CN212727571U - Gold plating system for high-frequency microwave - Google Patents

Gold plating system for high-frequency microwave Download PDF

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Publication number
CN212727571U
CN212727571U CN202021904573.4U CN202021904573U CN212727571U CN 212727571 U CN212727571 U CN 212727571U CN 202021904573 U CN202021904573 U CN 202021904573U CN 212727571 U CN212727571 U CN 212727571U
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gold
box
plating
fixedly arranged
wall surface
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CN202021904573.4U
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郭红樟
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Sichuan Yilaiteng Electronic Technology Co ltd
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Sichuan Yilaiteng Electronic Technology Co ltd
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Abstract

The utility model discloses a gilding system for high frequency microwave, include: the device comprises a base, a first electrode and a second electrode, wherein a high-frequency microwave gold-plating structure is arranged on the base; wherein, the high-frequency microwave gold-plating structure comprises: the device comprises an immersion cleaning box, a gold-plating reaction box, a waveguide tube, a waveguide connector, a magnetic controller, an output control box, a mounting rack, a high-frequency microwave generator, a transformer, an intelligent controller, a control panel, a display screen and a clamping assembly; the utility model relates to the technical field of microwave gold plating equipment; the beneficial effects of present case do: the method solves the problems that the existing gold plating method adopts vacuum gold plating, electrogilding and chemical gold plating, the method has high equipment price, wastes time and labor during operation, the appearance and the thickness of a plated gold film are difficult to control, and particularly when large area and non-flat surface are plated, the thickness and the uniformity cannot be controlled, the gold plating effect is influenced, and the use cost is increased.

