CN103968347A - Metal heat dissipating support of LED lamp, LED light source plate and integration heat dissipating type LED lamp - Google Patents
Metal heat dissipating support of LED lamp, LED light source plate and integration heat dissipating type LED lamp Download PDFInfo
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- CN103968347A CN103968347A CN201410187810.2A CN201410187810A CN103968347A CN 103968347 A CN103968347 A CN 103968347A CN 201410187810 A CN201410187810 A CN 201410187810A CN 103968347 A CN103968347 A CN 103968347A
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- Prior art keywords
- light source
- led light
- source plate
- led
- heat dissipation
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 119
- 239000002184 metal Substances 0.000 title claims abstract description 119
- 230000010354 integration Effects 0.000 title abstract 4
- 239000011521 glass Substances 0.000 claims abstract description 146
- 230000017525 heat dissipation Effects 0.000 claims description 101
- 238000001816 cooling Methods 0.000 claims description 51
- 238000005452 bending Methods 0.000 claims description 23
- 239000006260 foam Substances 0.000 claims description 16
- 239000004411 aluminium Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 238000012546 transfer Methods 0.000 claims description 11
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 6
- 230000006872 improvement Effects 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 abstract description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 30
- 238000010586 diagram Methods 0.000 description 20
- 230000000694 effects Effects 0.000 description 16
- 238000005538 encapsulation Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000011222 crystalline ceramic Substances 0.000 description 2
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 2
- 239000008246 gaseous mixture Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a metal heat dissipating support of an LED lamp. The metal heat dissipating support is provided with at least two parallel heat dissipating belts extending longitudinally, transverse connecting sections are arranged between the two parallel heat dissipating belts, and a hollow frame is defined by the two adjacent transverse connecting sections and the two parallel heat dissipating belts. The hollow frame is internally provided with an electric conducting plate which is connected with the parallel heat dissipating belts on the edges of the hollow frame through technological connecting edges, and gaps exist between the electric conducting plate and the edges of the hollow frame. The invention further discloses an LED light source plate in which the heat dissipating support is applied, and the integration heat dissipating type LED lamp. The integration heat dissipating type LED lamp comprises a glass bulb shell, a lamp holder, a driving circuit and the LED light source plate. The metal heat dissipating support heat conducting, the heat conduction gas heat conducting and the glass bulb shell heat dissipating are integrated, and fast and effective integration heat dissipating is achieved. The metal heat dissipating support is especially suitable for high-power LED bulbs, the types of the bulbs are not limited, and the lamps can be bulb lamps, mercury lamps, candle lamps, tube lamps, reflector lamps, BR lamps, MR lamps and the like.
Description
Technical field
The invention belongs to the technical field of LED electricity-saving lamp, special relevant with the heat dissipation metal supporting structure of LED lamp, also relevant with integrated heat dissipation formula LED modulated structure with the LED light source plate of this cooling stand of application.
Technical background
In prior art, there is a kind of LED bulb, comprise: printing opacity cell-shell, LED light emitting source, stem stem, drive circuit and lamp holder.Printing opacity cell-shell and stem stem sealing form the cell-shell body of vacuum, and cell-shell is filled with low viscosity high thermal conductivity gas (for example helium, hydrogen or helium hydrogen gaseous mixture).LED light emitting source is comprised of high thermal conductivity transparent pipe and LED chip, high thermal conductivity transparent pipe is fixedly inserted on stem stem outer surface with transparent adhesive tape, LED chip is directly fixed on the planar section of high thermal conductivity transparent pipe outer surface with crystal-bonding adhesive, then be electrically connected to drive circuit and lamp holder, then cover last layer fluorescence coating.
This LED bulb is because high thermal conductivity transparent pipe has the larger contact-making surface contacting with low viscosity high thermal conductivity gas, reduced the thermal resistance between LED chip and low viscosity high thermal conductivity gas, so during electrified light emitting, the heat that LED chip produces is through larger area high thermal conductivity transparent pipe, low viscosity high thermal conductivity gas and the heat radiation of printing opacity cell-shell, and radiating effect increases.
Carefully analyze and be not difficult to find, the effect of high thermal conductivity transparent pipe is to play mounting bracket and heat radiation, installs on the one hand for LED chip, makes on the other hand the heat of LED chip work be conducted in time.But also there is following shortcoming in this LED bulb:
One, high thermal conductivity transparent pipe is to be made by high thermal conductivity crystalline ceramics, glass or plastics, in view of the heat conductivility of crystalline ceramics, glass or plastics is far away from metal, makes the radiating effect of LED bulb still await improving;
Two, high thermal conductivity transparent pipe only has upper and lower opening, can only increasing heat radiation area, can not in pipe, form thermal convection current, and radiating effect is ideal not to the utmost;
Three, high thermal conductivity transparent pipe is once moulding, and shape is fixing, makes the size of LED light emitting source to change and arbitrarily to change according to the power of LED bulb, and processing and manufacturing cost is high.
Summary of the invention
The object of the present invention is to provide a kind of heat dissipation metal support of LED lamp, significantly to improve radiating efficiency.
The object of the invention is to also provide a kind of LED light source plate and integrated heat dissipation formula LED lamp, significantly to improve radiating efficiency.
In order to reach above-mentioned purpose, technical scheme of the present invention is:
A kind of heat dissipation metal support of LED lamp, there are at least two parallel heat-radiation belts extending longitudinally, between two parallel heat-radiation belts, there is horizontal linkage section, adjacent two horizontal linkage sections surround hollow out frame with two parallel heat-radiation belts, in hollow out frame, there is conducting strip, conducting strip connects by technique fillet with the parallel heat-radiation belt of hollow out edge edge, and conducting strip and hollow out edge edge have gap.
Described cooling stand has 2N parallel heat-radiation belt, and when N >=2, all parallel heat-radiation belts are divided into N group, leaves gap and connect by point between two parallel heat-radiation belts of two adjacent groups.
