CN1575118A - Method for manufacturing an emi shielding element - Google Patents

Method for manufacturing an emi shielding element Download PDF

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Publication number
CN1575118A
CN1575118A CNA200310122394XA CN200310122394A CN1575118A CN 1575118 A CN1575118 A CN 1575118A CN A200310122394X A CNA200310122394X A CN A200310122394XA CN 200310122394 A CN200310122394 A CN 200310122394A CN 1575118 A CN1575118 A CN 1575118A
Authority
CN
China
Prior art keywords
plating
nickel
electroless plating
solution
paper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200310122394XA
Other languages
Chinese (zh)
Inventor
迈克尔·E·琼克
大卫·B·伍德
查尔斯·R·杰弗瑞斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Publication of CN1575118A publication Critical patent/CN1575118A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

A method for manufacturing an EMI shielding element from a sheet of polymer material includes forming the shielding element by vacuum- or pressure-molding. The formed element is then chemically etched to roughen its surface on a microscopic scale. The surface is subsequently treated with a catalyzing solution to enable the shielding element to be plated by electroless plating. A first metallic layer is deposited on the etched and catalyzed surface by electroless plating, and a second metallic layer is deposited on the first by electrolytic plating.

Description

A kind of manufacture method of electromagnetic interference shield unit
Technical field
The present invention relates to the screen unit that electronic equipment uses, as the screen unit of telecommunications, optical fiber and computer equipment or the like use.Need with these screen units shield this kind equipment assembly and with their line, avoiding electromagnetic field may be to the interference of their operations.
Background technology
In the prior art, such screen unit is made with metal foiled paper, metal foiled paper is cut and curves the covering shape that needs.Also have, screen unit is made by injection molding with plastics, plates subsequently with metal level, and the shielding action that needs is provided by metal level.
The invention provides a kind of method of more economic such screen unit of making, compare with the method for these prior aries, is a kind of improvement.
Summary of the invention
Therefore, the present invention is a kind of method that electronic equipment provides the screen unit of EMI (electromagnetic interference) shielding that is made as, and this method catalysis and deposited plating become the polymeric material of screen unit shape paper by pushing or vacuumizing.
Because in manufacturing process, screen unit is known, so this method comprises the step to this partial corrosion, this part is formed by polymeric material paper, it is coarse that this part surface is become at microscope, and it can and can be sticked to metal level above it by catalysis.Then, with catalytic solution catalyzed corrosion surface, make it apply plating with electroless plating.
Electroless plating is deposited on the first metal layer on the surface of this part.The first metal layer can be the metal of any conduction, comprises copper, nickel, cobalt, silver, gold or tin, can make this partially conductive, so that play the electrode effect in the deposited plating of electrolysis subsequently step.
At last, applying plating with electrolysis is deposited on second metal level on the first metal layer of this part.Second metal level can be the metal of any electrolysis, comprises nickel, tin, copper, zinc or chromium.
In the following discussion, will be described in more detail the present invention.
Embodiment
Screen unit according to method of the present invention is made has various widely application on electronics industry, they generally are used for the EMI shielding.Therefore, they have various shapes and structure, make them can finish the function of shielding that needs to specific application.For example, screen unit can be the lid of circuit chip on board in the electronic equipment, also can be the lid or the box of whole assembly in the electronic equipment, and for example, this electronic equipment for example is a personal computer.In addition, screen unit can be the big envelope of the cable that is connected with an electronic equipment.In brief, the invention is not restricted in these concrete varied screen units any, but other screen units of containing all these screen units and not offering some clarification on here.
According to the present invention, screen unit is to be formed through extrusion molding or vacuum mo(u)lding by polymeric material paper, rather than defers to the injection molding flow process that prior art has been set up.Paper shape polymeric material can be any of variety of polymers, comprises TEFLON (polytetrafluoroethylene, polytetrafluoroethylene), polyester (polyester) or polypropylene (polypropylene), but ABS (acrylonitrile-butadiene-styrene copolymer preferably, acrylonitrile-BS), HIPS (high-impact polystyrene, high impact polystyrene) or PC-ABS (polycarbonateABS, polycarbonate/ABS), selecting these polymer for use, is because they are easy to the catalysis of the standard of accepting and apply the plating flow process.The suitable ABS plastics can be bought from the Bayer Corporation of American I ndiana state Elkhart, model is Lustran 752, this kind model is high anti-towards property, high smooth surface, black ABS plastic, provides with the form of paper, and thickness is (0.017 inch of 17 mil; 0.43mm).LUSTRAN It is the registered trade mark (U.S. Register No.720,161) that Bayer Corporation has.
