WO2024082184A1 - Procédé de préparation d'une membrane composite et appareil de préparation d'une membrane composite - Google Patents

Procédé de préparation d'une membrane composite et appareil de préparation d'une membrane composite Download PDF

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WO2024082184A1
WO2024082184A1 PCT/CN2022/126261 CN2022126261W WO2024082184A1 WO 2024082184 A1 WO2024082184 A1 WO 2024082184A1 CN 2022126261 W CN2022126261 W CN 2022126261W WO 2024082184 A1 WO2024082184 A1 WO 2024082184A1
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base film
film layer
base
metal film
composite
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PCT/CN2022/126261
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English (en)
Chinese (zh)
Inventor
雷克武
张如成
伍平生
王岳利
尚鲲鹏
王伟
薛颜同
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宁德时代新能源科技股份有限公司
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Priority to PCT/CN2022/126261 priority Critical patent/WO2024082184A1/fr
Publication of WO2024082184A1 publication Critical patent/WO2024082184A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/531—Electrode connections inside a battery casing
    • H01M50/536—Electrode connections inside a battery casing characterised by the method of fixing the leads to the electrodes, e.g. by welding

Definitions

  • the present application relates to the field of film coating technology, and in particular to a method for preparing a composite film and a device for preparing the composite film.
  • the electrode is one of the important components that affect the performance of the battery, such as safety and energy density.
  • composite current collector electrodes In order to improve the safety performance and energy density of batteries, composite current collector electrodes have emerged.
  • the composite membranes currently disclosed for preparing composite current collectors due to the poor heat resistance of the organic film layer contained therein, the composite membranes have defects such as wrinkles and holes during the preparation process, resulting in low yield rates.
  • the composite membranes As the thickness of the composite current collectors is required to be thinner and thinner, the composite membranes have more and more defects such as wrinkles and holes during the preparation process, and the membrane breaks, which further reduces the yield rate of the composite membranes.
  • the embodiments of the present application provide a method for preparing a composite membrane and an apparatus for preparing a composite membrane, so as to solve the technical problem that the method for preparing a composite membrane leads to a low yield rate of the composite membrane.
  • the present invention provides a method for preparing a composite film, comprising the following steps:
  • a composite base film is provided, wherein the composite base film comprises n layers of base films, wherein the first base film to the nth base film are sequentially denoted as base films M1 to Mn , wherein the base films M1 to Mn are sequentially stacked along a thickness direction of the composite base film, and n is an integer ⁇ 2;
  • a second coating treatment is performed on each of them, so as to form a metal film layer N 12 on at least the surface M 1b and a metal film layer N 21 on at least the surface M 2a ;
  • the method for preparing the composite film of the embodiment of the present application forms the composite base film by arranging at least two layers of base films in the thickness direction, which effectively improves the thermal stability of the composite base film during the first coating process, thereby ensuring the quality of the metal film layer N11 and the metal film layer Nn2 formed during the first coating process.
  • the method for preparing the composite film of the embodiment of the present application can realize the formation of a metal film layer on the surface of a base film with a thickness lower than that of a conventional base film, effectively ensuring the quality of the metal film layer formed on the surface of each base film, thereby significantly improving the yield rate of the prepared composite film.
  • each base film has good thermal stability during each coating process, the thickness of the metal film layer formed once in each coating process can be significantly increased to reduce the number of coating times, thereby avoiding oxidation of the metal film layer, giving each formed metal film layer a low resistivity, and effectively improving the production efficiency of the composite film.
  • each coating process is an evaporation process. Forming each metal film layer by evaporation process can improve the quality of the metal film layer and the efficiency of each coating process, and in combination with the composite base film structure, on the basis of improving the yield rate of the composite film, further improve the production efficiency of the composite film.
  • At least one of the coating processes includes at least one of the following conditions:
  • the coating rate is 15-300 m/min
  • Wire feeding rate is 300-500cm/min
  • the diameter of the metal wire is 1.8 to 2.5 mm;
  • the power of the evaporation boat is 15-30KW;
  • each coating process that is, the evaporation process
  • the quality of each prepared metal film layer can be effectively guaranteed.
  • At least one of the coating processes further includes a step of cooling the base film on which the metal film layer is formed.
  • the temperature of each base film can be reduced in time, thereby improving the thermal stability of each base film and improving the quality of each metal film layer.
  • the cooling process is to cool the base film using a cooling roller, so as to cooperate with the evaporation process to improve the efficiency of forming each metal film layer.
  • the rotation speed of the cooling roller is 15-300 m/min.
  • the base film after the cooling treatment is 15-35°C.
  • the cooling effect of each base film can be improved, the thermal stability of each base film can be improved, and the quality of each metal film layer can be improved.
  • the thickness of each metal film layer formed on the surface of each base film is independently 0.8 to 1.5 ⁇ m. Based on the structure of the composite base film, the thickness of each metal film layer formed by each coating process such as evaporation process can be increased, thereby improving the production efficiency of the composite film while improving the quality of each metal film layer.
  • a thickened metal film layer is further formed on the outer surface of the metal film layer N (n-1) 1 formed on the surface M (n-1) a of the base film M n-1 .
  • a thickened metal film layer is further formed on the outer surface of the metal film layer N n2 formed on the surface M nb of the base film M n .
  • the thickness of the thickened metal film layer is 0.8-1.5 ⁇ m.
  • the thickness of the metal film layer can be further increased, thereby improving the conductive performance and production efficiency of the composite film.
  • each base film is subjected to at least one of pretreatment, coating treatment, and separation treatment in sequence by unwinding and rewinding.
  • the pretreatment includes performing a primer coating treatment on the surface of the base film to be formed with the metal film layer or performing a primer coating treatment after performing an ion surface treatment.
  • the ion surface treatment is used to improve the quality of the primer film layer formed by the primer coating treatment.
  • the primer film layer formed by the primer coating treatment can enhance the strength of the combination of each metal film layer and each base film and improve the quality of each metal film layer.
  • the base coating process is a base evaporation process.
  • the base evaporation treatment includes at least one of the following conditions:
  • the base coating rate is 200-500 m/min
  • the wire feeding rate for base coating is 20-50cm/min;
  • the power of the bottom evaporation boat is 5-10KW;
  • the bottom vacuum pressure is 10 -4 ⁇ 10 -2 Pa.
  • the quality of the primer film layer formed on the surface of each base film can be effectively improved, thereby further improving the quality of each metal film layer and the bonding strength between each metal film layer and the base film surface.
  • the material of the base film layer formed by the base coating process includes at least one of metal oxide and metal nitride.
  • the thickness of the base film layer formed by the base coating process is independently 5 to 100 nm.
  • the quality of each metal film layer can be improved and the bonding strength between the metal film layer and the surface of each base film can be enhanced.
  • the material of each of the base films independently comprises a polymer material.
  • the thickness of each base film is independently 3 to 6 ⁇ m.
  • each base film further includes a conductive additive dispersed in the polymer material.
  • a conductive additive dispersed in the polymer material.
  • the content of the conductive additive in each of the base films is independently 10% to 80%.
  • the conductive additive includes at least one of conductive particles, conductive sheets, and conductive fibers.
  • the dispersion amount and morphology of the conductive additive in each single-layer base film By controlling the dispersion amount and morphology of the conductive additive in each single-layer base film, it can be effectively dispersed in each base film to form a stable and rich conductive network, thereby improving the conductivity, mechanical properties and thermal stability of the base film, and further improving the yield of the composite film.
  • a release film is stacked between two adjacent base films, and the release film is separated and removed while the base film M1 or the base films M1 to Mn -1 are separated and processed from the composite base film in sequence.
  • each base film can be separated and processed from the composite base film in sequence.
  • an embodiment of the present application provides a device for preparing a composite film, comprising:
  • a pretreatment unit used for pretreatment of the surface of the composite base film or base film, wherein the composite base film comprises n layers of base films stacked in a thickness direction, wherein n is an integer ⁇ 2;
  • a coating unit used for coating the surface of the composite base film or base film treated by the pretreatment unit to form a metal film layer on the surface of the composite base film or base film;
  • the base film separation unit is used to separate the base film after being plated by the coating unit from the composite base film.
  • the device for preparing the composite film in the embodiment of the present application is connected in sequence by setting a pretreatment unit, a coating unit and a base film separation unit in accordance with the composite film preparation process, so that the base film surface can be effectively pretreated and coated, thereby forming a metal layer on the base film surface, and the stacked base films can be separated from the composite base film layer by layer, and the newly exposed base film surface can be pretreated and coated for the second time.
  • the prepared composite film has high quality and high yield, and the thickness of the metal layer formed by the first coating treatment is increased, which significantly improves the production efficiency of the composite film.
