The air thermal conductivity is K
Air=0.0233w/m.k, the helium thermal conductivity is K
He=0.144w/m.k, as calculated simulation and temperature test, it is that the helium of 1 standard atmospheric pressure is compared with the air of 1 standard atmospheric pressure that vacuum-sealed cavity 13 is filled with pressure, the led chip junction temperature descends more than 10 ℃, therefore, adopt the LED spot life-span of technical solution of the present invention can prolong more than 1 times.
As shown in Figure 7, when wiring board 8 adopted crystalline ceramics or high transmission rate glass of high refractive index substrate, it was 4 π that LED light-emitting section 9 upper surface emergent lights 25 and lower surface emergent light 26 form total emergent light lighting angle.As shown in Figure 8, be nontransparent pottery or epoxy resin when wiring board 8 adopts material, the light overwhelming majority of the led chip installed surface 15 of led chip 16 directive wiring boards 8 reflects, and has increased the light extraction efficiency of LED, and the LED rising angle is 2 π.LED light emitting source 9 has two kinds of patterns:
The first pattern, as shown in Figure 5, led chip on the LED light emitting source 9 16 directly loads in the circuit board by fixing glue 24 and at the light transmission medium layer 22 of led chip outer surface embedding semicircle column type or arc, is filled with light conversion material 23 in the light transmission medium layer.Light transmission medium layer 22 structure are semicircle column type or arc, by cirtical angle of total reflection formula sin θ=n
1/ n
2And analog computation can draw.When light transmission medium layer 22 structure were set to the semicircle column type, LED light emitting source 9 light extraction efficiencies can promote more than 20%, and thermal power reduces by 6%.Can fill light-converting material 23 in the light transmission medium layer 22, light conversion material 23 is fluorescent material.
The second pattern, as shown in Figure 6, LED light emitting source 9 comprises substrate strip 27, is loaded in led chip 16 on the substrate strip 27 by fixing glue 24, sealing is mounted with the transparent core pipe 28 of the substrate strip of led chip, be filled with light transmission medium layer 22 in the transparent core pipe, the electrode of described led chip is drawn by transparent core pipe two ends.Be filled with light conversion material 23 in the light transmission medium layer, perhaps apply light conversion material on the transparent core pipe wall body
Specifically, light transmission medium layer 22 material are transparent silica gel or epoxy resin, and the material of substrate strip and transparent core pipe is crystalline ceramics or clear glass, and fixing glue is transparent silica gel or epoxy resin.
The above is the preferred embodiments of the present invention only, is not limited to the present invention.In the above-described embodiments, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. LED spot, it is characterized in that comprising printing opacity fluorescent tube (1), be arranged on the LED illumination module (5) in the printing opacity fluorescent tube (1), the two ends of described printing opacity fluorescent tube (1) are respectively equipped with stem stem (4), be located at the peripheral end cap (7) of stem stem (4), described stem stem (4) cooperates with printing opacity fluorescent tube (1) vacuum seal, is filled with inert gas (29) in the vacuum-sealed cavity (13) that described stem stem (4) and printing opacity fluorescent tube (1) form.
2. a kind of LED spot according to claim 1, it is characterized in that the wiring board (8) that described LED illumination module (5) comprises LED light emitting source (9), is electrically connected with the LED light emitting source, the driver (10) that is electrically connected with described wiring board, it is crystalline ceramics or glass or epoxy resin that described wiring board (8) adopts material.
3. a kind of LED spot according to claim 2 is characterized in that led chip (16) on the described LED light emitting source (9) directly loads in the circuit board by fixing glue (24) and at the light transmission medium layer of led chip outer surface embedding semicircle column type or arc; Perhaps, described LED light emitting source (9) comprises substrate strip (27), is loaded in led chip (16) on the substrate strip (27) by fixing glue (24), sealing is mounted with the transparent core pipe (28) of the substrate strip of led chip, be filled with light transmission medium layer (22) in the described transparent core pipe, the electrode of described led chip is drawn by transparent core pipe two ends.
4. a kind of LED spot according to claim 3 it is characterized in that described LED light emitting source (9) is at least two strings, and every described led chip lighting angle is 4 π.
5. a kind of LED spot according to claim 3, it is characterized in that described light transmission medium layer (22) material is transparent silica gel or epoxy resin, the material of described transparent core pipe is crystalline ceramics or clear glass, described fixing glue is transparent silica gel or epoxy resin, and the material of described substrate strip is pottery or clear glass.
6. a kind of LED spot according to claim 1 is characterized in that described inert gas is helium, hydrogen or hydrogen helium gas mixture, and its air pressure is 0.5 to 2 standard atmospheric pressure at room temperature.
7. a kind of LED spot according to claim 1 is characterized in that described printing opacity fluorescent tube is transparent glass tube or transparent ground glass pipe.
