CN208478336U - LED module, flexible filament and light source - Google Patents

Abstract

A kind of LED module, including at least one LED unit, the LED unit include: metallic support, including the first metallic object and the second metallic object being oppositely arranged；Light emitting module, including insulative bridge and LED chip, the insulative bridge connect first metallic object and second metallic object for bridge-type, and the LED chip is for being electrically connected first metallic object and second metallic object；When the LED unit is a plurality of, the LED unit realizes series/parallel connection by the metallic support.A kind of flexibility filament, is packaged in the fluorescent adhesive layer outside the LED module including LED module described in any of the above item and coating.LED module, flexible filament and light source provided by the utility model break through the limitation of chip selection using metal modular structure, simplify process, reduce circuit design manufacture difficulty, realize the lighting use of low cost, high heat dissipation, high current.

Description

LED module, flexible filament and light source

Technical field

The utility model belongs to lighting technical field, specifically, is related to a kind of LED module, flexible filament and light source.

Background technique

Incandescent lamp has a long history, and is the illuminator occurred earliest.Incandescent lamp there are energy transformation ratios low, energy consumption It high, the defects of service life is short, is runed counter to the environmentally friendly development trend in the present age, crisis on the verge of being replaced.With the superseded incandescent lamp in the whole world The publication of route map, the LED filament lamp as incandescent lamp substitute have welcome unprecedented opportunity to develop.

Currently, LED filament lamp mostly uses flexible filament as light-emitting component.Flexible filament utilizes HVLED technology, by more LED chip connects to form HVLEDs mould group, has the advantages that low temperature low energy consumption.Flexible filament is with the laminating macromolecule membrane of copper foil (FPC, BT, PE etc.) is base material, elongated flexible and have plasticity, it is bent to form different moulding, different type is provided Decorative lamp, thus the extensive favor by consumer.

Nevertheless, existing flexibility filament haves the defects that some to be difficult to overcome: (1) flexible base board must be by macromolecule material Material is made, and material price is high；(2) flexible base board heat dissipation performance is insufficient, and existing flexible filament is made to be only capable of working in low current Under (generally 10-60mA) environment, luminous power critical constraints mostly are difficult to make as illuminator as decorative lamp purposes With；(3) printed circuit is complicated, and yields is low；(4) flip-chip must be used, to guarantee LED chip connection under flexible state Reliability, chip selection are limited；(5) flexible filament both ends need to increase independent metal terminal, increase production stage at This.

Meanwhile the flexible preferable flexibility of filament, while reducing filament moulding difficulty, the sizing difficulty of filament is corresponding It improves.Existing LED filament lamp needs to carry out button silk to flexible filament using molybdenum filament to fix, not only increases production process, but also hold Easily flexible filament is polluted.And molybdenum filament also will cause to filament it is luminous block, packing colloid damage, long-term use process There are the undesirable hidden danger of electric property.

Utility model content

A kind of LED module that in order to overcome the deficiencies of the prior art, the utility model provides, flexible filament and light source, are adopted With metal modular structure, the limitation that chip selects is broken through, simplifies process, reduce circuit design manufacture difficulty, realize low cost, height It radiates, the lighting use of high current.

The purpose of this utility model is achieved through the following technical solutions:

A kind of LED module, including at least one LED unit, the LED unit include:

Metallic support, including the first metallic object and the second metallic object being oppositely arranged；

Light emitting module, including insulative bridge and LED chip, the insulative bridge connect first metallic object and institute for bridge-type The second metallic object is stated, the LED chip is for being electrically connected first metallic object and second metallic object；

When the LED unit is a plurality of, the LED unit realizes series/parallel connection by the metallic support.

As an improvement of the above technical solution, to include the first solid welding zone consolidate welding zone with second to the metallic support, and described the One solid welding zone and the first metallic object integrally connected, the described second solid welding zone and the second metallic object integrally connected, it is described First solid welding zone is realized by the LED chip with the described second solid welding zone and is electrically connected.

As a further improvement of the above technical scheme, the described first solid welding zone is all set in institute with the described second solid welding zone It states in insulative bridge.

As a further improvement of the above technical scheme, the LED module at least has the first array direction, along described A burst of column direction, a plurality of LED units are successively in line array.

As a further improvement of the above technical scheme, along first array direction, the first metal of adjacent LED units It keeps conllinear respectively between body, between the second metallic object, keeps between the first metallic object of adjacent LED unit or the second metal Integrally connected between body.

