JPS63297588A - Electrolytic plating method for isolated electric conductor - Google Patents
Electrolytic plating method for isolated electric conductorInfo
- Publication number
- JPS63297588A JPS63297588A JP13681387A JP13681387A JPS63297588A JP S63297588 A JPS63297588 A JP S63297588A JP 13681387 A JP13681387 A JP 13681387A JP 13681387 A JP13681387 A JP 13681387A JP S63297588 A JPS63297588 A JP S63297588A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- brush
- electrolytic plating
- isolated
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 25
- 238000009713 electroplating Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 12
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 16
- 239000004917 carbon fiber Substances 0.000 claims abstract description 16
- 239000000835 fiber Substances 0.000 claims abstract description 6
- 239000012212 insulator Substances 0.000 claims abstract description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 14
- 238000007747 plating Methods 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 7
- 238000005868 electrolysis reaction Methods 0.000 abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 101100493711 Caenorhabditis elegans bath-41 gene Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はプリント基板のように絶縁体上に複数の孤立し
た導電体部分を金やニッケル等で電解メッキる、もので
、メッキ浴中に、カーボンファイバー等で作製したブラ
シ状の電極をプリント基板に接触し、ブラシ状の電極ま
たはプリント基板を移動し、可とう性を有る、ブラシ先
端部を孤立した多数の導電体部分に当接させ、ブラシ状
の電極を陰極として電解メッキを施す。[Detailed Description of the Invention] The present invention involves electrolytically plating a plurality of isolated conductor parts on an insulator, such as a printed circuit board, with gold, nickel, etc. In a plating bath, conductor parts made of carbon fiber, etc. A brush-like electrode is brought into contact with a printed circuit board, the brush-like electrode or the printed circuit board is moved, and the flexible brush tip is brought into contact with a large number of isolated conductive parts, and the brush-like electrode is connected to a cathode. Electrolytic plating is applied as a.
プリント基板上の孤立した導電体部分をメッキる、には
、メツキレシストによシ導電体部分のみを無電解メッキ
液に潰し、次にレジストを剥離る、方式が採用されてい
るが、９０Ｃと高温でかつ高アルカリ性の無電解メッキ
液が本来導電体部分を溶解る、ために、その浸漬時間等
に細心の注意が要求され、総じて、歩留りの低下とメッ
キ廃液処理等に基づくコスト高を招いている。電解メッ
キ法で孤立した導電体部分をメッキる、には、予じめこ
の導電体部分を相互に接続した回路にて作製し、メッキ
後にバンチングして導電体部分を孤立させる方式が採用
されている。本発明は、高品位・低コストのメッキ方式
であるこの電解メッキ法下でパンチング不要のメッキ方
式を提供る、もので、以下図面に基づいて詳しく説明る
、。To plate isolated conductor parts on a printed circuit board, a method is used in which only the conductor part is crushed in an electroless plating solution using a metal resist, and then the resist is peeled off, but at a high temperature of 90C. Since the highly alkaline electroless plating solution originally dissolves conductive parts, careful attention is required to the immersion time, etc., which generally leads to lower yields and higher costs due to processing of plating waste liquid, etc. There is. In order to plate isolated conductor parts using the electrolytic plating method, a method is adopted in which a circuit is created in advance in which the conductor parts are connected to each other, and after plating, the conductor parts are isolated by bunching. There is. The present invention provides a plating method that does not require punching under this electrolytic plating method, which is a high-quality, low-cost plating method, and will be described in detail below based on the drawings.
