CN117186794A - Low-resistance copper foil adhesive tape and preparation method thereof - Google Patents
Low-resistance copper foil adhesive tape and preparation method thereof Download PDFInfo
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- CN117186794A CN117186794A CN202311192455.3A CN202311192455A CN117186794A CN 117186794 A CN117186794 A CN 117186794A CN 202311192455 A CN202311192455 A CN 202311192455A CN 117186794 A CN117186794 A CN 117186794A
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- copper foil
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- adhesive
- adhesive tape
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 125
- 239000011889 copper foil Substances 0.000 title claims abstract description 115
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000004544 sputter deposition Methods 0.000 claims abstract description 12
- 239000013077 target material Substances 0.000 claims abstract description 11
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 9
- 238000007731 hot pressing Methods 0.000 claims abstract description 9
- 238000000151 deposition Methods 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000005406 washing Methods 0.000 claims abstract description 4
- 239000011261 inert gas Substances 0.000 claims abstract description 3
- 239000002245 particle Substances 0.000 claims description 16
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 15
- 239000011241 protective layer Substances 0.000 claims description 15
- 229920000767 polyaniline Polymers 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000004793 Polystyrene Substances 0.000 claims description 9
- 229920002223 polystyrene Polymers 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 8
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 7
- 239000002041 carbon nanotube Substances 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 239000003431 cross linking reagent Substances 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 5
- 238000013329 compounding Methods 0.000 claims description 5
- 238000005237 degreasing agent Methods 0.000 claims description 5
- 239000013527 degreasing agent Substances 0.000 claims description 5
- 229910017604 nitric acid Inorganic materials 0.000 claims description 5
- 238000005554 pickling Methods 0.000 claims description 5
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 5
- PHFQLYPOURZARY-UHFFFAOYSA-N chromium trinitrate Chemical compound [Cr+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PHFQLYPOURZARY-UHFFFAOYSA-N 0.000 claims description 4
- 238000005238 degreasing Methods 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 229910001923 silver oxide Inorganic materials 0.000 claims description 3
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Substances [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 10
- 238000005260 corrosion Methods 0.000 abstract description 10
- 238000010030 laminating Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 239000002253 acid Substances 0.000 abstract 1
- 238000003672 processing method Methods 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 23
- 238000012360 testing method Methods 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000003490 calendering Methods 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The application belongs to the field of copper foil tape processing, and discloses a low-resistance copper foil tape and a preparation method thereof, wherein the processing method comprises the following steps: s1, surface pretreatment: oil removal and acid washing treatment, soaking microetching solution, water washing and drying for standby; s2, setting a conductive sputtering layer: introducing inert gas into graphene serving as a target material under a high temperature condition to sputter the graphene onto a copper foil substrate to form a netlike conductive sputtering layer; s3, setting a conductive adhesive layer: depositing a conductive adhesive on the conductive sputtered layer; s4, hot pressing: and (3) laminating and combining the coated copper foil and the adhesive tape base material, and performing hot pressing treatment to obtain the low-resistance copper foil adhesive tape. The low-resistance copper foil adhesive tape prepared by the method can effectively and efficiently conduct current, can maintain the conductivity and shape performance under different working environments and stress conditions, and has excellent corrosion resistance and shielding performance.
Description
Technical Field
The application relates to the technical field of copper foil adhesive tapes, in particular to a low-resistance copper foil adhesive tape and a preparation method thereof.
Background
The low-resistance copper foil adhesive tape is an important conductive material widely applied to the fields of electronics, electricity, communication, electromagnetic shielding and the like. The conductive material has excellent conductivity, low resistance, good mechanical property and dimensional stability, and is widely applied to the fields of flexible circuit boards, planarization cables, shielding materials, electronic packaging and the like.