For the screen unit of the 3 dimensional coil geometry that forms requirement, polymeric material paper is cut into the former that size is put use just into, in other words, or extrusion molding equipment, or vacuum mo(u)lding equipment.Slightly paper is heated, make its deliquescing and easily deformable, be placed on then between two matrixs of former mould.Then altogether, perhaps,, make polymer paper consistent with mold shape perhaps by vacuumizing by pressurization mould.When mould takes out, " part " of acquisition keeps this shape in view of the above.Obviously, should " part " will comprise two sections, i.e. moulding section and not moulding section, the moulding section finally becomes the screen unit that will make, and the moulding section is not made of the area of undeformed paper in the mold apparatus.In case of necessity, perhaps be when deposited plating process finishes, can repair the edge of screen unit, the said section in back is cut.
Next step of manufacturing process is this part that cleaning prepares to apply plating, removes any oil, fat or other pollutants that require in forming process.For example, can be at room temperature, this part was immersed 1-propyl alcohol (1-propanol) (propyl group alcohol) 30 seconds, then, in DI (deionization) water that flows, wash, remove any immersion process and remain in alcohol film on this part.More generally, any commercial available solvent such as alcohol, may be used to this cleaning.
Manufacturing process is then carried out corrosion step, and it is coarse that the surface of this part is become at microscope, for catalysis is prepared with applying to plate.Chromium/sulfuric acid corrosion solution can be used for this corrosion purposes.
The preparation of this solution can be dissolved in 380 gram chromic acid in the enough DI water, to produce the solution of 830ml volume.Then, add the concentrated sulfuric acid of 170ml, make its volume become 1 liter.
The solution that obtains is heated to 70 ℃, these partially submerged about 7 minutes, at this moment between in want mechanical agitation.Then, this part is placed in the mobile DI water washes, and remove chromium, till again can't see chromium at this part surface.
Next step, promptly catalytic step is the surface catalysis that this part is corroded, and makes it apply plating with electroless plating.The commercial catalyst of buying can be used for this purposes.For example available Shipley Cataposit 44 can buy from the Shipley Company of U.S. Massachusetts state Marlboro.CATAPOSIT It is the registered trade mark (U.S. Register No.1,031,891) that U.S. Pennsylvania state Rohmand Haas Company of Philadelphia has.
Being used for the preparation of the catalytic solution of this manufacturing process, is the enough DI water dilutions of ShipleyCataposit 44 usefulness of 50ml, obtains the volume of 300ml.Then the catalytic solution that obtains is heated to 40 ℃, this partially submerged about 1 minute, at this moment between in want mechanical agitation.Take out this part then, be immersed in succession in three DI water receptacles, this part is stayed in the 3rd container, till will carrying out next step of manufacturing process.
Shipley Cataposit 44 usefulness tin and palladium mixture are as catalyst.In practice of the present invention, adopt other catalyst of palladium, gold, silver or platinum, also can use.
Next step is the electroless plating step.The commercial electroless plating solution of buying can be used as this purposes.For example use MacDermid Ultra Dep 1000 no electrolytic coppers, can buy from Land of Steady Habits MacDermid Incorporated of Waterbury.For finishing the electroless plating step, prepare the MacDermid Ultra Dep 1000 no electrolytic copper solution of appropriate amount, be heated to 50 ℃, apply plating 15 to 20 minutes with standby catalysis material, the while mechanical agitation is to activate solution.Take out standby catalysis material then, in this partially submerged solution that will apply plating, still need mechanical agitation, apply about 7 minutes of plating then.Afterwards, take out this part and in the DI water that flows, washing.
In addition, the electroless plating step also can be carried out with the electroless plating solution based on nickel, cobalt, silver, gold or tin, and this does not depart from scope of the present invention.
The final step of manufacturing process of the present invention is that the plating step is applied in electrolysis.Plating liquor is applied in the commercial electrolysis of buying, and can be used as this purposes.For example use MacDermid BarrettSN (electrolysis sulfamate nickel), also can buy from Land of Steady Habits MacDermid Incorporated of Waterbury.Apply the plating step for finishing electrolysis, prepare the MacDermid Barrett SN of appropriate amount, be heated to 50 ℃, and pH is adjusted to 4.0.Then, lay the hull cell nickel electrode of standard in the deposited plating liquor of electrolysis, solution is wanted mechanical agitation.Then, applied this part of plating about 2 minutes with 2.0amps, Rotate 180 ° applied this part of plating about again 2 minutes with 2.0amps again.Afterwards, this part is taken out from solution, in the DI water that flows, washed, and in 80 ℃ dry 30 minutes.
Because the corrosion resistance of nickel, nickel is to be generally used for electric coating most, but also can apply plating one deck tin, copper, zinc or chromium with electrolysis, applies to be plated on this part.All these metals all are effective providing in the EMI shielding.
One of ordinary skill in the art appreciates that and revise above illustration, but such modification can not make the present invention depart from the scope of back appended claims.

