CN203644775U - LED filament and lighting apparatus - Google Patents

LED filament and lighting apparatus Download PDF

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Publication number
CN203644775U
CN203644775U CN201420019147.0U CN201420019147U CN203644775U CN 203644775 U CN203644775 U CN 203644775U CN 201420019147 U CN201420019147 U CN 201420019147U CN 203644775 U CN203644775 U CN 203644775U
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CN
China
Prior art keywords
substrate
bonding area
crystal bonding
led filament
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420019147.0U
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Chinese (zh)
Inventor
游志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Lingtao Photoelectric Technology Co., Ltd.
Original Assignee
Shenzhen Refond Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Refond Optoelectronics Co Ltd filed Critical Shenzhen Refond Optoelectronics Co Ltd
Priority to CN201420019147.0U priority Critical patent/CN203644775U/en
Application granted granted Critical
Publication of CN203644775U publication Critical patent/CN203644775U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model belongs to the lighting technical field and provides an LED filament and a lighting apparatus. The LED filament comprises a first substrate, a second substrate which is in back-to-back attachment with the first substrate, and fluorescent glue; middle portions of the first substrate and the second substrate are die bonding areas; a plurality of the LED chips are arranged on the die bonding areas; and the die bonding areas and the LED chips are completely coated with the fluorescent glue. With the above structure adopted, the front surface and the back surface of the LED filament can emit light, and therefore, the problem of inconsistency in light colors of the front surface and the back surface of the filament can be completely solved. The LED filament can be widely applied to various lighting apparatuses.