In the prior art, the preparation of the low-resistance copper foil tape mainly comprises the following methods: preparing electrolytic copper foil: electrolytic copper foil is a common method for preparing low-resistance copper foil tape. Copper foil having good conductive properties is formed by electrowinning an electrolytic copper solution onto a conductive substrate. In the preparation process, the conductivity and thickness of the copper foil can be adjusted by controlling parameters such as components, temperature, current density, electrolysis time and the like of the electrolyte. Bonding calendaring method: the bonding calendaring method is another commonly used method for preparing the low-resistance copper foil adhesive tape. The method is to bond the steel plate and the thin copper foil by using a high-temperature and high-pressure calendaring process, so that the copper foil and the substrate are firmly combined. Then, the copper foil is gradually thinned by continuous rolling and annealing treatment, and excellent conductive properties are obtained. Electroless copper plating: the electroless copper plating method is a low-temperature, electroless process. The copper foil layer is formed by depositing a layer of chemically reduced copper metal on the surface of the substrate. The method can be used for preparing the copper foil adhesive tape on a substrate similar to Polyimide (PI), polyamide (PU) and the like which are sensitive to high temperature, and can obtain the copper foil adhesive tape with excellent conductive performance. Chemical treatment method: the method mainly comprises the step of performing specific chemical treatment on the surface of the copper foil to form a surface layer with good conductivity and oxidation resistance. For example, a chemical etchant may be used to clean and roughen the surface, and then the conductive polymer coating or metallization may be used to enhance conductivity.
The copper foil tape may be divided into two types, one is a single-sided tape and the other is a double-sided tape, and the single-sided tape may be divided into two types, i.e., a single-conductive copper foil tape and a double-conductive copper foil tape, respectively. The single-conductive copper foil tape is that the adhesive-coated surface is not conductive, and only the copper on the other surface can be conductive, so that the single-conductive copper foil tape is called single-conductive, namely single-sided conductive. The double-conductive copper foil tape is characterized in that one side of the adhesive is conductive, and the other side of the adhesive is conductive, so that the double-conductive copper foil tape is called double-conductive, namely, both sides of the double-conductive copper foil tape are conductive; and a double-sided adhesive copper foil tape for processing with other materials to form a relatively expensive composite material. The double-sided glued copper foil has two glue surfaces, one of which is conductive and the other of which is non-conductive, and the user can select according to his/her own requirements for conductivity. The copper foil strips used at present have poor conductivity, imperfect installation device, difficult tearing during adhesion, difficult cutting in special shapes and the like.
In view of the above problems, how to provide a method with high preparation efficiency, low energy consumption and small environmental impact, and which can be widely used and different base materials and preparation scales is a big problem to be solved in the current copper foil tape technical field.
Disclosure of Invention
Aiming at the defects of the prior art, the application aims to provide the low-resistance copper foil adhesive tape and the preparation method thereof, and the low-resistance copper foil adhesive tape prepared by the method can effectively and efficiently conduct current, can maintain the conductivity and shape performance under different working environments and stress conditions, and has excellent corrosion resistance and shielding performance.
In order to achieve the above purpose, the present application provides the following technical solutions:
a low-resistance copper foil adhesive tape comprises the following structural components: the adhesive tape comprises an adhesive tape substrate, wherein a copper foil is hot-pressed on the adhesive tape substrate, a conductive structure layer is arranged on the surface of the copper foil, the conductive structure layer is a netlike pore structure formed on the copper foil in a magnetron sputtering mode, a conductive protection layer is deposited on the conductive structure layer, the conductive protection layer is composed of a conductive adhesive, and the composition of the conductive protection layer comprises the following components in parts by mass: polyaniline: polystyrene: conductive particles: and (3) an initiator: crosslinking agent=10:5:7:2:1, the thickness of the conductive protective layer is 10-15um, and the release film is compounded on the conductive protective layer.
Preferably, the conductive structure layer is a reticular pore structure formed by graphene materials, the mesh number is 100 meshes, and the thickness of the conductive structure layer is 5-10um.
Preferably, the conductive particles are one or more of carbon nanotubes, indium zinc oxide or nano silver oxide.
Preferably, the initiator is copper bromocyclooctadione.
Preferably, the crosslinking agent is an ethyldienyl benzene.
