CN215735021U

CN215735021U - Non-conductor flexible circuit board adopting single-side back-adhesive PI copper-clad plate back line

Info

Publication number: CN215735021U
Application number: CN202122211329.0U
Authority: CN
Inventors: 宋克政
Original assignee: Jiangmen Jiayan Electronic Technology Co ltd
Current assignee: Jiangmen Jiayan Electronic Technology Co ltd
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2022-02-01
Anticipated expiration: 2031-09-14

Abstract

The utility model discloses a wire-free flexible circuit board adopting a single-side back-adhesive PI copper-clad plate back line, which is made of a back-adhesive PI copper-clad plate through a back copper wire, wherein the back-adhesive PI copper-clad plate comprises a copper foil layer, an adhesive layer, a PI film layer and a back adhesive layer, the back adhesive layer comprises a pure adhesive film layer and a release film layer, the wire-free flexible circuit board comprises an upper insulating layer, a copper foil layer, an adhesive layer, a PI film layer, a pure adhesive film layer, a copper wire layer and a lower insulating layer which are sequentially arranged from top to bottom, the adhesive layer is an epoxy resin adhesive layer, and the pure adhesive film layer is an acrylic resin adhesive layer. The copper foil layer can be processed by etching, the copper conductor layer can be processed by circular knife die cutting, the production process is simple in the whole processing process, the production efficiency is high, meanwhile, the PI base material is good in high and low temperature resistance, good in electrical insulation and good in cohesiveness, and the stability of the circuit board is improved.

Description

Non-conductor flexible circuit board adopting single-side back-adhesive PI copper-clad plate back line

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a leadless flexible circuit board adopting a single-sided back-adhesive PI copper-clad plate back line.

Background

At present, the LED lamp strip is generally assembled on a banded FPC (flexible printed circuit) or an LED wire guide plate by adopting an LED lamp bead. However, in the conventional etching ink flexible circuit board, the production process is carried out by cutting, drilling, circuit, exposure, green oil, etching, lettering, electrical measurement and the like, the production process is complex and high in cost, continuous roll production is realized by the multilayer film substrate and the metal layer in the production process, the process is greatly optimized, the cost is saved, the production process is stable, and the cost performance of the product is greatly improved. Therefore, there is a need for improvements in the prior art to avoid the disadvantages of the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects in the prior art and provide a leadless flexible circuit board which is simple in structure and high in production efficiency and adopts a single-sided adhesive PI copper-clad plate back line.

The utility model is realized by the following technical scheme:

the utility model provides an adopt no wire flexible line way board of single face gum PI copper-clad plate back line, no wire flexible line way board is made through the back of the body copper wire by back of the body gum PI copper-clad plate, back of the body gum PI copper-clad plate includes copper foil layer, glue film, PI thin layer and gum layer, the gum layer includes the pure glue rete and leaves the type rete, no wire flexible line way board is including last insulating layer, copper foil layer, glue film, PI thin layer, pure glue rete, copper wire layer and the lower insulating layer that from top to bottom sets gradually, the glue film is epoxy viscose layer, the pure glue rete is acrylic resin viscose layer.

Further, the upper insulating layer is an ink layer.

Further, the lower insulating layer is an ink layer.

Further, the copper conductor layer is manufactured by circular knife die cutting.

Further, the copper foil layer is made by etching.

Further, the thickness of the PI thin film layer is 25 μm.

Further, the thickness of the copper foil layer is 25 μm.

Compared with the prior art, the wire-free flexible circuit board is manufactured by the gum PI copper-clad plate through the gum PI conducting wire, the wire-free flexible circuit board comprises the upper insulating layer, the copper foil layer, the glue layer, the PI thin film layer, the pure glue film layer, the copper conducting wire layer and the lower insulating layer which are sequentially arranged from top to bottom, so that the wire-free flexible circuit board can be manufactured by the gum PI copper-clad plate through the procedures of plate cutting, drilling, circuit, exposure, green oil, etching, printing, electrical measurement and the like, and then is adhered to the copper conducting wire layer and the lower insulating layer through gum.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a leadless flexible circuit board adopting a single-sided adhesive PI copper-clad plate back line.

