CN210351772U

CN210351772U - LED lamp area circuit board

Info

Publication number: CN210351772U
Application number: CN201921126443.XU
Authority: CN
Inventors: 张欣
Original assignee: Foshan Xinlu Electronic Technology Co Ltd
Current assignee: Jiangmen Yihengxin Electronic Technology Co ltd
Priority date: 2019-07-17
Filing date: 2019-07-17
Publication date: 2020-04-17
Anticipated expiration: 2029-07-17

Abstract

The utility model discloses a LED lamp area circuit board includes first insulation layer, first metal level, second insulation layer and second metal level from top to bottom, the first insulation layer is PET thin layer or polyimide thin layer or printing ink layer, the second insulation layer is PET thin layer or polyimide thin layer, the thickness of first metal level is 12 mu m ~ 18 mu m, the thickness of second metal level is 18 mu m ~ 35 mu m. The utility model discloses production efficiency is high, product environmental protection, low in production cost, has not only reduced the thickness of circuit board, has still improved the life of product.

Description

LED lamp area circuit board

Technical Field

The utility model relates to a circuit board field, concretely relates to LED lamp area circuit board.

Background

At present, the LED lamp strip is generally assembled on a banded FPC (flexible printed circuit) or an LED wire guide plate by adopting the LED. However, in the conventional etching ink flexible circuit board, the production process of the conventional etching ink flexible circuit board needs to be subjected to plate cutting, drilling, circuit exposure, green oil, etching, printing, electrical measurement and the like, the production process is complex, and the cost is high. The production process which needs electroplating, etching, acid washing, drilling and other environmental pollution is not environment-friendly, the production efficiency of splicing and cutting is extremely low, and the production is about 3 meters per minute.

The other process wire guide plate is similar to the traditional cable in the production process, although the processes such as electroplating, etching, pickling, drilling and the like are not needed, the flat copper strip needs to be pressed and then the punch press is used for producing, the production process is high in cost and poor in precision, the productivity is extremely low (0.8 meter per minute of a hardware punching die), the process is unstable, the copper wire is easy to deviate, a bottom plate is bridged after the punch presses punch out the circuit, the insulativity is poor, and the breakdown is easy to cause and the conductive risk exists when the voltage of the circuit is high. In view of the above problems, the chinese utility model patent with the publication number CN104953011B discloses a substrate with a metal layer and a manufacturing method thereof, which realizes continuous roll-like production through a multilayer film substrate and a metal layer, and has the advantages of greatly optimized process, cost saving, stable production process, and greatly improved product cost performance, but the multilayer film substrate and the metal layer need to be connected by adhesive bonding, and has high requirements on film substrate cost and adhesive stability. Therefore, there is a need for improvements in the prior art to avoid the disadvantages of the prior art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the shortcoming and not enough among the prior art, provide a can reduction in production cost, improve product stability's LED lamp area circuit board.

The utility model discloses a realize through following technical scheme:

the utility model provides a LED lamp area circuit board, includes first insulating layer, first metal level, second insulating layer and second metal level from top to bottom, first insulating layer is PET thin layer or polyimide film layer or printing ink layer, the second insulating layer is PET thin layer or polyimide film layer, the thickness of first metal level is 12 mu m ~ 18 mu m, the thickness of second metal level is 18 mu m ~ 35 mu m.

Further, a protective film is adhered to the lower surface of the second metal layer.

Further, a third insulating layer is arranged below the second metal layer, and the third insulating layer is an ink layer.

Furthermore, the first insulating layer is connected with the first metal layer in an adhesive mode through adhesive, and the second insulating layer is connected with the first metal layer and the second metal layer in an adhesive mode through adhesive respectively.

Furthermore, the first insulating layer is provided with a plurality of groups of through holes.

Further, the thickness of the second metal layer is 25 μm.

Further, the thickness of the ink layer is 1-10 μm.

Further, the thickness of the first metal layer is 12 μm, and the thickness of the second metal layer is 18 μm.

Further, the thickness of the first metal layer is 18 μm, and the thickness of the second metal layer is 35 μm.

Compared with the prior art, the utility model discloses a reduce the insulating layer of circuit board bottom surface, not only reduce the material of bottom surface insulating layer, do not influence the normal use of circuit board moreover, reduced manufacturing cost, prevent that the circuit board bottom from droing.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is the structure schematic diagram of the circuit board of the LED lamp strip of the present invention.