8. optional described a kind of LED spot according to claim 1-7, it is characterized in that being provided with in each described end cap (7) stem stem (4) of a band blast pipe (2) and electric lead-out wire (3), the outer end of each described end cap (7) arranges conducting terminal (6), the other end of described driver (10) connects conducting terminal (6), and described wiring board comprises the wire mark circuit (14) that is electrically connected with LED light emitting source (9) and driver (10) respectively.
9. a kind of LED spot according to claim 3 is characterized in that the led chip on the described LED light emitting source (9) is plural pieces, is filled with light conversion material (23) in the described light transmission medium layer, perhaps applies light conversion material on the described transparent core pipe wall body.
10. a kind of LED spot according to claim 9 is characterized in that described light conversion material (23) is fluorescent material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105372139A CN103032735A (en) | 2012-12-11 | 2012-12-11 | LED (Light-Emitting Diode) lamp tube |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105372139A CN103032735A (en) | 2012-12-11 | 2012-12-11 | LED (Light-Emitting Diode) lamp tube |
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| CN103032735A true CN103032735A (en) | 2013-04-10 |
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| CN2012105372139A Pending CN103032735A (en) | 2012-12-11 | 2012-12-11 | LED (Light-Emitting Diode) lamp tube |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855143A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED lamp filament and light-emitting device |
| CN104595774A (en) * | 2015-02-05 | 2015-05-06 | 深圳市中电照明股份有限公司 | LED (Light Emitting Diode) straight lamp |
| CN104613340A (en) * | 2014-12-23 | 2015-05-13 | 龙岩金太阳光电科技有限公司 | Full period-luminosity LED daylight lamp |
| CN104763913A (en) * | 2015-04-01 | 2015-07-08 | 安徽康佳绿色照明技术有限公司 | Line lamp of LED module with fixed winding displacement is equipped with |
| CN105135281A (en) * | 2015-09-10 | 2015-12-09 | 江苏舒适照明有限公司 | LED mirror front lamp |
| CN105365684A (en) * | 2015-11-30 | 2016-03-02 | 重庆熠美实业发展有限公司 | Method for improving safety of vehicle driving |
| CN105365685A (en) * | 2015-11-30 | 2016-03-02 | 重庆熠美实业发展有限公司 | Automobile rearview mirror device with prompt function |
| CN106090650A (en) * | 2016-07-29 | 2016-11-09 | 广州依恩施节能科技有限公司 | A kind of LED fluorescent lamp and manufacture method thereof |
| CN113161469A (en) * | 2021-03-23 | 2021-07-23 | 聿耒科技(天津)有限公司 | Tubular packaging-free ultraviolet LED light source module and processing method |
| CN116428566A (en) * | 2023-04-14 | 2023-07-14 | 佛山市南海雷德灯饰照明有限公司 | LED ceiling lamp packaging structure capable of efficiently radiating heat |
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| CN103855143A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED lamp filament and light-emitting device |
| CN104613340A (en) * | 2014-12-23 | 2015-05-13 | 龙岩金太阳光电科技有限公司 | Full period-luminosity LED daylight lamp |
| CN104595774A (en) * | 2015-02-05 | 2015-05-06 | 深圳市中电照明股份有限公司 | LED (Light Emitting Diode) straight lamp |
| CN104763913A (en) * | 2015-04-01 | 2015-07-08 | 安徽康佳绿色照明技术有限公司 | Line lamp of LED module with fixed winding displacement is equipped with |
| CN104763913B (en) * | 2015-04-01 | 2017-06-27 | 安徽康佳绿色照明技术有限公司 | Line lamp of LED module with fixed winding displacement is equipped with |
| CN105135281A (en) * | 2015-09-10 | 2015-12-09 | 江苏舒适照明有限公司 | LED mirror front lamp |
| CN105365685A (en) * | 2015-11-30 | 2016-03-02 | 重庆熠美实业发展有限公司 | Automobile rearview mirror device with prompt function |
| CN105365684A (en) * | 2015-11-30 | 2016-03-02 | 重庆熠美实业发展有限公司 | Method for improving safety of vehicle driving |
| CN106090650A (en) * | 2016-07-29 | 2016-11-09 | 广州依恩施节能科技有限公司 | A kind of LED fluorescent lamp and manufacture method thereof |
| CN113161469A (en) * | 2021-03-23 | 2021-07-23 | 聿耒科技(天津)有限公司 | Tubular packaging-free ultraviolet LED light source module and processing method |
| CN113161469B (en) * | 2021-03-23 | 2023-12-01 | 聿耒科技(天津)有限公司 | Tubular packaging-free ultraviolet LED light source module and processing method |
| CN116428566A (en) * | 2023-04-14 | 2023-07-14 | 佛山市南海雷德灯饰照明有限公司 | LED ceiling lamp packaging structure capable of efficiently radiating heat |
| CN116428566B (en) * | 2023-04-14 | 2024-03-15 | 雷德照明科技(广东)有限公司 | LED ceiling lamp packaging structure capable of efficiently radiating heat |
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Application publication date: 20130410 |