As a further improvement of the above technical scheme, it is mutually not connected to along first array direction, adjacent LED units The first metallic object be truncated by the first Metal Substrate, discrete second metallic object is by the second metal in adjacent LED units Base is truncated, first Metal Substrate and second Metal Substrate separation light emitting module two sides.

As a further improvement of the above technical scheme, the LED module also has second array direction, along described second Array direction, the second metallic object integrally connected of the first metallic object of the LED unit and adjacent LED unit.

As a further improvement of the above technical scheme, the insulative bridge has first for containing the LED chip Receiving portion, the first receiving portion of first receiving portion both ends are separately connected first metallic object and second metallic object, institute The first receiving portion side is stated to keep opening.

As a further improvement of the above technical scheme, the insulative bridge has and is disposed opposite to each other with first receiving portion Second receiving portion, second receiving portion keep opening far from the side of first receiving portion.

As a further improvement of the above technical scheme, second receiving portion is opened on each to side of the insulative bridge Wall.

As a further improvement of the above technical scheme, the LED chip of the light emitting module is a plurality of, and described in separation The not same surface of insulative bridge.

As a further improvement of the above technical scheme, the insulative bridge is made of transparent plastic.

As a further improvement of the above technical scheme, the light emitting module further includes non-luminescent electronic component, described Non-luminescent electronic component is electrically connected the two in first metallic object, second metallic object and the LED chip.

As a further improvement of the above technical scheme, the LED chip of the light emitting module is by non-luminescent electronic component It replaces and forms non-luminescent module, the light emitting module of the LED unit is replaced by the non-luminescent module and forms non-luminescent list Member, the LED unit realize that series/parallel is connect by the metallic support with the non-luminescent unit.

As a further improvement of the above technical scheme, the LED module further includes for encapsulating the non-luminescent module Encapsulation glue-line.

As a further improvement of the above technical scheme, the LED module further includes for encapsulating the light emitting module Encapsulate glue-line.

As a further improvement of the above technical scheme, there is the bending part for being easy to bend between the LED unit, it is described First metallic object and the bending part integrally connected and/or second metallic object and the bending part integrally connected.

A kind of flexibility filament, is packaged in outside the LED module including LED module described in any of the above item and coating Fluorescent adhesive layer, the free end of the LED module keep exposed and form the metal terminal for being externally electrically connected, the LED The free end of mould group is that one end keeps free first metallic object or the second metallic object.

A kind of light source, including LED module described in pedestal, big envelope and any of the above item, the LED module is set to described On pedestal, the big envelope is for sealing the LED module.

As an improvement of the above technical solution, coating encapsulates fluorescent adhesive layer and forms flexible filament outside the LED module, The flexibility filament is set on the pedestal after bending according to preset shape, and the big envelope is for sealing the flexible filament, institute The free end for stating LED module both ends keeps exposed and forms the metal terminal for being externally electrically connected, the LED module both ends Free end be that one end keeps free first metallic object or the second metallic object.

The beneficial effects of the utility model are:

(1) metallic support of LED unit is formed with the first metallic object and the second metallic object, and further connection forms LED The metal architecture of mould group realizes structure support and high efficiency and heat radiation with cheap metal material, breaks through the low electricity of conventional flex substrate Bottleneck is flowed, the high current and power requirement of general illumination field are adapted to；

(2) light emitting module is electrically connected with the metallic support that the first metallic object and the second metallic object are formed, is realized with metal Water conservancy diversion and can any strap circuits, save the process of printed circuit, reduce cost, discharge flexible base board structure to circuit design Constraint, arbitrariness with circuit design and easily expands characteristic, flexible filament also no setting is required independent metal terminal and save Production procedure；

(3) metallic support has preferable flexibility and easy constancy in LED size environment, makes LED module and flexibility Filament can arbitrarily be bent to form required moulding, meet the moulding needs of LED filament lamp, and sizing can be realized without molybdenum filament, Molybdenum filament bring is avoided to adversely affect；

(4) insulative bridge and LED chip form independent independent light emitting module, and insulative bridge has light transmission features and guarantees LED 360 ° of chip shine, and insulative bridge provides reliable structural defence for LED chip, and LED chip connection is reliable under flexible state Property guaranteed always, breach chip selection limitation, positive cartridge chip and flip-chip are applicable.

To enable the above objects, features, and advantages of the utility model to be clearer and more comprehensible, preferred embodiment is cited below particularly, and Cooperate appended attached drawing, is described in detail below.

Detailed description of the invention

It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also To obtain other relevant attached drawings according to these attached drawings.