Description

Gold plating system for high-frequency microwave
Technical Field
The utility model relates to a microwave gilding equipment technical field specifically is a gilding system for high frequency microwave.
Background
Gold plating, which is a decoration process, is firstly to plate a thin gold layer on the surface of a device, the gold plating layer has good ductility, easy polishing, high temperature resistance and good discoloration resistance, and the gold alloy plating layer can present various colors, so the gold alloy plating layer is commonly used as a decoration plating layer, such as jewelry, clock parts, artworks and the like, the gold plating has lower contact resistance, good conductivity, easy welding, strong corrosion resistance and certain wear resistance (referring to hard gold), thereby having wide application in the aspects of precise instruments, printed circuit boards, integrated circuits, tube shells, electric contacts and the like, the existing gold plating mode adopts vacuum gold plating, gold electroplating and chemical gold plating modes, the methods not only have high equipment price, but also waste time and labor during operation, the appearance and thickness of the plated gold film are not easy to control, especially when the gold plating is large in area and uneven, the thickness and the uniformity can not be controlled, the gold plating effect is influenced, and the use cost is increased.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a gilding system for high frequency microwave has solved the mode of current gilding and has adopted vacuum gold plating, electrogilding and chemical gold plating more, and these methods are not only expensive equipment price, and waste time and energy when the operation, and the appearance and the thickness of the gold film of plating are wayward, especially when plating big area and non-flat surface, and thickness and degree of consistency are uncontrollable, influence gilding effect, increase use cost's problem.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a gold plating system for high frequency microwaves, comprising: the device comprises a base, a first electrode and a second electrode, wherein a high-frequency microwave gold-plating structure is arranged on the base;
wherein, the high-frequency microwave gold-plating structure comprises: the device comprises an immersion cleaning box, a gold-plating reaction box, a waveguide tube, a waveguide connector, a magnetic controller, an output control box, a mounting rack, a high-frequency microwave generator, a transformer, an intelligent controller, a control panel, a display screen and a clamping assembly;
the immersion cleaning box is fixedly arranged on the left side of the upper wall surface of the base, the gold-plating reaction box is fixedly arranged on the right side of the immersion cleaning box, the waveguide tube is embedded and fixed in the inner wall surface of the gold-plating reaction box, the waveguide connector is fixedly arranged on the right side of the gold-plating reaction box, the magnetic controller is embedded and fixed in the lower wall surface of the gold-plating reaction box, the output control box is fixedly arranged on the right side of the gold-plating reaction box, the mounting rack is fixedly arranged in the middle of the inner wall surface of the output control box, the high-frequency microwave generator is fixedly arranged in the middle of the inner lower wall surface of the output control box, the transformer is fixedly arranged on the right position of the upper wall surface of the mounting rack, the intelligent controller is fixedly arranged on the left side of the transformer, the control panel is fixedly installed on the upper wall surface of the output control box, the display screen is fixedly installed above the control panel, and the clamping assembly is fixedly installed on the upper wall surface of the base and is in the position close to the back.
Preferably, the grasping assembly comprises: the device comprises a support frame, a movable box, a fixed baffle, a pair of bearings, a screw rod, a rotating motor, a movable block, a hydraulic push rod and a hydraulic claw;
the hydraulic clamping device comprises a support frame, a movable block, a screw rod, a hydraulic push rod, a hydraulic claw and a pair of bearings, wherein the support frame is fixedly installed on the upper wall surface of a base and close to the rear position, the movable block is fixedly installed on the support frame, the fixed baffle is installed on the inner wall surface of the movable block and close to the right position, the pair of bearings are embedded in the middle position of the left wall surface of the movable block and the middle position of the fixed baffle, the screw rod is embedded in the pair of bearings, the rotary motor is fixedly installed at the right position in the movable block, the right end of the screw rod is connected with the output end of the rotary motor, the movable block.
Preferably, a sensor for detecting the concentration of the internal immersion cleaning solution is mounted in the immersion cleaning tank.
Preferably, all the electronic components are connected through connecting wires.
Preferably, a motor frame with a fixing function is mounted on the rotating motor.
Preferably, the screw is connected with the rotating motor through a coupling.
Advantageous effects
