TW574437B - Electrodeposition device and electrodeposition system for coating structures which have already been made conductive - Google Patents

Electrodeposition device and electrodeposition system for coating structures which have already been made conductive Download PDF

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Publication number
TW574437B
TW574437B TW91124513A TW91124513A TW574437B TW 574437 B TW574437 B TW 574437B TW 91124513 A TW91124513 A TW 91124513A TW 91124513 A TW91124513 A TW 91124513A TW 574437 B TW574437 B TW 574437B
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TW
Taiwan
Prior art keywords
electrolytic
contact
anode
electrolysis
substrate
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Application number
TW91124513A
Other languages
Chinese (zh)
Inventor
Andreas Karl
Andreas Mueller-Hipper
Ewald Simmerlein-Erlbacher
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Infineon Technologies Ag
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Priority claimed from DE10234705A external-priority patent/DE10234705B4/en
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
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Publication of TW574437B publication Critical patent/TW574437B/en

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18Electroplating using modulated, pulsed or reversing current
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0657Conducting rolls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Description

(i) (i)574437 玖、發明說明 (發明說明應敘明:發明所屬之技術領域、先前技術、内t 本發明係屬於一電解裝置,且係屬於用於在一基板上一 電傳導層的電解之電解系統。 - 利用電解裝置及電解系統對覆蓋有全部表面可製造導 . 體架構及導體層《舉例示之,利用此種裝置可製造天線線 圈、印刷電路板、晶片卡模組或類似物品。此為迄今為止 利用腐蚀處理已做成之此種形式的導體架構之方式。 為了此種目的,將一如同一陰極般成連續連接之金屬圓籲 筒’至少部分浸入在有電解液之電解液槽内並做成旋轉。 電解液槽内有一陽極裝置。視所使用之電解液而定,在慢 速旋轉之陰極上分解出一金屬層。電解液外,此一金屬層 成薄片加在一所謂基板之不導電薄板上。 該方法僅能在載體基板之一單一面上製造一金屬層,能 獲得金屬之最低厚度有限,由於金屬箔一般由銅來製成, 該金屬落自陰極脫離加至由塑膠組成之薄板上,考慮到由 後續進一步之處理造成龜裂形成之可能性,所限制之最低_ 薄板厚度約為17 μηι。 在薄板上已經加有成薄片類似薄板狀之金屬層後,此一 · 金屬層具有一自17 μπ^ 75 μπι範圍之厚度,_蝕刻抗蝕劑· 加至金屬層,然後利用微影技術使之曝光。利用後續之蝕 二J步驟將覆盍有全部表面中這_些不需要用於具有導體路 徑足圖形區域蝕刻除去。將保存在圖形之金屬化上之蝕刻 抗姓劑予以移去後,所需要之導體架構即完成。說明之方 -6- (2)574437 法,參見丽言(introduction),乃利用腐蝕原理,首先之缺 點為因為使用腐蝕原理,所需要之化學 客, -予阿枓A耗量很的 且浪費在使用大量之原料(金屬層)上,㊉僅能獲得低生虞 量。 步之缺點為,圓筒形陰極之陽極清 ^ μ ^ q理必需定期執i *ίΐ[ ΙΪ1 xh ife Μ, iri- 、 »〇. __ 進 / π口 π 四内少Γ去從义呀極潘现 , t p v让q理必需定期執L 。雖然可利用硝酸來執行陽極之清理,但必需將電解液相 之電解液全面的排除。在此一清理期間,電解裝2則無g 用來生產。替代之方式,為已知之一種 搜州於清理為目的&lt; 陰極-陽極脈衝之切換《然而,此種型々、 凡裡土式&lt;裝置,在腺邊 之模式中由於必需-在很短時間-内加上極合 彳丄阿電流之故,在; 流器上有極高之消耗量。因此,依採購及維護費用之角肩 來看,安裝此種脈衝型式是高費用的。 因此,本發明根據此種目的提供—電解裝置及一電解身 統,與先前技藝相較,可得到更快速、更簡便、製:費拜 更低的電傳導層基板。 此一目的可藉由申請專利範圍第(電解裝置讀 專利範圍第13項(電解系統)之特點來達成 } + ¾成。此種1有優聚 之配置可從申請專利範圍中之每一附M ^ 阿屬項中顯出。 藉由上述發明之電解裝置,可在一且 社 具有已經做好有導電 架構之基板上來進行電傳導層之劁#。 導電架構較佳的包 含有已經加至基板表面且固·定至甚姑士 .—土巷板 &lt;導電微粒。加至基 板表面之導電微粒成“非覆蓋,,之彤β ,即,在其四週未有 嵌入之物質。舉例來說,可藉著吹、喑 貫射、滾動及刷上等 形式將導電微粒加在基板上。導電微粒與基板之表面為獲 (3)574437 得充分之: 的及/或經 例如可由 或一合金 狀之形式 基板較 性之特性 使表面之 超音波或 加上導電 電微粒在 在實際 界定好之 可確保導 劑。因此1 粒之目的 可以看出 以達成的 由電解來 按照發 一其中安 ,每一個 況中至少」 與先前 麵 丨 微粒了先採用熱的及/或靜態的及/或磁力 由合層之方式加至基板本體上。導電微粒 石墨或導電聚合微粒之鐵、鎳、金、銀、鋁、銅 組成’在加至基板之期間,微粒較佳的為成粉末 〇 佳的由一不導電之材料組成,基板之表面具有粘 。例如’藉將表面予以軟化或加上一粘性物質, 粘〖生特性成為活性。表面之軟化可藉由熱放射、 使用溶劑來做到,故為了此種目的,表面在事先 微粒之前-先以溶劑予-以處理。替代的或此外,導 加在基板本體之前亦可以溶劑加以處理。 免解操作之則,將導電微粒加在覆蓋所要求已經 導體架構之全部表面之基板上。基板之預先處理 電微粒繼續粘合在基板上,且僅在此處具有接著 -解裝置或电解系統藉電解可達到加厚該導電微 。此一說明,由於實際上需要的僅屬規劃方面, 在按照發明之電解裝置利用供給帶來分配是可 。刖$中,說明之薄板,即,例如一導體架構則 支配。 明用於在基板上一電傳導層之電解裝置,其具有 排有一陽極及至少一個接觸_接通單元之電解槽 接觸-接通單元具有多個電傳導區域,在每一^ 多個接觸·接通單元之一個成陰極及陽極之連接。 技藝不同處為,先前技藝之接觸_接通裝置包含 -8- (4) (4)574437 專有的陰極連接之元件(金屬圓筒),按照發明之電解裝 置,則具有能成陰極及陽極二者之連接之接觸_接通單元 □此此種私解裝置可界定為自我再生者。此一意思乃 指,此種電解裝置不再要求用於成陰極之連接之陽極滾輪. &lt;清理上所發生的任何之停機時間。結果獲得充分高的生 產量是可能的,因此製造導體架構之單位費用亦隨之降低。 由於堆積在陰極連接之電傳導區域上之導電微粒僅一 部分用於藉電解加厚該基板,全程進行之時期電傳導區域 文到污染。由於每一電傳導區域在其已經成陰極之連接之籲 後至少一次成陽極之連接,故—接觸-接通單元是自我清洗 的。此時,該進行電解之電傳導區域做為一輔助之陰極來 用ο 因此,由於一接觸·接通裝置之每一電傳導區域能連接 成如同陰極或如同陽極,故接觸-接通裝置之陽極清洗, 此一分配方式到目前為止為僅知者。導電區域可視其位置 而足’成陰極或成陽極之連接。特別的是,不同的電傳導 區域可同時做成陰極及陽極之連接。 由於至少一個電傳導區域總是成陰極及陽極二者之連 接’故電解裝置可做連續之操作。 導體架構,例如,為參見前_言中之天線線圈或晶片模組 ’藉利用電解裝置電解可完·成加厚之事實,低費用之生產 亦屬可能,故將各自的導體架構分開以外之任何進一步之 處理步騾不再需要。因此,按照發明之步驟乃一用於製造 —導電架構之附加之或半附加之處理步驟。 (5) 574437 再音,電傳導層之金屬架構之品質其結果是可以控制, 且f為非常-致的均勻厚度。而且,使用按照發明之電解 裝置來製造-雙面金屬化是有可能的,對此_目的,必需 是在利用電解裝置處理之前對基板之二面上按架構之形 式加有導電微粒。除同時形成一雙面之金屬層之優點外, 電的通過·接觸之自我再生形成亦屬可能。這些接觸處, 與在基板之相反主要面上相結合之導體架構一起,形成一 具有’大約均勻層厚度亦是可能的。 進/步之優點為,在一電解裝置之一單一操作中,藉變 化電解裝置之電流強度及/或基板通過電解裝置之速率, 來製造不同程度之層厚度亦是可能的。 對於每一情況將—個電傳導區域做成陰極及陽極之連 接已屬足夠。然而,亦可設想成,對於相鄰之電傳導區域 同時成陰極之連接。此種情況,藉電解可加速基板使之加 厚成為可也。在一類似之方式中,對於多個電傳導區域而 言亦可如此連接,但無必要安排成直接相互相鄰,同時成 陽極之連接。用於在電傳導區域鄰近處安排成如同陽極般 連接之接觸-接通單元之電傳導區域’較佳的連接成如同 陰極。電傳導區域如同陽極般之連接,則形成一補助之陽 極。 _ 原則上,接觸-接通單元.可成為任何所要求之形狀,特 別的是應與進行該電解之基板相匹配。此一原因為藉電解 來加厚之該基板,不但是平面之基板且可能是立體形狀之 基板。 -10-(i) (i) 574437 发明, description of the invention (the description of the invention should state: the technical field to which the invention belongs, the prior art, the internal technology. The invention belongs to an electrolytic device and belongs to an electrically conductive layer on a substrate. -Electrolytic system for electrolysis.