  • the pretreatment unit includes a bottom coating component or includes a bottom coating component and an ion surface treatment component; when the bottom coating component and the ion surface treatment component are included, the ion surface treatment component and the bottom coating component are connected in the order of first performing ion surface treatment on the surface of the base film and then performing bottom coating treatment.
  • the surface of the base film can be pretreated including ion surface treatment and bottom coating treatment, thereby improving the quality of the metal film layer formed by the coating treatment in the coating unit.
  • the coating unit includes more than two coating units, and the coating units are separately arranged on both sides of the composite base film or base film.
  • the coating units are arranged on both sides of the base film so that one surface or both surfaces of the base film can be coated at the same time as needed.
  • a metal film thickness control unit which includes a metal film detection module, a data processing module and a control module; the metal film detection module is used to detect the thickness data of the metal film layer and send it to the data processing module; the data processing module receives the thickness data and sends it to the control module; the control module is connected to the coating unit, and controls the coating unit to perform the coating process according to the thickness data.
  • the metal film thickness control unit can monitor the thickness of the metal film layer formed by the coating unit on the surface of the corresponding base film in real time, and adjust the coating process conditions, so as to improve the automation and intelligence of the device for preparing the composite film in the embodiment of the present application, thereby improving the production efficiency and yield rate of the composite film.
  • a film conveying unit is further included, and the film conveying unit includes a unwinding roller, a control roller and a winding roller.
  • the unwinding roller is arranged before the pretreatment unit performs the pretreatment process, and is used for unwinding the composite base film or base film;
  • the control roller is arranged before and after the composite base film or base film is treated by at least one of the pretreatment unit, the coating unit and the base film separation unit;
  • the winding roller is arranged after the coating unit performs the coating process or/and after the base film separation unit performs the separation process.
  • the setting of the membrane conveying unit enables the device for preparing the composite membrane in the embodiment of the present application to continuously perform various treatments on the composite base membrane or base membrane, thereby improving the production efficiency of the device for preparing the composite membrane in the embodiment of the present application, and improving the quality stability of the prepared composite membrane, thereby improving the yield rate of the composite membrane.
  • the control roller includes a passing roller, a flattening roller, a vapor deposition roller, a deflection correction roller and a cooling roller.
  • the passing roller is arranged on the path of the composite base film or base film through the corresponding processing process
  • the vapor deposition roller is arranged at the coating unit
  • the flattening roller is arranged on both sides of the vapor deposition roller
  • the cooling roller is arranged on the film outlet side of the vapor deposition roller
  • the deflection correction roller is arranged on the film inlet side of the winding roller.
  • the control roller can improve the quality of each base film in the continuous processing process through the various functional rollers contained in it, in cooperation with the unwinding roller and the winding roller, and improve the quality stability of the prepared composite film.
  • FIG1 is a schematic diagram of a process for preparing a composite membrane according to an embodiment of the present application, wherein the composite base membrane comprises two stacked base membranes;
  • FIG2 is a schematic flow diagram of a method for preparing a composite membrane according to an embodiment of the present application, wherein the composite base membrane contains more than two layers of base membrane;
  • FIG3 is a schematic diagram of the structure of a device for preparing a composite membrane according to an embodiment of the present application
  • FIG4 is a schematic structural diagram of an implementation of a secondary battery in an embodiment of the present application.
  • FIG5 is an exploded schematic diagram of the secondary battery shown in FIG4 ;
  • FIG6 is a schematic structural diagram of an implementation scheme of a battery module according to an embodiment of the present application.
  • FIG7 is a schematic structural diagram of an implementation scheme of a battery pack according to an embodiment of the present application.
  • FIG8 is a schematic diagram of the exploded structure of the battery pack shown in FIG7 ;
  • FIG. 9 is a schematic diagram of an embodiment of an electric device including a secondary battery according to an embodiment of the present application as a power source.
  • M1a and M1b are two opposite surfaces of the first base film
  • M2a and M2b are two opposite surfaces of the second base film
  • M (n-1)a and M (n-1)b are two opposite surfaces of the n-1th base film
  • Mna and Mvb are two opposite surfaces of the nth base film
  • N 11 a metal film layer bonded to the surface M 1a of the first base film
  • N 12 a metal film layer bonded to the surface M 1b of the first base film
  • N 21 a metal film layer bonded to the surface M 2a of the second base film
  • N 22 a metal film layer bonded to the surface M 2b of the second base film
  • N (n-1)1 a metal film layer bonded to a surface M (n-1)a of the n-1th base film
  • N (n-1)2 a metal film layer bonded to a surface M (n-1)b of the n-1th base film
  • N n1 a metal film layer bonded to a surface M na of an n-th base film, N n2 , a metal film layer bonded to a surface M nb of an n-th base film;
  • Metal film thickness control unit 31. Metal film detection module, 32. Control module;
  • film conveying unit 41, unwinding roller, 42, passing roller, 43, flattening roller, 44, evaporation roller, 45, deviation correction roller, 46, winding roller;
  • Secondary battery 51. Housing, 52. Electrode assembly, 53. Cover plate;
  • the term "and/or" is only a description of the association relationship of associated objects, indicating that three relationships may exist.
  • a and/or B can represent: A exists alone, A and B exist at the same time, and B exists alone.
  • the character "/" in this article generally indicates that the associated objects before and after are in an "or" relationship.
  • multiple refers to more than two (including two).
  • multiple groups refers to more than two groups (including two groups), and “multiple pieces” refers to more than two pieces (including two pieces).
  • the composite film refers to a single-layer base film having two opposite surfaces, and metal layers are respectively laminated and bonded on the two opposite surfaces.
  • Power batteries are not only used in energy storage power systems such as hydropower, thermal power, wind power and solar power stations, but also widely used in electric vehicles such as electric bicycles, electric motorcycles, electric cars, as well as military equipment and aerospace and other fields.
  • energy storage power systems such as hydropower, thermal power, wind power and solar power stations
  • electric vehicles such as electric bicycles, electric motorcycles, electric cars, as well as military equipment and aerospace and other fields.
  • the market demand is also constantly expanding, and at the same time, the requirements for battery safety, energy density and other performance are becoming higher and higher.
  • the high temperature of the evaporation causes the prepared composite film to be prone to defects such as wrinkles and holes, resulting in a low yield rate of the composite film.
  • the thickness of the composite membrane is required to be thinner and thinner, so it is necessary to reduce the thickness of the organic membrane contained in the composite membrane. This further exacerbates the phenomenon of wrinkles, holes and other defects in the composite membrane during the preparation process.
  • the thinner the composite membrane the more limited the tension control adjustment space, the film is more likely to break, further reducing the yield rate of the composite membrane.
  • the current common practice is to increase the thickness of the organic film to increase the high-temperature stability of the organic film in the evaporation process. Therefore, the thickness of the organic film contained in the currently disclosed composite film is generally higher than 6 ⁇ m. It is precisely because of the large thickness of the organic film contained in the existing composite film that it directly leads to a decrease in the energy density of the battery cell when used as a composite current collector; at the same time, the high thickness of the composite current collector also leads to difficulties in welding the tabs contained in the battery cell. For example, ultrasonic welding is prone to cause problems such as cold welding or even welding failure.
  • the inventors further found that it is precisely because of multiple evaporation that the risk of oxidation of the metal film increases sharply, resulting in an increase in the resistivity of the formed metal film and a significant decrease in the preparation efficiency. That is, the use of multiple evaporation methods does not significantly improve the yield rate of the composite film, and further leads to a decrease in the efficiency of composite film layer preparation and an increase in the resistivity of the prepared composite film layer.
  • the inventors proposed the following composite film preparation method to significantly improve the yield rate of the composite film, further improve the production efficiency of the composite film, improve the conductive properties of the metal film and reduce the thickness of the organic film contained in the composite film to reduce the overall thickness of the composite film.
  • the present invention provides a method for preparing a composite membrane. As shown in FIG1 and FIG2 , the method for preparing a composite membrane in the present invention comprises the following steps:
  • S01 providing a composite base film, the composite base film comprising n layers of base films, the first base film to the nth base film are sequentially denoted as base films M1 to Mn , the base films M1 to Mn are sequentially stacked along a thickness direction of the composite base film, and n is an integer ⁇ 2;
  • S04' performing a second pretreatment and then a second coating treatment on at least the surface M1b and the surface M2a , respectively, to form a metal film layer N12 on at least the surface M1b , and to form a metal film layer N21 on at least the surface M2a ;
  • S05 Repeat the steps of separating the base film M1 from the composite base film and performing a second pretreatment and a second coating treatment on at least the newly exposed surface of the base film, and sequentially separate the base films M2 to Mn -1 from the composite base film and perform a second pretreatment and a second coating treatment on at least the newly exposed surface of the base film, to form a metal film layer on at least the newly exposed surface of the base film, until finally a metal film layer N (n-1)2 is formed on at least the surface M (n-1)b , and a metal film layer Nn1 is formed on at least the surface Mna .