Fig. 1 is the cascaded structure schematic diagram for the LED module that the utility model embodiment 1 provides；

Fig. 2 is the parallel-connection structure schematic diagram for the LED module that the utility model embodiment 1 provides；

Fig. 3 is the vertical view axonometric schematic diagram of the LED unit for the LED module that the utility model embodiment 1 provides；

Fig. 4 is the flip-chip scheme of installation for the LED module that the utility model embodiment 1 provides；

Fig. 5 is the blind hole structure schematic diagram of the first receiving portion of the LED module that the utility model embodiment 1 provides；

Fig. 6 is the horizontal type LED die bond structural schematic diagram for the LED module that the utility model embodiment 1 provides；

Fig. 7 is that the LED unit for the LED module that the utility model embodiment 1 provides looks up axonometric schematic diagram；

Fig. 8 is the package structure diagram of the LED unit for the LED module that the utility model embodiment 1 provides；

Fig. 9 is the two-sided die bond structural schematic diagram of the LED unit for the LED module that the utility model embodiment 1 provides；

Figure 10 is the blank schematic diagram with second array direction for the LED module that the utility model embodiment 1 provides；

Figure 11 is the finished product schematic with second array direction for the LED module that the utility model embodiment 1 provides；

Figure 12 is the luminescence unit with non-luminescent electronic component for the LED module that the utility model embodiment 1 provides Structural schematic diagram；

Figure 13 is the structural schematic diagram of the non-luminescent unit for the LED module that the utility model embodiment 1 provides；

Figure 14 is the structural schematic diagram after the removal part fluorescent glue for the flexible filament that the utility model embodiment 2 provides；

Figure 15 is the structural schematic diagram for the light source that the utility model embodiment 3 provides.

Main element symbol description:

P- light source, P (a)-flexibility filament, 1000-LED mould group, 0100-LED unit, 0110- metallic support, 0111- the One metallic object, the second metallic object of 0112-, 0113- first consolidate welding zone, and 0114- second consolidates welding zone, 0120- light emitting module, 0121- Insulative bridge, the first receiving portion of 0121a-, the second receiving portion of 0121b-, 0121c- normal society plastic cement, 0122-LED chip, 0122a- gold Line, 0130- encapsulate glue-line, the non-luminescent unit of 0200-, the non-luminescent module of 0210-, the non-luminescent electronic component of 0211-, 0300- Bending part, 2000- fluorescent adhesive layer, 3000- metal terminal, P (b)-pedestal, P (c)-big envelope, the-the first Metal Substrate of S (a), S (b)- Second Metal Substrate.

Specific embodiment

LED module, flexible filament and light source are carried out below with reference to relevant drawings for the ease of understanding the utility model, A more complete description.The preferred embodiment of LED module, flexible filament and light source is given in attached drawing.But LED module, flexibility Filament and light source can be realized by many different forms, however it is not limited to embodiment described herein.On the contrary, providing The purpose of these embodiments is to keep the disclosure to LED module, flexible filament and light source more thorough and comprehensive.

It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper", There is no intermediary elements.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are For illustrative purposes.

Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model The normally understood meaning of the technical staff in domain is identical.Herein in the used in the description of LED module, flexible filament and light source Term be only for the purpose of describing specific embodiments and be not intended to limit the utility model.Term as used herein " and/or " it include any and all combinations of one or more related listed items.

Embodiment 1

Fig. 1~4 are please referred to, the present embodiment discloses a kind of LED module 1000, including at least one LED unit 0100. Wherein, LED unit 0100 includes metallic support 0110 and light emitting module 0120.Wherein, metallic support 0110 includes the first metal Body 0111 and the second metallic object 0112, substantially series-parallel bracket.First metallic object 0111 is set relatively with the second metallic object 0112 It sets and 0120 two sides of light emitting module of living apart, the structure and electrical connection both realized by light emitting module 0120 make LED unit 0100 Form complete circuit structure.

Wherein, LED unit 0100 can be for one to a plurality of.When LED unit 0100 is a plurality of, LED unit 0100 Array structure is formed according to the default regularity of distribution.More typically, array structure include "-" type array structure, circumference array construction, The types such as square array construction, triangular array construction.

When LED unit 0100 is a plurality of, adjacent LED unit 0100 is realized by respective metallic support 0110 Series/parallel connection.Exemplarily, LED unit 0100 by the first metallic object 0111 thereon or the second metallic object 0112 with it is adjacent The first metallic object 0111 or the second metallic object 0112 for connecing LED unit 0100 realize series/parallel connection.Exemplarily, adjacent to close System includes being connected in series or being connected in parallel.It is appreciated that adjacent refer to adjacent between LED unit 0100 and keep connection.