-Use of electrolysis device and electrolysis system to fabricate conductors covering all surfaces. Body structure and conductor layer "For example, using this device can produce antenna coils, printed circuit boards, chip card modules or Similar items. This is the way to date to form conductor structures of this type using corrosion treatment. For this purpose, a metal circular cylinder, which is continuously connected like the same cathode, is at least partially immersed in an electrolyte The electrolyte tank is made to rotate. There is an anode device in the electrolyte tank. Depending on the electrolyte used, a metal layer is decomposed on the slowly rotating cathode. Outside of the electrolyte, this metal layer is formed into a thin sheet. Add on a so-called non-conductive thin plate of the substrate. This method can only produce a metal layer on one side of the carrier substrate. The minimum thickness of the metal that can be obtained is limited. Generally made of copper, the metal falls off the cathode and is added to a sheet made of plastic. Considering the possibility of crack formation caused by subsequent further processing, the minimum limit is _ sheet thickness is about 17 μηι. After a thin sheet-like metal layer has been added on the thin plate, this metal layer has a thickness ranging from 17 μπ ^ 75 μπι, and an etching resist is added to the metal layer, which is then made using lithography technology. Exposure. The subsequent etching steps will be used to cover all the surfaces. These are not required to be etched away from the pattern area with the conductor path. After removing the etch resist that is stored on the metallization of the pattern, The required conductor structure is completed. The method of explanation-6- (2) 574437 method, see introduction, uses the principle of corrosion. The first disadvantage is that because of the use of the principle of corrosion, the required chemical guest is-枓 A consumes a lot and is wasted on the use of a large amount of raw materials (metal layers). ㊉ can only obtain a low amount of growth. The disadvantage of this step is that the anode cleaning of the cylindrical cathode must be performed regularly i * ίΐ [ΙΪ 1 xh ife Μ, iri-, »〇. __ 进 / π 口 π 内 内 少 Γ to go from right to bottom, tpv makes q must be regularly performed L. Although nitric acid can be used to perform the cleaning of the anode, it must be The electrolyte phase of the electrolyte phase is completely eliminated. During this cleaning period, the electrolytic device 2 is not used for production. Instead, it is a known method for searching the state for cleaning purposes. However, this type of tritium, Vermiculite-type &lt; device, in the gland edge mode, because it is necessary-within a short time-to add a very high current, there is a very high Consumption. Therefore, from the perspective of purchase and maintenance costs, installing this type of pulse is expensive. Therefore, the present invention provides an electrolysis device and an electrolysis system according to this purpose. Compared with the prior art, a faster, simpler, and simpler manufacturing process: a substrate with a lower electrical conductive layer can be obtained. This purpose can be achieved by applying for the patent scope (characteristics of electrolysis device reading patent scope item 13 (electrolytic system)) + + ¾. This kind of configuration with excellent polymerization can be obtained from each appendix in the scope of patent application. M ^ is shown in the general term. With the electrolytic device of the above invention, it is possible to carry out an electrically conductive layer on a substrate that already has a conductive structure. # The conductive structure preferably includes the The surface of the substrate is solid and fixed to even a gentleman.—Earth alley plate <conductive particles. The conductive particles added to the surface of the substrate become "non-covered," which means that there is no substance embedded around it. For example It can be said that the conductive particles can be added to the substrate by means of blowing, continuous shooting, rolling and brushing. The surface of the conductive particles and the substrate is sufficiently obtained by (3) 574437: and / or The comparative characteristics of the substrate in the form of an alloy make the surface ultrasonic waves or the addition of conductive electrical particles to ensure the conductivity in actual definition. Therefore, the purpose of one grain can be seen by electrolysis to achieve the safety , Each In the case, at least "and the previous surface, the particles are first applied to the substrate body by means of thermal and / or static and / or magnetic force. The conductive particles graphite or conductive polymer particles of iron, nickel, gold, silver, "Aluminum and copper composition" During the addition to the substrate, the particles are preferably powdered. The composition is preferably composed of a non-conductive material, and the surface of the substrate is sticky. For example, 'by softening the surface or adding a sticky substance, Viscosity becomes active. Softening of the surface can be achieved by heat radiation and the use of solvents, so for this purpose, the surface is treated with a solvent before the particles are prepared in advance. Instead or in addition, The substrate body can also be treated with solvent before. In the case of dissolution-free operation, conductive particles are added to the substrate covering the entire surface of the required conductor structure. The pre-treated electrical particles of the substrate continue to