  • the composite base film in step S01 includes more than two layers of base films, and each base film is stacked in sequence along the thickness direction of the composite base film, as shown in Figures 1 and 2, the composite base film includes base films M1 to Mn stacked in sequence. Therefore, after the first coating treatment in step S02, a metal film layer N11 is first formed on the surface M1a of the base film M1, and a metal film layer Nn2 is formed on the surface Mnb of the base film Mn .
  • the second coating treatment in step S04 or step S04' is performed on the newly exposed base film surface, such as the surface M1b and M2a , to form new metal film layers, such as at least forming a metal film layer N12 on the surface M1b , and at least forming a metal film layer N21 on the surface M2a .
  • the preparation method of the composite film of the embodiment of the present application forms a composite base film by arranging at least two layers of base films in the thickness direction, so that the high temperature resistance of the composite base film is significantly higher than that of the single-layer base film.
  • the thermal stability of the composite base film can be effectively improved, thereby ensuring the quality of the metal film layer N 11 and the metal film layer N n2 formed in the first coating process.
  • the preparation method of the composite film of the embodiment of the present application can form a metal film layer on the surface of a base film with a thickness lower than that of conventional base films, and can effectively ensure the quality of the metal film layer formed on the surface of each base film, thereby significantly improving the yield rate of the prepared composite film.
  • the thickness of the metal film layer formed once in each coating process can be significantly increased to reduce the number of coatings, and the composite film can be prepared by two coating processes, avoiding multiple coating processes and oxidation of the metal film layer, giving each formed metal film layer a low resistivity, and effectively improving the production efficiency of the composite film.
  • the economic cost of the composite film is significantly reduced, making the preparation method of the composite film of the embodiment of the present application suitable for industrial mass production of composite films.
  • each base film contained in the composite base film is also a single-layer base film, such as the thickness of any base film in the base film M1 to the base film Mn is independently 3 to 6 ⁇ m, and can further be 3 to 4.5 ⁇ m, and can specifically be 3 ⁇ m, 3.5 ⁇ m, 4 ⁇ m, 4.5 ⁇ m, 5 ⁇ m, 5.5 ⁇ m, 6 ⁇ m and other typical but non-limiting thicknesses. Since the composite base film includes at least two layers of base films stacked.
  • the single-layer base film can control a lower thickness, and give the composite base film high thermal stability and mechanical properties, which can ensure excellent thermal stability during the first coating process, thereby ensuring the quality of the formed metal film layer N11 and the metal film layer Nn2 , while avoiding the composite base film from breaking, or further avoiding the metal film layer N11 and the metal film layer Nn2 from having undesirable phenomena such as pinholes, bumps and so on.
  • the obtained single-layer base film M (n-1) formed with the metal film layer N (n-1 ) 1 forms a composite layer structure with the metal film layer N (n-1)1 , and the remaining film layer is also a composite layer structure containing the metal film layer. In this way, the thermal stability of the composite layer structure is significantly improved.
  • the composite layer structure can maintain good structural stability during the coating process, thereby effectively ensuring the quality of the metal film layer N (n-1 )2 formed on the surface M (n-1)b of the single-layer base film M (n-1) and the metal film layer formed on the newly exposed surface of the remaining film layer, thereby avoiding the single-layer base film M (n-1) and the remaining film layer from breaking, or further avoiding the metal film layer N (n-1 )2 from breaking.
  • (n-1)2 and the metal film layer formed on the newly exposed surface of the remaining film layer will have undesirable phenomena such as pinholes, bumps and concave spots.
  • the thickness of the single-layer base film can also be other thicknesses, such as less than 3 ⁇ m, or greater than 6 ⁇ m.
  • the material of each base film can be a polymer material.
  • the polymer material can be at least one of silicone rubber, polyolefin, maleic anhydride grafted polyolefin, polyester plastic, and composite resin.
  • polyolefin can be PE, PP, etc.
  • the polymer material can also be the material of the organic film contained in the existing composite current collector and other modified organic materials, and can also be a newly developed polymer material. These polymer materials not only give the composite film excellent mechanical properties, but also can be melted in extreme situations such as high temperature caused by short circuit as a current collector, thereby forming a short circuit, avoiding effective danger resolution, and improving safety performance.
  • the material of each single-layer base film may include a conductive additive on the basis of a polymer material, and the conductive additive is dispersed in the polymer material.
  • the conductive properties of each single-layer base film can be effectively improved, thereby reducing the resistance between the two metal film layers contained in the composite base film, thereby improving the conductive properties of the composite film, enhancing the applicability of the composite film in the current collector, and improving the electrochemical properties of the battery such as energy density, while alleviating or avoiding overheating of the battery during charging and discharging.
  • the presence of the conductive additive can improve the thermal stability and mechanical properties of each single-layer base film, thereby further improving the yield rate of the composite film.
  • the mass content of the conductive additive in each single-layer base film can be independently 10% to 80%, and specifically can be 10%, 20%, 30%, 40%, 50%, 60%, 70%, 8, etc., which are typical but non-limiting contents.
  • the mechanical properties and thermal stability of the base film can be improved while reducing the resistance of the base film, thereby further improving the yield rate of the composite film.
  • the conductive additive forms a conductive network structure 121 in the base layer 11 , giving the support layer 1 a resistivity of ⁇ 20 ⁇ 10 ⁇ 8 ⁇ m.
  • the conductive additive may include at least one of conductive particles, conductive sheets, and conductive fibers.
  • the particle size of the conductive particles may be ⁇ 2 ⁇ m
  • the length or width of the conductive sheets may be greater than 0 and ⁇ 6 ⁇ m
  • the length of the conductive fibers may be greater than 0 and ⁇ 6 ⁇ m.
  • Conductive agents of these shapes and sizes can be effectively dispersed in each base film and form a stable and rich conductive network, thereby improving the conductivity, mechanical properties, and thermal stability of the base film, and further improving the yield rate of the composite film.
  • the composite base film further includes a release film, which is stacked between adjacent base films, that is, forms a sandwich structure with the adjacent base films.
  • a release film which is stacked between adjacent base films, that is, forms a sandwich structure with the adjacent base films.
  • the first pretreatment of the composite base film in step S02 is to treat the surface M1a of the base film Mn and the surface Mnb of the base film Mn , so as to facilitate the formation of the metal film layer N11 and the metal film layer Nn2 , improve the quality of the metal film layer N11 and the metal film layer Nn2 , and improve the bonding strength between the metal film layer N11 and the surface M1a and between the metal film layer Nn2 and the surface Mnb .
  • the first pretreatment includes performing a primer coating treatment on the surface M1a and the surface Mnb or performing a primer coating treatment after performing an ion surface treatment.
  • the primer coating treatment is to form a primer film layer on the surface M1a and the surface Mnb .
  • the surface M 1a and the surface M nb are subjected to ion surface treatment to modify the properties of the surface M 1a and the surface M nb to improve the quality of the base film layer formed by the base coating treatment.
  • the ion surface treatment may be, but is not limited to, plasma surface treatment.
  • the purpose of performing the primer coating treatment in the first pretreatment is to form a primer film layer on the surface M1a and the surface Mnb , respectively.
  • the material of the primer film layer can be a material that is conducive to the formation of the metal film layer N11 and the metal film layer Nn2 , improves the quality of the metal film layer N11 and the metal film layer Nn2 , and improves the bonding strength between the metal film layer N11 and the surface M1a and the metal film layer Nn2 and the surface Mnb .
  • the material of the primer film layer can include at least one of metal oxide and metal nitride.
  • the metal oxide and metal nitride can be the oxide or nitride of the metal contained in the metal film layer, such as aluminum oxide or aluminum nitride.
  • the thickness of the primer film layer is independently 5 to 100 nm, and can be specifically 5 nm, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, etc., which are typical but non-limiting thicknesses.
  • the quality of the metal film layer N11 and the metal film layer Nn2 can be improved, and the bonding strength between the metal film layer N11 and the surface M1a and between the metal film layer Nn2 and the surface Mnb can be enhanced.
  • the base coating treatment can be selected according to the material properties of the base film layer to be formed.
  • the base coating treatment can be a base evaporation treatment.
  • the material forming the base film layer is evaporated on the surface M1a and the surface Mnb by evaporation. If the base film layer is at least one of a metal oxide and a metal nitride, nitrogen or oxygen is introduced after the metal is evaporated to directly form a base film layer of at least one of a metal oxide and a metal nitride on the surface M1a and the surface Mnb .
  • the base evaporation treatment includes at least one of the following conditions:
  • the base coating rate is 200-500 m/min
  • the wire feeding rate for base coating is 20-50cm/min;
  • the power of the bottom evaporation boat is 5-10KW;
  • the bottom vacuum pressure is 10 -4 ⁇ 10 -2 Pa.
