WO2022047949A1

WO2022047949A1 - Production processing system and preparation process of flexible conductive film

Info

Publication number: WO2022047949A1
Application number: PCT/CN2020/123852
Authority: WO
Inventors: 贾孟
Original assignee: 昆山鑫美源电子科技有限公司
Priority date: 2020-09-05
Filing date: 2020-10-27
Publication date: 2022-03-10
Also published as: CN111876743A

Abstract

A production processing system and a preparation process of a flexible conductive film, relating to the field of base material coatings. The production processing system comprises a film laminating device used for laminating a product film base material and a substrate film base material to form a composite film; a first vacuum coating device used for forming a magnetron sputtering coating on a surface of the composite film base material; a second vacuum coating device located behind the first vacuum coating device and used for forming a first metal coating layer on the magnetron sputtering coating; a first water coating device located behind the second vacuum coating device, and using an alkaline water coating apparatus to form a transition metal coating layer on the first metal coating layer; a second water coating device located behind a third vacuum coating device, and using an acid water coating apparatus to form a thickened metal coating layer on the first metal coating layer; and a stripping device used for stripping the product film base material from the substrate film base material. The system and the preparation process can avoid the influence of high-temperature factors of an evaporation process on film surface bubble stringing and holes, can effectively solve the bubble stringing problem, and in addition, also solves the hole problem of an original evaporation process whereby a base film is punctured by high-temperature metal particles.

Description

Production and processing system and preparation technology of flexible conductive film

technical field

The invention relates to the field of flexible roll material processing, and more specifically, the invention relates to a production and processing system and a preparation process of a flexible conductive film roll material.

Background technique

Vacuum coating mainly refers to a type of coating that needs to be carried out under high vacuum, including many types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition and many others. It is mainly divided into two types: evaporation and sputtering. Evaporation coating generally heats the target material to evaporate the surface components in the form of atomic groups or ions, and settles on the surface of the substrate to form a thin film through the film formation process (scattered point-island structure-vagal structure-layered growth). For sputtering coating, it can be simply understood as bombarding the target with electrons or high-energy lasers, and sputtering the surface components in the form of atomic groups or ions, and finally depositing them on the surface of the substrate, going through the film-forming process, and finally forming a thin film .

Chinese patent document CN108531876A discloses a coating process, and specifically discloses the following content: it is to coat a metal film on an ultra-thin substrate to obtain a coating product that can improve adhesion. The process is as follows. The magnetron coating is 5-50nm, and then the water coating is 600-1000nm; or the process is as follows, the magnetron coating is first used on the surface of the ultra-thin substrate for 5-50nm, then the evaporation coating is 100-700nm, and the final water coating is 100-800nm. In the application of specific lithium battery current collectors, the properties of the substrate, the coating (metal coating) and the thickness range of the coating are a good combination. On this basis, the film between the magnetron coating and the water coating The binding force has been better reflected.

Using the process route of evaporation coating combined with water coating coating, there are the following two outstanding technical problems in the production of flexible conductive film coils: 1. The problem of bubble string: the base film used in flexible conductive film coil products is a stretching process. Local deformation is prone to occur during the process. During the evaporation coating process, due to the high temperature of the evaporation coating process, the deformation of the base film will be deteriorated, resulting in a series of deformations in the film running direction, which is called string bubbles. There will be two problems in the post-industrial chain processing and use of the flexible conductive film roll product: (1) During the film running process, there are bubbles on the surface of the film, and wrinkles are easily generated in the bubble-crossing area, which affects the product quality rate. ②In the post-processing process of the user, the uniformity of the tape and various surface treatments in the post-process cannot be guaranteed due to the foaming area on the film surface, thus affecting the consistency of the product. In view of this problem, the current process route cannot meet the requirements of product consistency and quality rate. From the actual estimation, the bubbles will cause a loss of about 30% of the quality rate of the product. 2. Hole problem: When the base film of the flexible conductive film coil product undergoes the evaporation coating process, due to the high temperature and slight fluctuation of the evaporation coating process, the high temperature metal particles caused by uneven evaporation during the film removal process are easy to hit the base film. pierced to form a hole, the size of the hole can reach the maximum millimeter level. Usually, the qualified rate of flexible conductive film products requires that the holes should not be larger than 500um. In the post-industrial chain processing and use, this defect will cause material leakage during the surface treatment process, which may cause a great safety risk to the end product.