Claims (18)

1. one kind is made as the method that electronic equipment provides the screen unit of EMI shielding, and the step that said method comprises is:
A) provide polymeric material paper;
B), form the part of the 3 dimensional coil geometry of said screen unit requirement by said polymeric material paper;
C) corrode said part, it is coarse that surface on it is become at microscope;
D) with the said surface of the said part of catalytic solution catalysis, make said surface energy apply plating with electroless plating;
E) carry out electroless plating in said part, the first metal layer is deposited on the surface of said part; With
F) carry out electrolysis in said part and apply plating, second metal level is deposited on the said the first metal layer.
2. according to the process of claim 1 wherein the said polymer material, be selected from one group of following material: polytetrafluoroethylene, polyester or polypropylene.
3. according to the process of claim 1 wherein that the said polymer material is ABS (acrylonitrile-butadiene-styrene copolymer).
4. according to the process of claim 1 wherein that the said polymer material is HIPS (high impact polystyrene).
5. according to the process of claim 1 wherein that the said polymer material is PC-ABS (polycarbonate/ABS).
6. according to the process of claim 1 wherein that said part is formed by extrusion molding by said paper.
7. according to the process of claim 1 wherein that said part is formed by vacuum mo(u)lding by said paper.
8. according to the method for claim 1, at step b) and c) between, also comprise the step of the said part that cleaning is formed by the said polymer material paper.
9. according to the method for claim 8, wherein said cleaning comprises in the said part immersion solvent.
10. according to the method for claim 9, wherein said solvent is 1-propyl alcohol (1-propanol).
11., comprise being partially immersed in chromium/sulfuric acid corrosion solution said according to the process of claim 1 wherein said corrosion step.
12. according to the method for claim 11, wherein said part is after being immersed in said etchant solution, with the deionized water rinsing that flows.
13. according to the process of claim 1 wherein that said catalytic solution contains tin and palladium mixture as catalyst.
14. be selected from as the metal of next group as catalyst according to the process of claim 1 wherein that said catalytic solution contains: palladium, gold, silver and platinum.
15., comprise being partially immersed in the electroless plating solution said according to the process of claim 1 wherein said electroless plating.
16. according to the method for claim 13, wherein said electroless plating solution contains the metal that is selected from as next group, is applied plating as being deposited on said the first metal layer: copper, nickel, cobalt, silver, gold and tin.
17. apply in the plating step in said electrolysis according to the process of claim 1 wherein, use the nickel electrode in nickel sulfamic acid (sulfamate nickel) solution, nickel is come deposit as said second metal level.
18. apply plating as said second metal level and metals deposited is selected from as next group: nickel, tin, copper, zinc and chromium by electrolysis according to the process of claim 1 wherein.
CNA200310122394XA 2003-05-20 2003-12-19 Method for manufacturing an emi shielding element Pending CN1575118A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47206503P 2003-05-20 2003-05-20
US60/472,065 2003-05-20