  • the primer coating treatment can be effectively performed on the surface M1a and the surface Mnb first, and the quality of the primer film layer can be improved, thereby further improving the quality of the metal film layer N11 and the metal film layer Nn2 , and improving the bonding strength between the metal film layer N11 and the surface M1a , and between the metal film layer Nn2 and the surface Mnb .
  • the first pretreatment in step S02 may also be cleaning or drying the surface M1a and the surface Mnb .
  • These pretreatments are all for the purpose of improving the quality of the metal film layer N11 and the metal film layer Nn2 , and improving the bonding strength between the metal film layer N11 and the surface M1a , and between the metal film layer Nn2 and the surface Mnb .
  • the first coating treatment in step S02 is to form a metal film layer N11 on the surface M1a of the base film M1 and a metal film layer Nn2 on the surface Mnb of the base film Mn , as shown in Figure 1B and Figure 2B.
  • the first pretreatment in step S01 includes the above-mentioned base coating treatment to form a base film layer
  • the metal film layer N11 formed by the first coating treatment is laminated and bonded on the surface M1a bonded with the base film layer
  • the metal film layer Nn2 formed is laminated and bonded on the surface Mnb bonded with the base film layer.
  • the first coating process may be an evaporation process. Forming the metal film layer N11 and the metal film layer Nn2 by evaporation can improve the quality of the metal film layer and the efficiency of the first coating process, and is more compatible with the composite base film in step S01, so as to further improve the production efficiency of the composite film on the basis of improving the yield rate of the composite film.
  • the first coating process may also adopt other coating methods, such as chemical vapor deposition, other physical vapor deposition such as magnetron sputtering, and electroplating.
  • the first coating process when the first coating process is an evaporation process, the first coating process may include at least one of the following conditions:
  • the coating rate is 15-300 m/min
  • Wire feeding rate is 300-500cm/min
  • the diameter of the metal wire is 1.8 to 2.5 mm;
  • the power of the evaporation boat is 15-30KW;
  • the coating rate is relatively lower than the existing evaporation treatment rate, and the evaporation treatment rate in the embodiment of the present application can be effectively reduced, and the wire feeding rate can be increased, so that in one evaporation treatment process, the thickness of the formed metal film layer N11 and the metal film layer Nn2 is increased, thereby improving the efficiency of forming the metal film layer N11 and the metal film layer Nn2 , thereby improving the production efficiency of the composite film.
  • a step of cooling the base film M1 formed with the metal film layer N11 and the base film Mn formed with the metal film layer Nn2 is further included.
  • the temperature of the base film M1 and the base film Mn can be reduced in time, thereby improving the thermal stability of the base film M1 and the base film Mn and improving the quality of the metal film layer N11 and the metal film layer Nn2 .
  • the cooling process may be to cool the base film M1 and the base film Mn using a cooling roller. This is to cooperate with the evaporation process to improve the efficiency of forming the metal film layer N11 and the metal film layer Nn2 .
  • the cooling process may also be other cooling methods. As long as other cooling methods that can effectively cool the base film M1 and the base film Mn are within the scope disclosed in the embodiment of the present application.
  • the temperature of the cooling roller is adjusted and controlled, for example, by dynamically introducing a coolant into the cooling roller.
  • the rotation speed of the cooling roller can be controlled to be 15 to 300 m/min.
  • the temperature of the base film M1 and the base film Mn after the cooling treatment can be controlled to be 15-35°C, specifically, 15°C, 16°C, 17°C, 18°C, 19°C, 20°C, 21°C, 22°C, 23°C, 24°C, 25°C, 26°C, 27°C, 28°C, 29°C, 30°C, 31°C, 32°C, 33°C, 34°C, 35°C, etc. Typical but non-limiting temperatures.
  • Controlling the temperature of the base film M1 and the base film Mn after the first coating treatment, i.e., the evaporation treatment, within this temperature range can improve the thermal stability of the base film M1 and the base film Mn and improve the quality of the metal film layer N11 and the metal film layer Nn2 .
  • the thickness of the metal film layer N11 and the metal film layer Nn2 formed by the first coating process can be independently 0.8-1.5 ⁇ m, and specifically can be controlled to be 0.8 ⁇ m, 0.9 ⁇ m, 1.0 ⁇ m, 1.2 ⁇ m, 1.3 ⁇ m, 1.4 ⁇ m, 1.5 ⁇ m, etc. Typical but non-limiting thicknesses.
  • the thickness of the formed metal film layer N11 and the metal film layer Nn2 can be increased by a single first coating process such as evaporation, thereby improving the production efficiency of the composite film on the basis of improving the quality of the metal film layer N11 and the metal film layer Nn2 .
  • the material of the metal film layer N11 and the metal film layer Nn2 formed by the first coating treatment may be but is not limited to aluminum, and may also be other metals, such as metals suitable for the current collector field, specifically at least one of copper, nickel, etc.
  • the surface M1a of the base film M1 is laminated with the metal film layer N11 , and the surface M1b of the base film M1 opposite to the surface M1a is exposed.
  • the surface Mna of the base film Mn is laminated with the metal film layer Nn2 , and the surface Mna of the base film Mn opposite to the surface Mnb is exposed.
  • the separation process in step S03 can be mechanical separation process or manual separation process. Any separation process method that can separate the base film M1 from the base film Mn and expose the surface M1b and the surface Mna is within the scope disclosed in the embodiment specification of this application.
  • step S04 the second pretreatment is performed on the surface M1b of the base film M1 and the surface Mna of the base film Mn , respectively.
  • the function of the second pretreatment is the same as that of the first pretreatment in step S02, specifically, the surface M1b of the base film M1 and the surface Mna of the base film Mn are treated to facilitate the formation of the metal film layer N12 and the metal film layer Nn1 , improve the quality of the metal film layer N12 and the metal film layer Nn1 , and improve the bonding strength between the metal film layer N12 and the surface M1b and between the metal film layer Nn1 and the surface Mna .
  • the second pretreatment includes performing a primer coating treatment on the surface M1b and the surface Mna or performing a primer coating treatment after performing an ion surface treatment.
  • the surface M 1b and the surface M na are subjected to ion surface treatment to modify the performance of the surface M 1b and the surface M na to improve the quality of the base film layer formed by the base coating treatment.
  • the ion surface treatment may be, but is not limited to, plasma surface treatment.
  • the purpose of performing the bottom coating treatment in the second pretreatment is to form bottom coating layers on the surface M1b and the surface Mna , respectively.
  • the material of the bottom coating layer can be a material that is conducive to the formation of the metal film layer N12 and the metal film layer Nn1 , improves the quality of the metal film layer N12 and the metal film layer Nn1 , improves the bonding strength between the metal film layer N12 and the surface M1b and between the metal film layer Nn1 and the surface Mna , etc.
  • the material, thickness, bottom coating treatment method and process conditions of the bottom coating layer formed in the second pretreatment can be the same as the material, thickness, bottom coating treatment method and process conditions of the bottom coating layer formed in the first pretreatment in the above step S02.
  • the second pretreatment in step S04 may also be cleaning or drying the surface M1b and the surface Mna .
  • These pretreatments are all for improving the quality of the metal film layer N12 and the metal film layer Nn1 , and improving the bonding strength between the metal film layer N12 and the surface M1b and between the metal film layer Nn1 and the surface Mna .
  • the second pretreatment may only be performed on the surface M1b and the surface Mna .
  • the second coating process in step S04 is to form a metal film layer N12 on at least the surface M1b of the base film M1 and a metal film layer Nn1 on the surface Mna of the base film Mn , as shown in D in FIG1 and D in FIG2.
  • the metal film layer N11 , the base film M1 and the metal film layer N12 are sequentially stacked and combined along the film thickness direction to form a composite film with a sandwich structure;
  • the metal film layer Nn1 , the base film Mn and the metal film layer Nn2 are sequentially stacked and combined along the film thickness direction to form another composite film with a sandwich structure.
  • step S04 includes the above-mentioned base coating treatment to form a base film layer
  • the metal film layer N12 formed by the second coating treatment is stacked and bonded on the surface M1b bonded with the base film layer
  • the formed metal film layer Nn1 is stacked and bonded on the surface Mna bonded with the base film layer.
  • the second coating process may be an evaporation process.
  • the metal film layer N12 and the metal film layer Nn1 are formed by the evaporation process, which can improve the quality of the metal film layer and improve the efficiency of the second coating process.
  • a metal film layer N11 is formed on the surface M1a of the base film M1
  • a metal film layer Nn2 is formed on the surface Mnb of the base film Mn .
  • the metal film layer N11 and the base film M1 form a composite structure film layer
  • the metal film layer Nn2 and the base film Mn form a composite structure film layer.