Referring to Fig. 1, two 0100 one end of LED unit connection with series relationship, the other end disconnect, such as " the two The first metallic object 0111 between integrally connected, remain open between second metallic object 0112 of the two " or " first gold medal of the two Belong to and being remained open between body 0111, integrally connected between second metallic object 0112 of the two " or " the first metallic object of one Both 0111 and the 0112 integrally connected of the second metallic object, the second metal of the first metallic object 0111 of one and the two Body 0112 remains open ".

Referring to Fig. 2,0100 both ends of LED unit with parallel relationship distinguish integrally connected and form parallel-connection structure, example Such as " 0111 integrally connected of the first metallic object of the first metallic object 0111 of one and the two, the second metallic object of one Both 0112 and the 0112 integrally connected of the second metallic object ".Under the form, it is in parallel that LED unit 0100 can form double units Or multiple-unit parallel-connection structure.

Light emitting module 0120 includes insulative bridge 0121 and LED chip 0122.Insulative bridge 0121 connects the first gold medal for bridge-type Belong to body 0111 and the second metallic object 0112, realize that the structure of the latter two is fixed, and provides structural defence to LED chip 0122；LED Chip 0122 realizes circuit communication for being electrically connected the first metallic object 0111 and the second metallic object 0112.Wherein, bridge-type connects Refer to the connection structure shaped like bridge.

It is appreciated that insulative bridge 0121 has insulating properties, and structure enhancing is formed to metallic support 0110.Exemplarily, Insulative bridge 0121 is by plastic material in being molded on metal base.Color, ingredient and the light transmittance of plastic material are according to reality Depending on purposes, such as transparent PC (polycarbonate), white PPA (polyphthalamide), black PPA (polyphthalamide) Deng.

Exemplarily, insulative bridge 0121 is made of opaque plastic, and light emitting module 0120 is encapsulated by fluorescent glue and realized 360 ° shine.Another kind demonstration, light emitting module 0120 are still encapsulated by fluorescent glue, and insulative bridge 0121 is made of transparent plastic, and is had Good light transmittance and further enhance 360 ° of illumination effects.

Exemplarily, the solid welding zone 0113 of the setting of insulative bridge 0,121 first and the second solid welding zone 0114, the first solid welding zone 0113 With 0111 integrally connected of the first metallic object, the second solid 0112 integrally connected of welding zone 0114 and the second metallic object, the first solid welding zone 0113 and second solid welding zone 0114 realized and be electrically connected by LED chip 0122.0,122 1 pole of LED chip is welded in the first solid weldering Area 0113, another pole are welded in the second solid welding zone 0114, guarantee circuit communication.

Exemplarily, the first solid welding zone 0113 and the second solid welding zone 0114 are all set in insulative bridge 0121, are located at insulation The surface of bridge 0121 is in order to die bond.Further, with normal society plastic cement between the first solid welding zone 0113 and the second solid welding zone 0114 0121c is separated, and guarantees structure separation between the two.Normal society plastic cement 0121c is constructed with plastic channels or protrusion construction shape At between the first solid welding zone 0113 and the second solid welding zone 0114, and both make to keep insulation for both separating.

Under aforementioned structure, the type of LED chip 0122 is no longer limited, can adopt the forms such as positive cartridge chip or flip-chip. The electrode of positive cartridge chip is usually welded in a manner of gold thread upper；And the electrode of flip-chip is under, usually in a manner of patch It is welded.

Referring to Fig. 1, the first solid welding zone 0113 is crystal bonding area, and the second solid welding zone 0114 is weldering in positive cartridge chip example Line area.Positive cartridge chip is adhered to crystal bonding area by crystal-bonding adhesive (insulating cement), and the two poles of the earth of positive cartridge chip pass through gold thread 0122a respectively and weld It is connected to crystal bonding area and wire welding area.

Referring to Fig. 4, the first solid welding zone 0113 and the second solid welding zone 0114 are crystal bonding area in flip-chip example. One pole of flip-chip is adhered to the first solid welding zone 0113 by crystal-bonding adhesive (conducting resinl), and another pole is viscous by crystal-bonding adhesive (conducting resinl) It is connected to the second solid welding zone 0114.

The effect of supplementary explanation, the first solid welding zone 0113 and the second solid welding zone 0114 also resides in, and provides arbitrary extension design The space of circuit avoids the complicated design and process of printed circuit existing for conventional flex substrate.

