CN116960362A - Composite copper foil, manufacturing method and lithium ion battery - Google Patents
Composite copper foil, manufacturing method and lithium ion battery Download PDFInfo
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- CN116960362A CN116960362A CN202311194103.1A CN202311194103A CN116960362A CN 116960362 A CN116960362 A CN 116960362A CN 202311194103 A CN202311194103 A CN 202311194103A CN 116960362 A CN116960362 A CN 116960362A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 217
- 239000011889 copper foil Substances 0.000 title claims abstract description 76
- 239000002131 composite material Substances 0.000 title claims abstract description 72
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 title claims abstract description 10
- 229910001416 lithium ion Inorganic materials 0.000 title claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 145
- 229910052802 copper Inorganic materials 0.000 claims abstract description 145
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000002861 polymer material Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 42
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 239000002243 precursor Substances 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 230000002950 deficient Effects 0.000 abstract description 13
- 239000010408 film Substances 0.000 description 196
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- -1 for example Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007738 vacuum evaporation Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 238000007709 nanocrystallization Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/665—Composites
- H01M4/667—Composites in the form of layers, e.g. coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The disclosure relates to the technical field of lithium ion batteries, in particular to a composite copper foil, a manufacturing method and a lithium ion battery, wherein the manufacturing method of the composite copper foil comprises the following steps: taking the composite copper foil with the copper film partially detached as a quasi-base film, and attaching a high polymer material on the surface of the quasi-base film to obtain a base film; copper metal layers are deposited on the two side surfaces of the base film. According to the technical scheme, the defective products are improved to be base films by attaching the high polymer materials on the surfaces of the composite copper foil which is partially fallen off, and copper metal layers are further deposited on the surfaces of two sides of the base films to obtain the composite copper foil meeting the requirements, so that the reutilization of the defective products is realized, and the cost is reduced.
Description
Technical Field
The disclosure relates to the technical field of lithium ion batteries, in particular to a composite copper foil, a manufacturing method and a lithium ion battery.
Background
The composite copper foil takes a high polymer material as a base film, and metal copper layers are deposited on the upper surface and the lower surface of the base film to form a sandwich structure of copper-high polymer-copper composite, and the composite copper foil has the characteristics of small density, thin thickness, good conductivity and the like, so that the composite copper foil has the potential of replacing the traditional lithium electrolytic copper foil. At present, the production yield of the composite copper foil is about 85%, and the situation that the copper foil falls off is often caused by defective products, so how to process and reuse the defective products is a technical problem to be solved urgently.
Disclosure of Invention
In order to solve the problems in the related art, embodiments of the present disclosure provide a composite copper foil, a manufacturing method, and a lithium ion battery.
In a first aspect, an embodiment of the present disclosure provides a method for manufacturing a composite copper foil, including:
taking the composite copper foil with the copper film partially detached as a quasi-base film, and attaching a high polymer material on the surface of the quasi-base film to obtain a base film;
copper metal layers are deposited on the two side surfaces of the base film.
According to the embodiment of the disclosure, a nano injection molding process is adopted to attach a high polymer material on the surface of the quasi-base film to obtain the base film.
According to an embodiment of the disclosure, the depositing copper metal layers on two side surfaces of the base film includes:
depositing copper metal layers on the surfaces of two sides of the base film by adopting a magnetron sputtering process and a water electroplating process;
the magnetron sputtering process comprises a precursor stage and a subsequent stage, wherein the precursor stage forms 10-15nm films on the surfaces of the two sides of the base film, the subsequent stage is entered after the parameters of the magnetron sputtering are regulated, copper plating is continued on the 10-15nm films, and finally the 25-40nm films are formed.
According to an embodiment of the present disclosure, the adjusting the parameters of the magnetron sputtering includes the following steps:
acquiring a surface image of a base film and an image in the thickness direction of the base film;
determining the flatness of the surface of the film obtained in the previous stage according to the surface image of the base film and the image in the thickness direction of the base film;
and adjusting parameters of magnetron sputtering according to the flatness of the film surface.
In a second aspect, embodiments of the present disclosure provide a composite copper foil obtained by the method for manufacturing a composite copper foil according to any one of the first aspects.