  • the second coating process adopts the evaporation process, on the basis of being able to improve the yield rate of the composite film, the production efficiency of the composite film is further improved. Therefore, when the second coating process is an evaporation process, the conditions of the second coating process can be the same as the conditions of the first coating process in step S02 above.
  • the metal film layer N11 and the base film M1 form a composite structure film layer
  • the metal film layer Nn2 and the base film Mn form a composite structure film layer.
  • the composite structure film layer has higher thermal stability than the simple base film. Therefore, when the second coating treatment is a vapor deposition treatment, the coating rate of the second coating treatment can be lower than the coating rate of the first coating treatment. In this way, the thickness of the metal film layer N12 and the metal film layer Nn1 can be increased per unit time.
  • the second coating process may also be performed by other coating methods, such as at least one of chemical vapor deposition, other physical vapor deposition such as magnetron sputtering, and electroplating.
  • the thickness and material of the metal film layer N12 and the metal film layer Nn1 formed by the second coating process may be the same as the thickness and material of the metal film layer N11 and the metal film layer Nn2 described above.
  • the thickness and material of each metal film layer may be the same or different.
  • a thickened metal film layer may be formed on the metal film layer N11 or the metal film layer Nn2 or on the surfaces of the metal film layer N11 and the metal film layer Nn2 respectively.
  • the thickness of the thickened metal film layer may be the same as the thickness of the metal film layer N12 or the metal film layer Nn1 .
  • the total thickness of the metal film layer formed on the surface M1a or the surface Mnb may be twice the thickness of the metal film layer N11 or the metal film layer Nn2 , such as 1.6 to 3.0 ⁇ m.
  • the thickness of the thickened metal film layer is different from the thickness of the metal film layer N11 or the metal film layer Nn2 .
  • a step of cooling the base film M1 formed with the metal film layer N12 and the base film Mn formed with the metal film layer Nn1 is further included.
  • the temperature of the base film M1 and the base film Mn can be timely reduced, thereby improving the thermal stability of the base film M1 and the base film Mn and improving the quality of the metal film layer N12 and the metal film layer Nn1 .
  • the method and conditions of the cooling treatment can be the same as the method and conditions of the cooling treatment after the first coating treatment in step S02 above.
  • Step S03' (when n>2):
  • step S01 contains two stacked base films, that is, n>2, after the composite base film treated in step S02 is subjected to separation treatment in step S03', the surface M1b of the base film M1 and the surface M2a of the base film M2 are separated and exposed, as shown in Figure C in Figure 2.
  • the separation process in step S03' also includes separating and removing the isolation film to expose the surface M1b of the base film M1 and the surface M2a of the base film M2 .
  • the surface M1a of the base film M1 is laminated with the metal film layer N11 , and the surface M1b of the base film M1 opposite to the surface M1a is exposed.
  • the surface M1a of the base film M2 is exposed, and the base films M2 to Mn are laminated, and the surface Mnb of the base film Mn is laminated with the metal film layer Nn2 .
  • the separation process in step S03' can be a mechanized separation process or a manual separation process. Any separation process method that can separate the base film M1 from the base film M2 and expose the surface M1b and the surface M2a is within the scope disclosed in the embodiment specification of the present application.
  • step S04' the second pretreatment is performed on the surface M1b of the base film M1 and the surface Mna of the base film Mn , respectively.
  • the purpose of the second pretreatment is the same as that of step S04, specifically, the surface M1b of the base film M1 and the surface M2a of the base film M2 are treated to facilitate the formation of the metal film layer N12 and the metal film layer N21 , improve the quality of the metal film layer N12 and the metal film layer N21 , and improve the bonding strength between the metal film layer N12 and the surface M1b and between the metal film layer N21 and the surface M2a .
  • the second pretreatment includes performing a primer coating treatment on the surface M1b and the surface M2a or performing a primer coating treatment after performing an ion surface treatment.
  • the surface M1b and the surface M2a are subjected to ion surface treatment to modify the performance of the surface M1b and the surface M2a to improve the quality of the base film layer formed by the base coating treatment.
  • the ion surface treatment may be, but is not limited to, plasma surface treatment.
  • the purpose of performing the bottom coating treatment in the second pretreatment is to form bottom coating layers on the surface M1b and the surface M2a , respectively.
  • the material of the bottom coating layer formed can be a material that is conducive to the formation of the metal film layer N12 and the metal film layer N21 , improves the quality of the metal film layer N12 and the metal film layer N21 , and improves the bonding strength between the metal film layer N12 and the surface M1b and between the metal film layer N21 and the surface M2a .
  • the material, thickness, bottom coating treatment method and process conditions of the bottom coating layer formed in the second pretreatment can be the same as the material, thickness, bottom coating treatment method and process conditions of the bottom coating layer formed in the second pretreatment in step S04.
  • the second pretreatment in step S04' may also be cleaning or drying the surface M1b and the surface M2a .
  • These pretreatments are all for the purpose of improving the quality of the metal film layer N12 and the metal film layer N21 , and improving the bonding strength between the metal film layer N12 and the surface M1b , and between the metal film layer N21 and the surface M2a .
  • the second coating process in step S04' is to form a metal film layer N12 on at least the surface M1b of the base film M1 and a metal film layer N21 on the surface M2a of the base film M2, as shown in D in FIG2.
  • the metal film layer N11 , the base film M1 and the metal film layer N12 are sequentially stacked and combined along the film thickness direction to form a composite film with a sandwich structure; the metal film layer N21 , the base film M2 to the base film Mn , the metal film layer Nn2 are sequentially stacked and combined along the film thickness direction.
  • the metal film layer N12 formed by the second coating treatment is laminated on the surface M1b with the base film layer, and the metal film layer N21 formed is laminated on the surface M2a with the base film layer.
  • the second coating process may be an evaporation process.
  • the metal film layer N12 and the metal film layer N21 are formed by the evaporation process, which can improve the quality of the metal film layer and improve the efficiency of the second coating process.
  • the surface M1a of the base film M1 is formed with a metal film layer N11 ; the base films M2 to Mn are stacked in sequence, and the metal film layer Nn2 is formed on the surface Mnb of the base film Mn .
  • the metal film layer N11 and the base film M1 form a composite structure film layer
  • the base films M2 to Mn and the metal film layer Nn2 form a composite structure film layer.
  • the second coating process adopts the evaporation process, on the basis of being able to improve the yield rate of the composite film, the production efficiency of the composite film is further improved. Therefore, when the second coating process is an evaporation process, the conditions of the second coating process can be the same as the conditions of the second coating process in step S04 above.
  • the metal film layer N11 and the base film M1 form a composite structure film layer
  • the base film M2 to the base film Mn and the metal film layer Nn2 form a composite structure film layer.
  • the composite structure film layer has higher thermal stability than the simple base film. Therefore, when the second coating treatment is a vapor deposition treatment, the coating rate of the second coating treatment can be lower than the coating rate of the first coating treatment. In this way, the thickness of the metal film layer N12 and the metal film layer N21 can be increased per unit time.
  • the second coating process may also be performed by other coating methods, such as at least one of chemical vapor deposition, other physical vapor deposition such as magnetron sputtering, and electroplating.
  • the thickness and material of the metal film layer N12 and the metal film layer N21 formed by the second coating process may be the same as the thickness and material of the metal film layer N12 and the metal film layer Nn1 formed in step S04 above.
  • the thickness and material of each metal film layer may be the same or different.
  • a thickened metal film layer in addition to forming a metal film layer N12 on the surface M1b of the base film M1 and forming a metal film layer N21 on the surface M2a of the base film M2 , a thickened metal film layer may be formed on the metal film layer N11 or the metal film layer N22 or on the surfaces of the metal film layer N11 and the metal film layer N22 respectively. In some embodiments, the thickness of the thickened metal film layer may be the same as the thickness of the metal film layer N12 or the metal film layer N21 .
  • the total thickness of the metal film layer formed on the surface M1a or the surface M2b may be twice the thickness of the metal film layer N11 or the metal film layer N22 , such as 1.6 to 3.0 ⁇ m.
  • the thickness of the thickened metal film layer is different from the thickness of the metal film layer N11 or the metal film layer N22 .
  • a step of cooling the base film M1 formed with the metal film layer N12 and the base film M2 formed with the metal film layer N21 is further included.
  • the temperature of the base film M1 and the base film M2 can be timely reduced, thereby improving the thermal stability of the base film M1 and the base film M2 and improving the quality of the metal film layer N12 and the metal film layer N21 .
  • the method and conditions of the cooling treatment can be the same as the method and conditions of the cooling treatment after the second coating treatment in step S04 above.