On described parallel heat-radiation belt, also form the breach that is easy to bending.
Corresponding a kind of LED light source plate, by LED chip and above-mentioned cooling stand, formed, at the horizontal linkage section two ends of above-mentioned cooling stand and the end of adjacent two conducting strips, Insulating frame (injection-moulded plastic framework) is set, LED chip is placed on horizontal linkage section and is fixed in Insulating frame, LED chip is also electrically connected to two conducting strips in adjacent two hollow out frames by wire, all LED chips are connected mutually, are coated with luminous bisque on LED chip.
Described cooling stand is tabular, dull and stereotyped ring-type, U-shaped, polygon, polygon tubular or screw type etc. by bending.
The heat dissipation metal support of another kind of LED lamp, comprises thermal conduction portions and current-carrying part; Thermal conduction portions is by crisscross forming through plate and latitude plate, and adjacent surrounds positive hollow out frame through plate and latitude plate; Current-carrying part is comprised of upper and lower two transverse slats and conducting strip, upper and lower two transverse slats lay respectively at the above and below of thermal conduction portions, and upper and lower two transverse slats and thermal conduction portions have gap, upper and lower two transverse slats and adjacent surround side hollow out frame through plate, latitude plate, conducting strip is arranged in positive hollow out frame and side hollow out frame, conducting strip is connected by technique fillet with the latitude plate of side hollow out edge edge with positive hollow out frame, the conducting strip that is positioned at side hollow out frame is also connected with adjacent transverse slat, and conducting strip also has gap with the edge of positive hollow out frame and side hollow out frame.
On described latitude plate, form longitudinal profile groove.
The corresponding longitudinally profile groove of described upper and lower two transverse slats also forms breach.
Corresponding another kind of LED light source plate, by LED chip and above-mentioned cooling stand, formed, in the end through plate and adjacent two conducting strips of above-mentioned cooling stand, Insulating frame (injection-moulded plastic framework) is set, LED chip is placed on plate and is fixed in Insulating frame, LED chip is also electrically connected to adjacent two conducting strips by wire, is coated with luminous bisque on LED chip.
Described cooling stand is tabular, dull and stereotyped ring-type or polygon tubular etc. by bending.
Above-mentioned two kinds of LED light source plates are applied in integrated heat dissipation formula LED lamp, and this integrated heat dissipation formula LED lamp comprises glass cell-shell, lamp holder, drive circuit and above-mentioned LED light source plate, and drive circuit is arranged in lamp holder or glass cell-shell; Glass envelope clamshell is located on lamp holder, is provided with the glass stem of setting in glass cell-shell, and glass cell-shell and glass stem form enclosed cavity at sealed bottom, falling heat-transfer gas (as helium, hydrogen or helium hydrogen gaseous mixture etc.) in enclosed cavity; Above-mentioned LED light source plate is fixed on glass stem, and the LED chip on LED light source plate is electrically connected to drive circuit and lamp holder.
Support and lower carriage are installed in the top and bottom of described glass stem, the two ends of above-mentioned LED light source plate are arranged on upper bracket and lower carriage, and above-mentioned LED light source plate is vertical shape around glass stem or around glass stem, is formed light beam in the shape of a spiral by bending.
On described glass stem, be also fixedly nested with honeycomb metal radiator, in the barrel of honeycomb metal radiator, form honeycomb, on the barrel of honeycomb metal radiator, also offer louvre, above-mentioned LED light source plate by bending be vertical shape around or helical form around being fixed on the barrel of honeycomb metal radiator, form light beam.
On described glass stem, be also fixedly nested with honeycomb metal radiator, in the barrel of honeycomb metal radiator, form honeycomb, on the barrel of honeycomb metal radiator, also offer louvre, above-mentioned LED light source plate is directly fixed on the top of honeycomb metal radiator, or above-mentioned LED light source plate is fixed on aluminium sheet and aluminium sheet is fixed on the top of honeycomb metal radiator.
Described honeycomb is that in the barrel of honeycomb metal radiator, side direction glass stem extends to form radially sheet, radially on sheet, is also circumferentially formed arc sheet.
On described glass stem, be also fixedly nested with foam metal, above-mentioned LED light source plate by bending be vertical shape around or helical form around being fixed on, on foam metal, form light beam.
On described glass stem, be also fixedly nested with foam metal, above-mentioned LED light source plate is directly fixed on the top of foam metal, or above-mentioned LED light source plate is fixed on aluminium sheet and aluminium sheet is fixed on the top of foam metal.
The below of the below of described LED light source plate, LED light source plate and honeycomb metal radiator or the below of LED light source plate and foam metal, go back provided with fan.
Described drive circuit is arranged in glass cell-shell, and the vigour part of drive circuit is directly welded on the cooling stand of LED light source plate.
Adopt after such scheme, the present invention compared with prior art, has the following advantages:
One, by heat dissipation metal support (as copper), replace high thermal conductivity transparent pipe, utilize the high thermal conductivity of metal, the radiating effect of LED bulb is greatly improved;
Two, the pedestal of existing LED chip only plays the installation effect of supporting, so existing LED chip also needs the special heat sink LED chip work calories derivation that supplies that increases except metal base, and pedestal only leaves few part in the LED of moulding light source grain afterwards in encapsulation, extremely most pedestal can be used as waste material and abandon after encapsulation, cause the cost of existing LED chip encapsulation high, consumption is large, and waste is serious; Compare with existing LED chip encapsulating structure, heat dissipation metal support of the present invention both provided support to facilitate the encapsulation of LED chip, provide again heat-radiation belt to facilitate LED chip work calories to derive, so raw material of the present invention is fully used, saved the heat sink of prior art, radiating effect but improves greatly;
Three, heat dissipation metal support or further coordinate honeycomb metal radiator, foam metal and fan etc., can not only increasing heat radiation area, can also form thermal convection current in inside, and radiating effect is better;
Four, heat dissipation metal support can require bending to be the form that varies in size according to the power designs of LED bulb, for the LED chip of different numbers is installed, makes corresponding LED light emitting source, convenient processing and manufacture, and cost is low.
