CN1705045A - Technological process for preparing flexible conducting material by vacuum sputtering - Google Patents
Technological process for preparing flexible conducting material by vacuum sputtering Download PDFInfo
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- CN1705045A CN1705045A CN 200410023269 CN200410023269A CN1705045A CN 1705045 A CN1705045 A CN 1705045A CN 200410023269 CN200410023269 CN 200410023269 CN 200410023269 A CN200410023269 A CN 200410023269A CN 1705045 A CN1705045 A CN 1705045A
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Abstract
This invention discloses a method for preparing flexible conductive material, which is characteristic of that setting flexible film base material in magnetic controlled sputtering vacuum film plating machine, filled with argon gas and ionizing, the ionized argon ion bombarding the metal target material acted under magnetic field, depositing metal particles on flexible base material surface to make non conductive film into conductive material, then electroplating to produce flexible shielding material and high performance flexible copper plated board.
Description
Technical field
The present invention relates to the preparing technical field of flexible conducting material, particularly utilize chemical ﹠ blended fabric, foamed plastics or polyimide material, adopt the vacuum sputtering technology to prepare the process of flexible conducting material.
Background technology
General flexible electromagnetic shielding material is to apply layer of copper or other metal on chemical ﹠ blended fabric or foamed plastics at present, makes it become electric conductor, carries out compound (plating) again.The publication number that has that this class technology is openly reported is disclosed Chinese patent among the CN1120654C " a kind of preparation method of flexible electromagnetic shielding material ", and this method is made up of following steps successively: 1, material is carried out preliminary treatment through the ultrasonic alkalies that involves; 2, after the pretreated material washing, put into acid coarsening solution and carry out roughening treatment; 3, after the washing of the material after the roughening treatment, put into the pre-activated treatment fluid and carry out the pre-activated processing; 4, activate pretreated material after washing, material is immersed carry out activation processing in the activating solution; 5, the material after the activation processing is after washing, immerses to reduce processings in the reducing solution, and the material after the reduction processing is promptly set up the plated platform of follow-up shielding alloy; 6, the material after the reduction is after washing, and the copper that sinks in the heavy copper liquid of immersion is handled; 7, after the material washing behind the heavy copper, immerse and carry out electronickelling alloy, heavy nickel alloy mixed processing in the heavy nickel alloy liquid; 8, by after the washing of the material after the above processing, carry out the electronickelling alloy treatment in the immersion plating nickel alloy liquid; 9, after wash, dry.Though having shield, the material that this method is made is evenly distributed, characteristics such as pliability is good, and comprehensive shielded usefulness is lasting, and its process route complexity, the difficulty of liquid waste processing is big, and environmental protection drops into many.
And the normal method that adopts of the production of copperclad plate is to be base material with glass cloth (paper), forms by the gluing Copper Foil hot pressing of resin, is commonly called as " three-layer process ".Along with electronic product to miniaturization, high speed, digitized development, the also oriented ultrathin type of printed circuit board (PCB), high density, the trend that the multi-layer sheet direction develops, original equipment and technology be difficult to adapt to is produced the needs of this printed circuit board (PCB).Adopt hot pressing and adhesion process to prepare printed circuit board (PCB), production cost height, copper thickness when employed copper thickness is lower than 18 μ m, particularly to the high performance copper clad laminate of 5 μ m-8 μ m, adopt above-mentioned technology to produce at 35 μ m-18 μ m.
Summary of the invention
The purpose of this invention is to provide a kind of non-environmental-pollution, the energy quantity-produced adopts the vacuum sputtering technology to prepare the process of flexible conducting material.It is on the flexible material of electrical insulator, as deposit layer of copper, nickel or other metal on chemical fabric, foamed plastics or polyimides, makes it become electric conductor.Carry out compound (plating) again and become electromagnetic shielding material or the flexible copperclad plate of high-performance, to solve the many weak points that exist in existing electromagnetic shielding material or the copperclad plate production process.
In order to realize the foregoing invention purpose, the technical solution used in the present invention is: vacuum sputtering prepares the process of flexible conducting material, it is characterized in that the fexible film base material is inserted in the magnetic control sputtering vacuum coating machine, charge into argon gas, and with argon gas ionization, under the action of a magnetic field, bombard metal targets through the argon ion after the ionization, make the metallic sputtering sedimentation on the flexible parent metal surface, thereby make former non-conductive fexible film base material become conductive material; Its technological parameter is: sputtering chamber base vacuum: 2.1 * 10
-2Pa, operating pressure: 2.6 * 10
-1-5.6 * 10
-1Pa, the sputtering chamber temperature: 180 ℃-260 ℃, argon flow amount: 250-280Pa, operating voltage: 340V-450V, operating current: 5-8A, deposition rate is at 2-6M/min, and the side hinders: 5-500 Ω.
Above-mentioned fexible film base material is chemical ﹠ blended fabric, foamed plastics or polyimide material.Its thickness is 0.06-2.0mm.The material of employed metal targets is copper, nickel or other metal material.
Adopt said method to produce flexible conducting material, have that technology is simple, production cost is low, advantage such as free from environmental pollution, production continuously, steady quality, working condition are good, non-conducting material through above conduction processing carries out compound (plating) again, can produce the flexible copperclad plate of flexible shielding material and high-performance.
