CN213662062U - Rigid-flex PCB structure and electronic product - Google Patents
Rigid-flex PCB structure and electronic product Download PDFInfo
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- CN213662062U CN213662062U CN202023022904.4U CN202023022904U CN213662062U CN 213662062 U CN213662062 U CN 213662062U CN 202023022904 U CN202023022904 U CN 202023022904U CN 213662062 U CN213662062 U CN 213662062U
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Abstract
The application relates to the field of electronic circuits, and relates to a rigid-flex PCB structure and an electronic product. The PCB structure comprises a flexible insulating substrate and a first conductive circuit, wherein the first conductive circuit is arranged on the flexible insulating substrate; the first conductive line is formed of single-layer large-domain single-crystal copper. The first rigid layer comprises a first rigid insulating substrate and a second conducting circuit, and the second conducting circuit is arranged on at least part of the area of the first rigid insulating substrate; the second conductive line is made of multilayer large-domain single crystal copper. The second conductive circuit formed by the multilayer large-domain single crystal copper is arranged in at least part of the area of the first rigid insulating substrate, so that most of current circulation paths flow in the multilayer large-domain single crystal copper on the first rigid insulating substrate, the resistance of the multilayer large-domain single crystal copper is low, the current obstruction caused by small domains and grain boundaries of the electrolytic copper foil is avoided, and the conductivity and comprehensive performance of the rigid flexible PCB and electronic products are greatly improved.
Description
Technical Field
The application relates to the field of electronic circuits, in particular to a rigid-flex PCB structure and an electronic product.
Background
With the development of electronic products towards high performance, light, thin, short and small, the designed circuit of the PCB is thinner and thinner, and the line width/line distance is developed from more than conventional 75/75um to 50/50um, 25/25m, 15/15um and 8/8 um; this also places increasing demands on its electrical conductivity properties.
The PCB can be divided into a rigid board and a flexible board according to different types of insulating base materials; the conventional flexible printed board has a multilayer structure composed of an insulating base material such as copper foil and PI, a cover layer, and the like. The traditional rigid board has a multilayer structure formed by copper foil, FR4 glass fiber and epoxy insulation base materials, solder resist ink layers and the like. The rigid-flex board combines the characteristics of the rigid circuit board and the flexible circuit board, improves the freedom degrees of circuit design, installation and the like, is convenient for three-dimensional board-level assembly with small volume, and is beneficial to the assembly reliability and the working stability of the whole system and the maintenance and management, thereby showing more and more extensive application prospect.
The copper foil is used as one of main materials of a rigid, flexible and flex-rigid circuit board, and the conductivity and the reliability of the copper foil are used as the most key performances of the whole circuit board.
However, in the field of multilayer flex-rigid circuit boards at present, the electric conductivity of circuits made of electrolytic copper foils of some multilayer flex-rigid circuit boards is low, and the development requirements of future circuit board technology are difficult to meet. Under the existing conditions, the yield of the superconducting single crystal copper foil is too low, the cost is higher, and large-scale popularization and application in the field of rigid-flex circuit boards cannot be realized.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of this application is to provide a just flexibilize PCB structure and electronic product, but it satisfies the higher electric conductivity of just flexibilize PCB board and resistant application demand of buckling with large-scale, large-area and low cost.
In a first aspect, the present application provides a rigid-flex PCB panel structure, comprising:
the flexible layer comprises a flexible insulating substrate and a first conductive circuit, and the first conductive circuit is arranged on the flexible insulating substrate; the first conductive line is formed by single-layer large-crystal-domain single crystal copper; and
a first rigid layer overlying and connected to the flexible layer; the first rigid layer comprises a first rigid insulating substrate and a second conducting circuit, and the second conducting circuit is arranged on at least part of the area of the first rigid insulating substrate; the second conductive line is made of multilayer large-domain single crystal copper.
