WO2022047949A1 - Système de traitement de production et procédé de préparation de film conducteur flexible - Google Patents

Système de traitement de production et procédé de préparation de film conducteur flexible Download PDF

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WO2022047949A1
WO2022047949A1 PCT/CN2020/123852 CN2020123852W WO2022047949A1 WO 2022047949 A1 WO2022047949 A1 WO 2022047949A1 CN 2020123852 W CN2020123852 W CN 2020123852W WO 2022047949 A1 WO2022047949 A1 WO 2022047949A1
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Prior art keywords
coating
film
metal
layer
flexible conductive
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PCT/CN2020/123852
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English (en)
Chinese (zh)
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贾孟
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昆山鑫美源电子科技有限公司
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper

Definitions

  • the invention relates to the field of flexible roll material processing, and more specifically, the invention relates to a production and processing system and a preparation process of a flexible conductive film roll material.
  • Vacuum coating mainly refers to a type of coating that needs to be carried out under high vacuum, including many types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition and many others. It is mainly divided into two types: evaporation and sputtering. Evaporation coating generally heats the target material to evaporate the surface components in the form of atomic groups or ions, and settles on the surface of the substrate to form a thin film through the film formation process (scattered point-island structure-vagal structure-layered growth).
  • sputtering coating it can be simply understood as bombarding the target with electrons or high-energy lasers, and sputtering the surface components in the form of atomic groups or ions, and finally depositing them on the surface of the substrate, going through the film-forming process, and finally forming a thin film .
  • Chinese patent document CN108531876A discloses a coating process, and specifically discloses the following content: it is to coat a metal film on an ultra-thin substrate to obtain a coating product that can improve adhesion.
  • the process is as follows.
  • the magnetron coating is 5-50nm, and then the water coating is 600-1000nm; or the process is as follows, the magnetron coating is first used on the surface of the ultra-thin substrate for 5-50nm, then the evaporation coating is 100-700nm, and the final water coating is 100-800nm.
  • the properties of the substrate, the coating (metal coating) and the thickness range of the coating are a good combination. On this basis, the film between the magnetron coating and the water coating The binding force has been better reflected.
  • the problem of bubble string the base film used in flexible conductive film coil products is a stretching process. Local deformation is prone to occur during the process. During the evaporation coating process, due to the high temperature of the evaporation coating process, the deformation of the base film will be deteriorated, resulting in a series of deformations in the film running direction, which is called string bubbles.
  • the purpose of the present invention is to provide a flexible conductive film production and processing system and a preparation process, so as to improve the problem of bubbles and holes in the production process of the flexible conductive film, and the overall good rate of the product after the production is over. low problem.
  • a production and processing system for a flexible conductive film which includes:
  • a film laminating device for laminating the product film base material and the substrate film base material to form a composite film
  • a first vacuum coating device for forming a magnetron sputtering coating on the surface of the composite film substrate
  • a film peeling device for peeling the substrate film base material and the product film base material from the release layer.
  • the film laminating device is a film laminating machine
  • the film peeling device is a peeling machine
  • the first water plating device can use one of alkaline water plating equipment and acid water plating equipment, and the second water plating device uses acidic water plating equipment.
  • a third vacuum coating device is further provided between the first water coating device and the second water coating device, and the third vacuum coating device is used to form a second metal coating on the transition metal coating to increase the thickness
  • the metal plating layer is formed on the second metal plating layer.
  • the metals plated on the first metal coating, the transition metal coating, the second metal coating and the thickening metal coating are all copper, that is, the first metal coating, the transition metal coating, the second metal coating and the thickening metal coating
  • the metal plating layers are all copper plating layers.
  • the first vacuum coating device, the second vacuum coating device and the third vacuum coating device all use magnetron sputtering coating equipment, and the thicknesses of the first metal coating and the second metal coating are both 8-15nm .
  • the first vacuum coating device, the second vacuum coating device and the third vacuum coating device may be the same magnetron sputtering coating equipment.
  • the magnetron sputtering coating is a magnetron sputtering alloy layer
  • the magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer.
  • the thickness of the magnetron sputtering coating is 2-10 nm.
  • the thickness of the transition metal coating is 50-250 nm.
  • the thickness of the thickened metal plating layer is 600-950 nm.