Key of the present invention is to integrate the conduction of heat dissipation metal support heat, heat-conducting gas heat conduction and glass cell-shell to dispel the heat, the heat of LED chip work is fully spread through heat dissipation metal support, fully contact with heat-conducting gas, by glass cell-shell, fully distributed again, realize integrated heat dissipation quickly and efficiently.The present invention is specially adapted to make high-power LED bulb, and bulb type is not limit, as bulb lamp, mercury lamp, candle lamp, Down lamp, shot-light, BR lamp, MR lamp etc.
Below in conjunction with drawings and Examples, the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is the structural representation of heat dissipation metal support of the present invention ();
Figure 1A is the partial enlarged drawing of Fig. 1;
Fig. 2 is the structural representation that framework is moulded in heat dissipation metal support of the present invention () injection moulding;
Fig. 2 B is the partial enlarged drawing of Fig. 2;
Fig. 3 is the structural representation of LED light source plate of the present invention ();
Fig. 3 C is the partial enlarged drawing of Fig. 3;
Fig. 3-1st, the en-block construction schematic diagram of LED light source plate of the present invention ();
Fig. 3-2nd, the wall scroll structural representation of LED light source plate of the present invention ();
Fig. 4 is the dull and stereotyped circulus schematic diagram of LED light source plate of the present invention ();
Fig. 4-1st, the dull and stereotyped circulus of LED light source plate of the present invention () is used schematic diagram;
Fig. 5 is the polygonized structure schematic diagram of LED light source plate of the present invention ();
Fig. 6 is the U-shaped structural representation of LED light source plate of the present invention ();
Fig. 7 is the U-shaped textural association schematic diagram of LED light source plate of the present invention ();
Fig. 8 is the spiral-shaped structure schematic diagram of LED light source plate of the present invention ();
Fig. 9 is the polygon tubular structure schematic diagram of LED light source plate of the present invention ();
Figure 10 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment mono-(bulb lamp);
Figure 11 is the internal structure schematic diagram of Figure 10;
Figure 12 is the internal structure top view of Figure 10;
Figure 13 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment bis-(bulb lamps);
Figure 14 is the internal structure schematic diagram of Figure 13;
Figure 15 is the internal structure top view of Figure 13;
Figure 16 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment tri-(mercury lamps);
Figure 17 is the internal structure schematic diagram of Figure 16;
Figure 18 is the internal structure three-dimensional exploded view of Figure 16;
Figure 19 is the structural representation of foam metal;
Figure 20 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment tetra-(candle lamps);
Figure 21 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment five (PAR lamps);
Figure 22 is the internal structure three-dimensional exploded view of Figure 21;
Figure 23 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment six (BR lamps);
Figure 24 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment seven (MR lamps);
Figure 25 is the internal structure three-dimensional exploded view of Figure 24;
Figure 26 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment eight (pluggable T8 fluorescent tube);
Figure 27 is the internal structure schematic diagram of Figure 26;
Figure 28 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment nine (screw type T8 fluorescent tube);
Figure 29 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention () embodiment ten (bulb lamps).
Figure 30 is the structural representation of heat dissipation metal support of the present invention (two);
Figure 30 A is the partial enlarged drawing of Figure 30;
Figure 31 is the structural representation that framework is moulded in heat dissipation metal support of the present invention (two) injection moulding;
Figure 31 B is the partial enlarged drawing of Figure 31;
Figure 32 is that the structural representation that excises technique fillet after framework is moulded in heat dissipation metal support of the present invention (two) injection moulding;
Figure 32 C is the partial enlarged drawing of Figure 32;
Figure 33 is the structural representation of heat dissipation metal support of the present invention (two) die bond;
Figure 33 D is the partial enlarged drawing of Figure 33;
Figure 34 is the structural representation of heat dissipation metal support of the present invention (two) binding gold thread;
Figure 34 E is the partial enlarged drawing of Figure 34;
Figure 35 is the structural representation of heat dissipation metal support of the present invention (two) dot fluorescent powder;
Figure 35 F is the partial enlarged drawing of Figure 35;
Figure 36 is the structural representation that heat dissipation metal support of the present invention (two) is cut out;
Figure 36 G is the partial enlarged drawing of Figure 36;
Figure 37 is the square flat structure schematic diagram of LED light source plate of the present invention (two);
Figure 37-1st, the square flat structure of LED light source plate of the present invention (two) is used schematic diagram;
Figure 38 is the dull and stereotyped circulus schematic diagram of LED light source plate of the present invention (two);
Figure 39 is the polygon tubular structure schematic diagram of LED light source plate of the present invention (two);
Figure 40 is the polygon tubular docking structure schematic diagram of LED light source plate of the present invention (two);
Figure 41 is that the polygon tubular structure of LED light source plate of the present invention (two) is used schematic diagram;
Figure 42 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment mono-(bulb lamp);
Figure 43 is the internal structure schematic diagram of Figure 42;
Figure 44 is the internal structure top view of Figure 42;
Figure 45 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment bis-(bulb lamps);
Figure 46 is the internal structure schematic diagram of Figure 45;
Figure 47 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment tri-(mercury lamps);
Figure 48 is the internal structure perspective exploded view of Figure 47;
Figure 49 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment tetra-(PAR lamps);
Figure 50 is the internal structure three-dimensional exploded view of Figure 49;
Figure 51 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment five (BR lamps);
Figure 52 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment six (MR lamps);
Figure 53 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment seven (pluggable T8 fluorescent tube);
Figure 54 is the internal structure schematic diagram of Figure 53;
Figure 55 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment eight (screw type T8 fluorescent tube);
Figure 56 is the whole cut-away view of integrated heat dissipation formula LED lamp of the present invention (two) embodiment nine (bulb lamps).