Description

LED filament and ligthing paraphernalia
Technical field
The utility model belongs to lighting technical field, relates in particular to a kind of LED filament and ligthing paraphernalia.
Background technology
At present, LED filament product is by BT plate or FR4, and the opaque substrate such as metal substrate is made, and after lighting, tends to have dark space at substrate back, and photochromic consistency is poor, affects illuminating effect.
Utility model content
The object of the utility model embodiment is to provide a kind of LED filament, is intended to solve the poor problem of the photochromic consistency of existing LED filament.
The utility model embodiment realizes like this, a kind of LED filament, the second substrate and the fluorescent glue that comprise first substrate, fit back-to-back with described first substrate, described first substrate and second substrate mid portion are crystal bonding area, multiple LED chips are located at described crystal bonding area, by the completely coated crystal bonding area of described fluorescent glue and LED chip.
Another object of the utility model embodiment is to provide a kind of ligthing paraphernalia, and described ligthing paraphernalia adopts above-mentioned LED filament.
The utility model embodiment welds respectively LED chip admittedly prior to the crystal bonding area of two substrates, then makes their integralization back-to-back bonded to each other, then the fluorescent glue of completely coated each the crystal bonding area of moulding and LED chip.The LED filament front and back of this structure all can be luminous, so can thoroughly solve existing filament product front, the photochromic inconsistent problem in the back side.Thereby this LED filament can be widely used in various ligthing paraphernalias.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED filament that provides of the utility model embodiment;
Fig. 2 is Figure 1A-A schematic cross-section;
Fig. 3 is the structural representation of filament substrate;
Fig. 4 is the structural representation of bulk substrate;
Fig. 5 is the structural representation that is connected crystal bonding area and weld zone by plastic parts;
Fig. 6 is Fig. 5 B-B profile.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The utility model embodiment welds respectively LED chip admittedly prior to the crystal bonding area of two substrates, then makes their integralization back-to-back bonded to each other, then the fluorescent glue of completely coated each the crystal bonding area of moulding and LED chip.The LED filament front and back of this structure all can be luminous, so can thoroughly solve existing filament product front, the photochromic inconsistent problem in the back side.
Below in conjunction with specific embodiment, realization of the present utility model is described in detail.
As shown in Figures 1 to 3, second substrate 2 and fluorescent glue 4 that the LED filament that the utility model embodiment provides comprises first substrate 1, fits back-to-back with described first substrate 1, described first substrate 1 and second substrate 2 mid portions are crystal bonding area 11, multiple LED chips 3 are located at described crystal bonding area 11, by the completely coated crystal bonding area 11 of described fluorescent glue 4 and LED chip 3.Wherein, described first substrate 1 and second substrate 2 are BT plate or FR4, the opaque substrate such as metal substrate.The LED filament front of this structure and the back side all can be luminous, so can thoroughly solve the photochromic and positive photochromic inconsistent problem in the existing filament product back side.
As shown in Figure 4, the utility model embodiment first processes bulk substrate 5 by machining, chemical etching or other forming method, makes it to mold multiple filament substrates that are arranged in parallel, i.e. aforementioned first substrate or second substrate.The weld zone 12 that herein also can be disconnected compared with small end 14 and with described crystal bonding area described crystal bonding area by the plastic parts 16 after solidifying is separately connected, make described crystal bonding area be positioned at the middle part of breach 13 compared with small end 14, thereby the positive and negative electrode disconnecting is engaged togather, as shown in Figure 5,6.Described first substrate or second substrate are embedded in this plastic parts 16, can be to be partly or entirely wrapped in plastic cement, so guarantee that positive and negative electrode position is relatively stable, at not easy fracture of gap, have improved the bulk strength of substrate simultaneously.Wherein, described plastic parts 16 can be made up of transparent or other colouring plastic (as thermoplastic or thermosetting material).Then, make the interconnected circuit of LED chip 3 and external electrical in 11 designs of the crystal bonding area of each filament substrate, and in each crystal bonding area 11, multiple LED chips 3 are set.Admittedly weld after described LED chip 3, two major parts substrate 5 fit together back-to-back.Then, by fluorescent glue 2 described in the technological forming such as injection moulding or mold pressing, make it entirely to wrap up the part substrate at LED chip 3 and place, 11(Ji crystal bonding area, crystal bonding area), thus realize similar incandescent lamp illumination effect.Finally, cut out each LED filament.
Conventionally, described LED filament can be both bilateral single electrode, can be also monolateral bipolar electrode, flexible design.As shown in Figure 1,3, the LED filament that the present embodiment provides is taked bilateral single electrode pattern, wherein said first substrate 1 and second substrate 2 two ends are weld zone 12,11You one end, described crystal bonding area and weld zone 12 disconnect, so the positive and negative electrode of this LED filament can be disconnected, and destroy less to whole substrate.Certainly, 11 two ends, described crystal bonding area all disconnect and also can with corresponding weld zone 12.
Wherein, establish a breach 13 with the weld zone 12 that described crystal bonding area 11 disconnects, described crystal bonding area is placed in this breach 13 compared with small end 14, as shown in Fig. 1,3,4.Locate crystal bonding area compared with small end 14 and breach 13 at this by described fluorescent glue 2, make it to be separated by a distance, and be parallel to each other.This structural design, after described fluorescent glue 2 forming and hardenings, has strengthened the bonding strength of the gap of described crystal bonding area 11 and weld zone 12, further promotes the reliability of this LED filament.
For strengthening button glue power, guarantee described fluorescent glue 2 and substrate bond strength, establish to fill the through hole 15 of fluorescent glue near the end of crystal bonding area 11 in described weld zone 12.The through hole 15 of this increase has reduced the area of the excessive glue of described fluorescent glue, also can shorten the distance of described fluorescent glue at the excessive glue of substrate surface.As preferably, described through hole 15 is only filled by fluorescent glue near the part of crystal bonding area 11, so both can reach aforementioned effect, can save again described fluorescent glue.The surface of described bulk substrate 5 is coated with silverskin or golden film, strengthens this LED filament light extraction efficiency with this.Wherein, described fluorescent glue 2 is for being mixed with the thermosets (as silica gel, epoxy resin) of fluorescent material, and it is square, circular or oval that its cross section may be molded to.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.