adhere to the substrate, and only here There is a bonding device or an electrolytic system to thicken the conductive micro-electrode by electrolysis. This shows that since the actual need is only a planning aspect, the electrolysis according to the invention It is possible to use the supply to bring the distribution. In the $, the thin plate described, that is, for example, a conductor structure is dominated. The electrolysis device for an electrically conductive layer on the substrate has an anode and at least one contact. Electrolytic cell contact of the switch-on unit-The switch-on unit has multiple electrically conductive areas, and each of the multiple contact and switch-on units becomes the connection between the cathode and anode. The device contains -8- (4) (4) 574437 Proprietary cathode connection element (metal cylinder). According to the electrolytic device of the invention, it has a contact that can connect the cathode and the anode. A private solution device can be defined as a self-regenerating device. This means that this electrolytic device no longer requires an anode roller for connection to the cathode. &Lt; Any downtime in cleaning. As a result, it is possible to obtain a sufficiently high production capacity, so that the unit cost of manufacturing the conductor structure is also reduced. Since only a part of the conductive particles deposited on the electrically conductive area connected to the cathode is used to thicken the substrate by electrolysis, the electrically conductive area is contaminated during the whole process. Since each electrically conductive area becomes an anode connection at least once after it has been called a cathode connection, the contact-switching unit is self-cleaning. At this time, the electrically conducting area for electrolysis is used as an auxiliary cathode. Therefore, since each electrically conducting area of a contacting / connecting device can be connected as a cathode or as an anode, Anode cleaning, this distribution method is so far known only. Depending on its location, the conductive area can be a cathode or anode connection. In particular, different electrical conduction regions can be made as cathode and anode connections at the same time. Since at least one electrically conductive region is always connected to both the cathode and the anode, the electrolysis device can be operated continuously. Conductor structure, for example, to see the fact that the antenna coil or chip module in the preface can be completed and thickened by electrolysis using an electrolytic device, low-cost production is also possible, so separate the separate conductor structures No further processing steps are required. Therefore, the step according to the invention is an additional or semi-additive processing step for manufacturing a conductive structure. (5) 574437 Again, the quality of the metal structure of the electrically conductive layer can be controlled, and f is a very uniform thickness. Furthermore, it is possible to manufacture a double-sided metallization using an electrolytic device according to the invention. For this purpose, it is necessary to add conductive particles to both sides of the substrate in a structured manner before processing by the electrolytic device. In addition to the advantages of forming a double-sided metal layer at the same time, self-regeneration of electricity through contact is also possible. It is also possible for these contacts, together with the conductor structure combined on the opposite major face of the substrate, to have a thickness of approximately uniform layer. The advantage of this step is that it is also possible to manufacture layer thicknesses of varying degrees by changing the current strength of the electrolytic device and / or the rate at which the substrate passes through the electrolytic device in a single operation of an electrolytic device. In each case, it is sufficient to make an electrically conductive region a cathode and anode connection. However, it is also conceivable to simultaneously form a cathode connection for adjacent electrically conductive regions. In this case, it is possible to accelerate the thickness of the substrate by electrolysis. In a similar manner, it is also possible to connect a plurality of electrically conductive regions, but it is not necessary to arrange to be directly adjacent to each other, and at the same time to form an anode connection. The electrically conductive region 'of the contact-switching unit arranged adjacent to the electrically conductive region to be connected like an anode is preferably connected like a cathode. The electrically conductive areas are connected like anodes, forming a complementary anode. _ In principle, the contact-on unit can be of any desired shape, in particular it should match the substrate on which the electrolysis is performed. This reason is that the substrate is thickened by electrolysis, not only a flat substrate but also a three-dimensional substrate. -10-