Label declaration
Glass cell-shell 1, enclosed cavity 11, heat-conducting gas 12, lamp holder 2, drive circuit 3, LED chip 4, aluminium sheet 5, glass stem 6, upper bracket 61, lower carriage 62, honeycomb metal radiator 7, radially sheet 71, arc sheet 72, louvre 73, fan 8, foam metal 9;
Cooling stand 100, parallel heat-radiation belt 110, horizontal linkage section 120, hollow out frame 130, conducting strip 140, technique fillet 150, gap 160, gap 170, point 180, breach 190;
LED light source plate 200, Insulating frame 210;
Cooling stand 300, thermal conduction portions 310, through plate 311, latitude plate 312, positive hollow out frame 313, longitudinal profile groove 314, current-carrying part 320, transverse slat 321,322, conducting strip 323, side hollow out frame 324, technique fillet 325, gap 326, gap 327, breach 328, Insulating frame 330;
LED light source plate 400, gold thread 410, fluorescent material 420.
The specific embodiment
Fig. 1 to Figure 29 is the heat dissipation metal supporting structure of the first LED lamp of the present invention, with and application LED light source plate and integrated heat dissipation formula LED lamp.
As shown in Fig. 1 and Figure 1A, the heat dissipation metal support 100 of the first LED lamp that the present invention discloses, by punch forming, there are at least two parallel heat-radiation belts 110 extending longitudinally, between two parallel heat-radiation belts 110, there is several horizontal linkage sections 120, adjacent two horizontal linkage sections 120 heat-radiation belt 110 parallel with two surrounds hollow out frame 130, in hollow out frame 130, there is conducting strip 140, conducting strip 140 connects by technique fillet 150 with the parallel heat-radiation belt 110 at hollow out frame 130 edges, and conducting strip 150 has gap 160 with the edge of hollow out frame 130, technique fillet 150 removal that will be stamped after LED chip 4 encapsulation, make parallel heat-radiation belt 110 not with conducting strip 140 conductings.
It is 2N=12 that cooling stand shown in Fig. 1 100 has 12 parallel heat-radiation belt 110(, N=6), make all parallel heat-radiation belts 110 be divided into 6 groups, between two parallel heat-radiation belts 110 of two adjacent groups, leave gap 170 and connect by point 180, this structure is convenient to the cooling stand of monoblock 100 to disassemble into the size needing, such as only having the single row configuration of one group of parallel heat-radiation belt 110 shown in Fig. 3-2, certainly, gap 170 and point 180 are also convenient to the cooling stand of monoblock 100 to be bent into the form needing.The present invention further also forms the breach 190 that is easy to bending on parallel heat-radiation belt 110.
For another example shown in Fig. 3 and Fig. 3 C, the first LED light source plate 200 that the present invention discloses, is comprised of cooling stand 100 shown in LED chip 4 and Fig. 1.Coordinate shown in Fig. 2 and Fig. 2 B and first at horizontal linkage section 120 two ends of above-mentioned cooling stand 100 and the end of adjacent two conducting strips 140, the plastic frame that Insulating frame 210(can be injection molding moulding is set, or adopt other insulating materials to make Insulating frame 210), in technique fillet 150(Fig. 3 C of punching press excision cooling stand 100, be shown in broken lines and represent punching press excision again), conducting strip 140 is all disconnected with parallel heat-radiation belt 110 and horizontal linkage section 120, then LED chip 4 be placed on horizontal linkage section 120 and be fixed in Insulating frame 210, LED chip 4 is also electrically connected to two conducting strips 140 in adjacent two hollow out frames 130 by wire, all LED chips 4 of whole LED light source plate 200 are connected mutually, on LED chip 4, be coated with again luminous bisque, make the monoblock LED light source plate 200 shown in Fig. 3-1.
Like this, conducting strip 140 is equivalent to the pedestal of existing LED light source grain, and parallel heat-radiation belt 110 and laterally linkage section 120 can replace the heat sink heat conduction and heat radiation of realizing LED chip 4 of existing LED light source grain.The present invention makes full use of the leftover pieces (parallel heat-radiation belt 110 and laterally linkage section 120) that tradition can be discarded, and raw material is fully used, and radiating effect but improves greatly.And, the present invention is by the feature of heat dissipation metal support 100, LED light source plate 200 can be tabular (Fig. 3), or is dull and stereotyped ring-type (Fig. 4), U-shaped (Fig. 6 and Fig. 7), polygon (Fig. 5), polygon tubular (Fig. 9) or screw type (Fig. 8) etc. by bending.
As shown in Figure 10 to Figure 12, the embodiment mono-of the first integrated heat dissipation formula LED lamp that the present invention discloses is bulb lamp, comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 200(LED chip 4 and cooling stand 100 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 200 is fixed on glass stem 6, specifically, the two ends of LED light source plate 200 are erect and are arranged on upper bracket 61 and lower carriage 62, series LED chip 4 on LED light source plate 200 is electrically connected to drive circuit 3 and lamp holder 2, and LED light source plate 200 forms light beam around glass stem 6 in the shape of a spiral by bending.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 100, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in FIG. 13 to 15, the embodiment bis-of the first integrated heat dissipation formula LED lamp that the present invention discloses is bulb lamp, also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 200(LED chip 4 and cooling stand 100 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 200 is fixed on glass stem 6, and the series LED chip 4 on LED light source plate 200 is electrically connected to drive circuit 3 and lamp holder 2.This embodiment bis-with the difference of embodiment mono-is, on the upper bracket 61 of glass stem 6 and lower carriage 62, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms, honeycomb shown in figure is, in the barrel of honeycomb metal radiator 7, side direction glass stem 6 extends to form radially sheet 71, radially on sheet 71, be also circumferentially formed arc sheet 72, on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 200 forms light beam around being fixed on the barrel of honeycomb metal radiator 7 in the shape of a spiral by bending.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 100 and honeycomb metal radiator 7, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 16 to Figure 18, the embodiment tri-of the first integrated heat dissipation formula LED lamp that the present invention discloses is mercury lamp (profile is different with embodiment bis-from embodiment mono-), also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3, LED chip 4 and LED light source plate 200(LED chip 4 and cooling stand 100 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 200 is fixed on glass stem 6, and the series LED chip 4 on LED light source plate 200 is electrically connected to drive circuit 3 and lamp holder 2.This embodiment tri-with the difference (the same with embodiment bis-) of embodiment mono-is, on the upper bracket 61 of glass stem 6 and lower carriage 62, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms, honeycomb shown in figure is, in the barrel of honeycomb metal radiator 7, side direction glass stem 6 extends to form radially sheet 71, radially on sheet 71, be also circumferentially formed arc sheet 72, on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 200 forms light beam around being fixed on the barrel of honeycomb metal radiator 7 in the shape of a spiral by bending.In addition, this embodiment tri-is also different from embodiment bis-, and provided with fan 8 is gone back in the below of LED light source plate 200 and honeycomb metal radiator 7.The heat producing during LED chip 4 work, large area through cooling stand 100 and honeycomb metal radiator 7 fully spreads, and fully contacts, and coordinate fan 8 to strengthen thermal convection current with heat-conducting gas 12, large surface by glass cell-shell 1 fully distributes again, realizes integrated heat dissipation quickly and efficiently.