Exemplarily, the first solid welding zone 0113 can be sequentially distributed with the second solid welding zone 0114 along the first array direction, also may be used Vertical along the first array direction is sequentially distributed.The former forms vertical type LED die bond structure (such as Fig. 1~2), and the latter forms horizontal type LED die bond structure (such as Fig. 6).

As previously mentioned, LED module 1000 has array structure when LED unit 0100 is a plurality of.Exemplarily, LED Mould group 1000 at least has the first array direction, to form basic array structure.Correspondingly, along the first array direction, plural number A LED unit 0100 successively linear array, and connection is correspondingly formed according to series/parallel connection relationship.

Exemplarily, between the first array direction, the first metallic object 0111 of adjacent LED units 0100, the second metal It keeps conllinear between body 0112 respectively, keeps between the first metallic object 0111 of adjacent LED unit 0100 or the second metallic object Integrally connected between 0112.

Supplementary explanation is kept between adjacent LED unit 0100, and studying carefully is to realize to connect by mutual first metallic object 0111 It connects or connection is realized by mutual second metallic object 0112, the string between LED unit 0100 depending on keeping adjoining is simultaneously Join circuit connecting relation.

Under aforementioned collinear relationship, successively a straight line is collectively formed in the first metallic object 0111 of the LED unit 0100 of array, Another straight line is collectively formed in second metallic object 0112.Exemplarily, along the first array direction, adjacent LED units 0100 mutually not First metallic object 0111 of connection is truncated by the first Metal Substrate S (a) according to circuit connecting relation, adjacent LED units 0100 In discrete second metallic object 0112 be truncated by the second Metal Substrate S (b) according to circuit connecting relation.In other words, it goes Before material means truncation, successively the first metallic object 0111 of the LED unit 0100 of array belongs to the group of the first Metal Substrate S (a) At part, the second metallic object 0112 belongs to the component part of the second Metal Substrate S (b).Exemplarily, the first solid welding zone 0113 is also fallen within The component part of first Metal Substrate S (a), the second solid welding zone 0114 also fall within the component part of the second solid welding zone 0114.

Wherein, the first Metal Substrate S (a) and the second Metal Substrate S (b) separation 0120 two sides of light emitting module.First Metal Substrate S (a) numerous with the adoptable shape of the second Metal Substrate S (b), including the types such as sheet, strip, plate, bulk.First Metal Substrate S (a) it can be the metals such as copper and iron, also can be the flexible alloys of coating surface conductive material.

It is appreciated that under the application size environment of LED, the first metallic object 0111 and the second metallic object 0112 all have compared with Good flexibility and plasticity.Characteristic based on metal material, the first metallic object 0111 and the second metallic object 0112 have both preferably Easy sizing characteristics, be easy to keep current moulding.

Fig. 3~5 are please referred to, exemplarily, insulative bridge 0121 has first for containing LED chip 0122 to accommodate Portion 0121a, the first both ends receiving portion 0121a are separately connected the first metallic object 0111 and the second metallic object 0112.First receiving portion The side 0121a keeps opening, and to carry out die bond to LED chip 0122, and guarantees the good light transmission of LED chip 0122.

The effect of first receiving portion 0121a at least that, form the encirclement to LED chip 0122 and protect, guarantee LED chip The reliability of 0122 connection.Exemplarily, the first solid welding zone 0113 and the second solid welding zone 0114 are all set in the first receiving portion The surface of 0121a.

It is appreciated that side keeps open and has to open referring to Fig. 4, the first receiving portion 0121a can be straight groove structure It is open-ended and be separately connected the first metallic object 0111 and the second metallic object 0112 to put formula；Referring to Fig. 5, the first receiving portion 0121a is also possible to blind hole structure, and side keeps open and forms slot in end, so that the first solid welding zone 0113 and second is solid 0114 grafting of welding zone is passed through.

Referring to Fig. 8, supplementary explanation, the first receiving portion 0121a realizes encapsulation by fluorescent glue and forms encapsulation glue-line 0130. It encapsulates glue-line 0130 and is used for encapsulating light emitting module 0120, form bowl construction, protect LED chip 0122 and guarantee translucent effect. Exemplarily, packaged type is glue dispensing and packaging.Wherein, fluorescent glue can be by fluorescent powder (nitride, gallate, YAG, rare earth aluminium Hydrochlorate etc.) it is reconciled with packaging plastic (silica gel, epoxy resin etc.).

