CN202210535U

CN202210535U - Flexible circuit board for LED

Info

Publication number: CN202210535U
Application number: CN 201120250407
Authority: CN
Inventors: 王冬雷
Original assignee: Elec Tech International Co Ltd
Current assignee: Yangzhou Dehao Runda Optoelectronic Co., Ltd.
Priority date: 2011-07-15
Filing date: 2011-07-15
Publication date: 2012-05-02
Anticipated expiration: 2021-07-15

Abstract

The present utility model provides a flexible circuit board for LED. Through adopting the flexible circuit board, technological processes of the flexible circuit board can be shortened, electrolytic plating and etching technologies are unnecessary, thus industrial chemical consumption can be avoided, costs and working hours can be greatly reduced, and environment pollution can be avoided. The flexible circuit board for LED comprises a flexible metal substrate and an insulation substrate formed by punching a continuous metal strip, the insulation substrate is pressed on the lower part of the flexible metal substrate; the flexible metal substrate comprises two conducting wires and a plurality of line tablet units, the two conducting wires and the line tablet units are mutually insulated; and each line tablet unit is provided with an LED chip die bond area. Through adopting a three-step molding method to manufacture the flexible circuit board for LED, technological processes are greatly shortened, production efficiency is increased, and the method can be used in a stream-lined line to continuously manufacture flexible circuit boards, and LED light sources or module groups of subsequent technologies.

Description

LED uses FPC

Technical field

The utility model belongs to electronic circuit board and application thereof, relates in particular to a kind of LED and uses FPC.

Background technology

In the prior art.The common flexible printed circuit board (FPC) that is used for the LED lighting field adopts printing technology production, and technological process is long, and production stage is many, and is time-consuming, so expensive, and the plating in the production process and etching process procedure also pollute the environment.

Summary of the invention

The purpose of the utility model is to provide a kind of LED to use FPC; Shortened the technological process of FPC, need not therefore also not have industrial chemicals consumption through electroplating and etch process; Can reduce cost widely and man-hour, and not pollute the environment.

The utility model is realized through following technical scheme:

LED uses FPC, wherein, includes: by flexible metal base plate and dielectric substrate that a continuous metal tape forms through stamping-out, said dielectric substrate is pressed together on the bottom of flexible metal base plate; Said flexible metal base plate includes two leads and the little blade unit of a plurality of circuit, and two leads and the little blade unit of a plurality of circuit insulate each other; The little blade unit of each circuit is provided with led chip crystal bonding area territory.

The width dimensions of said dielectric substrate is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate is more than or equal to the length dimension of flexible metal base plate.

A plurality of circuit small pieces unit adopts the rectangular array mode to arrange.

The beneficial effect of the utility model is following:

A kind of LED of the utility model uses FPC, owing to include: by flexible metal base plate and dielectric substrate that a continuous metal tape forms through stamping-out, said dielectric substrate is pressed together on the bottom of flexible metal base plate; Said flexible metal base plate includes two leads and the little blade unit of a plurality of circuit, and two leads and the little blade unit of a plurality of circuit insulate each other; The little blade unit of each circuit is provided with led chip crystal bonding area territory; Form two leads and a plurality of circuit small pieces of insulation each other, and form the series-parallel circuit of welding LED lamp pearl or chip, but constitute a continuous cutting segmentation LED FPC; Can form the series-parallel circuit of welding LED lamp pearl or chip in the later stage operation, but constitute the FPC with led light source of a continuous cutting segmentation.And because this LED is with the manufacturing approach of FPC; Adopt the FPC of three-step approach moulding, greatly shortened technological process, and do not had common necessary plating and the etch process of flexible print FPC production; Therefore there is not industrial chemicals consumption yet; Therefore can reduce cost widely and man-hour, enhance productivity, and do not pollute the environment.The big benefit of another of the utility model is, can be applied in led light source or the module of producing FPC and subsequent technique on the streamline continuously.

Description of drawings

Fig. 1 is that the utility model LED is with FPC embodiment one preparatory stamping-out structural representation;

Fig. 2 is that the utility model LED is with FPC embodiment two preparatory stamping-out structural representations;

Fig. 3 be the utility model LED with FPC embodiment one pressing after stamping-out structural representation again;

Fig. 4 be the utility model LED with FPC embodiment two pressings after stamping-out structural representation again;

Fig. 5 be the utility model LED with FPC embodiment one pressing after stamping-out structure for amplifying sketch map again.

Description of reference numerals:

1, lead, 2, the little blade unit of circuit, 3, little muscle, 4, location hole, 5, dielectric substrate, 6, lock shape groove, 7, interval trough, 8, led chip crystal bonding area territory, 9, isolation channel.

Embodiment

Ask for an interview Fig. 1 to Fig. 5, the utility model discloses a kind of LED and use FPC, wherein, include: by flexible metal base plate and dielectric substrate 5 that a continuous metal tape forms through stamping-out, said dielectric substrate 5 is pressed together on the bottom of flexible metal base plate; Said flexible metal base plate includes two leads 1 and insulate each other with 2, two leads in a plurality of circuit small pieces unit 1 and a plurality of circuit small pieces unit 2; Each circuit small pieces unit 2 is provided with led chip crystal bonding area territory.

