CN216749963U - Composite conductive copper foil - Google Patents
Composite conductive copper foil Download PDFInfo
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- CN216749963U CN216749963U CN202122794912.9U CN202122794912U CN216749963U CN 216749963 U CN216749963 U CN 216749963U CN 202122794912 U CN202122794912 U CN 202122794912U CN 216749963 U CN216749963 U CN 216749963U
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Abstract
The utility model discloses a composite conductive copper foil which comprises a film substrate, a first metallization layer arranged on the top surface of the film substrate, a second metallization layer arranged on the bottom surface of the film substrate, a first copper film layer arranged on one surface, far away from the film substrate, of the first metallization layer, and a second copper film layer arranged on one surface, far away from the film substrate, of the second metallization layer. The lithium (sodium) ion battery has the advantages of light weight, low cost, good tensile strength and ductility, greatly improved safety performance, and great satisfaction of use requirements.
Description
Technical Field
The utility model relates to the technical field of lithium (sodium) ion batteries, in particular to a composite conductive copper foil.
Background
The copper foil is naturally the preferred material for the negative electrode of the lithium (sodium) ion battery due to the advantages of good conductivity, soft texture, mature manufacturing technology and the like. The copper foil serves as a carrier of a negative electrode active substance and a collection and transmission body of negative electrode electron current in the lithium (sodium) ion battery, so that the tensile strength, the ductility, the compactness, the surface roughness, the thickness uniformity, the appearance quality and the like of the copper foil have great influence on the manufacturing process of the negative electrode of the lithium (sodium) ion battery and the electrochemical performance of the lithium (sodium) ion battery. The lithium (sodium) ion battery has severe working environment and performance requirements, and has various requirements on the thickness, the oxidation resistance and the adhesion performance of the copper foil, and the quality of the copper foil has great influence on the manufacturing process of the negative electrode and the performance of the battery.
The copper foils are classified according to production processes, namely, calendered copper foils and electrolytic copper foils. With the development of the technology, the advantages of high production efficiency, low cost and the like of the electrolytic process are gradually highlighted, and the electrolytic copper foil becomes the first choice copper foil of the lithium (sodium) ion battery negative electrode.
The thickness of the current electrolytic copper foil is usually between 6 and 20 μm, the mainstream preparation method is the electrolytic copper process, and the electrolytic copper foil is solid copper, thereby causing the following disadvantages:
1. the electrolytic copper foil is thick and heavy;
2. the copper material used by the electrolytic copper foil is large in consumption and high in cost;
3. the electrolytic copper foil has poor tensile strength and ductility.
Therefore, a composite conductive copper foil is needed to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides the composite conductive copper foil which is light in weight, low in cost, good in tensile strength and ductility and capable of greatly improving the safety performance of the lithium (sodium) ion battery.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
the utility model provides a composite conductive copper foil which comprises a film substrate, a first metallization layer arranged on the top surface of the film substrate, a second metallization layer arranged on the bottom surface of the film substrate, a first copper film layer arranged on one surface, far away from the film substrate, of the first metallization layer, and a second copper film layer arranged on one surface, far away from the film substrate, of the second metallization layer.
As a preferable technical scheme, the film substrate is a PET film substrate, a PP film substrate or a PI film substrate.
As a preferred technical scheme, the thickness of the film substrate is 1.5um-30 um.
Preferably, the material of the first metallization layer and the material of the second metallization layer are each one or a combination of more of molybdenum, niobium, aluminum, neodymium, copper, titanium, silver, and gold.
Preferably, the first metallization layer and the second metallization layer are both alloy layers, and the alloy layers are made of two or more metals selected from molybdenum, niobium, aluminum, neodymium, copper, titanium, silver, and gold.
As a preferable technical solution, the thickness of the first metallization layer and the thickness of the second metallization layer are both 0.01um to 1 um.
Preferably, the surface resistance of the first metallization layer and the surface resistance of the second metallization layer are both 1 × 10-5Ω/cm2-1×101Ω/cm2。
As a preferred technical scheme, the first copper film layer and the second copper film layer are both copper layers.
As the preferred technical scheme, the thickness of the first copper film layer and the thickness of the second copper film layer are both 0.1um-3 um.
Preferably, the surface resistance of the first copper film layer and the surface resistance of the second copper film layer are both 1 × 10-5Ω/cm2-1×10-1Ω/cm2。
The utility model has the beneficial effects that: according to the utility model, the film substrate is light in weight, the using amount of copper materials can be reduced, the cost is reduced, the weight of the whole composite conductive copper foil is reduced, the tensile strength and the ductility of the whole composite conductive copper foil are improved, the safety performance of the lithium (sodium) ion battery is greatly improved, the performance requirements of the copper foil can be met through the first metallization layer, the second metallization layer, the first copper film layer and the second copper film layer, and the use requirements are greatly met.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic cross-sectional view of a composite conductive copper foil according to an embodiment of the present invention;
fig. 2 is a schematic flow chart of a method for manufacturing a composite conductive copper foil based on the composite conductive copper foil shown in fig. 1.