Embodiment
Vacuum sputtering prepares the process of flexible conducting material, be that the fexible film base material is inserted in the magnetic control sputtering vacuum coating machine, charge into argon gas, and with argon gas ionization, under the action of a magnetic field, bombard metal targets through the argon ion after the ionization, make the metallic sputtering sedimentation on the flexible parent metal surface, thereby make former non-conductive fexible film base material become conductive material; Its technological parameter is: power supply AC50HZ380V, and recirculated cooling water is pressed: 0.15-0.25Mpa, coolant water temperature :≤20 ℃, ambient temperature 50-38 ℃, relative humidity: 0-85 ℃, it is wide to plate base material: 650mm-1100mm, thick 0.06-2.0mm, sputtering chamber base vacuum: 2.1 * 10
-2Pa, operating pressure: 2.6 * 10
-1-5.6 * 10
-1Pa, the sputtering chamber temperature: 180 ℃-260 ℃, argon flow amount: 250-280Pa, operating voltage: 340V-450V, operating current: 5-8A, deposition rate is at 2-6M/min, and the side hinders: 5-500 Ω.
Claims (4)
1, vacuum sputtering prepares the process of flexible conducting material, it is characterized in that the fexible film base material is inserted in the magnetic control sputtering vacuum coating machine, charge into argon gas, and with argon gas ionization, under the action of a magnetic field, bombard metal targets through the argon ion after the ionization, make the metallic sputtering sedimentation on the flexible parent metal surface, thereby make former non-conductive fexible film base material become conductive material; Its technological parameter is: sputtering chamber base vacuum: 2.1 * 10
-2Pa, operating pressure: 2.6 * 10
-1-5.6 * 10
-1Pa, the sputtering chamber temperature: 180 ℃-260 ℃, argon flow amount: 250-280Pa, operating voltage: 340V-450V, operating current: 5-8A, deposition rate is at 2-6M/min, and the side hinders: 5-500 Ω.
2, vacuum sputtering according to claim 1 prepares the process of flexible conducting material, it is characterized in that above-mentioned fexible film base material is chemical ﹠ blended fabric, foamed plastics or polyimide material.
3, vacuum sputtering according to claim 1 and 2 prepares the process of flexible conducting material, it is characterized in that above-mentioned its thickness of fexible film base material is 0.06-2.0mm.
4, vacuum sputtering according to claim 1 prepares the process of flexible conducting material, and the material that it is characterized in that employed metal targets is copper or nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410023269 CN1705045A (en) | 2004-05-29 | 2004-05-29 | Technological process for preparing flexible conducting material by vacuum sputtering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410023269 CN1705045A (en) | 2004-05-29 | 2004-05-29 | Technological process for preparing flexible conducting material by vacuum sputtering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1705045A true CN1705045A (en) | 2005-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410023269 Pending CN1705045A (en) | 2004-05-29 | 2004-05-29 | Technological process for preparing flexible conducting material by vacuum sputtering |
Country Status (1)
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| CN (1) | CN1705045A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102636931A (en) * | 2011-02-15 | 2012-08-15 | 鸿富锦精密工业（深圳）有限公司 | Electro-chromic layer, coated element and preparation method of coated element |
| CN103147076A (en) * | 2013-02-26 | 2013-06-12 | 中国电子科技集团公司第四十一研究所 | Surface metallization method for complicated hard polyimide shielding cavity |
| CN108103506A (en) * | 2017-12-18 | 2018-06-01 | 常德力元新材料有限责任公司 | A kind of preparation method of foam metal shielding material |
| CN109097726A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097748A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097750A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097749A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097751A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN111876743A (en) * | 2020-09-05 | 2020-11-03 | 昆山鑫美源电子科技有限公司 | Production and processing system and preparation process of flexible conductive film |
| CN113346038A (en) * | 2020-03-03 | 2021-09-03 | 宁德新能源科技有限公司 | Preparation method and preparation device of composite current collector |
| CN115064672A (en) * | 2022-06-17 | 2022-09-16 | 哈尔滨工业大学 | Star-shaped coating layer battery electrode material and preparation method and application thereof |
-
2004
- 2004-05-29 CN CN 200410023269 patent/CN1705045A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102636931A (en) * | 2011-02-15 | 2012-08-15 | 鸿富锦精密工业（深圳）有限公司 | Electro-chromic layer, coated element and preparation method of coated element |
| CN103147076A (en) * | 2013-02-26 | 2013-06-12 | 中国电子科技集团公司第四十一研究所 | Surface metallization method for complicated hard polyimide shielding cavity |
| CN109097749A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097726A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097748A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097750A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097751A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN108103506A (en) * | 2017-12-18 | 2018-06-01 | 常德力元新材料有限责任公司 | A kind of preparation method of foam metal shielding material |
| CN113346038A (en) * | 2020-03-03 | 2021-09-03 | 宁德新能源科技有限公司 | Preparation method and preparation device of composite current collector |
| CN111876743A (en) * | 2020-09-05 | 2020-11-03 | 昆山鑫美源电子科技有限公司 | Production and processing system and preparation process of flexible conductive film |
| WO2022047949A1 (en) * | 2020-09-05 | 2022-03-10 | 昆山鑫美源电子科技有限公司 | Production processing system and preparation process of flexible conductive film |
| CN115064672A (en) * | 2022-06-17 | 2022-09-16 | 哈尔滨工业大学 | Star-shaped coating layer battery electrode material and preparation method and application thereof |
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