574437 再者,一改進的發明之接觸-接通單元可將之連接至一 脈衝之處理器上。 用於接觸-接通單元較佳的為圓筒形之設計。然後電傳 導區域自一個基本面對向另一基本面,來延伸該圓柱形接· 觸·接通單元之側面之面。 車父佳的是’若電傳導區域相互的加以間隔分開,且按波 形、鋸齒形、或斜坡形之形狀來運轉。電傳導區域亦可為 直線形。波形、鋸齒形' 或斜坡形形狀,具有對進行電解 之基板的該區域能達到一致高可靠性水準且可以確保導籲 電層之均勻生長之優點。 - 如果電傳導區域之側面為一顯著之波形、鋸齒形、或斜 坡形時,成陰極連接之電傳導區域之地區,如果,即,藉 一遮蔽裝置,將陽極裝置處加以遮蔽時,是最為有利的。 此一地區因未定位在基板之直接鄰近處,且因之不要求傳 送電流,故應加以遮蔽。在陰極連接之區域上,遮蔽裝置 可設計成具翼狀之側面,如此,可避免在陰極連接之有電 區域上直接分解。 Φ 較佳的為提供一將基板壓在至少一接觸-接通單元上之 固定器,固定器可為一不導電之滾輪。固定器亦可設計為 進一步I 一接觸_接通單元。可藉固定器將進行電解之基 板壓在成為如同陰極般連·接之接觸_接通單之電傳導區域·- 上。 ‘ 在/替代又配置中,接觸-接通安排可具有希望將其與 進行電解之基板之區域處達成接觸之滑片。特 〜考,可利 -11 - 574437574437 Furthermore, an improved invention contact-on unit can be connected to a pulse processor. The contact-connection unit is preferably a cylindrical design. The electrically conducting area then extends from one basic face to the other basic face to extend the side face of the cylindrical contact, contact, and connection unit. Chevrolet ’s preference is that ‘if the electrically conductive areas are spaced apart from each other and run in a wave, sawtooth, or ramp shape. The electrically conducting area may also be linear. The wave shape, zigzag shape, or slope shape has the advantages of achieving a consistent high level of reliability for this area of the substrate to be electrolyzed and ensuring the uniform growth of the conductive layer. -If the side of the electrically conductive area is a significant wave, zigzag, or slope, the area of the electrically conductive area that is connected to the cathode is the most suitable if the anode device is shielded by a shielding device advantageous. This area should be shielded because it is not located in the immediate vicinity of the substrate and no current is required to be transmitted. In the area where the cathode is connected, the shielding device can be designed as a wing-shaped side, so that it can avoid direct decomposition on the area where the cathode is connected. Φ It is preferable to provide a holder for pressing the substrate on at least one contact-on unit, and the holder may be a non-conductive roller. The holder can also be designed as a further contact-on unit. The substrate to be electrolyzed can be pressed by the holder onto the electrically conductive area of the contact-connected contact-connected sheet, which is like a cathode. ‘In / alternative configuration, the contact-on arrangement may have sliders that wish to make contact with the area of the substrate on which electrolysis is performed. Special ~ Kao, Keli -11-574437

⑺ 立體空間之 用孩滑片來達到,例如,下切之且很難進入該 基板區域。滑片可藉由氣壓或液壓裝置從進行電解之物體 處取去或放回。然後一滑片依其所在位置,決定是成陰極 或陽極之連接。 在另一配置中,接觸-接通單元具有關於一基板能移動 ,並且如所要求能做不同之活動之栓,依其位置栓可做成 陰極或陽極之連接。此處所說明之接觸_接通單元為藉電 解特別適合用於加厚印刷電路板者。按照欲電解之導體架 構,將栓自基板向外“伸出,,,以便在導體架構之位置上做鲁 成陰極之連接。將栓縮回基榕内,可使其為陽極之連接, 結果導致清洗該先前已成陰極連接之栓。 符悉报為二層架構’且第一層為陽極之連接,及第二居 為陰極之連接之事實,使此一做法成為可能的。因此,視 其現在所在之限定位置而定,检成為陽極或陰極之連接。 /成電傳導區域之栓藉由例如,氣動、液動或電動之慣 吊技術可予以縮回及伸出。 按照發明,至少具有一個以上上 泰 斤說明的電解裝置之 包解系、.·无’其包含一將基板饋送至至少—切 杯+〜、 一電解裝置處來進 包醉又饋送裝置,及一接收該已 举罢〜基板又接收 。特別的是,基板可按環狀之方式 --. 、貝运至至少一電解 兀處。如此,由於電解裝置 有效、俏罄田= * — 名1τ機時間,故可得到 低費用及可靠之製造。― 最好是將電解單元安排 電解液榫访番士 收集备益内,收集容器中之 ^置有電解液,㈣之電解液亦可溢出,以便在 -12- 574437⑺ Three-dimensional space is achieved with child slides, for example, cut down and difficult to access the substrate area. The slider can be removed or replaced from the object being electrolyzed by pneumatic or hydraulic means. Then a slider, depending on where it is located, determines whether it is a cathode or anode connection. In another configuration, the contact-on unit has a plug that can move about a substrate and can perform different activities as required. Depending on its position, the plug can be connected to a cathode or anode. The contacting / closing unit described here is particularly suitable for thickening printed circuit boards by electrolysis. According to the conductor structure to be electrolyzed, the plug "extends" from the substrate, so as to make a cathode connection at the position of the conductor structure. The plug is retracted into the base, which can be used as the anode connection. This led to the cleaning of the plug which had previously been connected to the cathode. The fact that the report was reported as a two-layer structure and that the first layer was the anode connection, and the fact that the second house was the cathode connection made this possible. Depending on where it is currently located, it can be detected as a connection to the anode or cathode. / The bolts that form an electrically conductive area can be retracted and extended by, for example, pneumatic, hydraulic or electric hoisting techniques. According to the invention, at least An unpacking system with more than one electrolysis device as described on Taijin, which contains a substrate feeding to at least-cutting cup + ~, an electrolysis device to feed into the packaging and feeding device, and a receiving device Let ’s say ~ the substrate is received again. In particular, the substrate can be transported to at least one electrolytic cell in a ring-like manner. In this way, because the electrolytic device is effective and full of time = * — name 1τ machine time, so Get low fees .- and reliable manufacturing electrolytic cell is preferably arranged to collect an electrolytic solution prepared tenon access Fan Yi Shi the collection container placed in the electrolyte solution ^, (iv) the electrolytic solution may overflow, so -12-574437