The method comprises the steps that a first conductive circuit formed by single-layer large-domain single crystal copper is arranged on a flexible insulating substrate; and a second conductive circuit formed by multiple layers of large-domain single crystal copper is arranged in at least part of the area of the first rigid insulating substrate, so that most of current circulation paths flow in the multiple layers of large-domain single crystal copper on the first rigid insulating substrate, and the resistance of the multiple layers of large-domain single crystal copper is low, thereby avoiding the obstruction of small crystal domains and crystal boundaries to current, and greatly improving the conductivity of the rigid flexible PCB. And only at least partial area of the first rigid insulating substrate is provided with a second conductive circuit formed by multiple layers of large-crystal-domain single-crystal copper, so that the conductive performance of the circuit in the local area of the rigid-flex PCB structure can be improved in a targeted manner, and the cost is not too high. Meanwhile, the rigid-flex board structure is characterized in that a first conductive circuit is formed by single-layer large-domain single crystal copper on a flexible insulating substrate; the single-layer large-crystal-domain single crystal copper with low cost is adopted, and the thickness of the copper is small, so that the bending resistance and the reliability of the rigid-flex PCB structure can be effectively improved. Therefore, the rigid-flex PCB structure has the characteristics of low cost, ultrahigh conductivity and high bending resistance, and can be well applied to the fields of rigid-flex circuit boards and related electronic products in a large-area manner in a large-scale manner.
In other embodiments of the present application, the flexible insulating substrate has a first surface and an opposite second surface; the first surface and the second surface are both provided with first conductive circuits.
In other embodiments of the present application, the first rigid insulating substrate has a third surface and an opposite fourth surface, and the third surface is connected to the flexible insulating substrate;
the third surface is provided with an electrolytic copper foil; and a part of area of the fourth surface is provided with a second conductive circuit, and a part of area is provided with an electrolytic copper foil.
In other embodiments of the present application, a surface of the flexible insulating substrate, which is not connected to the first rigid insulating substrate, is an exposed area, and the exposed area is provided with a cover film.
In other embodiments of the present application, the rigid-flex PCB structure further includes a connection layer;
the tie layer is connected between the flexible layer and the first rigid layer.
In other embodiments of the present application, the rigid-flex PCB structure further comprises a second rigid layer;
the flexible layer is superposed and connected between the first rigid layer and the second rigid layer;
the second rigid layer comprises a second rigid insulating substrate;
and a third electrolytic copper foil is arranged on the surface of the second rigid insulating substrate.
In other embodiments of the present application, the multilayer large domain single crystal copper comprises 2 to 3 layers of single layer large domain single crystal copper; the thickness of the single-layer large-domain single crystal copper is in the range of 18-35 mu m.
In other embodiments of the present application, the line width of the line made of the multilayer large domain single crystal copper is in the range of 500 μm to 2 mm.
In other embodiments of the present application, the rigid-flex PCB structure is provided with a metal hole;
the metal hole penetrates through the flexible layer and the first rigid layer and is used for conducting the first conductive circuit and the second conductive circuit.
In a second aspect, the present application provides an electronic product comprising the rigid-flex PCB panel structure of any of the preceding claims.
This electronic product has greatly improved electric conductive property and resistant bending property through setting up foretell rigid-flex PCB plate structure 100, and the cost is lower.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a rigid-flex PCB structure according to an embodiment of the present disclosure;
fig. 2 is a partially enlarged view of a first rigid layer of a rigid-flex PCB structure provided in an embodiment of the present application;
fig. 3 is another schematic structural diagram of a rigid-flex PCB structure according to an embodiment of the present disclosure;
FIG. 4 is a schematic view of a process for preparing multilayer large-domain single-crystal copper according to an embodiment of the present disclosure.
Icon: 100-rigid-flex PCB structure; 110-a flexible layer; 111-a flexible insulating substrate; 1111-a first surface; 1112-a second surface; 1113-bare area; 1114-a cover film; 112-a first conductive line; 120-a first rigid layer; 121-a first rigid insulating substrate; 1213-third surface; 1214-a fourth surface; 122-second conductive traces; 1221-multilayer large domain single crystal copper; 130-metal vias; 140-a tie layer; 141-electrolytic copper foil; 150-a second rigid layer; 151-a second rigid insulating substrate; 160-solder resist ink layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present application, it should be understood that the indication of orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship which is usually placed when the product of the application is used, or the orientation or positional relationship which is conventionally understood by those skilled in the art, is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be interpreted as limiting the present application.