In the figure: 1-a first insulating layer; 2-a first metal layer; 3-a second insulating layer; 4-a second metal layer; 5-third insulating layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 the utility model discloses a LED lamp area circuit board, from top to bottom including first insulation layer 1, first metal level 2, second insulation layer 3 and second metal level 4, first insulation layer 1 is PET thin layer or polyimide thin layer or printing ink layer, and second insulation layer 3 is PET thin layer or polyimide thin layer, and the thickness of first metal level 2 is 12 mu m ~ 18 mu m, and the thickness of second metal level 4 is 18 mu m ~ 35 mu m. When the lamp belt circuit board is used, if the lamp belt circuit board is a high-pressure plate, the lamp belt circuit board can be wrapped in PVC or silica gel, and the lamp belt circuit board has an insulation effect; if the low pressure plate is used, the heat dissipation adhesive tape is attached to the lowest layer, and the insulation effect is also achieved. Therefore, the bottom surface of the lamp belt circuit board is not provided with an insulating layer, and the normal use is not influenced.

In order to prevent the lamp strip circuit board from being scratched, a protective film is adhered to the lower surface of the second metal layer 4. When the lamp belt circuit board is used, the protective film is directly torn off, and then the lamp belt circuit board can be installed.

A third insulating layer 5 is further arranged below the second metal layer 4, and the third insulating layer 5 is an ink layer. Through adopting the printing ink layer to realize insulating effect to third insulating layer 5, avoid need through viscose bonding connection between third insulating layer 5 and the second metal level 4, reduction in production cost, the printing ink layer makes the structure more stable, prevents that third insulating layer 5 from droing. The ink layer is simple and convenient to process, low in cost and more stable in layer structure, and the use stability of the product is improved.

The first insulating layer 1 is adhesively connected to the first metal layer 2 by means of glue, and the second insulating layer 3 is adhesively connected to the first metal layer 2 and the second metal layer 4 by means of glue, respectively.

The first insulating layer 1 is provided with a plurality of groups of through holes. The through holes are pad hole sites, and light emitting parts are convenient to mount.

The thickness of the second metal layer 4 is 25 μm.

The thickness of the ink layer is 1-10 μm.

In one embodiment, the thickness of the first metal layer 2 may be 12 μm and the thickness of the second metal layer 4 may be 18 μm.

As another embodiment, the thickness of the first metal layer 2 may be 18 μm and the thickness of the second metal layer 4 may be 35 μm.

Of course, the thicknesses of the first metal layer 2 and the second metal layer 4 may be adjusted as required.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a LED lamp area circuit board which characterized in that: the PET/polyimide composite film comprises a first insulating layer, a first metal layer, a second insulating layer and a second metal layer from top to bottom, wherein the first insulating layer is a PET (polyethylene terephthalate) film layer or a polyimide film layer or an ink layer, the second insulating layer is a PET film layer or a polyimide film layer, the thickness of the first metal layer is 12-18 mu m, and the thickness of the second metal layer is 18-35 mu m.

2. A LED strip wiring board according to claim 1, wherein: and a protective film is adhered to the lower surface of the second metal layer.

3. A LED strip wiring board according to claim 1, wherein: and a third insulating layer is arranged below the second metal layer and is an ink layer.

4. A LED strip wiring board according to claim 1, wherein: the first insulating layer is connected with the first metal layer in an adhesive mode through adhesive, and the second insulating layer is connected with the first metal layer and the second metal layer in an adhesive mode through adhesive.

5. A LED strip wiring board according to claim 1, wherein: the first insulating layer is provided with a plurality of groups of through holes.

6. A LED strip wiring board according to claim 1, wherein: the thickness of the second metal layer is 25 μm.

7. A LED strip wiring board according to claim 1, wherein: the thickness of the ink layer is 1-10 mu m.

8. A LED strip wiring board according to claim 1, wherein: the thickness of the first metal layer is 12 μm, and the thickness of the second metal layer is 18 μm.

9. A LED strip wiring board according to claim 1, wherein: the thickness of the first metal layer is 18 μm, and the thickness of the second metal layer is 35 μm.