⑻ 電解液槽内之電解液呈現有一自我補充之狀態。為了此種 目的,收集容器配備有經一溢流器之電解裝置之電解液槽 。在一類似之方法中,收集容器具有將處理過之電解液抽 回至電解液槽内之一泵及一過濾器。 在一所選之配備中,按照發明之電解系統至少具有二個 成串聯連接,及使用相同之電解液或不相同電解液之電解电解液 The electrolyte in the electrolyte tank appears to be self-replenishing. For this purpose, the collection container is equipped with an electrolyte tank of an electrolysis device through an overflow. In a similar method, the collection container has a pump and a filter that draw the treated electrolyte back into the electrolyte tank. In a selected installation, the electrolysis system according to the invention has at least two electrolysis systems connected in series, and electrolysis using the same electrolyte or different electrolytes

按照發明之電解系統因此可為一模組架構。作業及生產 量藉模組之數目來決定。按照發明之電解裝置之優點為, 在相同之電解液内,其可在不-同之電流強度下操作,且特 別的是陽極裝置及補助陽極裝置,可利用不同之電流強度 來操作。 發明併同參考以下之圖式,按更詳細方式加以說明之, 其中: 圖1示出按照發明之一電解裝置之一舉例之具體實施例 之橫斷面之略圖, 圖2示出在電解裝置中所使用之接觸-接通單元之操作 及架構, 圖3示出橫穿按照發明之電解裝置之第一舉例之具體實 施例之一截面圖, - 圖4示出一包含有在圖1至3說明之電解裝置之電解系統, 圖5及6示出一用於環狀基板之電解之接觸-接通單元之 多種安排, 圖7示出一電解裝置之一第二舉例之具體實施例之透視 -13- 574437 (9) mwm 圖 圖8不出穿過圖7中所示之電解裝置之一截面圖, 圖9及10在每一圖示中示出顯示該第二舉例之具體實施 例之電傳導區域之配置, 圖11示出其中電傳導區域設計成成薄板狀之一電解裝 置之第三舉例之一具體實施例,及 圖12示出如於圖2所示之在一接觸-接通單元之陰極連 接區域上之遮蔽裝置之安排。 圖1示出按照發明之一電解裝置10之/第一舉例之具體 貫施例。純為舉例之方式,在^電解液槽14中依次安排有 五個接觸-接通單元16,槽26中充滿有電解液。接觸-接通 單元16之橫斷面為圓形。再一次說明純為說明之方式,在 或靠近各自之一接觸-接通單元16之間顯示有一陽極裝置 3〇之電極28。陽極裝置30之陽極28原則上可安排成任何方 式。在每一接觸-接通單元16上,安排有一由不導電材料 組成且示出用於將基板壓入在接觸-接通單元之固定器上 又农輪18。在每一次清洗情況中,該進行電解之基板(圖工 中未不出)會在一滾輪1S與一接觸-接通單元16之間來輪送 基板可為環狀且在電解液槽14之上部引入,而在另一 ' 送出。 側 可從圖2更清楚看出接觸_.接通單元16之架構。亦可從此 、圓同形接觸-接通單元之全面之周圍上,具有相互隔開 又電傳導區域20之側面表面之圖形更能清楚的看出。電解 裝置在操作時,接觸·接通單元做成不是由一馬達帶動, -14- 574437 (ίο) 就疋由基板自己推叙—、A &amp; ^ 、 、 万疋轉。…後將在圖2中以20k來表示 之電傳導區域20與—岭紅择罢 、 农和裝置22相接觸,成陰極之連接, 目的為了清洗該接館拉 wtf 一 m ·»· 、 觸-接通早兀,同時將電傳導區域20(此 區域以20a來表示)與 臬 —、 ” 舉彳】万式所·,,、員不之二個陽極裝置24 相接觸,則成陽極之連接。 當接觸*接通單元16旋轉成360度時,每一傳導區域20至 y有 極般及二次如同陽極般之連接。陰極裝置 22及陽極裝置24,例如,可設計成輪狀或滾輪之形式放置 在接觸-接通單元16上。 在圖斤王獻之舉例之具體實施例中,陰極裝置22及 陽極裝置24安排成互相相反。陽極裝置24在原則上可安排 在所兩要之任何位置,較佳的可與圖式中所顯示者不同, 就在陰極纟後成&amp;同-補助陽極般之連#。所冑“就在陰 極之後應可了解到意思是,有一角度近於叩度之偏置, 即相應於陰極22位置所選之偏置約為9〇度。 事實上接觸-接通單元16具有多個電傳導區域2〇,且不同 之傳導區域同時成陽極及陰極之連接,如此按照發明之電 解裝置可得到連續之操作。藉由陽極裝置24之陽極連接可 自動清洗除去分解在成陰極連接之電傳導區域2〇k上之導 電微粒。此一步驟可使電解裝置在無中斷或無必需停機之 情況下做連續之操作。 圖12示出示於圖2中之一修飾·之接觸_接通單元,其中, 首先以舉例方式示之,顯示者為金屬化之陽極裝置Μ及基 板12。事實上沿圓筒形接觸-接通單元16之内部周圍安排 •15- 574437 ⑼ 之陰極裝置22及陽極桊$, 衮且30與本發明無關,重 一架構性之配置而矣。命面 文百1皇 入圖2相較最明顯之不同處 極連接區域20k上安排々、点_ — 處為 文徘&lt; 遮蔽裝置25意欲在不需 流之區域徽地區上防止金屬之分解。這些地區以元 號21示之’且離開區域2Gk與基板以間之接觸點。 是如果電傳導區域2〇具有一缸3日從、、丄 極為月顯又波形或鑛齒 面或成極斜坡之活動時,柢 ,# 助咛知用此種遮蔽裝置甚為有利 例示之’遮蔽裝置25具有在圖12中所顯示似翼狀之例 ’ϋ可推動成金屬化之基板12與遮蔽裝置25之間以箭 示(在原先前已經在基板形成嶺13a表示之及在電解 成以13b表示之導電架構)之離子流動。 圖3再次顯示關於電解液槽14及接觸-接通單元丨6之 及陽極裝置22,24之安排。以舉例之方式將陰極裝置 陽極裝置24二者安排在電解液槽14之外。旋轉之纟士果 不同之傳導區域20上成為陽極及陰極之連接。將不導 滾輪18安排在接觸-接通單元16之上部。進行電解之 穿過在滾輪18與接觸-接通單元16之間所形成且清楚 之槽缝,滾輪18提供有將預先成形之基板壓緊在陰極 之電傳導區域上之壓力。 原則上’電解裝置可包含僅一個接觸-接通單元16 而,在一電解槽中安排多個接觸-接通單元,可在已 供有導電微粒之基板上藉電解以增加電傳導層之生名 圖4示出一按照發明利用圖1至圖3所說明之電解裝 造之電解系統。將電解裝置10安排在一收集容器46内The electrolytic system according to the invention can therefore be a modular structure. The operation and production volume are determined by the number of modules. The advantage of the electrolytic device according to the invention is that it can operate at different current strengths within the same electrolyte, and in particular the anode device and auxiliary anode device can be operated with different current strengths. The invention will be described in more detail with reference to the following drawings, in which: FIG. 1 shows a schematic cross-section of a specific embodiment of an electrolysis device according to the invention, and FIG. 2 shows an electrolysis device The operation and structure of the contact-switching unit used in FIG. 3 shows a cross-sectional view of a specific example of a first example of an electrolytic device according to the invention, which is shown in FIG. 4. The electrolytic system of the electrolytic device illustrated in Fig. 3, Figs. 5 and 6 show various arrangements of a contact-connection unit for electrolysis of a ring-shaped substrate, and Fig. 7 shows a second embodiment of an electrolytic device Perspective-13- 574437 (9) mwm Figure 8 shows a cross-sectional view through one of the electrolytic devices shown in Figure 7, Figures 9 and 10 show in each figure a specific embodiment showing the second example The configuration of the electric conduction area, FIG. 11 shows a specific example of a third example of an electrolysis device in which the electric conduction area is designed in a thin plate shape, and FIG. 12 shows a contact as shown in FIG. 2- Arrangement of the shielding device on the cathode connection area of the switching unitFig. 1 shows a specific embodiment of a first example of an electrolytic device 10 according to the invention. By way of example only, five contact-on units 16 are arranged in the electrolyte bath 14 in order, and the bath 26 is filled with electrolyte. The cross section of the contact-on unit 16 is circular. The explanation is again purely illustrative, and an electrode 28 of an anode device 30 is shown between or close to one of the contact-on units 16. The anode 28 of the anode device 30 can be arranged in any manner in principle. On each contact-connection unit 16, there is arranged a non-conductive material and a holder 18 for pressing the substrate onto the contact-connection unit is shown. In each cleaning situation, the substrate for electrolysis (not shown in the drawing) will be rotated between a roller 1S and a contact-on unit 16 to rotate the