In the description of the embodiments of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The inventors have found that the copper foil used in the conventional PCB is an electrolytic copper foil or a rolled copper foil, and the crystal structure thereof is a polycrystalline structure, and there are many grain boundaries or small domains, which hinder the current when the current passes through, thereby reducing the conductivity of the PCB. There are related patent reports that a large-area single crystal copper foil or a multilayer single crystal copper foil laminate is obtained by conditions such as 'high temperature annealing'; the copper foil has excellent conductivity due to no crystal boundary, and can realize excellent performance of the conductivity being more than or equal to 105% IACS; however, to realize a continuous industrial-grade 250mm wide superconducting copper foil coil, the manufacturing difficulty is very high, especially for the field of multilayer rigid-flex circuit boards, the product yield is too low and the cost is high by applying the existing superconducting single crystal copper foil, and large-scale popularization and application in the rigid-flex circuit boards cannot be realized.
Referring to fig. 1 to 3, an embodiment of the present application provides a rigid-flex PCB structure 100, including: a flexible layer 110 and a first rigid layer 120.
Further, the flexible layer 110 includes a flexible insulating substrate 111 and a first conductive trace 112, the first conductive trace 112 is disposed on the flexible insulating substrate 111; the first conductive traces 112 are formed of single-layer large-domain single crystal copper.
Further, a first rigid layer 120 is stacked and connected to the flexible layer 110. The first rigid layer 120 includes a first rigid insulating substrate 121 and a second conductive trace 122, the second conductive trace 122 being disposed on the first rigid insulating substrate 121; at least a portion of the second conductive traces 122 are formed from multiple layers of large domain single crystal copper 1221.
A first conductive line 112 made of single-layer large-domain single crystal copper is provided on a flexible insulating substrate 111; the second conductive traces 122 formed by multiple layers of large-domain single crystal copper are arranged on at least part of the first rigid insulating substrate 121, so that most of current circulation paths flow in the multiple layers of large-domain single crystal copper 1221 on the first rigid insulating substrate 121 (referring to fig. 2, the current transmission paths are along the arrow direction in fig. 2), the blocking effect of small crystal domains and grain boundaries of electrolytic copper on current is avoided, and the conductivity and the comprehensive performance of the rigid flexible PCB and the electronic product are greatly improved.
Further, according to the rigid-flex PCB structure 100 of the present application, the second conductive traces 122 formed by the multiple layers of large-domain single crystal copper are only disposed in at least a partial region of the first rigid insulating substrate 121, so that the conductive performance of the local region trace of the rigid-flex PCB structure 100 can be purposefully improved, and the cost is not too high. Meanwhile, in the rigid-flex PCB structure 100 of the present application, a first conductive trace 112 formed by single-layer large-domain single crystal copper is disposed on the flexible insulating substrate 111; the single-layer large-domain single crystal copper with low cost is adopted, the overall cost is low, the thickness of the single-layer large-domain single crystal copper is small, and the bending resistance and the reliability of the rigid-flex PCB structure 100 can be effectively improved. Therefore, the flex-rigid PCB structure 100 of the present application has the characteristics of low cost, ultrahigh conductivity, and high bending resistance, and can be applied to the flex-rigid PCB field in a large scale.
The large-domain single crystal copper can be obtained commercially or can be prepared by a preparation method provided in a patent (application No. 201610098623.6, application date 2016.02.23, grant No. CN 105603514B, grant date 2017.12.01, etc.) previously published by the applicant.
Further, referring to fig. 2, the multilayer large domain single crystal copper includes 2 to 3 layers of single layer large domain single crystal copper. In fig. 2, the number of layers L is 3, that is, the multilayer large domain single crystal copper includes 3 layers of single layer large domain single crystal copper.