SUMMARY OF THE INVENTION

In order to solve the above problems, the purpose of the present invention is to provide a flexible conductive film production and processing system and a preparation process, so as to improve the problem of bubbles and holes in the production process of the flexible conductive film, and the overall good rate of the product after the production is over. low problem.

In order to achieve the above purpose, a production and processing system for a flexible conductive film is provided, which includes:

A film laminating device for laminating the product film base material and the substrate film base material to form a composite film;

and a first vacuum coating device for forming a magnetron sputtering coating on the surface of the composite film substrate;

and a second vacuum coating device for forming the first metal coating on the magnetron sputtering coating, behind the first vacuum coating device;

and a first water plating device positioned behind the second vacuum coating device for forming a transition metal coating on the first metal coating;

and a second water-plating device for forming a thickened metal coating on the transition metal coating, behind the first water-plating device;

And a film peeling device for peeling the substrate film base material and the product film base material from the release layer.

Preferably, in the present invention, the film laminating device is a film laminating machine, and the film peeling device is a peeling machine.

Preferably, in the present invention, the first water plating device can use one of alkaline water plating equipment and acid water plating equipment, and the second water plating device uses acidic water plating equipment.

Preferably, in the present invention, a third vacuum coating device is further provided between the first water coating device and the second water coating device, and the third vacuum coating device is used to form a second metal coating on the transition metal coating to increase the thickness The metal plating layer is formed on the second metal plating layer.

Preferably, in the present invention, the metals plated on the first metal coating, the transition metal coating, the second metal coating and the thickening metal coating are all copper, that is, the first metal coating, the transition metal coating, the second metal coating and the thickening metal coating The metal plating layers are all copper plating layers.

Preferably, in the present invention, the first vacuum coating device, the second vacuum coating device and the third vacuum coating device all use magnetron sputtering coating equipment, and the thicknesses of the first metal coating and the second metal coating are both 8-15nm .

Preferably, in the present invention, the first vacuum coating device, the second vacuum coating device and the third vacuum coating device may be the same magnetron sputtering coating equipment.

Preferably, in the present invention, the magnetron sputtering coating is a magnetron sputtering alloy layer, and the magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer.

Preferably, in the present invention, the thickness of the magnetron sputtering coating is 2-10 nm.

Preferably, in the present invention, the thickness of the transition metal coating is 50-250 nm.

Preferably, in the present invention, the thickness of the thickened metal plating layer is 600-950 nm.

Preferably, in the present invention, the substrate film substrate includes but is not limited to PP film, PE film or PET film.

Preferably, in the present invention, the product film substrate includes but is not limited to PP film, PE film or PET film.

The present invention also provides a preparation process of the flexible conductive film, comprising:

S1. Coating a layer of release agent on both sides of the substrate film substrate to form a release layer with a thickness of 0.3-1um.

S2. Each surface of the two release layers is laminated with a layer of product film base material to form a first composite film base material.

S3, using a vacuum coating device to coat both surfaces of the first composite film substrate to form a 2-10nm magnetron sputtering alloy layer;

S4, forming a first metal coating layer of 8-15 nm on the magnetron sputtering alloy layer by a vacuum coating device;

S5, through the first water plating device, a transition metal coating of 50-250 nm is formed on the first metal coating;

S6, using the second water plating device to form a thickened metal plating layer with a thickness of 600-950 nm on the transition metal plating layer.