According to an embodiment of the present disclosure, the composite copper foil includes:
the first film layer is made of a high polymer material;
the first copper film is positioned above the first film layer;
the second film layer is made of a high polymer material and is positioned above the first copper film;
the second copper film is positioned above the second film layer;
the third copper film is positioned below the first film layer;
wherein, the first film layer and the first copper film form a composite copper foil with a copper film partially falling off; the first film layer, the first copper film and the second film layer form a base film.
According to an embodiment of the present disclosure, the composite copper foil includes:
the first film layer is made of a high polymer material;
the first copper film is positioned above the first film layer;
the second copper film is positioned below the first film layer;
the second film layer is made of a high polymer material and is respectively positioned above the first copper film and the second copper film;
the third copper films are respectively positioned above the second film layer;
wherein, the first film layer, the first copper film and the second copper film form a composite copper foil with copper film partially falling off; the first film layer, the first copper film, the second copper film and the second film layer form a base film.
According to an embodiment of the present disclosure, the first copper film is a continuous copper film or a discontinuous copper film.
According to an embodiment of the present disclosure, the first copper film is a continuous copper film or a discontinuous copper film; and/or, the second copper film is a continuous copper film or a discontinuous copper film.
In a third aspect, embodiments of the present disclosure provide a lithium ion battery comprising a composite copper foil as in any one of the second aspects.
The manufacturing method of the composite copper foil provided by the embodiment of the disclosure comprises the following steps: taking the composite copper foil with the copper film partially detached as a quasi-base film, and attaching a high polymer material on the surface of the quasi-base film to obtain a base film; copper metal layers are deposited on the two side surfaces of the base film. According to the technical scheme, the defective products are improved to be base films by attaching the high polymer materials on the surfaces of the composite copper foil which is partially fallen off, and copper metal layers are further deposited on the surfaces of two sides of the base films to obtain the composite copper foil meeting the requirements, so that the reutilization of the defective products is realized, and the cost is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
Other features, objects and advantages of the present disclosure will become more apparent from the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 shows a schematic structure of a composite copper foil according to an embodiment of the present disclosure.
Fig. 2 illustrates a schematic structural view of a composite copper foil according to another embodiment of the present disclosure.
Fig. 3 shows a flowchart of a method of manufacturing a composite copper foil according to an embodiment of the present disclosure.
Detailed Description
Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement them. In addition, for the sake of clarity, portions irrelevant to description of the exemplary embodiments are omitted in the drawings.
In this disclosure, it should be understood that terms such as "comprises" or "comprising," etc., are intended to indicate the presence of features, numbers, steps, acts, components, portions, or combinations thereof disclosed in this specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, acts, components, portions, or combinations thereof are present or added.
In addition, it should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
The composite copper foil takes a high polymer material as a base film, and metal copper layers are deposited on the upper surface and the lower surface of the base film to form a sandwich structure of copper-high polymer-copper composite, and the composite copper foil has the characteristics of small density, thin thickness, good conductivity and the like, so that the composite copper foil has the potential of replacing the traditional lithium electrolytic copper foil. At present, the production yield of the composite copper foil is about 85%, and the situation that the copper foil falls off is often caused by defective products, so how to process and reuse the defective products is a technical problem to be solved urgently.
Fig. 1 shows a schematic structure of a composite copper foil according to an embodiment of the present disclosure.
As shown in fig. 1, the composite copper foil includes: a first film 111, a first copper film 112, a second film 12, a second copper film 13, and a third copper film 14. The first film 111, the first copper film 112, and the second film 12 constitute a base film. The second copper film 13 and the third copper film 14 are copper metal layers deposited on the two side surfaces of the base film. The second copper film 13 is positioned above the second film layer 12; the third copper film 14 is located under the first film layer 111. The second copper film 13 includes a sputtered layer 131 and a plating layer 132, the sputtered layer 131 being located on the surface of the base film, the plating layer 132 being located above the sputtered layer 131. The third copper film 14 includes a sputtered layer 141 and a plating layer 142, the sputtered layer 141 being located on the surface of the base film, the plating layer 142 being located above the sputtered layer 141.
The composite copper foil is generally of a sandwich structure of copper-macromolecule-copper, in the disclosed mode, the first film layer 111 and the first copper film 112 form the composite copper foil 11 with the copper film partially falling off, namely, the upper layer or the lower layer copper foil in the sandwich structure is stripped off, the composite copper foil with the copper film partially falling off is generally a defective product, the defective product is improved into a base film by forming the second film layer on the basis of the defective product, and copper metal layers are further deposited on the surfaces of two sides of the base film to obtain the composite copper foil meeting the requirements, so that the recycling of the defective product is realized, and the cost is reduced.
