CN114015994A - Preparation method of ultrathin composite current collector - Google Patents
Preparation method of ultrathin composite current collector Download PDFInfo
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- CN114015994A CN114015994A CN202111292764.9A CN202111292764A CN114015994A CN 114015994 A CN114015994 A CN 114015994A CN 202111292764 A CN202111292764 A CN 202111292764A CN 114015994 A CN114015994 A CN 114015994A
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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Abstract
The invention discloses a preparation method of an ultrathin composite current collector, which relates to the technical field of vacuum coating and is provided based on the problems of easy film breaking and easy film adhesion in the preparation process of the existing composite current collector preparation technology, and comprises the following steps: (1) processing a film substrate; (2) and simultaneously carrying out asynchronous vacuum plating. After the surface pretreatment, the film supporting layer of the ultrathin composite current collector manufactured by the preparation method forms the bonding layer and the conductive metal layer on the surface of the supporting layer by means of synchronous vacuum plating, so that the surface oxidation of the bonding layer and the internal oxidation of the conductive layer are avoided, the bonding force between the bonding layer and the supporting layer and between the conductive layer and the supporting layer are effectively improved, meanwhile, the mutual adhesion among the bonding layers in the multi-process circulation process can be effectively prevented by the asynchronous vacuum plating, and the product quality ratio is improved.
Description
Technical Field
The invention relates to the technical field of vacuum coating, in particular to a preparation method of an ultrathin composite current collector.
Background
With the continuous development of the lithium ion battery industry, people are pursuing high energy density and light weight of the battery. The current collector is used as an important component of a battery, the quality of the current collector is reduced by an effective method, and the current method for reducing the current collector is mainly realized by plating a conductive metal layer on a thin film supporting layer to prepare a composite current collector.
The existing composite current collector preparation technology is that magnetron sputtering is carried out, evaporation coating and electrolytic plating are carried out, or multiple evaporation coating is carried out, for example, a patent with the application number of 202080005428.9 discloses a composite current collector, and discloses: placing a polyimide film with the thickness of 50 mu m in a vacuum chamber of a crucible boat type vacuum evaporation aluminizing machine, sealing the vacuum chamber, pumping the air pressure of the vacuum aluminizing machine to 10-3Pa, starting aluminizing when the temperature of the crucible boat is adjusted to 1200-1500 ℃, stopping aluminizing when the aluminum thickness reaches 200nm, and then sputtering a layer of Al with the thickness of 5nm on the surface of the aluminum layer2O3A passivation layer is used for standby; the method comprises the steps of carrying out corona treatment on a polyethylene terephthalate film with the thickness of 12 mu m, coating a mixture of bisphenol A epoxy resin and an amine curing agent on the surface of the polyethylene terephthalate film, and carrying out hot-pressing compounding (the temperature of hot-pressing compounding is 85 ℃ and the pressure is 0.7MPa) on the passivated surface of an aluminum coating on the polyethylene terephthalate film and a polyimide film within the opening time of a coating to obtain a first composite current collector, so that the stability of the current collector is improved, but the square resistance of the coating is higher (multiple times of opening after magnetron sputtering or evaporation coating) under the same coating material and thickness, the film is easy to break in the preparation process, and the production rate and efficiency are low (the standing time after magnetron sputtering is longer, and the film is easy to adhere).
Disclosure of Invention
The invention aims to solve the technical problems that the film is easy to break and the film layer is easy to adhere in the preparation process of the existing composite current collector preparation technology.
The invention solves the technical problems through the following technical means:
the preparation method of the ultrathin composite current collector comprises the following steps:
(1) film substrate processing: pretreating the surface of the film;
(2) simultaneous asynchronous vacuum plating
And in the same vacuum chamber, simultaneously performing single magnetron sputtering or evaporation coating on the two surfaces of the film to form a bonding layer and performing single evaporation coating or electron beam plating on a conductive metal layer.
After the surface pretreatment, the film supporting layer of the ultrathin composite current collector manufactured by the preparation method forms the bonding layer and the conductive metal layer on the surface of the supporting layer by means of synchronous vacuum plating, so that the surface oxidation of the bonding layer and the internal oxidation of the conductive layer are avoided, the bonding force between the bonding layer and the supporting layer and between the conductive layer and the supporting layer are effectively improved, meanwhile, the mutual adhesion among the bonding layers in the multi-process circulation process can be effectively prevented by the asynchronous vacuum plating, and the product quality ratio is improved.