Coordinate shown in Figure 19, above-mentioned honeycomb metal radiator 7 of the present invention also can be replaced by foam metal 9, improves radiating effect, and effect is identical.
As shown in figure 20, the embodiment tetra-of the first integrated heat dissipation formula LED lamp that the present invention discloses is candle lamp (profile is different from embodiment mono-to three), also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 200(LED chip 4 and cooling stand 100 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.200 bendings of LED light source plate are U-shaped combination shown in Fig. 7 and are fixed on glass stem 6 again and form light beam, and the series LED chip 4 on LED light source plate 200 is electrically connected to drive circuit 3 and lamp holder 2.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 100, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 21 to Figure 22, the embodiment five of the first integrated heat dissipation formula LED lamp that the present invention discloses is PAR lamp, as shown in figure 23, the embodiment six of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is BR lamp, as shown in Figure 24 to Figure 25, the embodiment seven of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is MR lamp.Embodiment five to embodiment seven also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 200(LED chip 4 and cooling stand 100 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.LED light source plate 200 is fixed on glass stem 6, specifically, on glass stem 6, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms (as previously mentioned), on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 200 is fixed on aluminium sheet 5 (sees Fig. 4-1), and aluminium sheet 5 is fixed on the top of honeycomb metal radiator 7, LED light source plate 200 also can directly be fixed on the top of honeycomb metal radiator 7.Series LED chip 4 on LED light source plate 200 is electrically connected to drive circuit 3 and lamp holder 2.The heat producing during LED chip 4 work, large area through cooling stand 100 and honeycomb metal radiator 7 fully spreads, and fully contacts, and coordinate fan 8 to strengthen thermal convection current with heat-conducting gas 12, large surface by glass cell-shell 1 fully distributes again, realizes integrated heat dissipation quickly and efficiently.
As shown in FIG. 26 to 27, the embodiment eight of the first integrated heat dissipation formula LED lamp that the present invention discloses is pluggable T8 fluorescent tube, as shown in figure 28, the embodiment nine of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is screw type T8 fluorescent tube, also all comprise glass cell-shell 1, lamp holder 2, drive circuit 3, LED light source plate 200 and glass stem 6, correlation between this embodiment eight and each member of embodiment nine is identical with embodiment mono-, at this, do not repeat, difference is that the bulb type using is different.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 100, fully contact, more fully distributed by the large surface after 1 expansion of glass cell-shell with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in figure 29, the embodiment ten of the first integrated heat dissipation formula LED lamp that the present invention discloses is bulb lamp, also comprise glass cell-shell 1, lamp holder 2, drive circuit 3, LED light source plate 200 and glass stem 6, correlation between each member of this embodiment ten is identical with embodiment mono-, at this, does not repeat.This embodiment ten with the difference of embodiment mono-is, drive circuit 3 is arranged in glass cell-shell 1, specifically the vigour part of drive circuit 3 is directly welded on to the inner side of cooling stand 100.The heat producing during 3 work of LED chip 4 and drive circuit, fully spreads through the large area of cooling stand 100, fully contact, more fully distributed by the large surface after 1 expansion of glass cell-shell with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.This embodiment ten can extend glass cell-shell 1 as far as possible to lamp holder 2, increase glazed area, and illuminating effect is better.
Figure 30 to Figure 57 is the heat dissipation metal supporting structure of the second LED lamp of the present invention, with and application LED light source plate and integrated heat dissipation formula LED lamp.
As shown in Figure 30 and Figure 30 A, the improvement heat dissipation metal support 300 of the second LED lamp that the present invention discloses, is by punch forming, comprises thermal conduction portions 310 and current-carrying part 320.Thermal conduction portions 310 is by crisscross forming through plate 311 and latitude plate 312, and adjacent surrounds positive hollow out frame 313 through plate 311 and latitude plate 312.Current-carrying part 320 is by upper and lower two transverse slats 321, 322 and conducting strip 323 form, upper and lower two transverse slats 321 and 322 lay respectively at the above and below of thermal conduction portions 310, and upper and lower two transverse slats 321 and 322 and thermal conduction portions 310 have gap 326, upper and lower two transverse slats 321, 322 and adjacent through plate 311, latitude plate 312 surrounds side hollow out frame 324, conducting strip 323 is arranged in positive hollow out frame 313 and side hollow out frame 324, conducting strip 323 is connected by technique fillet 325 with the latitude plate 312 at side hollow out frame 324 edges with positive hollow out frame 313, the conducting strip 323 that is positioned at side hollow out frame 324 is also connected with 322 with adjacent transverse slat 321, conducting strip 323 also has gap 327 with the edge of positive hollow out frame 313 and side hollow out frame 324.Technique fillet 325 removal that will be stamped after LED chip 4 encapsulation, make thermal conduction portions 310 through plate 311 and latitude plate 312 not with two transverse slats 321,322 up and down and conducting strip 324 conductings of current-carrying part 320.