S7, peeling off the substrate film base material and the two-layer product film base material from the release layer, thereby simultaneously obtaining two rolls of product films plated with metal on one side.

S8. Pass the two rolls of product films plated with metal on one side in S7 and then go through the steps S1 to S2. When going through the S2 step, the metal plated surface is attached to the release layer, and then go through S3-S7 to obtain two Rolls are double-sided metallized product films.

Wherein, there is a step S51 between step S5 and step S6: forming a second metal coating of 8-15 nm on the transition metal coating by a vacuum coating device;

The step S6 is: forming a thickened metal plating layer with a thickness of 600-950 nm on the second metal plating layer by the second water plating device.

Wherein, in step S51, the formed second metal plating layer compensates the uniformity and compactness of the overall plating layer of the flexible conductive film, so that the elongation rate of the film coil is not less than 3%.

Wherein, in step S5, by forming the transition metal coating, the square resistance of the metal coating formed on the outer surface of the flexible conductive film is reduced to less than 800 mΩ.

Wherein, the first water plating device adopts alkaline water plating equipment, and the second water plating device adopts acid water plating equipment; or both the first water plating device and the second water plating device adopt acidic water plating equipment; or the first water plating device adopts acid water plating equipment; Both the device and the second water plating device use alkaline water plating equipment.

The beneficial effects of the present invention are: because the water plating equipment is used instead of the vacuum evaporation equipment, the existence of the transition metal coating can avoid the influence of the high temperature factor of the evaporation process on the bubbles and holes on the film surface, and can effectively solve the problem of bubbles. ; At the same time, it solves the hole problem that the high-temperature metal particles of the original evaporation process break down the base film, which can increase the product quality rate by more than one time.

Description of drawings

Fig. 1 is the embodiment flow chart of the preparation process of the flexible conductive film of the present invention;

FIG. 2 is a flow chart of another embodiment of the preparation process of the flexible conductive film of the present invention.

detailed description

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

The concept, specific structure and technical effects of the present invention will be clearly and completely described below with reference to the embodiments and accompanying drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts are all within the scope of The scope of protection of the present invention. In addition, all the coupling/connection relationships involved in the patent do not mean that the components are directly connected, but refer to a better coupling structure by adding or reducing coupling accessories according to the specific implementation. Various technical features in the present invention can be combined interactively on the premise of not contradicting each other.

In addition, the devices in the present invention, such as the film laminating machine, the vacuum double-sided coating device, the water plating device and the peeling machine are all in the prior art, so they will not be described in the following description.

Example 1

In this embodiment, the production and processing system of the flexible conductive film includes a film laminating machine, a first vacuum double-sided coating device, a second vacuum double-sided coating device, a first water coating device, a second water coating device, and a peeling device. There can also be a material transfer device between each device to facilitate the transfer of the processed film substrate. Among them, the film laminating machine is mainly used for laminating the product film substrate on the substrate film substrate to form a composite Film substrate, peeling machine is mainly used to peel the product film from the substrate to obtain the product. In this embodiment, the magnetron sputtering coating layer is a magnetron sputtering alloy layer with a thickness of 2 nm. The magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer. The nickel-copper alloy layer includes 70% nickel and 30% copper by mass.

Further, the second vacuum coating device is used to form a first metal coating layer on the magnetron sputtering coating layer. In this embodiment, the first metal coating layer is a copper coating layer with a thickness of 8 nm; the first water coating device adopts alkaline The water plating equipment is used to form a transition metal plating layer on the first metal plating layer. In this embodiment, the transition metal plating layer is a copper plating layer with a thickness of 50 nm; the second water plating device adopts an acid water plating equipment, which is used for the first water plating A thickened metal coating is formed on the metal coating. In this embodiment, the thickened metal coating is a copper coating with a thickness of 600 nm. Finally, a peeling machine is used to peel off the substrate film base material and the product film base material.