In the figure: 1-an upper insulating layer; 2-copper foil layer; 3-glue layer; 4-PI film layer; 5-pure glue film layer; 6-copper conductor layer; 7-lower insulating layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in figure 1, the utility model relates to a non-conductive flexible circuit board adopting a single-sided back-adhesive PI copper-clad plate back line, the non-conductive flexible circuit board is made of a back-adhesive PI copper-clad plate through a back copper wire, the back-adhesive PI copper-clad plate comprises a copper foil layer 2, an adhesive layer 3, a PI film layer 4 and a back adhesive layer, the back adhesive layer comprises a pure adhesive film layer 5 and a release film layer, the non-conductive flexible circuit board comprises an upper insulating layer 1, a copper foil layer 2, an adhesive layer 3, a PI film layer 4, a pure adhesive film layer 5, a copper wire layer 6 and a lower insulating layer 7 which are sequentially arranged from top to bottom, the adhesive layer 3 is an epoxy resin adhesive layer, and the pure adhesive film layer 5 is an acrylic resin adhesive layer. Through no wire flexible line way board by gum PI copper-clad plate through back of the body copper wire make, no wire flexible line way board is including the upper insulation layer 1 that from top to bottom sets gradually, copper foil layer 2, glue film 3, PI thin layer 4, pure glue rete 5, copper wire layer 6 and lower insulation layer 7, make no wire flexible line way board can be earlier by gum PI copper-clad plate through the cutting board, drilling, the circuit, the exposure, green oil, the etching, the printing, behind the process preparation such as electricity survey, rethread gum pastes with copper wire layer and lower insulation layer, copper wire layer accessible circular knife cross cutting processing, whole course of working production simple process, low in production cost, the resistant high low temperature nature of PI substrate is good simultaneously, electrical insulation is good, the cohesiveness is good, medium resistance is good, improve the stability of circuit board.

The upper insulating layer 1 is an ink layer which is generally solder resist white oil, so that the processing cost is saved.

The lower insulating layer 7 is an ink layer, and the back of the circuit board is directly covered with ink, so that the production process is simple, and the processing cost is saved.

In the specific implementation, the copper conductor layer 6 is manufactured by circular knife die cutting, and the processing technology is simpler.

In a specific embodiment, the copper foil layer 2 is made by etching.

In a specific embodiment, the thickness of the PI thin film layer 4 is 25 μm.

In a specific embodiment, the copper foil layer 2 has a thickness of 25 μm.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides an adopt no wire flexible line way board of single face gum PI copper-clad plate back line which characterized in that: the no wire flexible line way board is made through the back of the body copper wire by gum PI copper-clad plate, the gum PI copper-clad plate includes copper foil layer, glue film, PI thin layer and gum layer, the gum layer includes the pure glue rete and leaves the type rete, the no wire flexible line way board is including last insulating layer, copper foil layer, glue film, PI thin layer, pure glue rete, copper wire layer and the lower insulating layer that from top to bottom sets gradually, the glue film is epoxy viscose layer, the pure glue rete is acrylic resin viscose layer.

2. The leadless flexible circuit board adopting the single-sided adhesive-backed PI copper-clad plate back line according to claim 1, characterized in that: the upper insulating layer is an ink layer.

3. The leadless flexible circuit board adopting the single-sided adhesive-backed PI copper-clad plate back line according to claim 1, characterized in that: the lower insulating layer is an ink layer.

4. The leadless flexible circuit board adopting the single-sided adhesive-backed PI copper-clad plate back line according to claim 1, characterized in that: the copper conductor layer is manufactured by circular knife die cutting.

5. The leadless flexible circuit board adopting the single-sided adhesive-backed PI copper-clad plate back line according to claim 1, characterized in that: the copper foil layer is made by etching.

6. The leadless flexible circuit board adopting the single-sided adhesive-backed PI copper-clad plate back line according to claim 1, characterized in that: the thickness of the PI film layer is 25 mu m.

7. The leadless flexible circuit board adopting the single-sided adhesive-backed PI copper-clad plate back line according to claim 1, characterized in that: the thickness of the copper foil layer is 25 μm.