substrate. The substrate may be ring-shaped and placed in the electrolyte tank 14 The upper part is introduced, while the other one is sent out. The structure of the contact _.on unit 16 can be seen more clearly from FIG. 2. The pattern of the side surfaces of the electrically conductive region 20 spaced apart from each other can be more clearly seen from the entire periphery of the circular-shaped contact-connection unit. When the electrolytic device is in operation, the contact and connection unit is not driven by a motor. -14- 574437 (ίο) It is inferred from the substrate itself—A, &amp; ^, and 10,000. … The electrical conduction area 20 indicated by 20k in FIG. 2 will be in contact with Linghong Zheba, Nonghe device 22 to form a cathode connection, in order to clean the connection hall and pull wtf a m · »·, contact -Switch on the early stage, and at the same time, contact the electrically conductive area 20 (this area is represented by 20a) with 臬 —, ”彳】 Wan Shisuo ,,, and the two anode devices 24, then become the anode. Connection. When the contact * on unit 16 rotates 360 degrees, each conductive region 20 to y has a polar and secondary connection like an anode. The cathode device 22 and the anode device 24 can be designed, for example, in a wheel shape or The form of a roller is placed on the contact-connection unit 16. In the specific embodiment illustrated by Wang Jinxian, the cathode device 22 and the anode device 24 are arranged opposite to each other. The anode device 24 can be arranged in principle at any of the two requirements. The position, which may be different from what is shown in the drawing, is formed immediately after the cathode &amp; the same as the auxiliary anode #. Therefore, "just after the cathode should be understood to mean that there is an angle close to Bias offset, corresponding to the selected position of cathode 22 Set approximately 9〇 degrees. In fact, the contact-switching unit 16 has a plurality of electrically conductive regions 20, and different conductive regions are simultaneously connected to the anode and the cathode, so that the electrolytic device according to the invention can be continuously operated. The anode connection of the anode device 24 can automatically clean and remove conductive particles decomposed on the electrically conductive area 20k forming the cathode connection. This step enables continuous operation of the electrolysis unit without interruption or unnecessary shutdown. Fig. 12 shows a modified-contact-on unit shown in Fig. 2. Among them, it is shown by way of example first, and the display is a metalized anode device M and a substrate 12. In fact, it is arranged along the inner periphery of the cylindrical contact-connection unit 16. The cathode device 22 and the anode electrode 15-574437, and 30 have nothing to do with the present invention, and they have an architectural configuration. Figure 2 shows the difference between the most obvious difference in the pole connection area 20k. Figures 2 and 5 are arranged on the pole connection area 20k. The masking device 25 is intended to prevent the decomposition of the metal on the area where the flow is not needed. . These areas are indicated by 21 'and the contact point between the area 2Gk and the substrate. If the electric conduction area 20 has 3 cylinders of movement from the 3rd, the 3rd, the 3rd, the 3rd, the 3rd, the 3rd, and the 3rd, the waveform or the surface of the tine or the slope of the pole, 活动, # 咛 咛 know that using this kind of shielding device is very advantageous to illustrate it The shielding device 25 has a wing-like example as shown in FIG. 12. (1) The metalized substrate 12 and the shielding device 25 are indicated by arrows (indicated by the previously formed ridge 13a on the substrate and the electrolytic formation). 13b). Fig. 3 again shows the arrangement of the electrolyte tank 14 and the contact-on unit 6 and the anode devices 22 and 24. The cathode device and the anode device 24 are both arranged outside the electrolytic solution tank 14 by way of example. Rotating Fructus Juice The different conductive areas 20 become the connection between the anode and the cathode. A non-guide roller 18 is arranged above the contact-on unit 16. Electrolysis is performed through a clear slot formed between the roller 18 and the contact-connection unit 16, and the roller 18 is provided with a pressure for pressing a pre-formed substrate against an electrically conductive region of the cathode. In principle, the electrolysis device may include only one contact-on unit 16 and, by arranging a plurality of contact-on units in an electrolytic cell, electrolysis can be performed on a substrate provided with conductive particles to increase the life of the electrically conductive layer. Fig. 4 shows an electrolytic system according to the invention using the electrolytic device illustrated in Figs. Arrange the electrolytic device 10 in a collection container 46

表示 在陰 送電 件編 特別 之側 0以 面時 頭所 後形 陰極 22及 為使 電之 基板 可見 連接 〇 炊 經提 率〇 置製 -16-It indicates that the special side of the negative power transmission device is 0. The cathode 22 is shaped behind the head, and the substrate for the electricity is visible. 〇 The cooking rate is set. -16-