  • the substrate film substrate includes but is not limited to PP film, PE film or PET film.
  • the product film substrate includes but is not limited to PP film, PE film or PET film.
  • the present invention also provides a preparation process of the flexible conductive film, comprising:
  • Each surface of the two release layers is laminated with a layer of product film base material to form a first composite film base material.
  • step S51 between step S5 and step S6: forming a second metal coating of 8-15 nm on the transition metal coating by a vacuum coating device;
  • the step S6 is: forming a thickened metal plating layer with a thickness of 600-950 nm on the second metal plating layer by the second water plating device.
  • step S51 the formed second metal plating layer compensates the uniformity and compactness of the overall plating layer of the flexible conductive film, so that the elongation rate of the film coil is not less than 3%.
  • step S5 by forming the transition metal coating, the square resistance of the metal coating formed on the outer surface of the flexible conductive film is reduced to less than 800 m ⁇ .
  • the first water plating device adopts alkaline water plating equipment
  • the second water plating device adopts acid water plating equipment; or both the first water plating device and the second water plating device adopt acidic water plating equipment; or the first water plating device adopts acid water plating equipment; Both the device and the second water plating device use alkaline water plating equipment.
  • the beneficial effects of the present invention are: because the water plating equipment is used instead of the vacuum evaporation equipment, the existence of the transition metal coating can avoid the influence of the high temperature factor of the evaporation process on the bubbles and holes on the film surface, and can effectively solve the problem of bubbles. ; At the same time, it solves the hole problem that the high-temperature metal particles of the original evaporation process break down the base film, which can increase the product quality rate by more than one time.
  • Fig. 1 is the embodiment flow chart of the preparation process of the flexible conductive film of the present invention
  • FIG. 2 is a flow chart of another embodiment of the preparation process of the flexible conductive film of the present invention.
  • the devices in the present invention such as the film laminating machine, the vacuum double-sided coating device, the water plating device and the peeling machine are all in the prior art, so they will not be described in the following description.
  • the production and processing system of the flexible conductive film includes a film laminating machine, a first vacuum double-sided coating device, a second vacuum double-sided coating device, a first water coating device, a second water coating device, and a peeling device.
  • a material transfer device between each device to facilitate the transfer of the processed film substrate.
  • the film laminating machine is mainly used for laminating the product film substrate on the substrate film substrate to form a composite Film substrate
  • peeling machine is mainly used to peel the product film from the substrate to obtain the product.
  • the magnetron sputtering coating layer is a magnetron sputtering alloy layer with a thickness of 2 nm.
  • the magnetron sputtering alloy layer is a nickel-chromium alloy layer or a nickel-copper alloy layer.
  • the nickel-copper alloy layer includes 70% nickel and 30% copper by mass.
  • the second vacuum coating device is used to form a first metal coating layer on the magnetron sputtering coating layer.
  • the first metal coating layer is a copper coating layer with a thickness of 8 nm; the first water coating device adopts alkaline
  • the water plating equipment is used to form a transition metal plating layer on the first metal plating layer.
  • the transition metal plating layer is a copper plating layer with a thickness of 50 nm;
  • the second water plating device adopts an acid water plating equipment, which is used for the first water plating
  • a thickened metal coating is formed on the metal coating.
  • the thickened metal coating is a copper coating with a thickness of 600 nm.
  • a peeling machine is used to peel off the substrate film base material and the product film base material.
  • the square resistance of the copper film can only reach 10-30 ⁇ .
  • the transition metal plating layer formed by alkaline copper plating can reduce the square resistance to less than 800m ⁇ , so that acidity can be carried out. Copper plated. Since the film base material of the product is PP film, PE film or PET film, thermal shrinkage and deformation will occur when the temperature exceeds a certain temperature. At the same time, during the evaporation process, high temperature particles will inevitably splash and melt through the film base material to form holes.
  • using the alkaline copper plating process to form a transition metal coating instead of the evaporation process can avoid the influence of the high temperature factor of the evaporation process on the bubbles and holes on the film surface, and can effectively solve the problem of bubbles and solve the original evaporation process.
  • the high temperature copper vapor particles will break down the hole problem of the base film, which makes the product quality rate more than doubled.
  • the present invention also provides a flexible conductive film preparation process, the specific steps are as follows:
  • Each surface of the two release layers is laminated with a layer of product film base material to form a first composite film base material.