After the magnetron sputtering alloy layer and the first metal plating layer are formed, the square resistance of the copper film can only reach 10-30Ω. The transition metal plating layer formed by alkaline copper plating can reduce the square resistance to less than 800mΩ, so that acidity can be carried out. Copper plated. Since the film base material of the product is PP film, PE film or PET film, thermal shrinkage and deformation will occur when the temperature exceeds a certain temperature. At the same time, during the evaporation process, high temperature particles will inevitably splash and melt through the film base material to form holes. Therefore, using the alkaline copper plating process to form a transition metal coating instead of the evaporation process can avoid the influence of the high temperature factor of the evaporation process on the bubbles and holes on the film surface, and can effectively solve the problem of bubbles and solve the original evaporation process. The high temperature copper vapor particles will break down the hole problem of the base film, which makes the product quality rate more than doubled.

As shown in Figure 1, the present invention also provides a flexible conductive film preparation process, the specific steps are as follows:

S1. Coating a layer of release agent on both sides of the substrate film substrate to form a release layer with a thickness of 0.3um.

S3, using the first vacuum coating device to coat the surface of the first composite film substrate to form a magnetron sputtering alloy layer of 2 nm;

S4, through the second vacuum coating device, form the first metal coating layer of 8 nm on the magnetron sputtering alloy layer;

S5, through the first water plating device, a transition metal coating of 50 nm is formed on the first metal coating;

S6. Using the second water plating device, a thickened metal plating layer with a thickness of 600 nm is formed on the transition metal plating layer.

S8. Pass the two rolls of the single-sided metal-plated product film in S7 through the steps S1 to S2, and when going through the S2 step, attach the metal-plated surface to the release layer, and then go through S3-S7 again to obtain Two rolls of double-sided metallized product film.

The first vacuum coating device and the second vacuum coating device are both magnetron sputtering coating devices, the first water coating device is an alkaline water coating device, and the second water coating device is an acidic water coating device.

Through the above preparation process, a transition metal coating is formed on the first metal coating, which can avoid the influence of the high temperature factor of the evaporation process on the bubbles and holes on the film surface, and can effectively solve the problem of bubbles and solve the original evaporation process. The high temperature copper vapor particles will break down the hole problem of the base film.

Example 2

The present invention provides a production and processing system for a flexible conductive film. In this embodiment, it is the same as the technical solution in Embodiment 1, except that the coated release layer, magnetron sputtering alloy layer, The thickness of the first metal coating, the transition metal coating and the thickening metal coating, in this embodiment, the thickness of the release layer is 0.7um, the thickness of the magnetron sputtering alloy layer is 6nm, and the thickness of the first metal coating is 11.5nm , the thickness of the transition metal coating is 150nm, and the thickness of the thickened metal coating is 775nm.

Example 3

The present invention provides a production and processing system and a preparation process for a flexible conductive film. In this embodiment, it is the same as the technical solution in Embodiment 1, except that the first vacuum coating device and the second vacuum coating device are different. Both are the same magnetron sputtering coating equipment, that is, the same vacuum coating device is used in the two adjacent processes.

Therefore, on the basis of the production and processing system of the flexible conductive film based on this embodiment, as shown in FIG. 1 , the present invention provides a process for preparing a flexible conductive film, which includes the following steps:

S1. Coating a layer of release agent on both sides of the substrate film substrate to form a release layer with a thickness of 1um.

S3, using a vacuum coating device to coat the surface of the first composite film substrate to form a 10 nm magnetron sputtering alloy layer;

S4, through the vacuum coating device again, a first metal coating of 8 nm is formed on the magnetron sputtering alloy layer;

S5, through the first water plating device, a transition metal coating of 250 nm is formed on the first metal coating;

S6. Using the second water plating device, a thickened metal plating layer with a thickness of 900 nm is formed on the transition metal plating layer.

Wherein, the first water plating device is an alkaline water plating device, and the second water plating device is an acidic water plating device.