The utility model provides a gold plating system for high-frequency microwave; the method has the following beneficial effects: the scheme uses a high-frequency microwave gold plating structure, gold plating is carried out on the surface of the gold plating structure under the action of high-frequency microwaves, the high-frequency microwaves are used as energy sources, the use cost is low, the operation is simple, the gold plating speed is high, the reproducibility is good, and the problems that the conventional gold plating mode mostly adopts vacuum gold plating, electrogilding and chemical gold plating modes, the methods are expensive in equipment price, time and labor are wasted during operation, the appearance and the thickness of a plated gold film are not easy to control, particularly when large areas and non-flat surfaces are plated, the thickness and the uniformity cannot be controlled, the gold plating effect is influenced, and the use cost is increased are solved.
Drawings
Fig. 1 is a schematic sectional view of a gold plating system for high frequency microwave according to the present invention.
Fig. 2 is a schematic view of a sectional structure of a clamping assembly of a gold plating system for high frequency microwave.
Fig. 3 is a schematic diagram of a local enlarged structure of a gold plating system for high-frequency microwave according to the present invention.
In the figure: 1-a base; 2-a leaching tank; 3-gold plating reaction box; 4-a waveguide; 5-a waveguide connector; 6-magnetic controller; 7-output control box; 8-a mounting frame; 9-a high frequency microwave generator; 10-a transformer; 11-an intelligent controller; 12-a control panel; 13-a display screen; 14-a support frame; 15-moving the box; 16-a fixed baffle; 17-a bearing; 18-a screw; 19-a rotating electrical machine; 20-a moving block; 21-a hydraulic push rod; 22-hydraulic jaws; 23-a sensor; 24-a connecting line; 25-a motor frame; 26-coupling.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a gold plating system for high frequency microwaves;
the main components of the scheme are as follows: the device comprises a base 1, wherein a high-frequency microwave gold-plating structure is arranged on the base 1;
in a specific implementation process, the high-frequency microwave gold-plating structure comprises: the device comprises an immersion cleaning box 2, a gold-plating reaction box 3, a waveguide tube 4, a waveguide connector 5, a magnetic controller 6, an output control box 7, a mounting rack 8, a high-frequency microwave generator 9, a transformer 10, an intelligent controller 11, a control panel 12, a display screen 13 and a clamping assembly;
the immersion cleaning box 2 is fixedly arranged on the upper wall surface of the base 1 close to the left, the gold-plating reaction box 3 is fixedly arranged on the right side of the immersion cleaning box 2, the waveguide tube 4 is fixedly embedded in the inner wall surface of the gold-plating reaction box 3, the waveguide connector 5 is fixedly arranged on the right side of the gold-plating reaction box 3, the magnetic controller 6 is fixedly embedded in the lower wall surface of the gold-plating reaction box 3, the output control box 7 is fixedly arranged on the right side of the gold-plating reaction box 3, the mounting rack 8 is fixedly arranged in the middle position of the inner wall surface of the output control box 7, the high-frequency microwave generator 9 is fixedly arranged in the middle position of the lower wall surface of the output control box 7, the transformer 10 is fixedly arranged on the upper wall surface of the mounting rack 8 close to the right, the intelligent controller 11 is fixedly arranged on the left side of the transformer, the clamping assembly is fixedly arranged at the position, close to the rear, of the upper wall surface of the base 1.
In a specific implementation process, the grasping assembly further includes: the hydraulic control device comprises a support frame 14, a moving box 15, a fixed baffle 16, a pair of bearings 17, a screw rod 18, a rotating motor 19, a moving block 20, a hydraulic push rod 21 and a hydraulic claw 22;
the support frame 14 is fixedly installed at a position close to the rear of the upper wall surface of the base 1, the movable box 15 is fixedly installed on the support frame 14, the fixed baffle 16 is installed at a position close to the right of the inner wall surface of the movable box 15, the pair of bearings 17 are embedded in the middle of the left wall surface of the movable box 15 and the middle of the fixed baffle 16, the screw rod 18 is embedded in the pair of bearings 17, the rotating motor 19 is fixedly installed at the right position in the movable box 15, the right end of the screw rod 18 is connected with the output end of the rotating motor 19, the movable block 20 is movably installed on the screw rod 18, the hydraulic push rod 21 is fixedly installed on the lower wall surface of the movable block 20, and the hydraulic claw 22 is fixedly installed at.
It should be noted that, when using the high frequency microwave gold plating structure, the part to be gold plated is grabbed by the hydraulic claw 22, the rotating motor 19 rotates to drive the screw 18 connected with the output end of the coupling 26 to rotate, the screw 18 rotates in the pair of bearings 17 to drive the moving block 20 to move, when the moving block 20 moves to the upper part of the immersion cleaning box 2, the hydraulic push rod 21 extends out, the part clamped by the hydraulic claw 22 is immersed into the mixed liquid in the immersion cleaning box 2, when the immersion cleaning is completed, the hydraulic push rod 21 contracts, the moving block 20 moves to the upper part of the gold plating reaction box 3, the hydraulic push rod 21 extends out, the part is immersed into the nano gold sol in the gold plating reaction box 3, the control panel 12 is operated to start the device, the intelligent controller 11 controls the transformer 10 to start and generate a signal by the high frequency microwave generator 9, the waveguide 4 embedded in the inner wall surface of the gold plating reaction box 3 is started by the waveguide connector 5 connected with the intelligent, the gold plating reaction box 3 generates a magnetic field inside, and the energy in the electric field is converted into microwave energy under the action of the magnetic controller 6, so that the parts in the gold plating reaction box 3 react with the nano gold sol to form a gold plating layer, and the aim of high-frequency microwave gold plating is fulfilled.