  • the first vacuum coating device and the second vacuum coating device are both magnetron sputtering coating devices, the first water coating device is an alkaline water coating device, and the second water coating device is an acidic water coating device.
  • a transition metal coating is formed on the first metal coating, which can avoid the influence of the high temperature factor of the evaporation process on the bubbles and holes on the film surface, and can effectively solve the problem of bubbles and solve the original evaporation process.
  • the high temperature copper vapor particles will break down the hole problem of the base film.
  • the present invention provides a production and processing system for a flexible conductive film.
  • it is the same as the technical solution in Embodiment 1, except that the coated release layer, magnetron sputtering alloy layer,
  • the thickness of the first metal coating, the transition metal coating and the thickening metal coating in this embodiment, the thickness of the release layer is 0.7um, the thickness of the magnetron sputtering alloy layer is 6nm, and the thickness of the first metal coating is 11.5nm , the thickness of the transition metal coating is 150nm, and the thickness of the thickened metal coating is 775nm.
  • the present invention provides a production and processing system and a preparation process for a flexible conductive film.
  • it is the same as the technical solution in Embodiment 1, except that the first vacuum coating device and the second vacuum coating device are different. Both are the same magnetron sputtering coating equipment, that is, the same vacuum coating device is used in the two adjacent processes.
  • the present invention provides a process for preparing a flexible conductive film, which includes the following steps:
  • Each surface of the two release layers is laminated with a layer of product film base material to form a first composite film base material.
  • the first water plating device is an alkaline water plating device
  • the second water plating device is an acidic water plating device
  • the preparation of the alloy layer by magnetron sputtering in step S3 and the preparation of the first metal coating layer in step S4 use the same vacuum coating device, that is, the same magnetron sputtering device
  • the targets used in the two processes may be different, and between the two processes, the magnetron sputtering target needs to be replaced.
  • the target material used in preparing the magnetron sputtering alloy layer in the S3 process is a nickel-copper alloy target material, and the target material needs to be replaced with a pure copper target material when preparing the first metal coating layer in the S4 process.
  • the present invention provides a production and processing system and a preparation process for a flexible conductive film.
  • it is the same as the technical solution in Embodiment 3, and the only difference lies in the first water plating device and the second water plating device. All are acid water plating equipment.
  • the first water plating device and the second water plating device may be the same acid water plating equipment, that is, the same acid water plating equipment is used for repeated operations in the two processes.
  • the present invention also provides a specific embodiment for the production and processing system of the flexible conductive film, and in this embodiment, the production and processing system for the flexible conductive film also includes an array of film laminating devices , The first vacuum coating device, the second vacuum coating device, the first water coating device, the second water coating device and the stripping device.
  • a third vacuum coating device is further arranged between the first water coating device and the second water coating device.
  • the third vacuum coating device is used to form the second metal coating on the transition metal coating, and the thickening of the metal coating A second metal plating layer is formed.
  • the first vacuum coating device, the second vacuum coating device and the third vacuum coating device all use magnetron sputtering coating equipment.
  • the second metal coating is a copper coating with a thickness of 8 nm. The thickness of the second metal coating can be adjusted according to actual needs, and is controlled between 8-15nm.
  • the copper layer on the surface of the product film substrate is not uniform and dense, while the second water coating
  • the plating device is an acid plating device, and the acid plating solution used by the acid plating device has a strong metal dissolving effect on the metal plating layer, so the transition metal plating layer on the surface of the product film substrate formed by the alkali plating device of the first water plating device is not effective. It is recommended to directly enter the second water plating device, that is, the acid plating device for the next step of thickening the coating.
  • the third vacuum coating device is used to form on the transition metal coating.
  • the second metal coating By adding a third vacuum coating device, the uniformity and compactness of the copper layer on the surface of the flexible film coil can be compensated, which can make the subsequent acid water plating process more efficient, and since the copper layer has good uniformity and compactness, The elongation rate of the flexible film roll material reaches 3%, which solves the problem of poor product elongation rate.
  • this embodiment also provides a preparation process of a flexible conductive film, and the preparation process of the flexible conductive film includes the following steps:
  • Each surface of the two release layers is laminated with a layer of product film to form a first composite film substrate.