  • step S05 step S03' is repeated, that is, the steps of separating the base film M1 from the composite base film and performing the second pretreatment and the second coating treatment on at least the newly exposed surface of the base film are repeated, and the base films M2 to Mn -1 are sequentially separated from the composite base film and at least the newly exposed surfaces of the base films are respectively subjected to the second pretreatment and then the second coating treatment, so that the surface M2a of the base film M2 is laminated and combined with the metal film layer N21 , and the surface M2b is laminated and combined with the metal film layer N22 ; the surface M3a of the base film M3 is laminated and combined with the metal film layer N31 , and the surface M3b is laminated and combined with the metal film layer N32 ; and the surface M(n -1)a of the base film M (n-1) is laminated and combined with the metal film layer N(n-1 )1
  • the surface Mnb is stacked with a metal film layer Nn1 , and the surface Mnb is stacked with a metal film layer Nn2 , and finally n composite films are obtained.
  • the composite film structure of the surface stacked with a metal film layer N (n-1)1 and a base film M (n-1) with a metal film layer N(n-1 )2 , and the surface stacked with a metal film layer Nn1 and a base film Mn with a metal film layer Nn is shown in Figure E of Figure 2.
  • each separation process in step S05 can be the same as the separation process in step S04'.
  • each separation process also includes separating and removing the isolation film.
  • the methods and conditions of the second pretreatment and the second coating treatment in step S05 can also be the same as the methods and conditions of the second pretreatment and the second coating treatment in step S04'.
  • the thickness and material of each metal film layer formed on the surface of each base film in step S05 can also be the thickness and material of the metal film layer formed in step S04'.
  • a thickened metal film layer may also be formed on the surface of the metal film layer already formed on each base film.
  • a thickened metal film layer is further formed on the outer surface of the metal film layer N (n-1) 1 formed on the surface M (n-1)a of the base film M n-1 ; and/or a thickened metal film layer is further formed on the outer surface of the metal film layer N n2 formed on the surface M nb of the base film M n .
  • n should be greater than or equal to 3.
  • a thickened metal film layer is also formed on the outer surface of the metal film layer N (n-1)1 formed on the surface M (n-1)a of the base film Mn-1 ; and/or a thickened metal film layer is also formed on the outer surface of the metal film layer N n2 formed on the surface M nb of the base film Mn .
  • n should be greater than or equal to 2.
  • the thickness of the thickened metal film layer may be the same as or different from the thickness of each formed metal film layer.
  • each second coating treatment in step S05 is an evaporation treatment
  • a step of cooling the base film formed with the metal film layer is also included.
  • the method and conditions of the cooling treatment can be the same as the method and conditions of the cooling treatment after the second coating treatment in step S04' above.
  • the base film in each corresponding step is subjected to at least one of the pretreatment, coating treatment, and separation treatment in sequence by unwinding and rewinding.
  • the base film is subjected to at least one of the separation treatment, pretreatment, and coating treatment in sequence by unwinding and rewinding.
  • the production efficiency of the composite film can be improved, and the quality of each metal film layer formed, such as uniformity, can also be improved, thereby improving the yield rate of the composite film.
  • the present invention provides a device for preparing a composite membrane.
  • the structure of the device for preparing a composite membrane in the present invention is shown in FIG3 , and includes:
  • Pretreatment unit 01 used for pretreatment of the surface of the composite base film or base film
  • the coating unit 02 is used to coat the surface of the composite base film or base film treated by the pretreatment unit 01, so as to form a metal film layer on the surface of the composite base film or base film;
  • the base film separation unit (not shown) is used to separate the base film that has been coated by the coating unit 02 from the composite base film.
  • the pretreatment unit 01 is configured to perform at least one of the first pretreatment in step S02, the second pretreatment in step S04, the second pretreatment in step S04', and the second pretreatment in step S05 on the composite base film or base film in the composite film preparation method of the embodiment of the text application above, so as to pretreat the surface of the composite base film or base film 01, such as treating the surface M nb of the base film M 1a and the base film M n , so as to facilitate the formation of the metal film layer, improve the quality of the metal film layer, and improve the bonding strength between the metal film layer and the corresponding surface of the composite base film or the base film.
  • the pretreatment unit 01 pretreats the surface of the composite base film or base film, so as to facilitate the formation of the metal film layer N 11 and the metal film layer N n2 , improve the quality of the metal film layer N 11 and the metal film layer N n2 , and improve the bonding strength between the metal film layer N 11 and the surface M 1a and the metal film layer N n2 and the surface M nb .
  • the coating unit 02 forms a metal film layer on the composite base film or the corresponding surface of the base film pretreated by the pretreatment unit 01, specifically, the composite base film or the surface of the base film pretreated by the pretreatment unit 01 is subjected to at least one of the first coating treatment in step S02, the second coating treatment in step S04, the second coating treatment in step S04', and the second coating treatment in step S05 in the composite film preparation method of the above text application embodiment, thereby forming a metal film layer on the surface of each base film, or forming a thickened metal film layer on the surface of the metal film layer.
  • the base film separation unit is used to separate the base film that has been coated by the coating unit 02 from the composite base film layer by layer. Specifically, the composite base film that has been coated by the coating unit 02 is subjected to at least one of the separation treatments in step S03, step S03', and step S05 in the composite film preparation method of the above text application embodiment, thereby separating a single-layer base film with a metal film layer formed on the surface from the composite base film one by one, exposing a new surface of the base film, so as to restart the coating unit 02 to coat the newly exposed surface of the base film to form a metal film layer.
  • the apparatus for preparing the composite film in the embodiment of the present application is provided with a pretreatment unit 01, a coating unit 02 and a base film separation unit, so that the three are connected in sequence according to the composite film preparation process, so that the base film surface can be effectively pretreated and coated, so as to form a metal layer on the base film surface, and the stacked base films can be separated from the composite base film layer by layer in sequence, and the newly exposed base film surface can be pretreated and coated for the second time.
  • the prepared composite film has high quality and high yield, and the thickness of the metal layer formed by the first coating treatment is increased, which significantly improves the production efficiency of the composite film.
  • the pretreatment unit 01 includes a bottom coating component 11 or includes a bottom coating component 11 and an ion surface treatment component 12 .
  • the base coating component 11 is used to form a base coating layer on the surface of the base film
  • the ion surface treatment component 12 is used to perform ion surface treatment on the surface of the base film, specifically, performing base coating treatment or ion surface treatment on the surface of the base film as contained in at least one of the first pretreatment in step S02, the second pretreatment in step S04, the second pretreatment in step S04', and the second pretreatment in step S05 in the composite membrane preparation method of the above text application embodiment.
  • the pretreatment unit 01 includes both the base coating component 11 and the ion surface treatment component 12, the ion surface treatment component 12 and the base coating component 11 are connected in the order of first performing ion surface treatment on the base film surface and then performing base coating treatment, so as to realize the ion surface modification treatment and the formation of the base film layer on the base film surface in sequence.
  • the ion surface treatment component 12 may be two ion surface treatment components, which are respectively arranged on both sides of the base film, and the ion surface treatment of the opposite surfaces of the base film is started as needed to improve the pretreatment efficiency.
  • the ion surface treatment component 12 may be a plasma surface device.
  • the number of the bottom coating components 11 may be more than two, and as shown in FIG3 , two bottom coating components 11 may be included, and the two bottom coating components 11 are separately arranged on both sides of the base film.
  • the bottom coating components 11 on one side of the base film or on both sides of the base film may be started as needed to perform bottom coating treatment on the corresponding surface of the base film directly or after ion surface treatment to form a bottom film layer, so as to improve the pretreatment efficiency.
  • the bottom coating component 11 may be a vapor deposition device.
  • the number of coating units 02 may be more than two, and as shown in FIG3 , two coating units 02 are included, and the two coating units 02 are separately arranged on both sides of the base film.
  • the coating units 02 on one side of the base film or on both sides can be started as needed to perform coating treatment on the corresponding surface of the base film, such as the first coating treatment in step S02 of the composite film preparation method of the above text application embodiment, which simultaneously coats the surface M 1a of the base film M 1 and the surface M nb of the base film M n .
  • the coating unit 02 may be a vapor deposition device.
  • the above-mentioned bottom coating component 11 and coating unit 02 can both be evaporation devices, so the bottom coating component 11 and coating unit 02 can be completed by the same device, such as by evaporation equipment, as shown in Figure 3, the bottom coating component 11 and coating unit 02 are the same evaporation equipment.
  • the device structure of the composite film of the embodiment of the present application can be effectively simplified and its economic cost can be reduced.
  • the device for preparing a composite film in the embodiment of the present application may further include a metal film thickness control unit 03 .
  • the metal film thickness control unit 03 includes a metal film detection module 31 , a data processing module (not shown in FIG3 ) and a control module 32 .