Detailed Description
The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. All technical characteristics in the utility model can be interactively combined on the premise of not conflicting with each other.
Referring to fig. 1, a composite conductive copper foil according to an embodiment of the present invention includes a film substrate 12, a first metallization layer 14 disposed on a top surface of the film substrate 12, a second metallization layer 15 disposed on a bottom surface of the film substrate 12, a first copper film layer 17 disposed on a surface of the first metallization layer 14 away from the film substrate 12, and a second copper film layer 18 disposed on a surface of the second metallization layer 15 away from the film substrate 12. Through the structure, the film substrate 12 is light in weight, the using amount of copper materials can be reduced, the cost is reduced, the weight of the whole composite conductive copper foil is reduced, the tensile strength and the ductility of the whole composite conductive copper foil are improved, meanwhile, the safety performance of the lithium (sodium) ion battery is greatly improved, and the performance requirements of the copper foil can be met through the arranged first metallization layer 14, the second metallization layer 15, the first copper film layer 17 and the second copper film layer 18, so that the use requirements are greatly met.
The film substrate 12 is a PET (Polyethylene terephthalate) film substrate, and it is understood that the film substrate 12 may also be a PP (Polypropylene) film substrate, a PI (Polyimide) film substrate, or other organic film substrates, for example. The density of the PET film substrate, the PP film substrate and the PI film substrate is low, and the weight of the whole composite conductive copper foil can be further reduced.
In this embodiment, the first metallization layer 14 and the second metallization layer 15 are disposed on the top surface and the bottom surface of the film base 12 by a deposition method, such as physical vapor deposition, chemical vapor deposition, electroplating, or electroless plating.
The material of the first metallization layer 14 and the material of the second metallization layer 15 are each one or a combination of more of molybdenum, niobium, aluminum, neodymium, copper, titanium, silver, and gold.
In an alternative, the first metallization layer 14 and the second metallization layer 15 are both alloy layers, and the alloy layers are composed of two or more metals selected from molybdenum, niobium, aluminum, neodymium, copper, titanium, silver, and gold.
The first copper film layer 17 and the second copper film layer 18 are both copper layers, and the first copper film layer 17 and the second copper film layer 18 are obtained by performing copper electroplating treatment on one surface of the first metallization layer 14, which is far away from the film substrate 12, and one surface of the second metallization layer 15, which is far away from the film substrate 12.
The thickness of the film substrate 12 is 1.5um-30um (micrometer), the thickness of the first metallization layer 14 and the thickness of the second metallization layer 15 are both 0.01um-1um, and the thickness of the first copper film layer 17 and the thickness of the second copper film layer 18 are both 0.1um-3um, so that the composite conductive copper foil is 1.72um-34um in thickness, and is small compared with the copper foil in the prior art, and the weight of the whole composite conductive copper foil is further reduced.
The surface resistance of the first metallization layer 14 and the surface resistance of the second metallization layer 15 are both 1 × 10-5Ω/cm2(ohm/cm) 1X 101Ω/cm2The surface resistance of the first copper film layer 17 and the surface resistance of the second copper film layer 18 are both 1 × 10-5Ω/cm2-1×10-1Ω/cm2The purities of the first copper film layer 17 and the second copper film layer 18 are both more than or equal to 99 percent, so that the performance requirements of the copper foil can be met.
Further, the one side of keeping away from first metallization 14 of first copper rete 17 is equipped with first oxidation resisting layer, and the one side of keeping away from second metallization 15 of second copper rete 18 is equipped with the second oxidation resisting layer to can play the guard action to first copper rete 17, second copper rete 18, prevent the oxidation, prolong composite conductive copper foil's life. First oxidation resisting layer, the setting of second oxidation resisting layer, be through spraying first copper rete 17 the one side of keeping away from first metallization 14 with copper antioxidant solvent, the one side of keeping away from second metallization 15 of second copper rete 18, thereby form first oxidation resisting layer, the second oxidation resisting layer, or with first copper rete 17, second copper rete 18 is electroplated the back, soak compound conductive copper foil in copper antioxidant solvent, make the one side of keeping away from first metallization 14 of first copper rete 17, the one side of keeping away from second metallization 15 of second copper rete 18 forms first oxidation resisting layer respectively, the second oxidation resisting layer. It is understood that the arrangement of the first oxidation resistant layer and the second oxidation resistant layer can be set according to actual conditions.
Referring to fig. 2, the present invention further provides a method for preparing a composite conductive copper foil based on the composite conductive copper foil of fig. 1, including the steps of:
s2, selecting a film with the width of 0.4m-2m (meter) as the film substrate 12, and the length of the film is not limited. The film is a PET film, but it is understood that the film may be, for example, a PP film, a PI film, or other organic films. The thickness of the film substrate 12 is 1.5um to 30 um.