In the specific implementation process, a sensor 23 for detecting the concentration of the internal pickling solution is further installed in the pickling tank 2.
In a specific implementation process, further, all the electronic components are connected through the connection line 24.
In the specific implementation process, further, a motor frame 25 with a fixing function is installed on the rotating motor 19.
In the specific implementation, the screw 18 is further connected to the rotating motor 19 through a coupling 26.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A gold plating system for high frequency microwaves, comprising: the base (1) is characterized in that a high-frequency microwave gold-plating structure is arranged on the base (1);
wherein, the high-frequency microwave gold-plating structure comprises: the device comprises an immersion cleaning box (2), a gold-plating reaction box (3), a waveguide tube (4), a waveguide connector (5), a magnetic controller (6), an output control box (7), a mounting rack (8), a high-frequency microwave generator (9), a transformer (10), an intelligent controller (11), a control panel (12), a display screen (13) and a clamping assembly;
the immersion cleaning box (2) is fixedly arranged on the upper wall surface of the base (1) close to the left, the gold-plating reaction box (3) is fixedly arranged on the right side of the immersion cleaning box (2), the waveguide tube (4) is fixedly embedded in the inner wall surface of the gold-plating reaction box (3), the waveguide connector (5) is fixedly arranged on the right side of the gold-plating reaction box (3), the magnetic controller (6) is fixedly embedded in the lower wall surface of the gold-plating reaction box (3), the output control box (7) is fixedly arranged on the right side of the gold-plating reaction box (3), the mounting rack (8) is fixedly arranged in the middle of the inner wall surface of the output control box (7), the high-frequency microwave generator (9) is fixedly arranged in the middle of the lower wall surface of the output control box (7), the transformer (10) is fixedly arranged on the upper wall surface of the mounting rack (8) close to the right, the intelligent, control panel (12) fixed mounting is on output control box (7) wall, display screen (13) fixed mounting is in control panel (12) top, press from both sides subassembly fixed mounting and lean on the back position at base (1) wall.
2. The system of claim 1, wherein the clamping assembly comprises: the device comprises a support frame (14), a moving box (15), a fixed baffle (16), a pair of bearings (17), a screw rod (18), a rotating motor (19), a moving block (20), a hydraulic push rod (21) and a hydraulic claw (22);
the supporting frame (14) is fixedly arranged at the position close to the rear of the upper wall surface of the base (1), the movable box (15) is fixedly arranged on the supporting frame (14), the fixed baffle (16) is arranged at the right position of the inner wall surface of the movable box (15), the pair of bearings (17) is embedded at the middle position of the left wall surface of the movable box (15) and the middle position of the fixed baffle (16), the screw rod (18) is embedded in a pair of bearings (17), the rotating motor (19) is fixedly arranged at the right side position in the moving box (15), the right end of the screw rod (18) is connected with the output end of a rotating motor (19), the moving block (20) is movably arranged on the screw rod (18), the hydraulic push rod (21) is fixedly arranged on the lower wall surface of the moving block (20), the hydraulic claw (22) is fixedly arranged on the output end of the hydraulic push rod (21).
3. A gold plating system for high frequency microwaves according to claim 1, wherein a sensor (23) for detecting the concentration of the internal immersion liquid is installed in the immersion tank (2).
4. A gold plating system for high-frequency microwaves as recited in claim 1, wherein all the electronic components are connected by a connecting wire (24).
5. A gold plating system for high frequency microwaves according to claim 2, wherein a motor holder (25) having a fixing function is mounted on the rotating motor (19).
6. Gold plating system for high frequency microwaves according to claim 2, wherein the screw spindle (18) is connected to a rotating motor (19) via a coupling (26).
CN202021904573.4U 2020-09-03 2020-09-03 Gold plating system for high-frequency microwave Active CN212727571U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021904573.4U CN212727571U (en) 2020-09-03 2020-09-03 Gold plating system for high-frequency microwave

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021904573.4U CN212727571U (en) 2020-09-03 2020-09-03 Gold plating system for high-frequency microwave

Publications (1)

Publication Number Publication Date
CN212727571U true CN212727571U (en) 2021-03-16

Family

ID=74925638

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021904573.4U Active CN212727571U (en) 2020-09-03 2020-09-03 Gold plating system for high-frequency microwave

Country Status (1)

Country Link
CN (1) CN212727571U (en)

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