For convenient intercepting and splicing, the present invention further forms longitudinal profile groove 314 on latitude plate 312, and on upper and lower two transverse slats 312 and 322, corresponding longitudinally profile groove 314 also forms breach 328, and the longitudinal profile groove 314 on latitude plate 312 is also conducive to heat loss through convection.
When the heat dissipation metal support 300 of the second LED lamp of the present invention is applied to process LED light source plate 400, as shown in Figure 31 and Figure 31 B, first in the end through plate 311 and adjacent two conducting strips 323 of cooling stand 300, the plastic frame that Insulating frame 330(can be injection molding moulding is set, or adopt other insulating materials to make Insulating frame 330), for another example shown in Figure 32 and Figure 32 C, in technique fillet 325(Figure 32 C of punching press excision cooling stand 300, be shown in broken lines and represent punching press excision), make through plate 311 and latitude plate 312 and upper and lower two transverse slats 321, 322 and conducting strip 324 all disconnect and not conducting, then as shown in Figure 33 and Figure 33 D, LED chip 4 is placed on plate 311 and is fixed in Insulating frame 330, for another example shown in Figure 34 and Figure 34 E, LED chip 4 is electrically connected to two adjacent conducting strips 323 by wire (gold thread 410), as shown in Figure 35 and Figure 35 F, on LED chip 4, be coated with again luminous bisque (fluorescent material 420).So make a kind of LED light source plate 400 that the present invention discloses.
For the plate of LED light source shown in Figure 35 400, upper and lower two transverse slats 321 and 322 connect respectively positive source and negative pole, and in whole LED light source plate 400, all LED chips 4 of each latitude plate 312 are connected mutually, and all latitude plates 312 are parallel with one another, this LED light source plate 400 is parallel form.
For LED light source plate 400 shown in Figure 36 and Figure 36 G, in the structure shown in Figure 34, by cutting out (be shown in broken lines in Figure 36 G and represent punching press excision) and encapsulation, change electrode direction, make all LED chips 4 of whole LED light source plate 400 be mutual series connection, this LED light source plate 400 is series connection form.
Like this, conducting strip 323 is equivalent to the pedestal of existing LED light source grain, thermal conduction portions 310 through plate 311 and latitude plate 312, can replace the heat sink heat conduction and heat radiation of realizing LED chip 4 of existing LED light source grain.The present invention makes full use of the leftover pieces (through plate 311 and latitude plate 312) that tradition can be discarded, and raw material is fully used, and radiating effect but improves greatly.And, the present invention is by the feature of heat dissipation metal support 300, LED light source plate 400 can be tabular (Figure 37, Figure 37-1st, increases heat-dissipating aluminium plate 5), or be dull and stereotyped ring-type (Figure 38) by splicing, or be polygon tubular (Figure 39, Figure 40 is the polygon tubular docking of Figure 39, Figure 41 increases honeycomb metal radiator 7 in the polygon tubular of Figure 39) etc. by bending.
As shown in Figure 42 to Figure 44, the embodiment mono-of the second integrated heat dissipation formula LED lamp that the present invention discloses is bulb lamp, comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 400(LED chip 4 and cooling stand 300 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 400 is fixed on glass stem 6, specifically, the two ends of LED light source plate 400 are erect and are arranged on upper bracket 61 and lower carriage 62, LED chip 4 on LED light source plate 400 is electrically connected to drive circuit 3 and lamp holder 2, and LED light source plate 400 is vertical shape by bending and forms light beam around glass stem 6.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 300, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 45 to Figure 46, the embodiment bis-of the second integrated heat dissipation formula LED lamp that the present invention discloses is bulb lamp, also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 400(LED chip 4 and cooling stand 300 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 400 is fixed on glass stem 6, and the LED chip 4 on LED light source plate 400 is electrically connected to drive circuit 3 and lamp holder 2.This embodiment bis-with the difference of embodiment mono-is, on the upper bracket 61 of glass stem 6 and lower carriage 62, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms, honeycomb shown in figure is, in the barrel of honeycomb metal radiator 7, side direction glass stem 6 extends to form radially sheet 71, radially on sheet 71, be also circumferentially formed arc sheet 72, on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 400 is vertical shape by bending and forms light beam around being fixed on the barrel of honeycomb metal radiator 7.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 300 and honeycomb metal radiator 7, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 47 to Figure 48, the embodiment tri-of the second integrated heat dissipation formula LED lamp that the present invention discloses is mercury lamp (profile is different with embodiment bis-from embodiment mono-), also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3, LED chip 4 and LED light source plate 400(LED chip 4 and cooling stand 300 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 400 is fixed on glass stem 6, and the LED chip 4 on LED light source plate 400 is electrically connected to drive circuit 3 and lamp holder 2.This embodiment tri-with the difference (the same with embodiment bis-) of embodiment mono-is, on the upper bracket 61 of glass stem 6 and lower carriage 62, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms, honeycomb shown in figure is, in the barrel of honeycomb metal radiator 7, side direction glass stem 6 extends to form radially sheet 71, radially on sheet 71, be also circumferentially formed arc sheet 72, on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 400 is vertical shape by bending and forms light beam around being fixed on the barrel of honeycomb metal radiator 7.In addition, this embodiment tri-is also different from embodiment bis-, and provided with fan 8 is gone back in the below of LED light source plate 400 and honeycomb metal radiator 7.The heat producing during LED chip 4 work, large area through cooling stand 300 and honeycomb metal radiator 7 fully spreads, and fully contacts, and coordinate fan 8 to strengthen thermal convection current with heat-conducting gas 12, large surface by glass cell-shell 1 fully distributes again, realizes integrated heat dissipation quickly and efficiently.