In the composite copper foil 11 shown in fig. 1, the first copper film 112 is a continuous copper film, i.e. a region where no copper film is peeled off from the surface of the first film layer 111, it is understood that the first copper film 112 may also be a discontinuous copper film, i.e. a region where a copper film is peeled off from the surface of the first film layer 111, and the defect may also be improved into a base film by forming a second film layer, which is not described herein.
According to an embodiment of the present disclosure, the first film layer 111 and the second film layer 12 are both made of a polymer material, for example, polyethylene terephthalate (PET) material, polypropylene (PP) material, or Polyimide (PI) material. The materials of the first film layer 111 and the second film layer 12 may be the same or different, which is not limited in this disclosure.
According to embodiments of the present disclosure, the second film layer 12 may be attached on the first copper film 112 in a nano-injection molding process.
Nano injection molding refers to nano molding technology (NMT, nano Molding Technology), namely, after the metal surface is subjected to nanocrystallization, plastics are directly injection molded on the metal surface, so that the metal and the plastics can be integrally molded. The nanometer refers to a microporation process, namely, the metal surface is subjected to nanometer level microporation treatment through a specific solution, and the main purpose is to better combine the metal surface with plastic and improve the connection strength.
According to an embodiment of the present disclosure, sputtered layer 131 and sputtered layer 141 are nichrome layers or copper layers. The sputtering layer is prepared by adopting a magnetron sputtering process, and the nickel-chromium alloy layer is preferentially selected as the sputtering layer, so that compared with the copper layer, the nickel-chromium alloy layer generally has a certain porosity, thereby providing a certain roughness for an electroplated layer on the upper layer and improving the adhesion firmness of the electroplated layer. Of course, the sputtered layer may also be a copper layer, as this disclosure is not limited in this regard. The plating layer 132 and the plating layer 142 are copper layers, and are prepared by adopting a water electroplating process or a vacuum evaporation process combined with a water electroplating process, and the thickness of the sputtering layer is thickened to 1 μm so as to meet the use requirement of the composite copper foil.
Fig. 2 illustrates a schematic structural view of a composite copper foil according to another embodiment of the present disclosure.
As shown in fig. 2, the composite copper foil includes: a first film 211, a first copper film 212, a second copper film 213, a second film 22, and a third copper film 23. The first film layer 211, the first copper film 212, the second copper film 213, and the second film layer 22 constitute a base film. The third copper film 23 is a copper metal layer deposited on both side surfaces of the base film. The third copper film 23 is located above the second film layer 22. The third copper film 23 includes a sputtered layer 231 and a plated layer 232, the sputtered layer 231 being located on the surface of the base film, the plated layer 232 being located above the sputtered layer 231.
In the disclosed manner, the first film layer 211, the first copper film 212 and the second copper film 213 form a composite copper foil 21 with partially-fallen copper films, unlike fig. 1, the second copper film 213 is not wholly fallen, but partially peeled from the first film layer 211, and the defective products such as partial thinning can also occur.
In the composite copper foil 21 shown in fig. 2, the first copper film 212 is a continuous copper film, i.e. the area of the surface of the first film layer 211 where no copper film is peeled off, it is understood that the first copper film 212 may also be a discontinuous copper film, i.e. the area of the surface of the first film layer 211 where a copper film is peeled off, and the defect may also be improved into a base film by forming a second film layer, which is not described herein.
Fig. 3 shows a flowchart of a method of manufacturing a composite copper foil according to an embodiment of the present disclosure.
As shown in fig. 3, the method for manufacturing the composite copper foil includes the steps of:
step one: taking the composite copper foil with the copper film partially detached as a quasi-base film, and attaching a high polymer material on the surface of the quasi-base film to obtain a base film;
step two: copper metal layers are deposited on the two side surfaces of the base film.
According to the embodiment of the disclosure, in the first step, the composite copper foil with the copper film partially peeled off may be used as a reference film, for example, the composite copper foil is a sandwich structure of "copper-polymer-copper", and a bilayer structure of the upper layer or the lower layer of the polymer after the copper film is peeled off is used as the reference film, and in combination with fig. 1, for example, the first film 111 and the first copper film 112 in fig. 1 form the reference film; alternatively, the three-layer structure in which the copper film portion of the upper or lower polymer layer is removed is used as a base film, and as shown in fig. 2, for example, the first film 211, the first copper film 212, and the second copper film 213 in fig. 2 constitute a base film.