Furthermore, the total thickness of the multilayer large-domain single crystal copper is more than or equal to 75 mu m. Further optionally, the total thickness of the multilayer large-domain single crystal copper is between 75 and 105 μm. Illustratively, the total thickness of the multilayer large domain single crystal copper is 80 μm, 90 μm, or 100 μm.
Further, referring to FIG. 2, the line width D of the multilayer large domain single crystal copper is 500 μm or more. Further optionally, the line width of the multilayer large-domain single crystal copper is in the range of 500 μm to 2 mm.
Further optionally, the line width of the multilayer large-domain single crystal copper is 500-900 μm.
Further optionally, the line width of the multilayer large-domain single crystal copper is 550-850 mu m.
Illustratively, the line width of the multilayer large domain single crystal copper is 550 μm, 600 μm, 650 μm, 700 μm, or 750 μm.
Further, the thickness of the single-layer large-domain single crystal copper is in the range of 18 μm to 35 μm.
Further optionally, the thickness of the single layer large domain single crystal copper is in the range of 19 μm to 34 μm. Further optionally, the thickness of the single layer large domain single crystal copper is in the range of 20 μm to 33 μm. Illustratively, the thickness of the single layer large domain single crystal copper is 20 μm, 25 μm, 30 μm, or 32 μm.
Further, 1-5 crystal domains or crystal boundaries exist per square centimeter of single-layer large-domain single crystal copper. Further optionally, the single layer of large domain single crystal copper has 2-4 domains or grain boundaries per square centimeter. Illustratively, a single layer of large domain single crystal copper has 2, 3, or 4 domains or grain boundaries per square centimeter.
Further, the size of the crystal domain is in the range of 200 μm to 10 mm. Further optionally, the size of the domains is in the range of 250 μm to 9 mm. Illustratively, the size of the domains is 300 μm, 500 μm, 1mm or 3mm or 5 mm.
Further, the crystal lattice of each domain is oriented to one of single-crystal copper Cu (111), Cu (110), Cu (211), Cu (100), or Cu (222).
Referring to fig. 4, in some embodiments, the large domain single crystal copper may be prepared by the following method:
s1, counting the number of conventional polycrystalline boundaries (the number of the grain boundaries is more than 10000/cm)2) Putting the rolled copper foil into annealing equipment, and introducing N2And an inert gas atmosphere such as Ar or He.
S2, when the annealing temperature of the copper foil is reached, introducing H2Or a reducing gas such as CO, to start the annealing process.
And S3, after the annealing is finished, continuously introducing inert gas and cooling to room temperature to obtain the single-layer large-crystal-domain single crystal copper.
S4, carrying out XRD ray analysis and detection on the single-layer large-crystal-domain single crystal copper, determining a specific single crystal face orientation and peak intensity product, and determining the number of copper crystal boundaries in unit area as a specific number.
In some embodiments of the present application, 2 to 3 layers of the single-layer large-domain single crystal copper prepared in step S4 are rolled and pressed at normal temperature to synthesize a multilayer large-domain single crystal copper; or directly annealing at high temperature and rolling to form multilayer large-domain single crystal copper, wherein the annealing temperature is 800-1000 ℃, and the roller pressure is 400-2000Kg/cm2And reducing the thickness by 5-20% after rolling to finally obtain the multilayer large-domain single crystal copper.
In some embodiments of the present application, according to actual needs, the second conductive traces 122 made of multiple layers of large domain single crystal copper may be disposed on a local area of the first rigid insulating substrate 121; the second conductive traces 122 made of a plurality of layers of large domain single crystal copper may be provided on the entire area of the first rigid insulating substrate 121.
Further, referring to fig. 1, in some embodiments of the present application, the flexible insulating substrate 111 has a first surface 1111 and an opposite second surface 1112; the first surface 1111 and the second surface 1112 are each provided with a first conductive trace 112.
Further alternatively, the flexible insulating substrate 111 is made of a flexible insulating material such as polyimide.
Further, in some embodiments of the present application, the first rigid insulating substrate 121 has a third surface 1213 and an opposite fourth surface 1214, and the third surface 1213 is connected to the flexible insulating substrate 111.