574437 插入至電解液槽14之溢流器48,傳送溢流之電解液至收集 各器46内。收集容器46具有一將處理過之電解液泵回至電 解槽液14内並具有過濾器之泵50。 不於圖4中之電解系統特別適合用於處理為環狀形式之 基板。已經架構成具有導電微粒之基板,成鼓輪形狀先繞 在馈送裝置42上。由饋送裝置42導引該基板按箭頭所示之 方向進入電解裝置1〇内,且基板在各自之接觸-接通單元 16與滾輪18之間通過,並在電解裝置1〇之左手側再次移出 。藉電解已經被加厚之基板在一 T形拖把52上經過以便將 附著之電解液清除。仍為環帶形狀之基板經一導輪54進入 一漂洗裝置56。基板經二個導輪58予以轉向,進入及經過 另一 T形拖把60,另一導輪62及喷灑漂洗裝置64進入一純 化器68内。在基板穿過另一 τ形拖把72後並引導經過一乾 燥用之吹風機74,最後基板成鼓輪形狀繞回至一接收裝置 44上。藉電解已經被加厚之基板現在可分開做進一步之步 驟。再次應加強說明的是,此時之導體架構已經成為其最 終之形式,即,不再需要對其再執行用於任何蝕刻之步驟 或進一步之架構處理。 圖5顯示已經由一進一步之接觸-接通單元16來代替原 產生壓力之滾輪18之舉例的具體實施例。在此一情況中, 二個各自之接觸-接通單元16安排成互相相反,使得基板 可再次通過二者之間。為簡化設計,在圖5中已將電解液 槽及陽極裝置30省略。 圖6亦相同’其中,以舉例之方式,將接觸-接通單元16 -17- (13) (13)574437 抵垧排列。因此基板12在接觸_接通單元16之 間成曲折的形穿 ^式穿過在每一情況中藉抵消安排可確保所 需之塾力。 一即使是如果這些金屬化之基板在不具有通過_接觸下, =2顯示於圖5及6之接觸_接通單元16,將基板之二面予 I:日::化亦可製造。如果基板確有通過-接觸,且如果在 牧於、發明4 &amp; 電傳導加:電解裝置之處理之前已提供具有上述形式之 、導二構時,則用於基板之僅_個面將之連接在一接觸 -接通早7L 16上已屬足夠。儘管如此,由於通過·接觸為自 動的加厚,具有電傳導好 、 得夺材枓。-且在接觸-接通單元16遠方 之面上導致形成一纟士人古播&amp; 有導體架構之金屬之單元,故可以 確保二個面之金屬化是 疋了吨的。此為一具有大約為定值之 層厚度之導電架構形达; 稱/成又結果。然後通過-接觸與結合之 導體形成一金屬之單元。 圖7示出按照發明之拄 义接觸-接通單元16之一進一步之舉 例之具體實施例。現力 、 、 ~接觸-接通早元成為類似薄板 之形狀。其包含相互点如 风相鄰但分開之安排,且可向下放置 在底板34内之多個於κ κ Μ °栓36可自底板34移出至限定之位 置’其中可藉由在圖7φ 土、、, 岡/甲未評予示出之控制機械來執行基 板之電解。 可從圖8全部可以#、、主疮 &amp; '處的看出,其中六個栓36已經自 底板34移出,至其隈也丨、 -574437 is inserted into the overflow 48 of the electrolyte tank 14 and transfers the overflowed electrolyte to the collection tanks 46. The collection container 46 has a pump 50 that pumps the treated electrolyte back into the electrolytic bath liquid 14 and has a filter. The electrolytic system other than that shown in Fig. 4 is particularly suitable for processing a substrate in a ring form. A substrate having conductive particles has been formed, and is wound around the feeding device 42 in a drum shape. The substrate is guided by the feeding device 42 into the electrolytic device 10 in the direction shown by the arrow, and the substrate passes between the respective contact-connecting unit 16 and the roller 18, and is removed again on the left-hand side of the electrolytic device 10 . The substrate which has been thickened by electrolysis is passed on a T-shaped mop 52 to remove the attached electrolyte. The substrate, which is still in the shape of an endless belt, enters a rinsing device 56 through a guide wheel 54. The substrate is turned by two guide wheels 58 and enters and passes through another T-shaped mop 60, and the other guide wheel 62 and the spray rinsing device 64 enter a purifier 68. After the substrate passes through another τ-shaped mop 72 and is guided through a dryer 74 for drying, finally the substrate is wound back to a receiving device 44 in the shape of a drum. Substrates that have been thickened by electrolysis can now be separated for further steps. It should be emphasized again that the conductor structure at this time has become its final form, that is, it is no longer necessary to perform any further etching steps or further structure processing on it. Fig. 5 shows an exemplary embodiment in which a further contact-on unit 16 has been used instead of the roller 18 for generating pressure. In this case, the two respective contact-on units 16 are arranged opposite to each other so that the substrate can pass between the two again. In order to simplify the design, the electrolytic solution tank and the anode device 30 have been omitted in FIG. 5. Fig. 6 is also the same, in which the contact-on units 16 -17- (13) (13) 574437 are arranged next to each other by way of example. Therefore, the base plate 12 is passed through the zigzag shape between the contact and connection units 16 and the required force can be ensured by the offset arrangement in each case. First, even if these metallized substrates do not have a pass_contact, = 2 is shown in the contact_connection unit 16 of FIGS. 5 and 6, and the two sides of the substrate are given I: 日 :: 化 can also be manufactured. If the substrate does have a through-contact, and if the conductive structure with the above-mentioned form has been provided before the treatment of the invention and the invention 4 &amp; electrical conduction plus: electrolysis device, only _ one side of the substrate will be used It is sufficient to connect on a contact-on-early 7L-16. Nonetheless, because the through and contact are automatically thickened, it has good electrical conductivity and can be used for materials. -And on the far side of the contact-connecting unit 16 a unit of ancient soldiers &amp; metal with a conductor structure is formed, so it can be ensured that the metallization of the two sides is tens of tons. This is a conductive structure with a layer thickness of approximately a fixed value; A metal unit is then formed by -contacting and bonding the conductor. Fig. 7 shows a specific embodiment of a further example of the contact-switching unit 16 according to the invention. Now force,, ~ contact-turn on the early element to become a thin plate-like shape. It consists of points that are adjacent to each other but separated by wind, and a plurality of κ κ Μ ° bolts 36 that can be placed downward in the bottom plate 34 can be removed from the bottom plate 34 to a defined position. The control mechanism not shown is to perform electrolysis of the substrate. It can be seen from Fig. 8 that all of the six sores 36 have been removed from the base plate 34 to the main sores.