Preferably, the pretreatment mode of the film surface in the step (1) comprises one or more of corona treatment, plasma treatment and mechanical treatment.
Preferably, the simultaneous asynchronous vacuum plating is that in the same vacuum chamber, magnetron sputtering or evaporation coating and evaporation coating or electron beam coating are started simultaneously, and the film passes through a magnetron sputtering or evaporation coating area and then passes through an evaporation coating or electron beam coating area.
Preferably, the vacuum environment of the vacuum chamber is 5.0 x 10-4-3.0*10-2Pa。
Preferably, the material of the film support layer comprises a polypropylene film or a polyethylene terephthalate film.
Preferably, the thickness of the film support layer is 3.2 to 6 μm.
Preferably, the bonding layer material comprises one or more of aluminum oxide, titanium oxide, aluminum titanium alloy, metallic nickel and nickel base alloy.
Preferably, the thickness of the bonding layer is 2-50 nm.
Preferably, the material of the conductive metal layer includes metal aluminum or metal copper.
Preferably, the thickness of the conductive metal layer is 200-3000nm, and the sheet resistance of the conductive metal layer is 5-150m omega/□.
The invention has the following beneficial effects:
1. after the surface pretreatment, the film supporting layer of the ultrathin composite current collector manufactured by the preparation method forms the bonding layer and the conductive metal layer on the surface of the supporting layer by means of synchronous vacuum plating, so that the surface oxidation of the bonding layer and the internal oxidation of the conductive layer are avoided, the bonding force between the bonding layer and the supporting layer and between the conductive layer and the supporting layer are effectively improved, meanwhile, the mutual adhesion among the bonding layers in the multi-process circulation process can be effectively prevented by the asynchronous vacuum plating, and the product quality ratio is improved.
2. The bonding layer and the conductive metal layer are formed on the surface of the supporting layer in a simultaneous asynchronous vacuum plating mode, the method is different from the traditional mode of evaporation coating after magnetron sputtering and electrolytic plating or multiple evaporation coating, the required coating thickness can be deposited by one-time tape transport, the coating oxidation can be effectively reduced, the coating resistivity can be reduced, the production efficiency can be improved, and the production cost can be reduced.
Drawings
Fig. 1 is a schematic structural diagram of an ultra-thin composite current collector according to an embodiment of the present invention.
The reference numbers in the figures illustrate: 1. a support layer; 2. a bonding layer; 3. a conductive metal layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Test materials, reagents and the like used in the following examples are commercially available unless otherwise specified.
The specific techniques or conditions not specified in the examples can be performed according to the techniques or conditions described in the literature in the field or according to the product specification.
The structure of the ultrathin composite current collector provided by the invention comprises a film supporting layer 1, bonding layers 2 positioned on two sides of the film supporting layer, and a conductive metal layer 3 positioned on the outer side of the bonding layers 2.
Example 1
A preparation method of an ultrathin composite current collector comprises the following steps:
(1) film substrate processing: a polypropylene film with the thickness of 4.5 mu m is selected as a supporting layer 1, and then the polypropylene film is subjected to corona treatment.
(2) And simultaneously, asynchronous vacuum plating: placing the polypropylene film after corona treatment in a vacuum chamber of a simultaneous asynchronous vacuum plating device, and setting the vacuum environment to be 5.0 x 10-4-3.0*10-2Pa, magnetron sputtering and evaporation coating are started simultaneously, the treated polypropylene film is firstly unreeled from a magnetron sputtering chamber, a layer of nickel-based alloy with the thickness of 10nm is respectively sputtered on two sides of the polypropylene film to form a bonding layer 2 in the magnetron sputtering chamber through two magnetron sputtering areas, then the bonding layer 2 enters a vacuum evaporation chamber, a layer of metal copper with the thickness of 1000nm is respectively evaporated on two sides of the bonding layer 2 to form a conductive metal layer 3 through the two evaporation areas, and finally finished product rolling is carried out.
Example 2
A preparation method of an ultrathin composite current collector comprises the following steps:
(1) film substrate processing: a polypropylene film with the thickness of 4.5 mu m is selected as a supporting layer 1, and then the polypropylene film is subjected to corona treatment.