Further alternatively, the first rigid insulating substrate 121 is made of glass fiber or the like.
Further, the third surface 1213 is provided with an electrolytic copper foil 141; the second conductive traces 122 are disposed on a partial area of the fourth surface 1214, and the electrolytic copper foil 141 is disposed on a partial area.
Further, the surface of the flexible insulating substrate 111 not connected to the first rigid insulating substrate 121 is an exposed area 1113, and the exposed area 1113 is provided with a cover film 1114. Optionally, the cover film 1114 layer includes a glue layer and a polyimide layer (PI).
Further, the rigid-flex PCB structure 100 further includes a connection layer 140; the tie layer 140 is connected between the flexible layer 110 and the first rigid layer 120.
Optionally, the connection layer 140 is made of a non-flowing polypropylene (PP) material.
Further, the rigid-flex PCB structure 100 is provided with a metal hole 130. The metal hole 130 penetrates through the flexible layer 110 and the first rigid layer 120, and is used for conducting the first conductive trace 112 and the second conductive trace 122. Optionally, the metal vias 130 are made of electroplated copper.
Further, a solder resist ink layer 160 is disposed on the upper surface of the rigid-flex PCB structure 100; the lower surface is provided with a cover film 1114.
Referring to fig. 1, in the illustrated embodiment, a solder resist ink layer 160 is disposed on an outer surface of the second conductive trace 122. The cover film 1114 is disposed on an outer surface of the first conductive traces 112.
In some embodiments, referring to fig. 3, the rigid-flex PCB structure 100 further comprises a second rigid layer 150; the flexible layer 110 is stacked and connected between the first rigid layer 120 and the second rigid layer 150.
Further, the second rigid layer 150 includes a second rigid insulating substrate 151; the surface of the second rigid insulating substrate 151 is provided with an electrolytic copper foil 141.
In the illustrated embodiment, the electrolytic copper foils 141 are provided on both the upper and lower surfaces of the second rigid insulating substrate 151. In this embodiment, the metal via 130 penetrates the flexible layer 110, the first rigid layer 120, and the second rigid layer 150, and is used to electrically connect the first conductive trace 112, the second conductive trace 122, and the electrolytic copper foil 141 provided on the surface of the second rigid insulating substrate 151.
Further, a solder resist ink layer 160 is provided on the outer surface of the electrolytic copper foil 141 provided on the surface of the second rigid insulating substrate 151.
In some alternative embodiments, the flex-rigid PCB panel structure 100 described above is made by laminating the aforementioned layers together.
In some alternative embodiments, the rigid-flex PCB panel structure 100 described above is further subjected to conventional processes including, but not limited to: pretreatment, exposure, etching of wiring, lamination, and the like.
Some embodiments of the present application further provide an electronic product including the rigid-flex PCB structure 100 provided in any of the foregoing embodiments. This electronic product has greatly improved electric conductive property and anti buckling performance through setting up foretell rigid-flex PCB plate structure 100, and the cost is lower.
The performance parameters of the single-layer large-domain single crystal copper and the multilayer large-domain single crystal copper prepared by the steps S1 to S4 of the present application are examined below. The performance parameters of the conventional rolled copper foil were examined.
Specific performance parameters are reported in table 1. Examples 1 to 4 are single-layer large-domain single crystal copper and multi-layer large-domain single crystal copper prepared in the foregoing steps S1 to S4; comparative examples 1 to 2 are conventional rolled copper foils.
The performance parameters of the copper materials in the examples and comparative examples were measured as follows.
(1) Detecting the number of crystal boundaries: and observing by a metallographic microscope, and randomly taking the number of the grain boundaries within the range of 10 x 10 mm.
(2) Detection of the diameter of the large domain: and (5) observing by a metallographic microscope, randomly calculating the maximum distance between the grain boundary and the grain boundary of a single crystal domain within the range of 10 x 10mm, and counting the average value.
(3) Conductivity: detection is carried out according to the standard GB-T351.