Preferably, the preparation process of the conductive adhesive is as follows: mixing polyaniline and polystyrene in parts by mass, heating to 70-80 ℃, adding conductive particles, stirring, then dropwise adding an initiator and a cross-linking agent, and finally ultrasonically stirring until the conductive particles are uniformly dispersed in the polyaniline to obtain the conductive adhesive.
Preferably, the ultrasonic power of the ultrasonic stirring is 200W-300W, and the frequency is 20KHz-30Khz.
Preferably, the adhesive tape substrate is polyimide.
Preferably, the release film is one or more of polyester, polyethylene and polypropylene, and the thickness of the release film is 5-10um.
A preparation method of a low-resistance copper foil adhesive tape comprises the following steps:
s101, surface pretreatment: degreasing and pickling the copper foil, then immersing the copper foil into a microetching solution for microetching for 10-20min,
then washing the micro-etched copper foil with water and drying for later use;
s102, setting a conductive structure layer: placing the copper foil obtained in the step S1 in a vacuum box, taking graphene as a target material, introducing inert gas into sputtering equipment, activating the gas to form ions in the process of forming plasma by the target material, and sputtering the ions onto a copper foil substrate to form a netlike conductive structure layer;
s103, setting a conductive protective layer: uniformly depositing a conductive protective layer consisting of a conductive adhesive on the conductive structural layer in the step S2;
s104, hot pressing: and (3) stacking and combining the deposited copper foil and an adhesive tape base material formed by organic polyimide, performing hot pressing treatment, and finally compounding an upper release film to prepare the low-resistance copper foil adhesive tape.
Preferably, in S1, the degreasing agent and the nitric acid are used as the agent for the degreasing and pickling treatment; the microetching solution is one of potassium persulfate and chromium nitrate.
Compared with the prior art, the application has the beneficial effects that:
according to the application, by arranging the conductive structure layer, not only can the resistance of the copper foil be reduced, but also the mechanical strength and the dimensional stability of the low-resistance copper foil adhesive tape can be increased, and the conductive performance and the shape stability of the low-resistance copper foil adhesive tape can be maintained under different working environments and stress conditions. Besides, the mesh-shaped conductive structure layer can effectively shield electromagnetic radiation and interference signals and protect electronic devices and systems from external electromagnetic interference.
The application adopts polyaniline and polystyrene to interact with each other under the assistance of conductive particles, reduces the resistance of the copper foil adhesive tape, improves the conductivity of the copper foil adhesive tape, and adopts the prepared conductive adhesive to resist oxidation, corrosion and corrosion of chemical media, so that the low-resistance copper foil adhesive tape can stably operate for a long time in a severe environment, has longer service life, and reduces resistance increase and performance attenuation caused by corrosion.
The low-resistance copper foil adhesive tape prepared by the application has higher plasticity and processability, can adapt to complex shape requirements, and is customized by cutting, folding, bonding, pressing and other processing technologies. This flexibility enables the copper foil tape to meet different application requirements in a variety of electronic and circuit designs.
Drawings
FIG. 1 is a schematic view of a low resistance copper foil tape according to the present application;
FIG. 2 is a diagram of a mesh structure of a conductive structure layer according to the present application;
fig. 3 is a flowchart of a method for preparing the low-resistance copper foil tape according to the present application.
In the figure: 1. a tape substrate; 2. copper foil; 3. a conductive structure layer; 4. a conductive protective layer; 5. and (3) a release film.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1-3, the present application provides a technical solution:
example 1
Preparing a conductive adhesive:
100g polyaniline and 50g polystyrene are mixed and heated to 70 ℃, 70g carbon nano tube is added, 2ml bromocyclooctadione copper and 1ml of ethyl dienyl benzene are added dropwise, and the mixture is stirred for 3 hours under the ultrasonic wave with the frequency of 20KHz at 300W until the carbon nano tube is uniformly distributed in the conductive adhesive.
Preparing a low-resistance copper foil tape:
200g of copper foil is wiped by a degreasing agent, is pickled for 2min by 20% nitric acid, is immersed in potassium persulfate for microetching for 5min, is taken out, is rinsed by deionized water and is dried for 30min.