(2) And simultaneously, asynchronous vacuum plating: placing the polypropylene film after corona treatment in a vacuum chamber of a simultaneous asynchronous vacuum plating device, and setting the vacuum environment to be 5.0 x 10-4-3.0*10-2Pa, opening and treating the magnetron sputtering film and the evaporation film simultaneouslyThe polypropylene film is firstly unreeled from a magnetron sputtering chamber, nickel-based alloy with the thickness of 10nm is respectively sputtered on two sides of the polypropylene film to form a bonding layer 2 through two magnetron sputtering areas in the magnetron sputtering chamber, then the bonding layer enters a vacuum evaporation chamber, a metal copper with the thickness of 1500nm is respectively evaporated on two sides of the bonding layer 2 through the two evaporation areas to form a conductive metal layer 3, and finally finished product rolling is carried out.
Example 3
A preparation method of an ultrathin composite current collector comprises the following steps,
(1) film substrate processing: selecting a polypropylene film with the thickness of 3.2 mu m as a support layer 1, and then carrying out corona treatment on the polypropylene film.
(2) And simultaneously, asynchronous vacuum plating: placing the polypropylene film after corona treatment in a vacuum chamber of a simultaneous asynchronous vacuum plating device, and setting the vacuum environment to be 5.0 x 10-4-3.0*10-2Pa, starting magnetron sputtering and electron beam plating at the same time, firstly unreeling the treated polypropylene film from a magnetron sputtering chamber, respectively sputtering a layer of nickel-based alloy with the thickness of 5nm on two sides of the polypropylene film to form a bonding layer 2 in the magnetron sputtering chamber through two magnetron sputtering areas, then entering the electron beam coating chamber, respectively plating a layer of metal copper with the thickness of 1200nm on two sides of the bonding layer 2 through the two electron beam coating areas to form a conductive metal layer 3, and finally winding a finished product.
Example 4
A preparation method of an ultrathin composite current collector comprises the following steps,
(1) film substrate processing: a polyethylene terephthalate film having a thickness of 6 μm was selected as the support layer 1, and then plasma treatment was performed on the polyethylene terephthalate film.
(2) And simultaneously, asynchronous vacuum plating: placing the polyethylene terephthalate film subjected to corona treatment in a vacuum chamber of a simultaneous asynchronous vacuum plating device, and setting the vacuum environment to be 5.0 x 10-4-3.0*10-2Pa, the magnetron sputtering and the electron beam plating are started simultaneously, the treated polyethylene terephthalate film is firstly unreeled from the front vacuum evaporation chamber and is vacuum evaporated in frontIn the hair-growing chamber through two evaporation zone, respectively in the both sides of polyethylene glycol terephthalate film respectively the evaporation plating one deck thickness be 10nm aluminium oxide form tie coat 2, then get into back vacuum evaporation chamber, through two evaporation zone, respectively the evaporation plating one deck thickness be 1000nm metal aluminium form conductive metal layer 3 in tie coat 2 both sides, carry out the finished product rolling finally.
Example 5
A preparation method of an ultrathin composite current collector comprises the following steps,
(1) film substrate processing: selecting a polypropylene film with the thickness of 6 mu m as a support layer 1, and then carrying out corona treatment on the polyethylene terephthalate film.
(2) And simultaneously, asynchronous vacuum plating: placing the polyethylene terephthalate film subjected to corona treatment in a vacuum chamber of a simultaneous asynchronous vacuum plating device, and setting the vacuum environment to be 5.0 x 10-4-3.0*10-2Pa, simultaneously starting evaporation coating and electron beam plating, firstly unreeling the treated polyethylene terephthalate film from a vacuum evaporation chamber, respectively evaporating two sides of the polyethylene terephthalate film to form an alumina layer with the thickness of 5nm to form a bonding layer 2 in the vacuum evaporation chamber through two evaporation areas, then entering the electron beam coating chamber, respectively plating a metal aluminum layer with the thickness of 1200nm on two sides of the bonding layer 2 to form a conductive metal layer 3 through the two electron beam coating areas, and finally winding a finished product.
Comparative example 1
A preparation method of an ultrathin composite current collector comprises the following steps,
(1) film substrate processing: a polypropylene film with the thickness of 4.5 mu m is selected as a supporting layer 1, and then the polypropylene film is subjected to corona treatment.
(2) Film coating: 5.0 x 10 in vacuum environment-4-3.0*10-2Under Pa, firstly forming a layer of nickel-based alloy with the thickness of 10nm by magnetron sputtering on two surfaces of the polypropylene film prepared in the step 1 to form a bonding layer 2,
(3) 5.0 x 10 in vacuum environment-4-3.0*10-2Under Pa, a layer of metal copper with the thickness of 100nm is respectively evaporated and plated on the two sides of the bonding layer 2,
(4) and finally, electroplating metal copper with the thickness of 900nm in the atmospheric environment to form the conductive metal layer 3.