(4) And (3) detecting the purity and the oxygen content of copper: detection is carried out according to the standard GB/T5121.
(5) The bending performance of the copper foil is as follows: according to the industrial standard CPCA/JPCA-BM03-2005, different copper samples are taken and laminated and etched with 25+25um glue-containing PI films to form 1/1mm bent lines, and an MIT tester is used for testing the bending performance;
TABLE 1 comparison of copper foil Properties
According to table 1, compared with the polycrystalline rolled copper foil with the number of polycrystalline boundaries in the comparative example, the single-layer and multi-layer large-domain single crystal copper provided by the embodiment of the application has the advantages that the conductivity performance and the bending resistance better meet the requirements of a rigid-flex board, and the single-layer and multi-layer large-domain single crystal copper can be better applied to the industry of printed circuit boards in a low-cost and large-scale mode.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A rigid-flex PCB structure, comprising:
the flexible layer comprises a flexible insulating substrate and a first conductive circuit, wherein the first conductive circuit is arranged on the flexible insulating substrate; the first conductive line is formed by single-layer large-crystal-domain single crystal copper; and
a first rigid layer overlying and connected to the flexible layer; the first rigid layer comprises a first rigid insulating substrate and a second conducting circuit, and the second conducting circuit is arranged on the first rigid insulating substrate; at least part of the second conductive lines are made of multilayer large-domain single crystal copper.
2. A rigid-flex PCB board structure according to claim 1,
the flexible insulating substrate has a first surface and an opposite second surface; the first surface and the second surface are both provided with the first conductive circuit.
3. A rigid-flex PCB board structure according to claim 1,
the first rigid insulating substrate has a third surface and an opposing fourth surface;
the third surface is provided with an electrolytic copper foil and is connected with the flexible insulating substrate;
the multilayer large-domain single crystal copper is arranged in a partial area of the fourth surface, and the electrolytic copper foil is arranged in a partial area.
4. A rigid-flex PCB board structure according to claim 1,
the surface of the flexible insulating substrate, which is not connected with the first rigid insulating substrate, is an exposed area, and the exposed area is provided with a covering film.
5. The flex-rigid PCB panel structure of claim 1, wherein the flex-rigid PCB panel structure further comprises a connecting layer;
the tie layer is connected between the flexible layer and the first rigid layer.
6. A rigid-flex PCB board structure according to claim 1,
the rigid-flex PCB structure also comprises a second rigid layer;
the flexible layer is stacked and connected between the first rigid layer and the second rigid layer;
the second rigid layer comprises a second rigid insulating substrate;
and an electrolytic copper foil is arranged on the surface of the second rigid insulating substrate.
7. The rigid-flex PCB structure of any one of claims 1-6, wherein the multilayer large domain single crystal copper comprises 2-3 layers of the single layer large domain single crystal copper; the thickness of the single-layer large-domain single crystal copper is in the range of 18-35 mu m.
8. A rigid-flex PCB structure according to any of claims 1-6,
the line width of the multilayer large-domain single crystal copper is in the range of 500 mu m-2 mm.
9. A rigid-flex PCB structure according to any of claims 1-6,
the rigid-flex PCB structure is provided with metal holes;
the metal hole penetrates through the flexible layer and the first rigid layer and is used for conducting the first conductive circuit and the second conductive circuit.
10. An electronic product comprising the rigid-flex PCB structure of any one of claims 1 to 9.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115595658A (en) * | 2022-10-27 | 2023-01-13 | 松山湖材料实验室（Cn） | Low-transmission-loss single crystal copper material and preparation method thereof, PCB (printed circuit board) and preparation method thereof, and electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115595658A (en) * | 2022-10-27 | 2023-01-13 | 松山湖材料实验室（Cn） | Low-transmission-loss single crystal copper material and preparation method thereof, PCB (printed circuit board) and preparation method thereof, and electronic component |
| WO2024087282A1 (en) * | 2022-10-27 | 2024-05-02 | 松山湖材料实验室 | Low-transmission-loss single-crystal copper material and preparation method therefor, pcb and preparation method therefor, and electronic component |
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