CN212786015U - High heat conduction heat dissipation type single face structure flexible circuit board - Google Patents
High heat conduction heat dissipation type single face structure flexible circuit board Download PDFInfo
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- CN212786015U CN212786015U CN202021665577.1U CN202021665577U CN212786015U CN 212786015 U CN212786015 U CN 212786015U CN 202021665577 U CN202021665577 U CN 202021665577U CN 212786015 U CN212786015 U CN 212786015U
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Abstract
The utility model provides a high heat conduction heat dissipation type single face structure flexible circuit board, include: the heat dissipation substrate, heat dissipation substrate top coating has ultra-thin heat conduction insulating glue layer, ultra-thin no glue copper clad substrate is pasted to ultra-thin heat conduction insulating glue layer top, the cover has the tectorial membrane in ultra-thin no glue copper clad substrate top subsides, and wherein ultra-thin no glue copper clad substrate includes ultra-thin copper substrate, ultra-thin copper substrate surface evenly is provided with the copper foil arch of independent distribution, and the tectorial membrane includes thermosetting glue and polyimide film layer, and wherein thermosetting glue evenly pastes and covers on ultra-thin copper substrate surface and with each copper foil of independent distribution, and the polyimide film layer is pasted at the thermosetting glue top. This high heat conduction heat dissipation type single face structure flexible circuit board can effectively improve single face structure flexible circuit board's heat conduction and heat dispersion through the improvement to copper foil substrate structure and heat conduction insulating glue layer.
Description
Technical Field
The invention relates to the technical field of circuit board processing equipment, in particular to a high-heat-conduction heat-dissipation type single-sided structure flexible circuit board.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The flexible printed circuit board or FPC for short has the characteristics of high wiring density, light weight and thin thickness.
The structure of a traditional heat dissipation type single-sided structure FPC is shown in figure 1, and comprises an FPC soft board, heat-conducting insulating glue 30 and a heat dissipation substrate 40; the FPC soft board with the single-sided structure is formed by combining a cover film 10 and a copper foil base material 20, the cover film 10 is composed of a polyimide film base material 11+ thermosetting adhesive 12, the copper foil base material 20 is formed by compounding a copper foil 21+ thermosetting adhesive 22+ polyimide film base material 23, the heat dissipation base plate 40 mainly comprises an aluminum base plate, a stainless steel base plate, a copper base plate, a glass fiber plate and the like, the heat conduction and heat dissipation capabilities of the heat dissipation base plate are different according to different materials of the heat dissipation base plate, but for the whole circuit board, the materials of the heat dissipation base material of the circuit board are selected according to comprehensive factors such as the performance, the function and the cost of a product at the beginning of the research and development of a customer, so that the circuit board with higher heat dissipation capability can be designed and produced under the condition that the appearance size of the product is not increased, and the FPC with. The heat conduction and dissipation capability of the FPC flexible printed circuit board and the heat conduction insulating adhesive are urgently needed to be improved, the existing copper foil base material 20 is compounded by using a copper foil 21, a thermosetting adhesive 22 and a polyimide film base material 23, the essence is that the copper foil 21 is adhered to the polyimide film substrate 23 through the thermosetting adhesive 22, however, the thermosetting adhesive 22 and the polyimide film substrate 23 have poor thermal conductivity, which may hinder the heat dissipation capability of the copper foil 2, resulting in insufficient heat dissipation capability of the entire product, moreover, because the adhesion force of the polyimide film substrate 23 is worse, in order to ensure that the polyimide film substrate 23 can be firmly adhered to the surface of the heat dissipation substrate 40, the thickness of the heat conductive insulating glue 30 generally needs to reach more than 50 μm, otherwise, the polyimide film substrate 23 is easy to fall off, however, the thicker the thickness of the heat-conducting insulating paste 30 is, the poorer the heat-conducting property thereof is, and the heat dissipation performance of the whole product is also reduced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a high heat conduction heat dissipation type single face structure flexible circuit board through the improvement to copper foil substrate structure and heat conduction insulating glue layer, can effectively improve single face structure flexible circuit board's heat conduction and heat dispersion.
In order to realize the technical scheme, the utility model provides a high heat conduction heat dissipation type single face structure flexible circuit board, include: the heat dissipation substrate, heat dissipation substrate top coating has ultra-thin heat conduction insulating glue layer, ultra-thin no glue copper clad substrate is pasted to ultra-thin heat conduction insulating glue layer top, the cover has the tectorial membrane in ultra-thin no glue copper clad substrate top subsides, and wherein ultra-thin no glue copper clad substrate includes ultra-thin copper substrate, ultra-thin copper substrate surface evenly is provided with the copper foil arch of independent distribution, and the tectorial membrane includes thermosetting glue and polyimide film layer, and wherein thermosetting glue evenly pastes and covers on ultra-thin copper substrate surface and with each copper foil of independent distribution, and the polyimide film layer is pasted at the thermosetting glue top.