And placing the dried copper foil in a vacuum box, taking graphene as a target material, introducing argon gas into sputtering equipment, forming particles by the gas in the process of forming plasma by the target material, and sputtering the particles on a copper foil substrate to form a net-shaped conductive structure layer with the thickness of 5 um.
And uniformly depositing the conductive adhesive on the conductive structure layer to form a conductive protective layer with the thickness of 10um, then laminating and combining the deposited copper foil and the adhesive tape base material, performing hot pressing treatment, and finally compounding a release film with the thickness of 5-10um to obtain the low-resistance copper foil adhesive tape.
Example 2
Preparing a conductive adhesive:
110g polyaniline and 55g polystyrene are mixed and heated to 70 ℃, 77g carbon nano tube is added, 2.6ml bromocyclooctadione copper and 1.5ml of ethyldienyl benzene are added dropwise, and the mixture is stirred for 4 hours under the ultrasonic wave with the frequency of 25KHz at 250W until the carbon nano tube is uniformly distributed in the conductive adhesive.
Preparing a low-resistance copper foil tape:
200g of copper foil is wiped by a degreasing agent, is pickled for 2min by 20% nitric acid, is immersed in potassium persulfate for microetching for 7min, is taken out, is rinsed by deionized water and is dried for 25min.
And placing the dried copper foil in a vacuum box, taking graphene as a target material, introducing argon gas into sputtering equipment, forming particles by the gas in the process of forming plasma by the target material, and sputtering the particles on a copper foil substrate to form a net-shaped conductive structure layer with the thickness of 7 um.
And uniformly depositing the conductive adhesive on the conductive structure layer to form a conductive protective layer with the thickness of 12um, then laminating and combining the deposited copper foil and the adhesive tape base material, performing hot pressing treatment, and finally compounding an 8um release film to obtain the low-resistance copper foil adhesive tape.
EXAMPLE 3,
Preparing a conductive adhesive:
100g polyaniline and 50g polystyrene are mixed and heated to 70 ℃, 70g carbon nano tube is added, 2ml bromocyclooctadione copper and 1ml of ethyl dienyl benzene are added dropwise, and stirring is carried out for 3 hours under the ultrasonic wave with the frequency of 20KHz at 300W until nano silver oxide is uniformly distributed in the conductive adhesive.
Preparing a low-resistance copper foil tape:
wiping 200g of copper foil with a degreasing agent, pickling with 20% nitric acid for 3min, immersing the copper foil in potassium persulfate for microetching for 10min, taking out, leaching with deionized water, and drying for 20min;
and placing the dried copper foil in a vacuum box, taking graphene as a target material, introducing argon gas into sputtering equipment, forming particles by the gas in the process of forming plasma by the target material, and sputtering the particles on a copper foil substrate to form a netlike conductive structure layer with the thickness of 10um.
And uniformly depositing the conductive adhesive on the conductive structure layer to form a conductive protective layer with the thickness of 15um, then laminating and combining the deposited copper foil and the adhesive tape base material, performing hot pressing treatment, and finally compounding a 10um release film to obtain the low-resistance copper foil adhesive tape.
Comparative example 1
Comparative example 1 differs from example 1 only in that: in comparative example 1, polyaniline was not added in the preparation process of the conductive adhesive described in example 1, the balance was made up of polystyrene, and the other components and amounts were the same as in example 1.
The specific procedure of the preparation method of the low-resistance copper foil tape provided in the comparative example is the same as that of example 1.
Comparative example 2
Comparative example 2 the following differences exist for example 1 only: in comparative example 2, the conductive adhesive described in example 1 was prepared without adding p-cresol, and the other components and amounts were the same as in example 1.
The specific procedure of the preparation method of the low-resistance copper foil tape provided in the comparative example is the same as that of example 1.
Comparative example 3
Comparative example 3 differs from example 1 only in that: in comparative example 3, the conductive adhesive described in example 1 was prepared without adding conductive particles, and the other components and amounts were the same as in example 1.