It is worth noting that, in this specific embodiment, although the preparation of the alloy layer by magnetron sputtering in step S3 and the preparation of the first metal coating layer in step S4 use the same vacuum coating device, that is, the same magnetron sputtering device However, the targets used in the two processes may be different, and between the two processes, the magnetron sputtering target needs to be replaced. In this specific embodiment, the target material used in preparing the magnetron sputtering alloy layer in the S3 process is a nickel-copper alloy target material, and the target material needs to be replaced with a pure copper target material when preparing the first metal coating layer in the S4 process.

Example 4

The present invention provides a production and processing system and a preparation process for a flexible conductive film. In this embodiment, it is the same as the technical solution in Embodiment 3, and the only difference lies in the first water plating device and the second water plating device. All are acid water plating equipment. Moreover, the first water plating device and the second water plating device may be the same acid water plating equipment, that is, the same acid water plating equipment is used for repeated operations in the two processes.

Example 5

On the basis of Embodiment 2, the present invention also provides a specific embodiment for the production and processing system of the flexible conductive film, and in this embodiment, the production and processing system for the flexible conductive film also includes an array of film laminating devices , The first vacuum coating device, the second vacuum coating device, the first water coating device, the second water coating device and the stripping device.

In this embodiment, a third vacuum coating device is further arranged between the first water coating device and the second water coating device. The third vacuum coating device is used to form the second metal coating on the transition metal coating, and the thickening of the metal coating A second metal plating layer is formed. The first vacuum coating device, the second vacuum coating device and the third vacuum coating device all use magnetron sputtering coating equipment. In this embodiment, the second metal coating is a copper coating with a thickness of 8 nm. The thickness of the second metal coating can be adjusted according to actual needs, and is controlled between 8-15nm.

In this embodiment, after the product film substrate passes through the first vacuum coating device, the second vacuum coating device and the first water plating device in sequence, the copper layer on the surface of the product film substrate is not uniform and dense, while the second water coating The plating device is an acid plating device, and the acid plating solution used by the acid plating device has a strong metal dissolving effect on the metal plating layer, so the transition metal plating layer on the surface of the product film substrate formed by the alkali plating device of the first water plating device is not effective. It is recommended to directly enter the second water plating device, that is, the acid plating device for the next step of thickening the coating. It is necessary to enter the vacuum magnetron coating process again after the transition metal coating is formed, that is, the third vacuum coating device is used to form on the transition metal coating. The second metal coating. By adding a third vacuum coating device, the uniformity and compactness of the copper layer on the surface of the flexible film coil can be compensated, which can make the subsequent acid water plating process more efficient, and since the copper layer has good uniformity and compactness, The elongation rate of the flexible film roll material reaches 3%, which solves the problem of poor product elongation rate.

As shown in FIG. 2 , this embodiment also provides a preparation process of a flexible conductive film, and the preparation process of the flexible conductive film includes the following steps:

S2. Each surface of the two release layers is laminated with a layer of product film to form a first composite film substrate.

S4, through the second vacuum coating device, a first metal coating of 8 nm is formed on the magnetron sputtering alloy layer;

S5. A transition metal coating of 50 nm is formed on the first metal coating by the first water plating device; by the formation of the transition metal coating, the square resistance of the copper film formed on the outer surface of the flexible conductive film coil is reduced to below 800 mΩ;

S51, using the third vacuum coating device to form a second metal coating layer of 8 nm on the transition metal coating layer; in this step, using the second metal coating layer to make the elongation of the flexible conductive film coil greater than 3%;

S6. Using the second water plating device, a thickened metal plating layer with a thickness of 600 nm is formed on the second metal plating layer.

The first vacuum coating device, the second vacuum coating device and the third vacuum coating device are all magnetron sputtering coating devices, the first water coating device is an alkaline water coating device, and the second water coating device is an acidic water coating device.