（手段）
適度の可とう性を有る、導電性のカーボンファイバー（
１）を所定の寸法に細断し、円筒の周面に放射状に植設
してブラシ状の電極（２）を作製る、。円筒の支軸（３
）と先端群がロール形状を呈る、各カーボンファイバー
（１）とは導通している。ブラシ状の電極（２）材料と
しては、メッキ浴中に安定な導体であれば良く、ステン
レス、チタン、白金、金などの金属材料、鉄等の表面に
耐触性の金属をメッキしたもの、導電性プラスチックや
導電ゴム等の合成樹脂材料が挙げられる。このブラシ状
の電極（２）を第１図のようにメッキ浴槽（４）内に回
転自在に配し、陰極側に接続る、。プリント基板（５）
を移動させるロール（６）ヲ、電極（２）のブラシ先端
がプリント基板（５）表面に接触る、位置に配し、ブラ
シ状の電極（２）近傍に陽極プレート（７）を配置る、
。(Means) Conductive carbon fiber with appropriate flexibility (
1) is cut into pieces of predetermined dimensions and implanted radially around the circumferential surface of a cylinder to produce brush-like electrodes (2). Cylindrical support shaft (3
) and each carbon fiber (1) whose tip group has a roll shape are electrically connected. The material for the brush-shaped electrode (2) may be any conductor that is stable in the plating bath, such as metal materials such as stainless steel, titanium, platinum, or gold, or materials plated with a contact-resistant metal such as iron. Examples include synthetic resin materials such as conductive plastic and conductive rubber. This brush-shaped electrode (2) is rotatably arranged in a plating bath (4) as shown in FIG. 1, and connected to the cathode side. Printed circuit board (5)
The roll (6) for moving is placed in a position where the brush tip of the electrode (2) contacts the surface of the printed circuit board (5), and the anode plate (7) is placed near the brush-like electrode (2).
.
（作用）
メッキ浴４１！（４）内に所定の電解メッキ液を満たし
、ブラシ状の電極（２）を陰極に接続し、ロール（６）
にてプリント基板（５）をブラシ状の電極（２）に接触
させる。電極（２）を第１図のように矢印方向に回転さ
せるが、逆方向あるいは停止させても良い。カーボンフ
ァイバー（１）の先端部がプリント基板（５）上の導電
体部分（８）に確実に当接し、かつ、その表面を傷つけ
ることなく軽く撫でるように、ブラシ状の電極＜２）と
プリント基板（５）の相対位置、速度を選定る、。非常
に多数のカーボンファイバー（１）がプリント基板（５
）の表面を撫でるために、孤立した微小な導電体部分（
８）は、陰極であるこのカーボンファイバー（１）に当
接し、金やニッケル等のメッキ皮膜を付着る、。ブラシ
の回転により陰極薄液層は攪拌され、導電体部分（８）
の近傍の陽イオン拡散が促進される。このように適度の
可とり性を有る、カーボンファイバー（１）に撫でられ
た導電体部分（８）には所定のメッキ皮膜が形成され、
プリント基板（５）の裏側の導電体部分も、同じプロセ
スで電解メッキされる。(Function) Plating bath 41! (4) is filled with the specified electrolytic plating solution, the brush-shaped electrode (2) is connected to the cathode, and the roll (6) is
The printed circuit board (5) is brought into contact with the brush-shaped electrode (2). Although the electrode (2) is rotated in the direction of the arrow as shown in FIG. 1, it may also be rotated in the opposite direction or stopped. Print a brush-like electrode <2) so that the tip of the carbon fiber (1) will surely come into contact with the conductor part (8) on the printed circuit board (5) and lightly stroke the surface without damaging it. Select the relative position and speed of the board (5). A very large number of carbon fibers (1) are attached to a printed circuit board (5
) to stroke the surface of an isolated minute conductor part (
8) comes into contact with this carbon fiber (1), which is the cathode, and deposits a plating film of gold, nickel, etc. The cathode thin liquid layer is stirred by the rotation of the brush, and the conductor part (8)
cation diffusion in the vicinity of is promoted. In this way, a predetermined plating film is formed on the conductor portion (8) stroked by the carbon fiber (1), which has appropriate flexibility.
The conductive portion on the back side of the printed circuit board (5) is also electrolytically plated using the same process.