The specific procedure of the preparation method of the low-resistance copper foil tape provided in the comparative example is the same as that of example 1.
Comparative example 4
Comparative example 4 differs from example 1 only in that: in comparative example 4, the preparation method of the low-resistance copper foil tape described in example 1 was omitted, so that the step of "conductive structure layer" was omitted, the subsequent steps were directly performed, and the remaining steps were all identical to example 1.
Relevant performance test for conductive adhesive prepared in the low resistance copper foil tape provided in the above examples and comparative examples:
conducting performance test: the conductive adhesive 5g prepared in example 1 and comparative examples 1, 2 and 3 was coated on glass sheets of the same size and thickness to prepare a test plate having only a conductive adhesive layer.
Resistance measurement: the resistance is measured by contacting the test electrode to the conductive adhesive surface and using a resistance meter. A lower resistance value indicates better conductivity.
Current conduction test: the current conduction was measured on the conductive adhesive sample by contacting the test electrode to the conductive adhesive surface and applying an equivalent voltage.
Environmental test: the conductive adhesive is used under the conditions of different high temperature, low temperature and humidity, the conductive performance of the conductive adhesive under different environments is tested, and the stability and reliability of the conductive adhesive under different environments are evaluated.
Physical property test: the conductive adhesives 5g prepared in example 1 and comparative examples 1, 2 and 3 were formed into rectangular parallelepiped sheets having uniform thickness, and physical properties such as tensile strength were measured.
The test results are shown in the following table:
from the physical and chemical property parameter detection of the conductive adhesive prepared in the embodiment 1 and the comparative examples 1-3, it can be seen that the conductive adhesive prepared in the embodiment 1 is significantly better than the conductive adhesive prepared in the comparative examples 1-3, so that the conductive adhesive prepared in the document of the application can not only reduce the resistance of copper foil, but also effectively and efficiently conduct current, can also increase the mechanical strength and the dimensional stability of the low-resistance copper foil adhesive tape, and can maintain the conductive performance and the shape stability under different working environments and stress conditions.
Related performance test for the low resistance copper foil tape provided in the above examples and comparative examples:
conductivity (Conductivity): conductivity refers to the ability of a material to conduct electricity. The low-resistance copper foil tape should have excellent conductive properties, be able to effectively conduct current, and avoid energy loss and heat generation.
Resistivity: the resistivity refers to the resistance per unit length or unit area. For a low resistance copper foil tape, its resistivity should be as low as possible, indicating that it has excellent conductive properties. The calculation formula is as follows:
where ρ is the resistivity, L is the length of the material, S is the cross-sectional area of the material, and R is the resistance.
Corrosion resistance: corrosion resistance is the ability of a material to resist corrosion under attack by the external environment. The present test measures the corrosion loss of a test sample over a period of time by exposing the material to an acidic environment.
Tensile strength: tensile strength is the ability of a material to resist fracture under tensile stress. It represents the maximum tensile force that the material can withstand. The higher the tensile strength, the higher the mechanical strength of the material.
The low-resistance copper foil tape prepared by the method of arranging the conductive structure layer and the conductive protection layer in examples 1-3 can effectively and efficiently conduct current, can maintain the conductivity and shape performance under different working environments and stress conditions, and has excellent corrosion resistance and shielding performance.
The test results in the table indicate: the physical and chemical property parameters such as the resistivity and the tensile strength of the embodiment 1-3 are obviously superior to those of the comparative embodiment 1-4, so that the low-resistance copper foil adhesive tape and the preparation method thereof provided by the application are reliable and have obvious progress and substantial improvement, and meanwhile, the obvious difference of the embodiment 1 and the comparative embodiment 1-3 in the resistivity can prove that the resistance of the copper foil adhesive tape can be reduced to the maximum extent and the conductivity of the copper foil adhesive tape can be improved.
Although embodiments of the present application have been disclosed above, it is not limited to the use of the description and embodiments, it is well suited to various fields of use for the application, and further modifications may be readily apparent to those skilled in the art, and accordingly, the application is not limited to the particular details without departing from the general concepts defined in the claims and the equivalents thereof.