S4, depositing a first metallization layer 14 and a second metallization layer 15 on the top surface and the bottom surface of the film substrate 12 by a deposition method. The deposition method is, for example, physical vapor deposition, chemical vapor deposition, electroplating, electroless plating, and the like.
The material of the first metallization layer 14 and the material of the second metallization layer 15 are each one or a combination of more of molybdenum, niobium, aluminum, neodymium, copper, titanium, silver, and gold.
In an alternative, the first metallization layer 14 and the second metallization layer 15 are both alloy layers, and the alloy layers are composed of two or more metals selected from molybdenum, niobium, aluminum, neodymium, copper, titanium, silver, and gold.
The thickness of the first metallization layer 14 and the thickness of the second metallization layer 15 are both 0.01um to 1um, and the surface resistance of the first metallization layer 14 and the surface resistance of the second metallization layer 15 are both 1 × 10-5Ω/cm2-1×101Ω/cm2。
S6, performing an electroplating copper process on the surface of the first metallization layer 14 away from the film substrate 12 and the surface of the second metallization layer 15 away from the film substrate 12, respectively, to form a first copper film layer 17 and a second copper film layer 18, so as to complete the preparation of the composite conductive copper foil.
The thickness of the first copper film layer 17 and the thickness of the second copper film layer 18 are both 0.1um-3um, and the surface resistance of the first copper film layer 17 and the surface resistance of the second copper film layer 18 are both 1 x 10-5Ω/cm2-1×10-1Ω/cm2The purities of the first copper film layer 17 and the second copper film layer 18 are both more than or equal to 99%.
Further, the preparation method of the present invention further includes step S8, spraying a copper antioxidant solvent on the surface of the first copper film layer 17 away from the first metallization layer 14 and the surface of the second copper film layer 18 away from the second metallization layer 15, respectively, so as to form a first oxidation resistant layer and a second oxidation resistant layer. The first oxidation resistant layer and the second oxidation resistant layer can protect the first copper film layer 17 and the second copper film layer 18 from oxidation, and the service life of the composite conductive copper foil is prolonged.
Step S8 is also an alternative, and specifically, the composite conductive copper foil is soaked in a copper antioxidant solvent, so that a first antioxidant layer and a second antioxidant layer are respectively formed on a side of the first copper film layer 17 away from the first metallization layer 14 and a side of the second copper film layer 18 away from the second metallization layer 15.
The preparation method disclosed by the utility model is simple in process, and the prepared composite conductive copper foil is light in weight, good in tensile strength and ductility and low in cost, can meet the performance requirements of the copper foil, greatly improves the safety performance of the lithium (sodium) ion battery, and greatly meets the use requirements.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (9)
1. The composite conductive copper foil is characterized by comprising a film substrate, a first metallization layer arranged on the top surface of the film substrate, a second metallization layer arranged on the bottom surface of the film substrate, a first copper film layer arranged on one surface, far away from the film substrate, of the first metallization layer, and a second copper film layer arranged on one surface, far away from the film substrate, of the second metallization layer.
2. The composite conductive copper foil according to claim 1, wherein the film substrate is a PET film substrate, a PP film substrate, or a PI film substrate.
3. The composite conductive copper foil of claim 1, wherein the film base has a thickness of 1.5um to 30 um.
4. The composite conductive copper foil as claimed in claim 1, wherein the first and second metalized layers are each one of molybdenum, niobium, aluminum, neodymium, copper, titanium, silver and gold.
5. The composite conductive copper foil of claim 1, wherein the thickness of the first metallization layer and the thickness of the second metallization layer are both 0.01um to 1 um.
6. The composite conductive copper foil of claim 1, wherein the surface resistance of the first metallization layer and the surface resistance of the second metallization layer are each 1 x 10-5Ω/cm2-1×101Ω/cm2。
7. The composite conductive copper foil of claim 1, wherein the first and second copper film layers are both copper layers.
8. The composite conductive copper foil of claim 1, wherein the thickness of the first copper film layer and the thickness of the second copper film layer are both 0.1um to 3 um.
9. The composite conductive copper foil of claim 1, wherein the surface resistance of the first copper film layer and the surface resistance of the second copper film layer are both 1 x 10-5Ω/cm2-1×10-1Ω/cm2。
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| CN202122794912.9U CN216749963U (en) | 2021-11-15 | 2021-11-15 | Composite conductive copper foil |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114188543A (en) * | 2021-11-15 | 2022-03-15 | 深圳市宝明科技股份有限公司 | Composite conductive copper foil and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114188543A (en) * | 2021-11-15 | 2022-03-15 | 深圳市宝明科技股份有限公司 | Composite conductive copper foil and preparation method thereof |
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