Comparative example 2
A preparation method of an ultrathin composite current collector comprises the following steps,
(1) film substrate processing: a polyethylene terephthalate film having a thickness of 6 μm was selected as the support layer 1, and then plasma treatment was performed on the polyethylene terephthalate film.
(2) And (3) evaporation coating: 5.0 x 10 in vacuum environment-4-3.0*10-2Under Pa, evaporating a layer of aluminum oxide with the thickness of 10nm on each of two surfaces of the polyethylene terephthalate film prepared in the step 1 to form a bonding layer 2;
(3) then, the conductive metal layer 3 is formed by evaporating the plating film several times to obtain metallic aluminum having a total thickness of 1000 nm.
The performance of the composite current collectors manufactured in examples 1-5 and comparative examples 1-2 was tested, and the preparation goodness rate and efficiency were counted, with the test and statistical data shown in table 1; wherein the adhesion test standard is as follows: soaking a test sample in the electrolyte for 24 hours, and testing the bonding force by using a tensile machine after the test sample is taken out; the electrolyte model is U20, the sample size is 20 x 100mm, and the test speed is 300 mm/min.
Table 1 shows the results of the performance test of the composite current collector
As can be seen from the results in table 1, after the surface pretreatment, the bonding layer and the conductive metal layer are formed on the surface of the support layer by the simultaneous asynchronous vacuum plating, so that the oxidation of the surface of the bonding layer and the inside of the conductive layer is avoided, the bonding force between the bonding layer and the support layer is effectively improved, and the asynchronous vacuum plating can effectively prevent the bonding layers from being adhered to each other in the multi-process circulation process, thereby improving the product quality; and different from the traditional mode of evaporating and coating the film after magnetron sputtering and then electrolytically plating or evaporating and coating the film for multiple times, the required coating thickness can be deposited by one-time tape transport, the coating oxidation can be effectively reduced, the coating resistivity can be reduced, the production efficiency can be improved, and the production cost can be reduced.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The preparation method of the ultrathin composite current collector is characterized in that the structure of the ultrathin composite current collector comprises a film supporting layer, bonding layers positioned on two sides of the film supporting layer and a conductive metal layer positioned on the outer side of the bonding layers, and the preparation method comprises the following steps:
(1) film substrate processing: pretreating the surface of the film;
(2) simultaneous asynchronous vacuum plating
And in the same vacuum chamber, simultaneously performing single magnetron sputtering or evaporation coating on the two surfaces of the film to form a bonding layer and performing single evaporation coating or electron beam plating on a conductive metal layer.
2. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the pretreatment mode of the film surface in the step (1) comprises one or more of corona treatment, plasma treatment and mechanical treatment.
3. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the simultaneous asynchronous vacuum plating is that in the same vacuum chamber, magnetron sputtering or evaporation coating and evaporation coating or electron beam coating are started simultaneously, and the film passes through a magnetron sputtering or evaporation coating area and then passes through an evaporation coating or electron beam coating area.
4. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the vacuum environment of the vacuum chamber is 5.0 x 10-4-3.0*10-2Pa。
5. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the material of the film supporting layer comprises a polypropylene film or a polyethylene terephthalate film.
6. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the thickness of the film support layer is 3.2-6 μm.
7. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the bonding layer material comprises one or more of aluminum oxide, titanium oxide, aluminum-titanium alloy, metallic nickel and nickel-based alloy.
8. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the thickness of the bonding layer is 2-50 nm.
9. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the conductive metal layer is made of metal aluminum or metal copper.
10. The method of claim 1, wherein the step of preparing the ultra-thin composite current collector comprises: the thickness of the conductive metal layer is 200-3000nm, and the sheet resistance of the conductive metal layer is 5-150m omega/□.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024000803A1 (en) * | 2022-06-29 | 2024-01-04 | 扬州纳力新材料科技有限公司 | Preparation method for composite current collector, and composite current collector |
| WO2024031221A1 (en) * | 2022-08-08 | 2024-02-15 | 宁德时代新能源科技股份有限公司 | Current collector, electrode plate, secondary battery, battery module, battery pack and electric device |
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| CN106011798A (en) * | 2016-06-30 | 2016-10-12 | 肇庆市科润真空设备有限公司 | Graphene thin film coating device and method based on PECVD |
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