  • the metal film layer detection module 31 is used to detect the thickness data of the metal film layer and send it to the data processing module; the data processing module receives the thickness data and sends the thickness data to the control module 32; the control module 32 is connected to the coating unit 02, and controls the coating unit 02 to perform coating processing according to the received thickness data.
  • the thickness of the metal film layer formed on the surface of the corresponding base film by the coating unit 02 can be monitored in real time, and the coating unit 02 can be controlled according to the monitored thickness data while adjusting the coating treatment process conditions, thereby improving the automation and intelligence of the device for preparing the composite film in the embodiment of the present application, thereby improving the production efficiency and yield rate of the composite film.
  • the number of metal film layer detection modules 31 may be more than two, as shown in FIG. 3 , including two metal film layer detection modules 31, and the two metal film layer detection modules 31 are separately arranged on both sides of the base film.
  • the detection module 31 may be an eddy current sensor, which can sensitively sense the current size of the metal film layer.
  • the metal film layer detection module 31 may also be other devices.
  • the data processing module can be a programmable logic controller (PLC), which can calculate and process the thickness data sent by the metal film layer detection module 31.
  • PLC programmable logic controller
  • the programmable logic controller can process the current data sent by the eddy current sensor, convert it into resistance, convert it into metal film layer thickness data based on the resistance, and send it to the control module 32.
  • control module 32 When the control module 32 receives data from the data processing module, such as metal film thickness data, and compares it with the preset metal film thickness data, if it is lower than or exceeds the preset metal film thickness data, it starts controlling the coating unit 02, such as adjusting the coating processing conditions of the coating unit 02 including wire feeding rate, evaporation temperature and other conditions, so as to achieve control of the coating rate and realize adjustment and control of the metal film thickness.
  • data from the data processing module such as metal film thickness data
  • preset metal film thickness data if it is lower than or exceeds the preset metal film thickness data, it starts controlling the coating unit 02, such as adjusting the coating processing conditions of the coating unit 02 including wire feeding rate, evaporation temperature and other conditions, so as to achieve control of the coating rate and realize adjustment and control of the metal film thickness.
  • the number of control modules 32 can be more than two, as shown in FIG3 , including two control modules 32, and the two control modules 32 are the same as the number of coating units 02, that is, each coating unit 02 is equipped with a control module 32.
  • the two control modules 32 can receive the data sent by the data processing module in a timely manner, and control each coating unit 02 to perform coating processing.
  • all coating units 02 can also be controlled by one control module 32 to perform coating processing.
  • the device for preparing the composite film in the embodiment of the present application may further include a film conveying unit 04 .
  • the film conveying unit 04 includes an unwinding roller 41 , a control roller and a winding roller 46 .
  • the unwinding roller 41 is arranged before the pretreatment process is carried out by the pretreatment unit 01, and is used for unwinding the composite base film or base film.
  • the control roller is arranged before and after the composite base film or base film is treated by at least one of the pretreatment unit, the coating unit and the base film separation unit, and is used for controlling the running direction and state of the composite base film or base film.
  • the winding roller 46 is arranged after the coating process is carried out by the coating unit 02 or/and after the separation process is carried out by the base film separation unit, and is used for winding the composite base film or base film.
  • the setting of the membrane conveying unit 04 enables the device for preparing the composite membrane in the embodiment of the present application to continuously perform various treatments on the composite base membrane or base membrane, thereby improving the production efficiency of the device for preparing the composite membrane in the embodiment of the present application, and improving the quality stability of the prepared composite membrane, thereby improving the yield rate of the composite membrane.
  • control rollers include a passing roller 42, a flattening roller 43, a vapor deposition roller 44, a deviation correction roller 45 and a cooling roller (not shown in FIG3 ), wherein the passing roller 42 is arranged on the path of the composite base film or the base film through the corresponding processing process as required, and is used to adjust the pulling direction of the composite base film or the base film;
  • the evaporation roller 44 is arranged at the coating unit 02, so that the composite base film or the surface of the base film to be coated passes through the coating unit 02, and undergoes a pretreatment of a base coating treatment to form a base film layer and/or a coating treatment to form a metal film layer.
  • the flattening roller 43 is arranged on both sides of the evaporation roller 44, and is used to flatten the composite base film or base film, so that the surface to be coated can pass through the evaporation roller 44 and the coating unit 02 smoothly, so as to improve the quality of the coating.
  • the cooling roller is arranged on the film outlet side of the evaporation roller 44, so that the composite base film or base film treated by the coating unit 02 can be cooled in time, so as to improve the thermal stability of the composite base film or base film and the quality of the formed film layer.
  • the deviation correction roller 45 is arranged on the film inlet side of the winding roller 46, and is used to adjust the composite base film or base film before winding.
  • the composite membrane prepared has a high yield rate and high production efficiency, and is suitable for industrial production. Therefore, the method for preparing the composite membrane of the embodiment of the present application and the device for preparing the composite membrane of the embodiment of the present application can effectively solve the bottleneck problems of low yield rate and low efficiency encountered in the production of composite membranes.
  • the structure and quality of the composite membrane prepared based on the method for preparing the composite membrane of the embodiment and the device for preparing the composite membrane of the embodiment of the present application can effectively enhance its applicability in the composite current collector of the battery.
  • the embodiment of the present application provides a secondary battery.
  • the shape of the secondary battery in the embodiment of the present application is not particularly limited, and it can be cylindrical, square or any other shape.
  • a secondary battery 05 with a square structure is used as an example.
  • the outer package may include a shell 51 and a cover plate 53.
  • the shell 51 may include a bottom plate and a side plate connected to the bottom plate, and the bottom plate and the side plate enclose a receiving cavity.
  • the shell 51 has an opening connected to the receiving cavity, and the cover plate 53 is used to cover the opening to close the receiving cavity.
  • the positive electrode sheet, the negative electrode sheet and the isolation film may form an electrode assembly 52 through a winding process and/or a lamination process.
  • the electrode assembly 52 is encapsulated in the receiving cavity.
  • the electrolyte is infiltrated in the electrode assembly 52.
  • the number of electrode assemblies 52 contained in the secondary battery 05 may be one or more, which can be adjusted according to actual needs. Among them, when at least one of the positive electrode sheet and the negative electrode sheet contains a current collector, the current collector is formed by cutting the composite film prepared by the above composite film preparation method and the device for preparing the composite film in the embodiment of the present application.
  • the positive electrode sheet, the separator, the negative electrode sheet and the electrolyte can be assembled to form a secondary battery.
  • the positive electrode sheet, the separator and the negative electrode sheet can be wound or laminated to form an electrode assembly, the electrode assembly is placed in an outer package, dried and then injected with electrolyte, and vacuum packaged, left to stand, formed, shaped and other processes are performed to obtain a secondary battery.
  • the secondary batteries according to the present application can be assembled into a battery module.
  • the battery module can contain multiple secondary batteries, and the specific number can be adjusted according to the application and capacity of the battery module.
  • FIG6 is a schematic diagram of a battery module 06 as an example.
  • a plurality of secondary batteries 05 may be arranged in sequence along the length direction of the battery module 06. Of course, they may also be arranged in any other manner. Further, the plurality of secondary batteries 05 may be fixed by fasteners.
  • the battery module 06 may further include a housing having a housing space, and the plurality of secondary batteries 05 are housed in the housing space.
  • the battery modules described above may also be assembled into a battery pack, and the number of battery modules contained in the battery pack may be adjusted according to the application and capacity of the battery pack.
  • FIG7 and FIG8 are schematic diagrams of a battery pack 07 as an example.
  • the battery pack 07 may include a battery box and a plurality of battery modules 06 disposed in the battery box.
  • the battery box includes an upper box body 71 and a lower box body 72, and the upper box body 71 is used to cover the lower box body 72 and form a closed space for accommodating the battery module 06.
  • the plurality of battery modules 06 may be arranged in the battery box in any manner.
  • the embodiments of the present application also provide an electrical device, which includes one or more of the secondary battery, battery module or battery pack of the present application.
  • the secondary battery, battery module or battery pack can be used as a power source for the electrical device, or as an energy storage unit for the electrical device.
  • the electrical device may be, but is not limited to, a mobile device (such as a mobile phone, a laptop computer, etc.), an electric vehicle (such as a pure electric vehicle, a hybrid electric vehicle, a plug-in hybrid electric vehicle, an electric bicycle, an electric scooter, an electric golf cart, an electric truck, etc.), an electric train, a ship and a satellite, an energy storage system, etc.
  • the electrical device may select a secondary battery, a battery module or a battery pack according to its usage requirements.
  • Fig. 9 is a schematic diagram of an electric device as an example.
  • the electric device is a pure electric vehicle, a hybrid electric vehicle, or a plug-in hybrid electric vehicle, etc.
  • a battery pack or a battery module may be used.
