CN1329186C - Method for preparing flexible copper-cladded plate - Google Patents
Method for preparing flexible copper-cladded plate Download PDFInfo
- Publication number
- CN1329186C CN1329186C CNB2004100240980A CN200410024098A CN1329186C CN 1329186 C CN1329186 C CN 1329186C CN B2004100240980 A CNB2004100240980 A CN B2004100240980A CN 200410024098 A CN200410024098 A CN 200410024098A CN 1329186 C CN1329186 C CN 1329186C
- Authority
- CN
- China
- Prior art keywords
- copper
- present
- nickel
- square
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 229920001721 polyimide Polymers 0.000 claims abstract description 12
- 239000004743 Polypropylene Substances 0.000 claims abstract description 11
- -1 polypropylene Polymers 0.000 claims abstract description 11
- 229920001155 polypropylene Polymers 0.000 claims abstract description 11
- 229920006267 polyester film Polymers 0.000 claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims abstract description 9
- 239000010931 gold Substances 0.000 claims abstract description 9
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 3
- 239000011159 matrix material Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000009713 electroplating Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a preparation method for flexible copper clad sheets. The present invention comprises that metal of copper, nickel, gold, silver, etc. is coated on the substrates of a polyimide film, a polyester film and a polypropylene film in vacuum as conductors; then, a layer coated with copper or other metal is continuously compounded. Compared with the prior art, the present invention has the advantages of uniform thickness, no need of smearing adhesives on base material, no air bubble generation at a combining site, stable performance, serialization production, quality guarantee, high productive efficiency, no pollution and low production cost; compared with the existing copper clad sheets, the weight is lighter, the conductive layer is thinner, the flexibility is better, the present invention is more suitable for the requirements of the development of the modern electronic technology, and the present invention is suitable for material of reelability circuit boards needed by mobile phones, POP-TV, LCD-TV, etc.
Description
(1) technical field:
The present invention relates to a kind of preparation method, belong to vacuum plating, electroplating technology field around the property copper-clad plate.
(2) technical background:
Along with the fast development of electronic information technology and the raising of living standards of the people, household electrical appliance, mobile phone, computer, Medical Devices, military applications and instrument etc. are more and more higher to the requirement of printed substrate material, because the requirement to electronic instrument is more and more accurate, the thicker printed substrate of multilayer originally is the needs of the current electronic product of incompatibility, Japan adopts Copper Foil coating polyimide film at present, because the product surface outward appearance is relatively poor, film is thicker, peel strength is higher between metal and the substrate, can only do single side printed wiring board.
(3) summary of the invention:
At the defective of prior art, the invention provides that a kind of good conductivity, conductive layer are frivolous, peel strength is fit to be the preparation method around the property copper-clad plate around the property wiring board.
A kind of preparation method around the property copper-clad plate is included in vacuum copper facing on polyimide film, polyester film or the polypropylene screen matrix, nickel, gold or silver metal and does conductor, one or more of silver-plated continuously again, copper, gold, nickel metal.
Preparation method around the property copper-clad plate of the present invention, concrete technical scheme is as follows:
1, matrix: polyimides film thickness 0.009mm～1mm, width 110mm; Polyester film thickness 0.005mm～1mm, width 110mm; Polypropylene screen 0.005mm～1mm, width 110mm;
2, with above-mentioned polyimide film, polyester film or polypropylene screen vacuum magnetic-control sputtering copper facing, nickel, gold or silver etc. under argon shield, temperature≤230 ℃, vacuum is 3 * 10
-1Pa～9 * 10
-4Pa, the matrix translational speed is 0.5m/ minute～4m/ minute; Metal ion sputter concentration 0.2g/m
2～3g/m
2This moment, the sheet resistance of material was R=0.5 Ω/square～1K Ω/square;
3, adopt existing plastic electroplating technical matters on the above-mentioned conducting base, plate 1～3 kind of metal level continuously, institute's plating is copper, nickel, gold, silver etc., and order is not limit; This moment, the sheet resistance of material was R=0.001 Ω/square～0.1 Ω/square.
With above-mentioned material flushing, oven dry, clot.
Compared with the prior art the present invention has the following advantages: 1. compare with existing copper-clad plate have in light weight, conductive layer can be thinner, flexibility can be better, adapts to the development need of modern electronic technology more.Be suitable for mobile phone, required materials such as POPTV, LCD-TV around the property wiring board.2. thickness is even, must not smear adhesive on base material, and bonded block does not produce bubble, and performance is more stable.3. the present invention is serialization production, and quality is guaranteed, the production efficiency height.4. pollution-free, production cost is low.