According to the embodiment of the disclosure, in the first step, a nano injection molding process is adopted to attach a high polymer material on the surface of a quasi-base film to obtain a base film, the main process of the nano injection molding process related to the disclosure is as follows, firstly, T treatment or E treatment is carried out on a copper film, nanoscale holes are formed on the surface of the copper film by using a T treatment agent or an E treatment agent, the nano holes are ensured to be filled with T liquid or E liquid, air in the T liquid or E liquid is discharged, then, drying treatment is carried out on the surface of the copper film, and finally injection molding is carried out in a mold, so that the high polymer material and the copper film form a tight combination structure. The nano injection molding process is a mature process technology, and specific technical details can be referred to the prior art, and the disclosure is not repeated here.
According to the embodiment of the disclosure, the copper metal layers are deposited on the two side surfaces of the base film in the second step, and the copper plating process commonly used at present has a two-step method and a three-step method.
Specifically, the two-step process flow is a magnetron sputtering process combined with a water electroplating process, firstly, a copper metal layer (about 25-40 nm) is plated on the surfaces of two sides of a base film through the magnetron sputtering process, so that the base film can conduct electricity and ensure that the film has better compactness and bonding force; secondly, thickening the copper metal layer to 1 mu m through a water electroplating process; the three-step method is based on a two-step method, an evaporation process is added before the water electroplating process, and the deposition of the copper metal layer is accelerated by the evaporation process.
The magnetron sputtering process, namely vacuum magnetron sputtering coating, is the first step of the composite copper foil manufacturing process. The vacuum magnetron sputtering coating is to bombard a target material by using high-energy plasma (mainly using argon ions in the process of compounding copper foil), so that the target material is sputtered out in an atomic group or ion form and deposited on the surface of the base film.
The evaporation process, namely vacuum evaporation coating, is the core step of the three-step method. The vacuum evaporation coating is to evaporate metallic copper in the form of atomic groups or molecular groups by heating under vacuum condition, and to deposit on the surface of the base film to form a thin film. The deposition amount of the metal copper evaporated by the vacuum evaporation coating is about three times that of the metal copper by the magnetron sputtering, so that the deposition of copper can be more effectively assisted, the metal level layer is more uniformly distributed, and the problem of insufficient copper layer thickness by a two-step method is solved.
The core of the water electroplating process is to thicken the metallic copper layer to achieve the required thickness. Water electroplating is essentially a displacement reaction in which the two poles of the displacement are placed in a solution, copper ions in the solution are reduced to copper, and the copper ions are deposited on the surface of a base film to form a copper layer of a target thickness.
According to the embodiment of the disclosure, the magnetron sputtering process comprises a preamble stage and a subsequent stage, wherein the preamble stage forms 10-15nm films on the surfaces of the two sides of the base film, the subsequent stage is entered after the parameters of the magnetron sputtering are adjusted, copper plating is continued on the 10-15nm films, and finally the 25-40nm films are formed.
Specifically, the adjusting the parameters of the magnetron sputtering includes the following steps:
acquiring a surface image of a base film and an image in the thickness direction of the base film;
determining the flatness of the surface of the film obtained in the previous stage according to the surface image of the base film and the image in the thickness direction of the base film;
and adjusting parameters of magnetron sputtering according to the flatness of the film surface.
In the disclosed method, the thickness of the film formed in the previous stage is not too large or too small, and is not beneficial to subsequent image acquisition and image analysis if the thickness is smaller than 10nm, and the flatness of the film surface is not convenient to adjust in the subsequent stage if the thickness is larger than 15nm, and the overall sputtering times may also need to be increased, so that the production efficiency is reduced.
In the present disclosure, the surface image of the base film and the image in the thickness direction of the base film may be obtained by using an existing image acquisition technique, for example, the image may be acquired by using a high magnification camera, infrared imaging, or the like, which is not limited in this disclosure.