Fig. 3 and Fig. 7 are please referred to, exemplarily, insulative bridge 0121, which has, to be disposed opposite to each other with the first receiving portion 0121a Second receiving portion 0121b.Wherein, the second receiving portion 0121b keeps opening far from the side of the first receiving portion 0121a.In other words, The tow sides of first receiving portion 0121a and the second receiving portion 0121b separation insulative bridge 0121.The one of second receiving portion 0121b Aspect effect is, compresses a side surface and LED chip 0122 the distance between of the insulative bridge 0121 far from LED chip 0122, Enhance light transmittance and improves 360 ° of light emission luminance.It is appreciated that the second receiving portion 0121b can be slot type structure (such as straight trough, ten Word slot etc.), it also can be blind hole structure.

Exemplarily, the second receiving portion 0121b is opened on each to side wall of insulative bridge 0121, form multidirectional opening and into one Step enhancing three-dimensional transparent degree.For example, the second receiving portion 0121b is cross-shaped groove structure, it is open respectively in four walls of insulative bridge 0121, Form multidirectional light transmission effect.

Referring to Fig. 8, supplementary explanation, the second receiving portion 0121b realizes encapsulation by fluorescent glue and forms encapsulation glue-line 0130. Exemplarily, packaged type is glue dispensing and packaging.Wherein, fluorescent glue can be by fluorescent powder (nitride, gallate, YAG, rare earth aluminium Hydrochlorate etc.) it is reconciled with packaging plastic (silica gel, epoxy resin etc.).The light that LED chip 0122 issues is via encapsulation glue-line 0130 It is overflowed together from the surface of the second receiving portion 0121b and respectively to opening, realizes 360 ° omnibearing luminous.

The quantity of the LED chip 0122 of light emitting module 0120 can be for one to a plurality of.Exemplarily, light emitting module 0120 LED chip 0122 is a plurality of, and the not same surface for insulative bridge 0121 of living apart.For example, referring to Fig. 9, the first receiving portion LED chip 0122 is respectively set in 0121a and the second receiving portion 0121b, to form two-sided die bond structure, makes 360 ° comprehensive Stereo luminous effect is still good.Another kind demonstration, the LED chip 0122 positioned at the same side of insulative bridge 0121 also can be a plurality of.

Exemplarily, LED module 1000 also has second array direction, along second array direction, the of LED unit 0100 0112 integrally connected of the second metallic object of one metallic object 0111 and adjacent LED unit 0100.It is appreciated that the first array direction with Second array direction is not parallel to each other, and forms the structure that is interspersed.Exemplarily, the first array direction and second array direction are mutual Vertically.

Figure 10 shows the blank structure chart of the LED module 1000 with the first array direction Yu second array direction, root Material processing and forming is removed to blank according to required series/parallel circuit structure, the serial/parallel of LED module 1000 can be obtained Join circuit structure.Figure 11 shows a kind of finished product structure of LED module 1000 with exemplary circuit configuration.

Figure 12 is please referred to, exemplarily, light emitting module 0120 further includes non-luminescent electronic component 0211.Non-luminescent electronics Component 0211 is electrically connected the first metallic object 0111, the second metallic object 0112 and the two in LED chip 0122, forms connection Circuit.In other words, LED chip 0122 and non-luminescent electronic component 0211 coexist in same insulative bridge 0121, and the two is formed Required series/parallel connection structure.Wherein, the quantity of non-luminescent electronic component 0211 can be and real respectively for one to a plurality of Existing circuit connection.

The huge number of non-luminescent electronic component 0211, including IC (integrated circuit), resistance, capacitor Etc. types.When non-luminescent electronic component 0211 has more pin configurations, the first solid welding zone 0113 and/or the second solid welding zone 0114 forms corresponding pin connection line, to carry out solid weldering connection.

Figure 13 is please referred to, exemplarily, the LED chip 0122 of light emitting module 0120 is replaced by non-luminescent electronic component 0211 It changes and forms non-luminescent module 0210, the light emitting module 0120 of LED unit 0100 is replaced by non-luminescent module 0210 and formed non- Luminescence unit 0200, LED unit 0100 realize that series/parallel is connect by metallic support 0110 with non-luminescent unit 0200.

In other words, non-luminescent module 0210 has phase with light emitting module 0120, non-luminescent unit 0200 and LED unit 0100 Same construction, difference are to replace LED chip 0122 with non-luminescent electronic component 0211.Also that is, non-luminescent module 0210 with Non-luminescent unit 0200 is free of LED chip 0122, is only for forming required connection circuit.Specifically, non-luminescent module 0210 Forms the structure of such as light emitting module 0120 with insulative bridge 0121 by non-luminescent electronic component 0211, non-luminescent unit 0200 is by non- Light emitting module 0210 and metallic support 0110 form the structure such as LED unit.Supplementary explanation, LED unit 0100 above-mentioned it is each Class construction feature is equally applicable to non-luminescent unit 0200.