Publications (1)

Publication Number Publication Date
CN1575118A true CN1575118A (en) 2005-02-02

Family

ID=33476919

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200310122394XA Pending CN1575118A (en) 2003-05-20 2003-12-19 Method for manufacturing an emi shielding element

Country Status (4)

Country Link
US (1) US20080202937A1 (en)
CN (1) CN1575118A (en)
TW (1) TWI291322B (en)
WO (1) WO2004105183A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011038534A1 (en) * 2009-09-30 2011-04-07 Lin Shuchling Electromagnetic wave protection structure
CN101553105B (en) * 2008-04-01 2013-07-17 林淑清 Electromagnetic wave shielding structure
CN104878423A (en) * 2015-05-08 2015-09-02 芜湖航天特种电缆厂 Plating method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI268756B (en) * 2005-11-23 2006-12-11 Benq Corp Electromagnetic interference shielding slice of digital light processing projection devices
CN103576602A (en) * 2012-07-31 2014-02-12 昆山福冈电子有限公司 Manufacturing process of special EMI vacuum splattering jig
US9738555B2 (en) * 2013-05-29 2017-08-22 Corning Incorporated Electroless nickel plating of a high temperature power feedthrough for corrosion inhabitance
US20160186325A1 (en) * 2014-12-24 2016-06-30 Canon Components, Inc. Resin article having plating layer and manufacturing method thereof, and conductive film

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US3486989A (en) * 1967-01-30 1969-12-30 M & T Chemicals Inc Semi-bright nickel plating
US3472678A (en) * 1967-05-03 1969-10-14 Hexagon Lab Inc Surface treatment for polystyrene which is to be electroless plated and compositions therefor
US3620804A (en) * 1969-01-22 1971-11-16 Borg Warner Metal plating of thermoplastics
US3696665A (en) * 1971-03-01 1972-10-10 Standard Oil Co Contact angle measurement of plastic surfaces
US4514586A (en) * 1982-08-30 1985-04-30 Enthone, Inc. Method of using a shielding means to attenuate electromagnetic radiation in the radio frequency range
US4495253A (en) * 1983-05-31 1985-01-22 Hughes Aircraft Company Solderable plated plastic components and process for plating _
US5773403A (en) * 1992-01-21 1998-06-30 Olympus Optical Co., Ltd. Cleaning and drying solvent
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
JPH08245856A (en) * 1995-03-09 1996-09-24 Asahi Chem Ind Co Ltd Abs resin composition and molded product thereof
US6645557B2 (en) * 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
AU2003267260A1 (en) * 2002-09-17 2004-04-08 Shielding For Electronics Equipment and methods for producing continuous metallized thermoformable emi shielding material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101553105B (en) * 2008-04-01 2013-07-17 林淑清 Electromagnetic wave shielding structure
WO2011038534A1 (en) * 2009-09-30 2011-04-07 Lin Shuchling Electromagnetic wave protection structure
CN104878423A (en) * 2015-05-08 2015-09-02 芜湖航天特种电缆厂 Plating method

Also Published As

Publication number Publication date
US20080202937A1 (en) 2008-08-28
TWI291322B (en) 2007-12-11
WO2004105183A3 (en) 2006-02-02
TW200427399A (en) 2004-12-01
WO2004105183A2 (en) 2004-12-02

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