Above-mentioned honeycomb metal radiator 7 of the present invention also can replace by foam metal 9 as shown in Figure 19, improves radiating effect, and effect is identical.
As shown in Figure 49 to Figure 50, the embodiment tetra-of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is PAR lamp, as shown in Figure 51, the embodiment five of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is BR lamp, as shown in Figure 52, the embodiment six of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is MR lamp.Embodiment tetra-to embodiment six also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 400(LED chip 4 and cooling stand 300 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.LED light source plate 400 is fixed on glass stem 6, specifically, on glass stem 6, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms (as previously mentioned), on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 400 is fixed on aluminium sheet 5 (sees Figure 37-1), and aluminium sheet 5 is fixed on the top of honeycomb metal radiator 7, LED light source plate 400 also can directly be fixed on the top of honeycomb metal radiator 7.LED chip 4 on LED light source plate 400 is electrically connected to drive circuit 3 and lamp holder 2.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 300 and honeycomb metal radiator 7, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 53 to Figure 54, the embodiment seven of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is pluggable T8 fluorescent tube, as shown in Figure 55, the embodiment eight of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is screw type T8 fluorescent tube, also all comprise glass cell-shell 1, lamp holder 2, drive circuit 3, LED light source plate 400 and glass stem 6, correlation between this embodiment seven and each member of embodiment eight is identical with embodiment mono-, at this, does not repeat, and difference is that the bulb type using is different.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 300, fully contact, more fully distributed by the large surface after 1 expansion of glass cell-shell with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 56, the embodiment nine of a kind of integrated heat dissipation formula LED lamp that the present invention discloses is bulb lamp, also comprise glass cell-shell 1, lamp holder 2, drive circuit 3, LED light source plate 400 and glass stem 6, correlation between each member of this embodiment nine is identical with embodiment mono-, at this, does not repeat.This embodiment nine with the difference of embodiment mono-is, drive circuit 3 is arranged in glass cell-shell 1, specifically the vigour part of drive circuit 3 is directly welded on to the inner side of cooling stand 300.The heat producing during 3 work of LED chip 4 and drive circuit, fully spreads through the large area of cooling stand 300, fully contact, more fully distributed by the large surface after 1 expansion of glass cell-shell with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.This embodiment nine can extend glass cell-shell 1 as far as possible to lamp holder 2, increase glazed area, and illuminating effect is better.
Above-described embodiment and graphic and non-limiting product form of the present invention and style, suitable variation or modification that any person of an ordinary skill in the technical field does it, all should be considered as not departing from patent category of the present invention.
Claims (19)
1. the heat dissipation metal support of a LED lamp, it is characterized in that: there are at least two parallel heat-radiation belts extending longitudinally, between two parallel heat-radiation belts, there is horizontal linkage section, adjacent two horizontal linkage sections surround hollow out frame with two parallel heat-radiation belts, in hollow out frame, there is conducting strip, conducting strip connects by technique fillet with the parallel heat-radiation belt of hollow out edge edge, and conducting strip and hollow out edge edge have gap.
2. the heat dissipation metal support of a kind of LED lamp as claimed in claim 1, it is characterized in that: described cooling stand has 2N parallel heat-radiation belt, when N >=2, all parallel heat-radiation belts are divided into N group, leave gap and connect by point between two parallel heat-radiation belts of two adjacent groups.
3. the heat dissipation metal support of a kind of LED lamp as claimed in claim 1 or 2, is characterized in that: on described parallel heat-radiation belt, also form the breach that is easy to bending.
4. a LED light source plate, it is characterized in that: by LED chip and cooling stand as claimed in claim 1, formed, at the horizontal linkage section two ends of above-mentioned cooling stand and the end of adjacent two conducting strips, Insulating frame is set, LED chip is placed on horizontal linkage section and is fixed in Insulating frame, LED chip is also electrically connected to two conducting strips in adjacent two hollow out frames by wire, all LED chips are connected mutually, are coated with luminous bisque on LED chip.
5. a kind of LED light source plate as claimed in claim 4, is characterized in that: described cooling stand is tabular, dull and stereotyped ring-type, U-shaped, polygon, polygon tubular or screw type by bending.
6. a heat dissipation metal support for LED lamp, is characterized in that: comprise thermal conduction portions and current-carrying part; Thermal conduction portions is by crisscross forming through plate and latitude plate, and adjacent surrounds positive hollow out frame through plate and latitude plate; Current-carrying part is comprised of upper and lower two transverse slats and conducting strip, upper and lower two transverse slats lay respectively at the above and below of thermal conduction portions, and upper and lower two transverse slats and thermal conduction portions have gap, upper and lower two transverse slats and adjacent surround side hollow out frame through plate, latitude plate, conducting strip is arranged in positive hollow out frame and side hollow out frame, conducting strip is connected by technique fillet with the latitude plate of side hollow out edge edge with positive hollow out frame, the conducting strip that is positioned at side hollow out frame is also connected with adjacent transverse slat, and conducting strip also has gap with the edge of positive hollow out frame and side hollow out frame.
7. the improvement heat dissipation metal support of a kind of LED lamp as claimed in claim 6, is characterized in that: on described latitude plate, form longitudinal profile groove.
8. the improvement heat dissipation metal support of a kind of LED lamp as claimed in claim 6, is characterized in that: the corresponding longitudinally profile groove of described upper and lower two transverse slats also forms breach.
9. a LED light source plate, it is characterized in that: by LED chip and cooling stand as claimed in claim 6, formed, the end through plate and adjacent two conducting strips at above-mentioned cooling stand arranges Insulating frame, LED chip is placed on plate and is fixed in Insulating frame, LED chip is also electrically connected to adjacent two conducting strips by wire, is coated with luminous bisque on LED chip.
10. a kind of LED light source plate as claimed in claim 9, is characterized in that: described cooling stand is tabular, dull and stereotyped ring-type or polygon tubular by bending.