Exemplarily, encapsulation glue-line 0130 is also used to encapsulate non-luminescent module 0210, forms bowl construction.Encapsulate glue-line Ingredient is fluorescent glue, is formed by fluorescent glue point adhesive curing.

Referring to Fig. 6, exemplarily, keep between the first metallic object 0111 of connection, between the second metallic object 0112, the Between one metallic object 0111 and the second metallic object 0112, it is respectively formed the bending part 0300 that bending can occur.Filament framework 1000 Bending deformation can occur in bending part 0300, obtain good flexibility, deformability is strong.Exemplarily, bending part 0300 is The interconnecting piece of truncation is not given in first Metal Substrate S (a) or the second Metal Substrate S (b), there is metal rigidity, lamp can be stably kept The specific shape that 1000 bending of guide frame structure obtains, sizing characteristics are good.

Supplementary explanation, the shape of the first metallic object 0111, the second metallic object 0112 and bending part 0300 is according to actual needs Depending on.When bending deformation does not occur, the first metallic object 0111, the second metallic object 0112 can be respectively provided with flat with bending part 0300 Straight structure (such as without bending straight) or other bending shapes (such as arch).

Embodiment 2

Figure 14 is please referred to, the present embodiment discloses a kind of flexibility filament P (a), the LED mould introduced including above embodiments 1 Group 1000 and coating are packaged in fluorescent adhesive layer 2000 LED module 1000 outside, the free end holding of LED module 1000 it is exposed and The metal terminal 3000 for being externally electrically connected is formed, the free end of LED module 1000 is that one end keeps free first gold medal Belong to body 0111 or the second metallic object 0112.Wherein, fluorescent adhesive layer 2000 is solidified by fluorescent glue coating.

It is appreciated that fluorescent adhesive layer 2000 is realized to the fully wrapped around of LED module 1000, only in LED module 1000 from It is not wrapped up by end.It is constructed for example, LED module 1000 forms "-" type along the first array direction array by LED unit 0100.It mends Explanation is filled, when flexible filament P (a) bends, forms bending part 0300 between adjacent LED unit 0100.

As previously mentioned, under the application size environment of LED, the first metallic object 0111 and the second metallic object 0112 all have compared with Good flexibility and plasticity, makes flexible filament P (a) be easy to bend moulding.Characteristic and fluorescent glue based on metal material are squeezed Pressure effect, flexible filament P (a) have both preferable easy sizing characteristics, are easy to keep current moulding.

Embodiment 3

Figure 15 is please referred to, the present embodiment discloses a kind of light source P, including pedestal P (b), big envelope P (c) are introduced with embodiment 1 LED module 1000, LED module 1000 is set on pedestal P (b), and big envelope P (c) is for encapsulating LED module 1000.Pedestal P (b) for realizing external conduction, with electric energy needed for supplying light source P.It is appreciated that the huge number of light source P, including ball bubble The types such as (LED filament lamp), T pipe, panel.

Exemplarily, the form of light source P is LED filament lamp.In the application of LED filament lamp, coated outside LED module 1000 It encapsulates fluorescent adhesive layer 2000 and forms the flexible filament P (a) that embodiment 2 is introduced, flexible filament P (a) is bent according to preset shape After be set on pedestal P (b), big envelope P (c) is for encapsulating flexible filament P (a).Exemplarily, big envelope P (c) is transparent or at least portion It is point transparent, keep flexible filament P (a) visible and plays decoration function.For example, big envelope P (c) can be made of transparent glass.

As previously mentioned, flexibility filament P (a) has ideal plasticity and easy sizing characteristics, not only it is easy to bend moulding, but also easily In keeping current moulding, makes LED filament lamp no setting is required molybdenum filament, avoid molybdenum filament bring from adversely affecting, with long-term use process Electric property is good, service life is considerable.

In all examples being illustrated and described herein, any occurrence should be construed as merely illustratively, without It is as limitation, therefore, other examples of exemplary embodiment can have different values.

It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.

Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But it cannot be understood as the limitations to the scope of the utility model.It should be pointed out that for the ordinary skill of this field For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this The protection scope of utility model.Therefore, the protection scope of the utility model should be determined by the appended claims.