Claims (10)
1. A low resistance copper foil tape, characterized in that: the adhesive tape comprises an adhesive tape substrate, wherein a copper foil is hot-pressed on the adhesive tape substrate, a conductive structure layer is arranged on the surface of the copper foil, and the conductive structure layer is a netlike pore structure formed on the copper foil in a magnetron sputtering mode;
the conductive structure layer is deposited with a conductive protective layer, the conductive protective layer is composed of a conductive adhesive, and the conductive protective layer comprises the following components in parts by mass: polyaniline: polystyrene: conductive particles: and (3) an initiator: crosslinking agent=10:5:7:2:1, the thickness of the conductive protective layer is 10-15um;
the conductive protective layer is compounded with a release film.
2. The low resistance copper foil tape according to claim 1, wherein: the conductive structure layer is a reticular pore structure formed by graphene materials, the mesh number is 100 meshes, and the thickness of the conductive structure layer is 5-10um.
3. The low resistance copper foil tape according to claim 1, wherein: the conductive particles are one or more of carbon nanotubes, indium zinc oxide or nano silver oxide;
the initiator is copper bromocyclooctadione;
the cross-linking agent is ethyl dienyl benzene.
4. A low resistance copper foil tape according to claim 2 or 3, wherein: the preparation process of the conductive adhesive comprises the following steps: mixing polyaniline and polystyrene according to the mass ratio, heating to 70-80 ℃, adding conductive particles, stirring, then dropwise adding an initiator and a cross-linking agent, and finally ultrasonically stirring until the conductive particles are uniformly dispersed in the polyaniline, thus obtaining the conductive adhesive.
5. The low resistance copper foil tape according to claim 4, wherein: the ultrasonic power of the ultrasonic stirring is 200W-300W, and the frequency is 20KHz-30Khz.
6. The low resistance copper foil tape according to claim 1, wherein: the adhesive tape base material is polyimide.
7. The low resistance copper foil tape according to claim 1, wherein: the release film is one or more of polyester, polyethylene and polypropylene, and the thickness of the release film is 5-10um.
8. A method for preparing the low-resistance copper foil tape according to any one of claims 1 to 7, characterized in that: the method comprises the following steps:
s101, surface pretreatment: degreasing and pickling copper foil, immersing the copper foil in microetching solution to microetch for 10-20min, washing the microetched copper foil with water and drying for later use;
s102, setting a conductive structure layer: placing the copper foil obtained in the step S101 in a vacuum box, taking graphene as a target material, introducing inert gas into sputtering equipment, activating the gas to form ions in the process of forming plasma by the target material, and sputtering the ions onto a copper foil substrate to form a netlike conductive structure layer;
s103, setting a conductive protective layer: uniformly depositing a conductive protective layer consisting of a conductive adhesive on the conductive structural layer in the step S102;
s104, hot pressing: and (3) stacking and combining the deposited copper foil and an adhesive tape base material formed by organic polyimide, performing hot pressing treatment, and finally compounding an upper release film to prepare the low-resistance copper foil adhesive tape.
9. The method for preparing the low-resistance copper foil tape according to claim 8, wherein the method comprises the following steps: in step S101, the degreasing agent and nitric acid are used as the agent for the degreasing and pickling treatment.
10. The method for preparing the low-resistance copper foil tape according to claim 8, wherein the method comprises the following steps: the microetching solution is one of potassium persulfate and chromium nitrate.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117777522A (en) * | 2023-12-27 | 2024-03-29 | 广东盈华电子科技有限公司 | Composite copper foil for flexible circuit and preparation method and application thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117777522A (en) * | 2023-12-27 | 2024-03-29 | 广东盈华电子科技有限公司 | Composite copper foil for flexible circuit and preparation method and application thereof |
| CN117777522B (en) * | 2023-12-27 | 2024-07-09 | 广东盈华电子科技有限公司 | Composite copper foil for flexible circuit and preparation method and application thereof |
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