Claims (8)

1. a LED filament, it is characterized in that, the second substrate and the fluorescent glue that comprise first substrate, fit back-to-back with described first substrate, described first substrate and second substrate mid portion are crystal bonding area, multiple LED chips are located at described crystal bonding area, by the completely coated crystal bonding area of described fluorescent glue and LED chip.
2. LED filament as claimed in claim 1, is characterized in that, described first substrate and second substrate two ends are weld zone, and described crystal bonding area has at least one end and weld zone to disconnect.
3. LED filament as claimed in claim 2, is characterized in that, establishes a breach with the weld zone that described crystal bonding area disconnects, and described crystal bonding area is placed in this breach compared with small end.
4. LED filament as claimed in claim 3, it is characterized in that, the weld zone described crystal bonding area being disconnected compared with small end and with described crystal bonding area by the plastic parts after solidifying is connected, and makes described crystal bonding area be positioned at the middle part of breach compared with small end, thereby disconnects the positive and negative electrode of substrate.
5. LED filament as claimed in claim 3, is characterized in that, the through hole of fluorescent glue is established to fill in described weld zone near the end of crystal bonding area.
6. the LED filament as described in any one in claim 1~5, is characterized in that, described substrate surface is coated with silverskin or golden film.
7. LED filament as claimed in claim 6, is characterized in that, the cross section of described fluorescent glue is square, circular or oval.
8. a ligthing paraphernalia, is characterized in that, described ligthing paraphernalia adopts the LED filament as described in any one in claim 1~7.
CN201420019147.0U 2014-01-13 2014-01-13 LED filament and lighting apparatus Expired - Fee Related CN203644775U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420019147.0U CN203644775U (en) 2014-01-13 2014-01-13 LED filament and lighting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420019147.0U CN203644775U (en) 2014-01-13 2014-01-13 LED filament and lighting apparatus

Publications (1)

Publication Number Publication Date
CN203644775U true CN203644775U (en) 2014-06-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420019147.0U Expired - Fee Related CN203644775U (en) 2014-01-13 2014-01-13 LED filament and lighting apparatus

Country Status (1)

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CN (1) CN203644775U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103855146A (en) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 Led filament and lighting device
EP3086371A1 (en) * 2015-04-20 2016-10-26 Everlight Electronics Co., Ltd Light emitting module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103855146A (en) * 2014-01-13 2014-06-11 深圳市瑞丰光电子股份有限公司 Led filament and lighting device
CN103855146B (en) * 2014-01-13 2017-01-25 深圳市瑞丰光电子股份有限公司 Led filament and lighting device
EP3086371A1 (en) * 2015-04-20 2016-10-26 Everlight Electronics Co., Ltd Light emitting module

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Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
TR01 Transfer of patent right

Effective date of registration: 20170517

Address after: 518000, Guangdong, Shenzhen, Baoan District Xixiang street, hang Chau Hengfeng Industrial City, B15 plant, five or six floor

Patentee after: Shenzhen Lingtao Photoelectric Technology Co., Ltd.

Address before: Shenzhen Nanshan District City, Guangdong province 518000 White Pine Road Baiwang letter Industrial Park two District Sixth.

Patentee before: Shenzhen Refond Optoelectronics Co., Ltd.

Effective date of registration: 20170517

Address after: 518000, Guangdong, Shenzhen, Baoan District Xixiang street, hang Chau Hengfeng Industrial City, B15 plant, five or six floor

Patentee after: Shenzhen Lingtao Photoelectric Technology Co., Ltd.

Address before: Shenzhen Nanshan District City, Guangdong province 518000 White Pine Road Baiwang letter Industrial Park two District Sixth.

Patentee before: Shenzhen Refond Optoelectronics Co., Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140611

Termination date: 20200113

CF01 Termination of patent right due to non-payment of annual fee