（他の実施例）
第３図はカーボンファイバー（１）の先端が平面になる
ように支持体（９）に植設したもので、ロール形状の上
記実施例と同じように導電性の支持体（９）を陰極に接
続すればカーボンファイバー（１１も当然陰極になる。(Other Examples) Figure 3 shows carbon fibers (1) planted on a support (9) so that their tips are flat, and the conductive support is similar to the roll-shaped example above. If (9) is connected to the cathode, carbon fiber (11) also becomes the cathode.
この支持体（９）を自から移動る、プリント基板（５）
に軽く当接る、か、あるいは、停止しているプリント基
板（５）上を走査してその表面を撫でるようにして、多
数の導電体部分（８）を確実に電解メッキる、。カーボ
ンファイバー（１１をブラシ状に配設る、ことは、多数
のカーボンファイバー（１）先端部が、微細な凹凸を有
る、プリント基板（５）の表面形状に追従して当接させ
るためであシ、第１．３図の形状に限定されるものでな
い。The printed circuit board (5) moves this support (9) from itself.
A large number of conductor parts (8) are surely electrolytically plated by lightly contacting the printed circuit board (5), or by scanning and caressing the surface of the printed circuit board (5) which is stopped. The carbon fibers (11) are arranged in a brush-like manner so that the tips of the many carbon fibers (1) follow and come into contact with the surface shape of the printed circuit board (5), which has minute irregularities. However, the shape is not limited to the shape shown in FIG. 1.3.
ブラシ状の電極（２）は、電極表面に針状の電極を突出
したものでも良く、また、繊維を含めて剛性のある材料
でプリント基板等の被メッキ体を傷つける恐れがある場
合は、電極の芯のまわりに繊維を巻きつけるか、房状に
して取付けるなどして針または繊維の先端が被メッキ体
と直接に接触しないようにしても良い。剛性が不足して
いる場合は、他の材料と複合して用いても良い。ブラシ
状の電極表面にメッキ金属が沈着る、のを防ぐには、離
型性の良い材料をコーティングあるいはメッキる、。The brush-like electrode (2) may be one with a needle-like electrode protruding from the electrode surface.Also, if the brush-like electrode (2) is made of a rigid material including fibers and may damage the object to be plated such as a printed circuit board, The tip of the needle or fiber may be prevented from coming into direct contact with the object to be plated by wrapping the fiber around the core or attaching it in a tuft. If the rigidity is insufficient, it may be used in combination with other materials. To prevent plating metal from depositing on the brush-shaped electrode surface, coat or plate it with a material that has good mold release properties.
（効果）
要る、に、本発明はブラシ状の電極（２）を絶縁体上に
孤立した導電体部分（８）を有る、被メッキ体に接触し
、ブラシ状の電極（２）または被メッキ体を移動し、こ
のブラシ状の電極（２）を陰極として電解メッキを施す
ために、微小な導電体部分（８）を確実に電解メッキる
、ことができ、エツチングされたパターン上にも容易に
メッキ処理る、ことができる。特にフレキシブルプリン
ト基板の場合、従来はロールで巻きとりつつパターンを
形成しこれを切断して金メッキしていたが、本発明では
１パターン形成ラインに電解メッキ装置を組みこんで連
続処理る、ことが可能になる。また、カーボンファイバ
ー（１）は、抵抗値が比較的高いためにメッキが付着し
にくいことと、適度の剛度と可とう性を有る、ために、
長時間に亘って確実に導電体部分（８）を電解メッキる
、ことができる。(Effects) In short, the present invention brings the brush-shaped electrode (2) into contact with an object to be plated, which has an isolated conductor portion (8) on an insulator, and By moving the plated body and applying electrolytic plating using this brush-like electrode (2) as a cathode, it is possible to reliably electrolytically plate a minute conductive part (8), and even on the etched pattern. Can be easily plated. Particularly in the case of flexible printed circuit boards, conventionally a pattern was formed while being rolled up and then cut and plated with gold, but with the present invention, an electrolytic plating device is incorporated into one pattern forming line for continuous processing. It becomes possible. In addition, carbon fiber (1) has a relatively high resistance value, making it difficult for plating to adhere to it, and has appropriate rigidity and flexibility.