Example 6

The present invention provides a production and processing system and a preparation process for a flexible conductive film. In this embodiment, it is the same as the technical solution in Embodiment 5, and the only difference lies in the transition metal coating and the thickening metal coating. In this embodiment, the release agent coating is 0.7um, the magnetron alloy sputtering layer is 6nm, the thickness of the first metal coating is 11.5nm, the thickness of the transition metal coating is 150nm, and the thickness of the thickening metal coating is 775nm, the second metal coating is 11.5nm.

Example 7

The present invention provides a production and processing system and a preparation process for a flexible conductive film. In this embodiment, it is the same as the technical solution in Embodiment 5, except that the first vacuum coating device and the second vacuum coating device are different. and the third vacuum coating device are the same magnetron sputtering coating device, that is, the same vacuum coating device is used in the three processes before and after.

Therefore, as shown in FIG. 2 , based on the production and processing system of the flexible conductive film provided by this embodiment, a flexible conductive film preparation process provided by the present invention includes the following steps:

S4, through the vacuum coating device again, a first metal coating of 15 nm is formed on the magnetron sputtering alloy layer;

S5, through the first water plating device, a transition metal coating of 150 nm is formed on the first metal coating;

S51: pass the vacuum coating device again to form a second metal coating with a thickness of 15 nm on the transition metal coating;

S6. Using the second water plating device, a thickened metal plating layer with a thickness of 750 nm is formed on the second metal plating layer.

It is worth noting that, in this specific embodiment, although the magnetron sputtering alloy layer is prepared in step S3, the first metal coating is prepared in the S4 process, and the second metal coating is prepared in the S51 process, the same vacuum is used. Coating equipment is the same magnetron sputtering coating equipment; however, the targets used in the three processes can be different, and the magnetron sputtering targets need to be replaced between different processes before and after. In this specific embodiment, the target material used in the preparation of the magnetron sputtering alloy layer in the S3 process is a nickel-copper alloy target, and the target material needs to be replaced when the first metal coating layer and the second metal coating layer are prepared in the S4 and S51 processes. For pure copper target.

In addition, the first water plating device and the second water plating device may both use acid water plating equipment; or both the first water plating device and the second water plating device may use alkaline water plating equipment. Even the first water plating device and the second water plating device can use the same equipment.

The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the described embodiments, and those skilled in the art can also make various equivalent deformations or replacements on the premise that does not violate the spirit of the present invention , these equivalent modifications or substitutions are all included within the scope defined by the claims of the present application.

Claims

A production and processing system for a flexible conductive film, comprising:

The film laminating device is used for laminating the product film base material and the substrate film base material to form a composite film base material;

a first vacuum coating device for forming a magnetron sputtering coating on the surface of the composite film substrate;

The second vacuum coating device, located behind the first vacuum coating device, is used for forming the first metal coating on the magnetron sputtering coating;

a first water plating device, located behind the second vacuum coating device, for forming a transition metal coating on the first metal coating;

The second water plating device, located behind the first water plating device, is used for forming a thickened metal plating layer on the transition metal plating layer.