  • a transition metal coating of 50 nm is formed on the first metal coating by the first water plating device; by the formation of the transition metal coating, the square resistance of the copper film formed on the outer surface of the flexible conductive film coil is reduced to below 800 m ⁇ ;
  • the first vacuum coating device, the second vacuum coating device and the third vacuum coating device are all magnetron sputtering coating devices, the first water coating device is an alkaline water coating device, and the second water coating device is an acidic water coating device.
  • the present invention provides a production and processing system and a preparation process for a flexible conductive film.
  • it is the same as the technical solution in Embodiment 5, and the only difference lies in the transition metal coating and the thickening metal coating.
  • the release agent coating is 0.7um
  • the magnetron alloy sputtering layer is 6nm
  • the thickness of the first metal coating is 11.5nm
  • the thickness of the transition metal coating is 150nm
  • the thickness of the thickening metal coating is 775nm
  • the second metal coating is 11.5nm.
  • the present invention provides a production and processing system and a preparation process for a flexible conductive film.
  • it is the same as the technical solution in Embodiment 5, except that the first vacuum coating device and the second vacuum coating device are different. and the third vacuum coating device are the same magnetron sputtering coating device, that is, the same vacuum coating device is used in the three processes before and after.
  • a flexible conductive film preparation process provided by the present invention includes the following steps:
  • Each surface of the two release layers is laminated with a layer of product film to form a first composite film substrate.
  • S51 pass the vacuum coating device again to form a second metal coating with a thickness of 15 nm on the transition metal coating;
  • the first water plating device is an alkaline water plating device
  • the second water plating device is an acidic water plating device
  • the magnetron sputtering alloy layer is prepared in step S3, the first metal coating is prepared in the S4 process, and the second metal coating is prepared in the S51 process, the same vacuum is used.
  • Coating equipment is the same magnetron sputtering coating equipment; however, the targets used in the three processes can be different, and the magnetron sputtering targets need to be replaced between different processes before and after.
  • the target material used in the preparation of the magnetron sputtering alloy layer in the S3 process is a nickel-copper alloy target, and the target material needs to be replaced when the first metal coating layer and the second metal coating layer are prepared in the S4 and S51 processes. For pure copper target.
  • first water plating device and the second water plating device may both use acid water plating equipment; or both the first water plating device and the second water plating device may use alkaline water plating equipment. Even the first water plating device and the second water plating device can use the same equipment.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un système de traitement de production et un procédé de préparation d'un film conducteur flexible, se rapportant au domaine des revêtements de matériau de base. Le système de traitement de production comprend un dispositif de stratification de film utilisé pour stratifier un matériau de base de film de produit et un matériau de base de film de substrat pour former un film composite ; un premier dispositif de revêtement sous vide utilisé pour former un revêtement de pulvérisation magnétron sur une surface du matériau de base de film composite ; un deuxième dispositif de revêtement sous vide situé derrière le premier dispositif de revêtement sous vide et utilisé pour former une première couche de revêtement métallique sur le revêtement de pulvérisation magnétron ; un premier dispositif de revêtement aqueux situé derrière le deuxième dispositif de revêtement sous vide, et utilisant un appareil de revêtement aqueux alcalin pour former une couche de revêtement de métal de transition sur la première couche de revêtement métallique ; un deuxième dispositif de revêtement aqueux situé derrière un troisième dispositif de revêtement sous vide, et utilisant un appareil de revêtement aqueux acide pour former une couche de revêtement métallique épaissie sur la première couche de revêtement métallique ; et un dispositif de décapage utilisé pour décaper le matériau de base de film de produit sur le matériau de base de film de substrat. Le système et le procédé de préparation peuvent éviter l'influence de facteurs de température élevée d'un processus d'évaporation sur les trous et le cordon de bulles de surface de film, peut résoudre efficacement le problème de cordon de bulles, et en outre, résout le problème de trou d'un processus d'évaporation initial, moyennant quoi un film de base est perforé par des particules métalliques à haute température.
PCT/CN2020/123852 2020-09-05 2020-10-27 Système de traitement de production et procédé de préparation de film conducteur flexible WO2022047949A1 (fr)

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CN202010912868.4 2020-09-05
CN202010912868.4A CN111876743A (zh) 2020-09-05 2020-09-05 柔性导电薄膜的生产加工系统及制备工艺

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CN115537811A (zh) * 2022-10-20 2022-12-30 蹇印军 一种复合金属膜及其制备方法

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CN114381695A (zh) * 2021-12-31 2022-04-22 重庆金美新材料科技有限公司 一种薄膜生产线和薄膜生产方法
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CN114752906A (zh) * 2022-04-22 2022-07-15 广东欣丰科技有限公司 一种导电布及其制备方法和应用
CN115537811A (zh) * 2022-10-20 2022-12-30 蹇印军 一种复合金属膜及其制备方法

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