It is possible to reliably electrolytically plate the conductor portion (8) over a long period of time.
図面は本発明実施の一例を示すものにして、第１図は斜
視図、第２図はブラシ状電極の側面図、第３図はブラシ
状電極の他の実施例の斜視図である。
１・・・・カーボンファイバー ２・・・・電
極５・・・・プリント基板The drawings show an example of carrying out the present invention, and FIG. 1 is a perspective view, FIG. 2 is a side view of a brush-like electrode, and FIG. 3 is a perspective view of another embodiment of the brush-like electrode. 1... Carbon fiber 2... Electric
Pole 5...Printed circuit board
Claims (3)
分を有する被メッキ体に接触し、ブラシ状の電極または
被メッキ体を移動し、このブラシ状の電極を陰極として
電解メッキを施す、孤立した導電体の電解メッキ法。(1) A brush-shaped electrode is brought into contact with an object to be plated that has an isolated conductor portion on an insulator, the brush-shaped electrode or the object to be plated is moved, and the brush-shaped electrode is used as a cathode to perform electrolytic plating. An electrolytic plating method for isolated conductors.
、特許請求の範囲第１項記載の孤立した導電体の電解メ
ッキ法。(2) The electrolytic plating method for an isolated conductor according to claim 1, wherein a brush-like electrode is produced from a flexible conductive fiber.
請求の範囲第２項記載の孤立した導電体の電解メッキ法
。(3) The electrolytic plating method for an isolated conductor according to claim 2, which employs carbon fiber as the conductive fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13681387A JPS63297588A (en) | 1987-05-29 | 1987-05-29 | Electrolytic plating method for isolated electric conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13681387A JPS63297588A (en) | 1987-05-29 | 1987-05-29 | Electrolytic plating method for isolated electric conductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63297588A true JPS63297588A (en) | 1988-12-05 |
Family
ID=15184105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13681387A Pending JPS63297588A (en) | 1987-05-29 | 1987-05-29 | Electrolytic plating method for isolated electric conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63297588A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990009469A1 (en) * | 1989-02-15 | 1990-08-23 | Kadija Igor V | Method and apparatus for manufacturing interconnects with fine lines and spacing |
| US5114558A (en) * | 1989-02-15 | 1992-05-19 | Kadija Igor V | Method and apparatus for manufacturing interconnects with fine lines and spacing |
| WO1997037062A1 (en) * | 1996-03-29 | 1997-10-09 | Atotech Deutschland Gmbh | Process and device for the electrochemical treatment of items with a fluid |
| EP0889680A2 (en) * | 1997-07-01 | 1999-01-07 | Deutsche Thomson-Brandt Gmbh | Method of removing and/or applying conductive material |
| DE10043817A1 (en) * | 2000-09-06 | 2002-04-04 | Egon Huebel | Continuous electrochemical plant metallizing, etching, oxidizing and reducing e.g. PCBs, wafers and hybrids, controls electrode approach during conveying |
| DE10019713C2 (en) * | 2000-04-20 | 2003-11-13 | Atotech Deutschland Gmbh | Device and method for electrical contacting of goods to be treated electrolytically in continuous systems |
| DE10323660A1 (en) * | 2003-05-15 | 2004-12-02 | Gebr. Schmid Gmbh & Co. | Device for treating objects, in particular electroplating for printed circuit boards |
| JP2005256167A (en) * | 2004-02-09 | 2005-09-22 | Besi Plating Bv | Method and device for electrolytically increasing thickness of electrically conductive pattern on dielectric substrate, and dielectric substrate |
| WO2006033315A1 (en) * | 2004-09-24 | 2006-03-30 | Ibiden Co., Ltd. | Plating method and plating apparatus |