In the technical scheme, through the improvement to copper foil substrate structure, through using the structure that the surface evenly is provided with the bellied ultra-thin copper base material of copper foil of independent distribution, replace traditional copper foil, the thermosetting glue, the copper foil substrate that polyimide film substrate constitutes, can improve copper foil substrate heat conduction efficiency greatly, and because the ductility of ultra-thin copper substrate is better, consequently, can reduce the thickness of heat conduction insulating glue layer, can realize good adhesion between ultra-thin copper substrate and the heat dissipation base plate under the very thin condition of glue film, glue film thickness reduces the back, be favorable to the heat dissipation base plate to ultra-thin copper base material heat conduction, and then can further strengthen the heat conduction efficiency and the heat dispersion of product.
Preferably, the thickness of the ultrathin heat conduction insulation adhesive layer is 20 microns, the thickness of the ultrathin heat conduction insulation adhesive layer is not too large, otherwise, the heat conduction efficiency can be reduced, the thickness of the ultrathin heat conduction insulation adhesive layer is not too small, otherwise, the adhesion force between the ultrathin copper base material and the heat dissipation substrate is not enough, and test tests show that when the thickness of the ultrathin heat conduction insulation adhesive layer is 20 microns, the ultrathin copper base material and the heat dissipation substrate can keep good adhesion force, the ultrathin heat conduction insulation adhesive layer has good heat conduction efficiency, and the cost performance is good.
Preferably, the thickness of the ultra-thin copper substrate is 2-10 μm, the thickness of the ultra-thin copper substrate is not too thin, otherwise, the ultra-thin copper substrate is easy to break, the thickness of the ultra-thin copper substrate is not too thick, otherwise, the production cost is increased, and the heat conductivity is reduced.
Preferably, the ultra-thin copper substrate has a thickness of 5 μm. The test shows that the ultrathin copper substrate has good strength and heat conductivity when the thickness of the ultrathin copper substrate is 5 mu m, and the cost performance is optimal.
The utility model provides a pair of high heat conduction heat dissipation type single face structure flexible circuit board's beneficial effect lies in: this high heat conduction heat dissipation type single face structure flexible circuit board, through the improvement to copper foil substrate structure, use the surface evenly to be provided with the bellied structure of ultra-thin copper substrate of copper foil of independent distribution, replace traditional copper foil, the thermosetting glue, the copper foil substrate that polyimide film substrate constitutes, can improve copper foil substrate heat conduction efficiency greatly, and because the ductility of ultra-thin copper substrate is better, consequently, can reduce the thickness of heat conduction insulating glue layer, can realize good adhesion between ultra-thin copper substrate and the heat dissipation base plate under the very thin condition of glue film, glue film thickness reduces the back, be favorable to the heat conduction of heat dissipation base plate to ultra-thin copper substrate, and then can further strengthen the heat conduction efficiency and the heat dispersion of product.
Drawings
Fig. 1 shows a conventional heat dissipation type single-sided flexible circuit board structure.
Fig. 2 is a schematic structural diagram of the present invention.
In the figure: 1. covering the film; 11. a polyimide film layer; 12. thermosetting adhesive; 2. an ultrathin non-adhesive copper-clad substrate; 21. copper foil; 22. an ultra-thin copper substrate; 3. an ultrathin heat-conducting insulating adhesive layer; 4. a heat dissipation substrate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art without any inventive step are within the scope of the present invention.
Example (b): a high heat conduction and heat dissipation type single-sided structure flexible circuit board.