Claims (20)

1. a kind of LED module characterized by comprising

At least one LED unit, the LED unit include metallic support and light emitting module；

The metallic support includes the first metallic object and the second metallic object being oppositely arranged；

The light emitting module includes insulative bridge and LED chip, and the insulative bridge connects first metallic object and institute for bridge-type The second metallic object is stated, the LED chip is for being electrically connected first metallic object and second metallic object；

When the LED unit is a plurality of, series/parallel connection is realized by the metallic support between adjacent LED unit.

2. LED module according to claim 1, which is characterized in that the metallic support includes the first solid welding zone and second Gu welding zone, the described first solid welding zone and the first metallic object integrally connected, the described second solid welding zone and second metallic object Integrally connected, the described first solid welding zone are realized by the LED chip with the described second solid welding zone and are electrically connected.

3. LED module according to claim 2, which is characterized in that the described first solid welding zone and the described second solid welding zone are equal It is set in the insulative bridge.

4. LED module according to claim 1, which is characterized in that the LED module at least has the first array direction, Along first array direction, a plurality of LED units are successively in line array.

5. LED module according to claim 4, which is characterized in that along first array direction, adjacent LED units Keep conllinear respectively between first metallic object, between the second metallic object, keep between the first metallic object of adjacent LED unit or Integrally connected between second metallic object.

6. LED module according to claim 5, which is characterized in that along first array direction, adjacent LED units Discrete first metallic object is truncated by the first Metal Substrate, in adjacent LED units discrete second metallic object by Second Metal Substrate is truncated, first Metal Substrate and second Metal Substrate separation light emitting module two sides.

7. LED module according to claim 4, which is characterized in that the LED module also has second array direction, edge The second array direction, the second metallic object integrally connected of the first metallic object of the LED unit and adjacent LED unit.

8. LED module according to claim 1, which is characterized in that the insulative bridge has for containing the LED chip The first receiving portion, the first receiving portion of first receiving portion both ends is separately connected first metallic object and second metal Body, first receiving portion side keep opening.

9. LED module according to claim 8, which is characterized in that the insulative bridge has and the first receiving portion phase The second receiving portion of setting is carried on the back, second receiving portion keeps opening far from the side of first receiving portion.

10. LED module according to claim 9, which is characterized in that second receiving portion is opened on the insulative bridge Respectively to side wall.

11. LED module according to claim 1, which is characterized in that the LED chip of the light emitting module is a plurality of, and The not same surface for the insulative bridge of living apart.

12. LED module according to claim 1, which is characterized in that the insulative bridge is made of transparent plastic.

13. LED module according to claim 1, which is characterized in that the light emitting module further includes non-luminescent electronics member device Part, the non-luminescent electronic component are electrically connected in first metallic object, second metallic object and the LED chip The two.

14. LED module according to claim 1, which is characterized in that the LED chip of the light emitting module is by non-luminescent electricity Sub- component is replaced and forms non-luminescent module, and the light emitting module of the LED unit is replaced by the non-luminescent module and formed Non-luminescent unit, the LED unit realize that series/parallel is connect by the metallic support with the non-luminescent unit.

15. LED module according to claim 14, which is characterized in that further include for encapsulating the non-luminescent module Encapsulate glue-line.

16. LED module according to claim 1, which is characterized in that further include the encapsulation for encapsulating the light emitting module Glue-line.

17. LED module according to claim 1, which is characterized in that have the folding for being easy to bend between the LED unit Turn of bilge, first metallic object integrally connect with the bending part integrally connected and/or second metallic object with the bending part It connects.

18. a kind of flexibility filament, which is characterized in that including the described in any item LED modules of claim 1-17 and coating encapsulation Fluorescent adhesive layer outside the LED module, the free end at the LED module both ends keep exposed and are formed for externally electrical The metal terminal of connection, the free end at the LED module both ends are that one end keeps free first metallic object or the second metallic object.

19. a kind of light source, which is characterized in that including pedestal, big envelope and the described in any item LED modules of claim 1-17, institute It states LED module to be set on the pedestal, the big envelope is for sealing the LED module.

20. light source according to claim 19, which is characterized in that coating encapsulation fluorescent adhesive layer outside the LED module and Flexible filament is formed, the flexibility filament is set on the pedestal after bending according to preset shape, and the big envelope is for sealing institute Flexible filament is stated, the free end at the LED module both ends keeps exposed and forms the metal terminal for being externally electrically connected, institute The free end for stating LED module both ends is that one end keeps free first metallic object or the second metallic object.