| CN102234831A (en) * | 2010-04-26 | 2011-11-09 | 鸿吉机械有限公司 | Plating equipment, maintenance method of plating equipment and plating method |
| US8128790B2 (en) | 2006-01-30 | 2012-03-06 | Ibiden Co., Ltd. | Plating apparatus and plating method |
| US8679576B2 (en) | 2006-02-22 | 2014-03-25 | Ibiden Co., Ltd. | Plating apparatus and method of plating |
| WO2018017379A3 (en) * | 2016-07-18 | 2018-07-26 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
| CN114790565A (en) * | 2022-05-26 | 2022-07-26 | 江苏启威星装备科技有限公司 | Conductive device and horizontal electroplating equipment |
-
1987
- 1987-05-29 JP JP13681387A patent/JPS63297588A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990009469A1 (en) * | 1989-02-15 | 1990-08-23 | Kadija Igor V | Method and apparatus for manufacturing interconnects with fine lines and spacing |
| US5024735A (en) * | 1989-02-15 | 1991-06-18 | Kadija Igor V | Method and apparatus for manufacturing interconnects with fine lines and spacing |
| US5114558A (en) * | 1989-02-15 | 1992-05-19 | Kadija Igor V | Method and apparatus for manufacturing interconnects with fine lines and spacing |
| WO1997037062A1 (en) * | 1996-03-29 | 1997-10-09 | Atotech Deutschland Gmbh | Process and device for the electrochemical treatment of items with a fluid |
| EP0889680A2 (en) * | 1997-07-01 | 1999-01-07 | Deutsche Thomson-Brandt Gmbh | Method of removing and/or applying conductive material |
| EP0889680A3 (en) * | 1997-07-01 | 2000-07-05 | Deutsche Thomson-Brandt Gmbh | Method of removing and/or applying conductive material |
| DE10019713C2 (en) * | 2000-04-20 | 2003-11-13 | Atotech Deutschland Gmbh | Device and method for electrical contacting of goods to be treated electrolytically in continuous systems |
| DE10043817A1 (en) * | 2000-09-06 | 2002-04-04 | Egon Huebel | Continuous electrochemical plant metallizing, etching, oxidizing and reducing e.g. PCBs, wafers and hybrids, controls electrode approach during conveying |
| DE10043817C2 (en) * | 2000-09-06 | 2002-07-18 | Egon Huebel | Arrangement and method for goods to be treated electrochemically |
| DE10323660A1 (en) * | 2003-05-15 | 2004-12-02 | Gebr. Schmid Gmbh & Co. | Device for treating objects, in particular electroplating for printed circuit boards |
| JP2005256167A (en) * | 2004-02-09 | 2005-09-22 | Besi Plating Bv | Method and device for electrolytically increasing thickness of electrically conductive pattern on dielectric substrate, and dielectric substrate |
| WO2006033315A1 (en) * | 2004-09-24 | 2006-03-30 | Ibiden Co., Ltd. | Plating method and plating apparatus |
| JP4992428B2 (en) * | 2004-09-24 | 2012-08-08 | イビデン株式会社 | Plating method and plating apparatus |
| US8128790B2 (en) | 2006-01-30 | 2012-03-06 | Ibiden Co., Ltd. | Plating apparatus and plating method |
| US8721863B2 (en) | 2006-01-30 | 2014-05-13 | Ibiden Co., Ltd. | Plating apparatus and plating method |
| US8679576B2 (en) | 2006-02-22 | 2014-03-25 | Ibiden Co., Ltd. | Plating apparatus and method of plating |
| CN102234831A (en) * | 2010-04-26 | 2011-11-09 | 鸿吉机械有限公司 | Plating equipment, maintenance method of plating equipment and plating method |
| WO2018017379A3 (en) * | 2016-07-18 | 2018-07-26 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
| US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
| CN114790565A (en) * | 2022-05-26 | 2022-07-26 | 江苏启威星装备科技有限公司 | Conductive device and horizontal electroplating equipment |
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