(4) specific embodiment:
Embodiment 1, polyimide film copper facing, method is as follows:
(1) matrix: polyimide film, thickness 0.025mm;
(2) vacuum copper facing: with polyimide film sputter copper facing in vacuum chamber, 116 ℃ of temperature, vacuum 2.5 * 10
-3Pa, polyimide film translational speed 1.2m/min, metal ion sputter concentration 1.5g/m
2, at this moment, material has sheet resistance 500 Ω/square～600 Ω/square;
(3) adopt existing plastic electroplating technology copperizing continuously on above-mentioned material then, so that sheet resistance reaches specification requirement;
Above-mentioned material flushing, oven dry, clot.
Embodiment 2, polyester film nickel plating add silver, and method is as follows:
(1) matrix: PETG film (PET), thickness 0.018mm;
(2) vacuum nickel plating: with polyester film sputter nickel plating in vacuum chamber, 160 ℃ of temperature, vacuum 2.5 * 10
-3Pa, polyester film translational speed 2m/min, sheet resistance 40 Ω/square～50 Ω/square;
(3) adopt existing plastic electroplating technology silver-plated continuously on above-mentioned material then, so that sheet resistance reaches specification requirement.
Embodiment 3, polypropylene screen nickel plating add copper, and method is as follows:
(1) matrix: polypropylene screen, thickness 0.02mm;
(2) vacuum nickel plating: with polypropylene screen sputter nickel plating in vacuum chamber, 165 ℃ of temperature, vacuum 2.5 * 10
-3Pa, polypropylene screen translational speed 2m/min, sheet resistance 40 Ω/square～50 Ω/square;
(3) adopt existing plastic electroplating technology copperizing continuously on above-mentioned material then, so that sheet resistance reaches specification requirement.The sheet resistance of material is R=0.001 Ω/square～0.1 Ω/square.
With above-mentioned material flushing, oven dry, clot.
Claims (1)
1, a kind of preparation method around the property copper-clad plate is characterized in that vacuum copper facing on polyimide film, polyester film or polypropylene screen matrix, nickel, gold, silver metal do conductor, continuous more compound copper facing, nickel, gold, silver metal level, and concrete grammar is as follows:
(1) matrix: polyimides film thickness 0.009mm～1mm, width 110mm; Polyester film thickness 0.005mm～1mm, width 110mm; Polypropylene screen 0.005mm～1mm, width 110mm.
(2) with above-mentioned polyimide film, polyester film or polypropylene screen vacuum magnetic-control sputtering copper facing, nickel, gold or silver etc. under argon shield, temperature≤230 ℃, vacuum is 3 * 10
-1Pa～9 * 10
-4Pa, the matrix translational speed is 0.5m/ minute～4m/ minute; Metal ion sputter concentration 0.2g/m
2～3g/m
2, this moment, the sheet resistance of material was R=0.5 Ω/square～1K Ω/square;
(3) above-mentioned conducting base plates 1～3 kind of metal level continuously, and institute's plating is copper, nickel, gold, silver, and order is not limit, and this moment, the sheet resistance of material was R=0.001 Ω/square～0.1 Ω/square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100240980A CN1329186C (en) | 2004-05-20 | 2004-05-20 | Method for preparing flexible copper-cladded plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100240980A CN1329186C (en) | 2004-05-20 | 2004-05-20 | Method for preparing flexible copper-cladded plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1579754A CN1579754A (en) | 2005-02-16 |
| CN1329186C true CN1329186C (en) | 2007-08-01 |
Family
ID=34581963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100240980A Expired - Lifetime CN1329186C (en) | 2004-05-20 | 2004-05-20 | Method for preparing flexible copper-cladded plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1329186C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668094A (en) * | 2013-12-05 | 2014-03-26 | 江苏科技大学 | Method for making five-layer flexible non-glued double-sided copper clad by adopting sputtering process |
| CN104476847B (en) * | 2014-12-02 | 2017-05-17 | 广州方邦电子股份有限公司 | Flexible copper-clad plate having high peel strength and manufacture method thereof |
| CN109518131A (en) * | 2018-12-25 | 2019-03-26 | 胡旭日 | A kind of ultrathin copper foil with carrier, ultrathin copper foil production method and device |
| CN113386416B (en) * | 2021-07-08 | 2022-12-16 | 江西柔顺科技有限公司 | Heat-conducting double-sided copper-clad plate and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130192A (en) * | 1989-11-17 | 1992-07-14 | Ube Industries, Ltd. | Process for preparing metallized polyimide film |
-
2004
- 2004-05-20 CN CNB2004100240980A patent/CN1329186C/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130192A (en) * | 1989-11-17 | 1992-07-14 | Ube Industries, Ltd. | Process for preparing metallized polyimide film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1579754A (en) | 2005-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Yuxing Road Flyover District of Ji'nan city in Shandong province 250119 New Material Industrial Park No. 517 Patentee after: TIANNUO PHOTOELECTRIC MATERIAL Co.,Ltd. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong province 250101 Hospital No. 1251 Building No. 3 room 103 Patentee before: Shandong Tiannuo Photoelectric Material Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20070801 |