The film peeling device is used for peeling off the product film base material and the substrate film base material.
The flexible conductive film production and processing system according to claim 1, wherein the film laminating device is a film laminating machine, and the peeling device is a peeling machine.
The production and processing system of the flexible conductive film according to claim 1, wherein: the first water plating device adopts an alkaline water plating device, and the second water plating device adopts an acid water plating device; or the first water plating device adopts an alkaline water plating device; Both the device and the second water plating device use acid water plating equipment.
The production and processing system for flexible conductive films according to claim 3, wherein a third vacuum coating device is further arranged between the first water coating device and the second water coating device, and the third vacuum coating device uses A second metal coating is formed on the transition metal coating, and the thickened metal coating is formed on the second metal coating.
The production and processing system for a flexible conductive film according to claim 4, wherein the metal plated on the first metal coating, the transition metal coating, the second metal coating and the thickened metal coating is copper, that is, the first metal coating is copper. The first metal coating, the transition metal coating, the second metal coating and the thickened metal coating are all copper coating layers.
The production and processing system for flexible conductive films according to claim 4, wherein the first vacuum coating device, the second vacuum coating device and the third vacuum coating device all use magnetron sputtering coating equipment, and the first metal The thickness of the plating layer and the second metal plating layer are both 8-15 nm.
The flexible conductive film production and processing system according to claim 6, wherein the first vacuum coating device, the second vacuum coating device and the third vacuum coating device can be the same magnetron sputtering coating equipment.
The production and processing system for a flexible conductive film according to claim 1, wherein the magnetron sputtering coating is a magnetron sputtering alloy layer, and the magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy. Floor.
The production and processing system of the flexible conductive film according to claim 1, wherein the thickness of the magnetron sputtering coating is 2-10 nm.
The production and processing system of the flexible conductive film according to claim 1, wherein the thickness of the transition metal coating is 50-250 nm.
The production and processing system of the flexible conductive film according to claim 1, wherein the thickness of the thickened metal plating layer is 600-950 nm.
The flexible conductive film production and processing system according to claim 1, wherein the substrate film base material includes but is not limited to PP film, PE film or PET film.
The production and processing system of flexible conductive film according to claim 1, is characterized in that: described product film base material includes but not limited to PP film, PE film or PET film.
A preparation process of a flexible conductive film, which is used for coating a metal film on the surface of a film substrate, is characterized in that the preparation process comprises the following steps:

S1. Coating a layer of release agent on both sides of the substrate film substrate to form a release layer with a thickness of 0.3-1um.

S2. Each surface of the two release layers is laminated with a layer of product film base material to form a first composite film base material.

S3, using a vacuum coating device to coat the surface of the first composite film substrate to form a magnetron sputtering alloy layer of 2-10 nm;

S4, forming a first metal coating layer of 8-15 nm on the magnetron sputtering alloy layer by a vacuum coating device;

S5, through the first water plating device, a transition metal coating of 50-250 nm is formed on the first metal coating;

S6. Using the second water plating device, a thickened metal plating layer with a thickness of 600-950 nm is formed on the transition metal plating layer.

S7, peeling off the substrate film base material and the two-layer product base material from the release layer, thereby simultaneously obtaining two rolls of product films plated with metal on one side.

S8. The two rolls of the single-sided metal-plated product film in S7 go through the steps S1 to S2, and when the S2 step is passed, the metal-plated surface is attached to the release layer, and then passes through S3-S7 to obtain two Rolls are double-sided metallized product films.
The preparation process of the flexible conductive film according to claim 14, characterized in that: between the step S5 and the step S6, there is a step S51: forming a second metal of 8-15 nm on the transition metal coating by a vacuum coating device coating;

The step S6 is: forming a thickened metal plating layer with a thickness of 600-950 nm on the second metal plating layer by the second water plating device.
The preparation process of the flexible conductive film according to claim 15, wherein in the step S51, the uniformity and compactness of the overall coating of the flexible conductive film are compensated by the second metal plating layer formed, so that the film roll is The elongation of the material is not less than 3%.
The preparation process of the flexible conductive film according to claim 14, characterized in that: in the step S5, by forming the transition metal coating, the square resistance of the metal coating formed on the outer surface of the flexible conductive film is reduced to less than 800mΩ.
The preparation process of the flexible conductive film according to claim 14, wherein: the first water plating device adopts alkaline water plating equipment, and the second water plating device adopts acid water plating equipment; or the first water plating device Both the first water plating device and the second water plating device use acid water plating equipment; or both the first water plating device and the second water plating device use alkaline water plating equipment.
The preparation process of the flexible conductive film according to claim 14, wherein the first water plating device and the second water plating device use the same acid water plating equipment.