According to the embodiment of the disclosure, the parameters of the adjusted magnetron sputtering can include, but are not limited to, parameters such as adjusting sputtering pressure, sputtering power, target base distance, substrate type, substrate temperature, background vacuum degree, line speed and the like, one or a plurality of parameters are adjusted according to actual conditions and experience, and then the magnetron sputtering in a subsequent stage is performed, so that the flatness of the base film after being coated is improved. In magnetron sputtering, because argon ions are difficult to ensure to bombard a target uniformly, the randomness of particles bombarded out is reduced by adjusting the parameters of the magnetron sputtering and combining the magnetron sputtering for a plurality of times, the flatness of the surface of a coated film after the magnetron sputtering is ensured, and the high-temperature cycle test performance of the composite copper foil is improved, so that the use requirement can be met.
Based on the same or similar inventive concept, the embodiment of the present disclosure provides a lithium ion battery, including a composite copper foil as a negative electrode terminal, obtained by using the manufacturing method of the composite copper foil described in the above embodiment.
The foregoing description is only of the preferred embodiments of the present disclosure and description of the principles of the technology being employed. It will be appreciated by those skilled in the art that the scope of the invention referred to in this disclosure is not limited to the specific combination of features described above, but encompasses other embodiments in which any combination of features described above or their equivalents is contemplated without departing from the inventive concepts described. Such as those described above, are mutually substituted with the technical features having similar functions disclosed in the present disclosure (but not limited thereto).
Claims (10)
1. A method for manufacturing a composite copper foil, comprising:
taking the composite copper foil with the copper film partially detached as a quasi-base film, and attaching a high polymer material on the surface of the quasi-base film to obtain a base film;
copper metal layers are deposited on the two side surfaces of the base film.
2. The method for manufacturing a composite copper foil according to claim 1, wherein a nano injection molding process is used to attach a polymer material to the surface of the base film to obtain the base film.
3. The method of manufacturing a composite copper foil according to claim 1, wherein depositing copper metal layers on both side surfaces of the base film comprises:
depositing copper metal layers on the surfaces of two sides of the base film by adopting a magnetron sputtering process and a water electroplating process;
the magnetron sputtering process comprises a precursor stage and a subsequent stage, wherein the precursor stage forms 10-15nm films on the surfaces of the two sides of the base film, the subsequent stage is entered after the parameters of the magnetron sputtering are regulated, copper plating is continued on the 10-15nm films, and finally the 25-40nm films are formed.
4. The method of manufacturing a composite copper foil according to claim 3, wherein the adjusting the parameters of the magnetron sputtering comprises the steps of:
acquiring a surface image of a base film and an image in the thickness direction of the base film;
determining the flatness of the surface of the film obtained in the previous stage according to the surface image of the base film and the image in the thickness direction of the base film;
and adjusting parameters of magnetron sputtering according to the flatness of the film surface.
5. A composite copper foil obtained by the method for producing a composite copper foil according to any one of claims 1 to 4.
6. The composite copper foil according to claim 5, wherein the composite copper foil comprises:
the first film layer is made of a high polymer material;
the first copper film is positioned above the first film layer;
the second film layer is made of a high polymer material and is positioned above the first copper film;
the second copper film is positioned above the second film layer;
the third copper film is positioned below the first film layer;
wherein, the first film layer and the first copper film form a composite copper foil with a copper film partially falling off; the first film layer, the first copper film and the second film layer form a base film.
7. The composite copper foil according to claim 5, wherein the composite copper foil comprises:
the first film layer is made of a high polymer material;
the first copper film is positioned above the first film layer;
the second copper film is positioned below the first film layer;
the second film layer is made of a high polymer material and is respectively positioned above the first copper film and the second copper film;
the third copper films are respectively positioned above the second film layer;
wherein, the first film layer, the first copper film and the second copper film form a composite copper foil with copper film partially falling off; the first film layer, the first copper film, the second copper film and the second film layer form a base film.
8. The composite copper foil of claim 6, wherein the first copper film is a continuous copper film or a discontinuous copper film.
9. The composite copper foil of claim 7, wherein the first copper film is a continuous copper film or a discontinuous copper film; and/or, the second copper film is a continuous copper film or a discontinuous copper film.
10. A lithium ion battery comprising the composite copper foil according to any one of claims 5 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311194103.1A CN116960362A (en) | 2023-09-15 | 2023-09-15 | Composite copper foil, manufacturing method and lithium ion battery |
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| CN202311194103.1A CN116960362A (en) | 2023-09-15 | 2023-09-15 | Composite copper foil, manufacturing method and lithium ion battery |
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