  • the electric device may be a mobile phone, a tablet computer, a notebook computer, etc.
  • the electric device is usually required to be light and thin, and a secondary battery may be used as a power source.
  • This embodiment provides a method for preparing a composite film, comprising the following steps:
  • S1 providing a PET composite base film, wherein the PET composite base film comprises two layers of base films, wherein the first base film to the second base film are sequentially denoted as base film M1 to base film M2 , wherein the base film M1 and the base film M2 are sequentially stacked along a thickness direction of the composite base film, and an isolation film is stacked between the base film M1 and the base film M2 ;
  • S2 performing a first coating treatment on a surface M1a of the base film M1 that is away from the base film M2 and a surface M2b of the base film M2 that is away from the base film M1 , respectively, after a first pre-treatment of a plasma surface treatment and a primer coating treatment, respectively, to form a primer film layer and a metal film layer N11 on the surface M1a , and to form a primer film layer and a metal film layer N22 on the surface M2b ;
  • the surface M 2a of the base film M 2 is subjected to a second pretreatment of plasma surface treatment and primer coating treatment in sequence, the surface M 2a is subjected to a second coating treatment to sequentially form a primer film layer and a metal film layer N 21 on the surface M 2a .
  • the present invention provides a method for preparing a composite film, comprising the following steps:
  • the surface M2a of the base film M2 is subjected to a second pretreatment of plasma surface treatment and primer coating treatment in sequence
  • the surface of the metal film layer N22 and the surface M2a are subjected to a second coating treatment to form a thickened metal film layer on the surface of the metal film layer N22 and a primer film layer and a metal film layer N21 are formed in sequence on the surface M2a .
  • the present invention provides a method for preparing a composite film, comprising the following steps:
  • the surface M2a of the base film M2 is subjected to a second pretreatment of plasma surface treatment and primer coating treatment in sequence
  • the surface of the metal film layer N22 and the surface M2a are subjected to a second coating treatment to form a thickened metal film layer on the surface of the metal film layer N22 and a primer film layer and a metal film layer N21 are formed in sequence on the surface M2a .
  • the present invention provides a method for preparing a composite film, comprising the following steps:
  • the surface M2a of the base film M2 is subjected to a second pretreatment of plasma surface treatment and primer coating treatment in sequence
  • the surface of the metal film layer N22 and the surface M2a are subjected to a second coating treatment to form a thickened metal film layer on the surface of the metal film layer N22 and a primer film layer and a metal film layer N21 are formed in sequence on the surface M2a .
  • the present invention provides a method for preparing a composite film, comprising the following steps:
  • S1 providing a PET composite base film, the PET composite base film comprising three layers of base films, the first base film to the third base film are sequentially recorded as base film M1 to base film M3 , the base film M1 and the base film M3 are sequentially stacked along the thickness direction of the composite base film, and an isolation film is stacked between the base film M1 and the base film M2 , and between the base film M2 and the base film M3 ;
  • S2 performing a first coating treatment on a surface M1a of the base film M1 that is away from the base film M3 and a surface M3b of the base film M3 that is away from the base film M1 respectively after a first pre-treatment of a plasma surface treatment and a primer coating treatment, and then performing a first coating treatment respectively, forming a primer film layer and a metal film layer N11 on the surface M1a in sequence, and forming a primer film layer and a metal film layer N32 on the surface M3b in sequence;
  • the surface M2a of the base film M2 is subjected to a second pretreatment of plasma surface treatment and primer coating treatment in sequence, the surface M2a is subjected to a second coating treatment to sequentially form a primer film layer and a metal film layer N21 on the surface M2a ;
  • the surface M 3a of the base film M 3 is subjected to a second pretreatment of plasma surface treatment and primer coating treatment in sequence, the surface M 3a is subjected to a second coating treatment to sequentially form a primer film layer and a metal film layer N 31 on the surface M 3a .
  • This comparative example provides a method for preparing a composite film, comprising the following steps:
  • step S2 The base film M1 is subjected to the first pretreatment and the first coating treatment under the same conditions as those in step S2 of embodiment 1 , and the surface M1a and the surface M1b of the base film M1 are subjected to the first pretreatment and then the first coating treatment to form a metal film layer N11 on the surface M1a of the base film M1 and a metal film layer N12 on the surface M1b .
  • This comparative example provides a method for preparing a composite film, comprising the following steps:
  • step S2 The base film M1 is subjected to the first pretreatment and the first coating treatment under the same conditions as those in step S2 of embodiment 1 , and the surface M1a and the surface M1b of the base film M1 are subjected to the first pretreatment and then the first coating treatment to form a metal film layer N11 on the surface M1a of the base film M1 and a metal film layer N12 on the surface M1b .
  • the square resistance test method is as follows:
  • test methods for tensile strength and elongation at break are as follows:
  • the organic support layer was punched into samples with a width of 15 mm and a length of 150 mm.
  • the tensile test was performed using a high-speed rail tensile machine at room temperature and pressure (25°C, 0.1 MPa). The initial length was set to 50 mm.
  • the tensile test was performed at a tensile rate of 5 mm/min until the sample broke and the tensile test was stopped.
  • S is the initial cross-sectional area of the sample, which is equal to the product of the width of the sample and the thickness of the sample.
  • the device displacement y (mm) at the time of tensile fracture was recorded, and finally the elongation at break was calculated to be (y/50) ⁇ 100%.
  • the preparation method of the composite film of the embodiment of the present application first forms a metal film layer on the relative surface of the composite base film formed by stacking more than two base films, then separates each base film one by one, and performs a secondary coating treatment on the newly exposed base film surface, thereby being able to prepare at least two composite films.
  • the thermal stability of the composite base film and the single-layer base film with a metal film layer formed on one side after the separation treatment is significantly improved, thereby ensuring that the preparation method of the composite film of the embodiment of the present application can effectively ensure the quality of the metal film layer formed on the surface of each base film, thereby significantly improving the yield rate of the prepared composite film, and the efficiency is high.

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Abstract

La présente invention concerne un procédé de préparation d'une membrane composite, et un appareil de préparation de la membrane composite. Selon un mode de réalisation de la présente invention, le procédé de préparation de la membrane composite comprend les étapes consistant à : effectuer séparément un premier prétraitement et un premier traitement de revêtement sur les surfaces opposées d'une membrane de base composite formée par lamination d'au moins deux couches de membranes de base, afin de former une couche de membrane métallique ; effectuer un traitement de séparation couche-par-couche sur chaque membrane de base, effectuer un deuxième prétraitement et un premier traitement de revêtement sur la surface de chaque membrane de base nouvellement exposée, et former une couche de film métallique sur la surface de chaque membrane de base nouvellement exposée. L'appareil de préparation de la membrane composite de la présente invention comprend une unité de prétraitement, une unité de revêtement et une unité de séparation de membrane de base. Le procédé de préparation de la membrane composite selon le mode de réalisation de la présente invention peut former une couche de film métallique sur la surface d'une membrane de base inférieure afin de former la membrane composite, et assure un rendement élevé et l'efficacité de production de la membrane composite. Le dispositif de préparation d'une membrane composite de la présente invention permet une mise en oeuvre efficace du procédé de préparation d'une membrane composite.
PCT/CN2022/126261 2022-10-19 2022-10-19 Procédé de préparation d'une membrane composite et appareil de préparation d'une membrane composite WO2024082184A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014053410A (ja) * 2012-09-06 2014-03-20 Sumitomo Metal Mining Co Ltd 両面金属積層フィルムの製造方法とその製造装置、および、フレキシブル両面プリント配線基板の製造方法
CN111876743A (zh) * 2020-09-05 2020-11-03 昆山鑫美源电子科技有限公司 柔性导电薄膜的生产加工系统及制备工艺
WO2022047948A1 (fr) * 2020-09-05 2022-03-10 昆山鑫美源电子科技有限公司 Procédé de préparation d'un film mince conducteur à base d'aluminium ayant une structure composite multicouche
CN114204036A (zh) * 2021-11-17 2022-03-18 合肥国轩高科动力能源有限公司 一种复合集流体的制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014053410A (ja) * 2012-09-06 2014-03-20 Sumitomo Metal Mining Co Ltd 両面金属積層フィルムの製造方法とその製造装置、および、フレキシブル両面プリント配線基板の製造方法
CN111876743A (zh) * 2020-09-05 2020-11-03 昆山鑫美源电子科技有限公司 柔性导电薄膜的生产加工系统及制备工艺
WO2022047948A1 (fr) * 2020-09-05 2022-03-10 昆山鑫美源电子科技有限公司 Procédé de préparation d'un film mince conducteur à base d'aluminium ayant une structure composite multicouche
CN114204036A (zh) * 2021-11-17 2022-03-18 合肥国轩高科动力能源有限公司 一种复合集流体的制备方法

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