The width dimensions of said dielectric substrate 5 is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate 5 is more than or equal to the length dimension of flexible metal base plate.

A plurality of circuit small pieces unit 2 adopts the rectangular array mode to arrange.

Said dielectric substrate 5 adopts and can crooked material process.

Said dielectric substrate 5 adopt can be anti-the material of high temperature during the LED Reflow Soldering process.

Embodiment one:

In the present embodiment, like Fig. 1,3, shown in 5, include multirow and multiple row circuit small pieces unit 2 arrays, be provided with the interval trough 7 of rectangle between every column line small pieces unit 2, the two ends of every column line small pieces unit 2 are provided with location hole 4; Each circuit small pieces unit 2 has included lock shape groove 6, and led chip crystal bonding area territory 8 is positioned at the space that lock shape groove 6 surrounds.

Embodiment two:

In the present embodiment,, include delegation's multiple row circuit small pieces unit 2 arrays, isolate through isolation channel 9 between the adjacent lines small pieces unit 2 like Fig. 2, shown in 4; The two ends of circuit small pieces unit 2 are provided with a plurality of location holes 4.

Above-mentioned LED wherein, comprises the steps: with the manufacturing approach of FPC

The first step: with a continuous preparatory stamping-out of metal tape warp; Formation has the flexible metal base plate of two leads and a plurality of circuit small pieces unit main body, and each circuit small pieces unit main body all at least respectively has a little muscle to link to each other with one of two leads and adjacent circuit small pieces unit main body;

Second step: with flexible metal base plate and a width dimensions more than or equal to the metal tape width dimensions, continuous dielectric substrate pressing;

The 3rd step: stamping-out once more, all little muscle that each circuit small pieces unit main body and one of two leads and adjacent circuit small pieces unit main body are linked to each other local or all stamping-outs fall, form two leads and the little blade unit of a plurality of circuit that insulate each other.

In the above-mentioned first step, continuous metal tape adopts the coiled strip form to get the raw materials ready, and the flexible metal base plate behind the stamping-out reticulates in advance, like accompanying drawing 1.

In above-mentioned second step, continuous dielectric substrate is that material is flexible, and a kind of continuous sheet coiled strip of the high temperature during ability LED Reflow Soldering.

After above-mentioned the 3rd step, form the series-parallel circuit that welding LED lamp pearl maybe can carry out the COF encapsulation, but constitute the FPC with led light source of a continuous cutting segmentation.

Among the embodiment one, be the needs of adaptation COF (Chip On The Flexible) encapsulation, dashing at each circuit small pieces has the required lock shape groove of LED encapsulation, so that combine more firm with packing colloid and FPC.

Above-mentioned listed concrete implementation is nonrestrictive, and to one skilled in the art, in not departing from the utility model scope, various improvement and the variation carried out all belong to the protection range of the utility model.

Claims

1.LED use FPC, it is characterized in that: include: by flexible metal base plate and dielectric substrate (5) that a continuous metal tape forms through stamping-out, said dielectric substrate (5) is pressed together on the bottom of flexible metal base plate; Said flexible metal base plate includes two leads (1) and the little blade unit of a plurality of circuit (2), and two leads (1) and the little blade unit of a plurality of circuit (2) insulate each other; The little blade unit of each circuit (2) is provided with led chip crystal bonding area territory.

2. LED as claimed in claim 1 uses FPC; It is characterized in that: the width dimensions of said dielectric substrate (5) is more than or equal to the width dimensions of flexible metal base plate, and the length dimension of dielectric substrate (5) is more than or equal to the length dimension of flexible metal base plate.

3. LED as claimed in claim 2 uses FPC, it is characterized in that: the little blade units of a plurality of said circuits (2) adopt the rectangular array mode to arrange.

4. use FPC like claim 1 or 2 or 3 described LED, it is characterized in that: said dielectric substrate (5) adopts and can crooked material process.

5. LED as claimed in claim 4 uses FPC, it is characterized in that: said dielectric substrate (5) adopt can be anti-the material of high temperature during the LED Reflow Soldering process.

6. LED as claimed in claim 5 uses FPC; It is characterized in that: include multirow and the little blade unit of multiple row circuit (2) array; Be provided with the interval trough (7) of rectangle between the little blade unit of every column line (2), the two ends of the little blade unit of every column line (2) are provided with location hole (4); The little blade unit of each circuit (2) has included lock shape groove (6), and led chip crystal bonding area territory (8) is positioned at the space that lock shape groove (6) surrounds.

7. LED as claimed in claim 5 uses FPC, it is characterized in that: include the little blade unit of delegation's multiple row circuit (2) array, isolate through isolation channel (9) between the little blade unit of adjacent lines (2); The two ends of the little blade unit of circuit (2) are provided with a plurality of location holes (4).