11. 1 kinds of integrated heat dissipation formula LED lamps, is characterized in that: comprise glass cell-shell, lamp holder, drive circuit and the LED light source plate as described in claim 4 or 9, drive circuit is arranged in lamp holder or glass cell-shell; Glass envelope clamshell is located on lamp holder, is provided with the glass stem of setting in glass cell-shell, and glass cell-shell and glass stem form enclosed cavity at sealed bottom, falling heat-transfer gas in enclosed cavity; Above-mentioned LED light source plate is fixed on glass stem, and the LED chip on LED light source plate is electrically connected to drive circuit and lamp holder.
12. a kind of integrated heat dissipation formula LED lamps as claimed in claim 11, is characterized in that: provided with fan is gone back in the below of described LED light source plate.
13. a kind of integrated heat dissipation formula LED lamps as claimed in claim 11, it is characterized in that: support and lower carriage are installed in the top and bottom of described glass stem, the two ends of above-mentioned LED light source plate are arranged on upper bracket and lower carriage, and above-mentioned LED light source plate is vertical shape around glass stem or around glass stem, is formed light beam in the shape of a spiral by bending.
14. a kind of integrated heat dissipation formula LED lamps as claimed in claim 11, it is characterized in that: on described glass stem, be also fixedly nested with honeycomb metal radiator, in the barrel of honeycomb metal radiator, form honeycomb, on the barrel of honeycomb metal radiator, also offer louvre, above-mentioned LED light source plate by bending be vertical shape around or helical form around being fixed on the barrel of honeycomb metal radiator, form light beam, or above-mentioned LED light source plate is directly fixed on the top of honeycomb metal radiator, or above-mentioned LED light source plate is fixed on aluminium sheet and aluminium sheet is fixed on the top of honeycomb metal radiator.
15. a kind of integrated heat dissipation formula LED lamps as claimed in claim 14, is characterized in that: provided with fan is gone back in the below of described LED light source plate and honeycomb metal radiator.
16. a kind of integrated heat dissipation formula LED lamps as claimed in claim 11, is characterized in that: described honeycomb is that in the barrel of honeycomb metal radiator, side direction glass stem extends to form radially sheet, radially on sheet, is also circumferentially formed arc sheet.
17. a kind of integrated heat dissipation formula LED lamps as claimed in claim 11, it is characterized in that: on described glass stem, be also fixedly nested with foam metal, above-mentioned LED light source plate by bending be vertical shape around or helical form around being fixed on, on foam metal, form light beam, or above-mentioned LED light source plate is directly fixed on the top of foam metal, or above-mentioned LED light source plate is fixed on aluminium sheet and aluminium sheet is fixed on the top of foam metal.
18. a kind of integrated heat dissipation formula LED lamps as claimed in claim 17, is characterized in that: provided with fan is gone back in the below of described LED light source plate and foam metal.
19. a kind of integrated heat dissipation formula LED lamps as claimed in claim 11, it is characterized in that: described drive circuit is arranged in glass cell-shell, and the vigour part of drive circuit are directly welded on the cooling stand of LED light source plate.
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| CN201410187810.2A CN103968347A (en) | 2014-04-04 | 2014-05-06 | Metal heat dissipating support of LED lamp, LED light source plate and integration heat dissipating type LED lamp |
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| CN201410135261 | 2014-04-04 | ||
| CN201410135261.4 | 2014-04-04 | ||
| CN201410187810.2A CN103968347A (en) | 2014-04-04 | 2014-05-06 | Metal heat dissipating support of LED lamp, LED light source plate and integration heat dissipating type LED lamp |
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| CN103968347A true CN103968347A (en) | 2014-08-06 |
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| CN104165326A (en) * | 2014-08-26 | 2014-11-26 | 广东金达照明科技股份有限公司 | LED candle lamp |
| CN104659186A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | LED integrated module |
| WO2015149511A1 (en) * | 2014-04-04 | 2015-10-08 | 厦门萤火虫节能科技有限公司 | Metal heat-dissipation bracket of led lamp, led light source plate and integrated heat-dissipation led lamp |
| CN105186075A (en) * | 2015-07-29 | 2015-12-23 | 中国电子科技集团公司第四十一研究所 | YIG electrically tunable filter magnetic circuit structure with high temperature stability |
| WO2016197957A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light metal frame |
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| CN104165326B (en) * | 2014-08-26 | 2017-02-15 | 广东金达照明科技股份有限公司 | LED candle lamp |
| CN104659186B (en) * | 2015-02-12 | 2017-06-20 | 矽照光电（厦门）有限公司 | A kind of LED integration modules |
| CN104659186A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | LED integrated module |
| WO2016197957A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light metal frame |
| CN105186075A (en) * | 2015-07-29 | 2015-12-23 | 中国电子科技集团公司第四十一研究所 | YIG electrically tunable filter magnetic circuit structure with high temperature stability |
| CN110494690A (en) * | 2017-04-19 | 2019-11-22 | 爱丽思欧雅玛株式会社 | lighting device |
| CN109065524A (en) * | 2018-07-05 | 2018-12-21 | 代云生 | LED module, flexible filament, light source and LED module manufacturing method |
| CN109244066A (en) * | 2018-10-12 | 2019-01-18 | 深圳市欣上科技有限公司 | Without substrate filament framework, without substrate flexibility filament, light source and manufacturing method without substrate filament framework |
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| CN109300888B (en) * | 2018-10-12 | 2024-06-04 | 深圳市欣上科技有限公司 | Filament architecture, flexible filament, light source and filament manufacturing method |
| CN109244066B (en) * | 2018-10-12 | 2024-06-25 | 深圳市欣上科技有限公司 | Filament structure without substrate, flexible filament without substrate, light source and manufacturing method of filament structure without substrate |
| CN110375209A (en) * | 2019-06-21 | 2019-10-25 | 萤尔光电有限公司 | Rigid metal plate luminescent support and its processing technology |
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