Referring to fig. 2, a high thermal conductive heat dissipation type single-sided structure flexible circuit board includes: the heat dissipation substrate 4 is coated with the ultrathin heat conduction and insulation adhesive layer 3 on the top of the heat dissipation substrate 4, the thickness of the ultrathin heat conduction and insulation adhesive layer 3 is 20 microns, the thickness of the ultrathin heat conduction and insulation adhesive layer 3 is not too large, otherwise, the heat conduction efficiency is reduced, the thickness of the ultrathin heat conduction and insulation adhesive layer 3 is not too small, otherwise, the adhesion force between the ultrathin copper base material 22 and the heat dissipation substrate 4 is insufficient, and test tests show that when the thickness of the ultrathin heat conduction and insulation adhesive layer 3 is 20 microns (compared with the thickness of the ultrathin heat conduction and insulation adhesive layer 3 in the traditional structure which is larger than 50 microns in the traditional structure, the thickness of the ultrathin heat conduction and insulation adhesive layer 3 in the embodiment is greatly reduced), good adhesion force can be kept between the ultrathin copper base material 22 and the heat dissipation substrate 4; an ultrathin non-adhesive copper-clad base material 2 is adhered above the ultrathin heat-conducting insulating adhesive layer 3, a cover film 1 is adhered above the ultrathin non-adhesive copper-clad base material 2, wherein the ultrathin non-adhesive copper-clad base material 2 comprises an ultrathin copper base material 22, the thickness of the ultrathin copper base material 22 is 5 micrometers, the thickness of the ultrathin copper base material 22 is not too thin, otherwise, the ultrathin copper base material is easy to damage, the processing difficulty is high, the thickness of the ultrathin copper base material 22 is not too thick, otherwise, the production cost is increased, and the heat-conducting performance is reduced, and the ultrathin copper base material 22 is obtained through test, has good strength and heat-conducting performance when the thickness of the ultrathin copper base material 22 is 5 micrometers, and has the optimal cost performance, the surface of the ultrathin copper base material 22 is integrally processed and punched through a die to form uniformly and independently distributed copper foil 21 bulges, the cover film 1 comprises a thermosetting adhesive 12 and a polyimide film layer 11, wherein the thermosetting adhesive 12 is uniformly adhered on the, the polyimide film layer 11 is adhered to the top of the thermosetting adhesive 12.
This high heat conduction heat dissipation type single face structure flexible circuit board, through the improvement to copper foil substrate structure, use the surface evenly to be provided with the bellied ultra-thin copper substrate 22's of copper foil 21 structure of independent distribution, replace traditional copper foil, the thermosetting glue, the copper foil substrate that polyimide film substrate constitutes, can improve copper foil substrate heat conduction efficiency greatly, and because ultra-thin copper substrate 22's ductility is better, consequently, ultra-thin heat conduction insulating glue layer 3's thickness can be reduced, can realize good adhesion between ultra-thin copper substrate 22 and the heat dissipation base plate 4 under the very thin condition of glue film, glue film thickness reduces the back, be favorable to heat conduction of heat dissipation base plate 4 to ultra-thin copper substrate 22, and then can further strengthen the heat conduction efficiency and the heat dispersion of product. The high-heat-conduction heat-dissipation type single-sided structure flexible circuit board is particularly suitable for products carrying light-emitting LED illuminating lamps, liquid crystal televisions, automobile lamps and the like.
The above description is a preferred embodiment of the present invention, but the present invention should not be limited to the disclosure of the embodiment and the accompanying drawings, and therefore, all equivalents and modifications that can be accomplished without departing from the spirit of the present invention are within the protection scope of the present invention.
Claims (4)
1. A high heat conduction and dissipation type single-sided structure flexible circuit board comprises: the heat dissipation base plate, its characterized in that: the utility model discloses a heat dissipation substrate, including heat dissipation substrate, ultra-thin heat conduction insulating glue layer, ultra-thin glueless copper clad substrate top subsides have the tectorial membrane, and wherein ultra-thin glueless copper clad substrate includes the ultra-thin copper substrate, the ultra-thin copper substrate surface evenly is provided with the copper foil arch of independent distribution, and the tectorial membrane includes thermosetting glue and polyimide film layer, and wherein the even subsides of thermosetting glue are covered on the ultra-thin copper substrate surface and cover each copper foil that independently distributes, and the polyimide film layer is pasted at the thermosetting glue top.
2. The high thermal conductivity heat dissipation type single-sided structure flexible circuit board of claim 1, wherein: the thickness of the ultrathin heat-conducting insulating adhesive layer is 20 micrometers.
3. The high thermal conductivity heat dissipation type single-sided structure flexible circuit board of claim 1, wherein: the thickness of the ultrathin copper base material is 2-10 mu m.
4. The high thermal conductivity heat dissipation type single-sided structure flexible circuit board of claim 3, wherein: the thickness of the ultra-thin copper substrate is 5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021665577.1U CN212786015U (en) | 2020-08-12 | 2020-08-12 | High heat conduction heat dissipation type single face structure flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021665577.1U CN212786015U (en) | 2020-08-12 | 2020-08-12 | High heat conduction heat dissipation type single face structure flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212786015U true CN212786015U (en) | 2021-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021665577.1U Active CN212786015U (en) | 2020-08-12 | 2020-08-12 | High heat conduction heat dissipation type single face structure flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212786015U (en) |
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2020
- 2020-08-12 CN CN202021665577.1U patent/CN212786015U/en active Active
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