^ &lt; 位置。底板34包含二個層38,4C ,第一層38為如同陽炻如、 連接及第二層40如同陰極般之 連接。當然,第— 禾一層38及40相互成電的絕緣。依栓 -18- 574437 (14)^ &lt; position. The bottom plate 34 includes two layers 38, 4C. The first layer 38 is connected like an anode, and the second layer 40 is connected like a cathode. Of course, layers 38 and 40 are electrically insulated from each other. Ebolt -18- 574437 (14)

36之位置可單獨決定是否成陰極或陽極之連接。 可從顯示一栓36在其底板34之限制位置之外(圖9)及一 栓36在其底板34之限制位置之内(圖1〇)之圖9及1〇更清楚 的看出。栓36具有一較第二層40之厚度為大之長度之絕緣 體82 ^ —與栓36之直徑相一致之電導區域8〇並與在其可 以移動進入之接觸面成接觸。如圖9所示如果栓36在其限 制位置,成陰極之連接。對照下,如果栓36全部進入至底 板34内則成陽極之連接。 於圖7至1〇中顯π之接觸-接通單元16特別適合用於,藉鲁 電解加厚一具有一要求之導體—架構之印刷電路板。因為拾 16相互間安排成有一規則之間隔,藉著將栓%移動至其如 圖9所示限制之位置,原則上是可能再製造任何所要求之 導體架構1栓有規則的縮回至其如圖1〇所示之限制位置 ,可確保連接U板進行電解之電傳導區域8〇為在清潔該 陽極之正常位置。 圖11示出接觸-接通單元16之另一舉例之具體實施例。將 接觸-接通單元16做成_輸送帶之形式,沿著輸送帶安裝φ 有多個薄片90〇薄片90經一關節形連接器96連接至輸送帶 ,薄片在其遠離該關節形連接器之端處僅具有一電傳導區 域94,換句話說,有—絕緣體%將二者分開。在輸送帶做 成旋轉狀態下,結果是電傳·導區域94交替的成陰極及陽極’ 之連接田薄片90與以記號Κ來指出之基板12成接觸進行 電解時’全部時間内成陰極之連接。一直至一薄片達到輸 运帶《一預先決定之位置時,此一情形成陽極(Α)之連接 •19- 574437The position of 36 can be individually determined whether it is a cathode or anode connection. This can be seen more clearly from Figs. 9 and 10, which show a bolt 36 outside the restricted position of its bottom plate 34 (Fig. 9) and a bolt 36 within the restricted position of its bottom plate 34 (Fig. 10). The bolt 36 has an insulator 82 having a greater length than the thickness of the second layer 40. A conductive region 80 conforming to the diameter of the bolt 36 is brought into contact with a contact surface on which it can be moved. As shown in Fig. 9, if the plug 36 is in its restricted position, it becomes a cathode connection. In contrast, if all the bolts 36 enter the bottom plate 34, they are connected to the anode. The contact-switching unit 16 shown in Figs. 7 to 10 is particularly suitable for thickening a printed circuit board having a required conductor-frame structure by electrolytic plating. Because the pick 16 is arranged at a regular interval with each other, by moving the bolt% to its limit position as shown in FIG. 9, it is possible in principle to remanufacture any required conductor structure 1. The bolt is retracted regularly to it The restricted position shown in FIG. 10 can ensure that the electrically conductive area 80 connected to the U plate for electrolysis is in a normal position for cleaning the anode. FIG. 11 shows another specific embodiment of the contact-connection unit 16. The contact-on unit 16 is made into the form of a conveyor belt, and a plurality of sheets 90 are mounted along the conveyor belt. The sheet 90 is connected to the conveyor belt through an articulated connector 96, and the sheet is away from the articulated connector. There is only one electrically conductive region 94 at the end, in other words, there is-an insulator% separating the two. When the conveyor belt is rotated, the result is that the teleconducting and conducting areas 94 alternately form cathodes and anodes. The connection sheet 90 and the substrate 12 indicated by the symbol K are in contact with each other for electrolysis. connection. Until a slice reaches the transport belt "a predetermined position, this situation forms the connection of the anode (Α) • 19- 574437

且為清潔之方式。 原則上,有關接觸-接通單元之設計無論是什麼形狀是 無限制的。特別是,只要接觸-接通單元能與進行電解之 基板相互配合,即使是在下切之區域上亦屬可行。 說明之電解裝置亦可在已知之脈衝模式下來操作。且本 裝置可使用所有已知之商業上可取得之電解液。 可從按照發明之電解裝置之說明變得更為明確,即該電 解裝置可允許伴隨有一定品質及高的生產率,且製造費用 低廉。所需要之用於製造所要求之導體架構部分,基於需 要必需進行電解為-其一個優點-。進一步之優點則為,由於 相關用於控制目的之所有裝置可安排在電解液槽之外部 ,故所說明之電解裝置為簡單的製造及易於維護之裝置。 特別的是,對於示於圖4之多個接觸-接通單元之電解系 統,將接觸-接通單元做成串聯之安排是成為能。然後工 作量僅視模組之數目及導電層所要求之應用厚度而定。在 此一情況下,製造具有一迄今為止未曾見之均勻性之品質 ,且同時在正規之處理及環狀之處理二種情形上合併有最 低可能之價格之基板是可能達成的。 圖式代表符號說明 10 電解裝置- 12 基板 13a,b 導電層 14 電解液槽 16 接觸-接通單元 -20- 574437 (16) 18 20, 20a,20k,21 22 24 25 26 30 32 34 36 38 40 42 44 46 48 50 52, 60, 72 54, 58, 70 56 64 68 74 80 滾輪 電傳導區域 陰極裝置 陽極裝置 遮蔽裝置 井/槽 陽極裝置 滑片 底板 -栓 - 第一層(陽極) 第二層(陰極) 饋送裝置 接收裝置 收集容器 溢流器 泵/過濾器 T形拖把 引導滾輪 漂洗裝置-噴灑漂洗·裝置 銅鈍化器 烘乾吹風機 導電區域And a clean way. In principle, the design of the contact-making unit is unlimited regardless of its shape. In particular, as long as the contact-on unit can cooperate with the substrate on which electrolysis is performed, it is feasible even in the area undercut. The illustrated electrolytic device can also be operated in a known pulse mode. And the device can use all known commercially available electrolytes. It will become clearer from the description of the electrolytic device according to the invention that the electrolytic device can be accompanied by a certain quality and high productivity, and the manufacturing cost is low. The part of the conductor structure required for the manufacture of the required conductors, based on the need to perform electrolysis-one of its advantages-. A further advantage is that, since all relevant devices used for control purposes can be arranged outside the electrolyte tank, the illustrated electrolytic device is simple to manufacture and easy to maintain. In particular, for an electrolytic system of a plurality of contact-on units shown in Fig. 4, it is possible to arrange the contact-on units in series. Then the workload depends only on the number of modules and the application thickness required for the conductive layer. In this case, it is possible to manufacture a substrate with a uniform quality that has not been seen so far, and combining the lowest possible price in both the regular processing and the circular processing. Description of Symbols of the Drawings 10 Electrolytic device-12 Substrates 13a, b Conductive layer 14 Electrolyte tank 16 Contact-on unit -20- 574437 (16) 18 20, 20a, 20k, 21 22 24 25 26 30 32 34 36 38 38 40 42 44 46 48 50 52, 60, 72 54, 58, 70 56 64 68 74 80 Roller electrical conduction area cathode device anode device shield device well / tank anode device slider bottom plate-bolt-first layer (anode) second Layer (cathode) Feeding device Receiving device Collecting container Overflow pump / filter T-shaped mop guide roller rinsing device-spray rinsing · device copper passivator drying hair dryer conductive area

-21 - 574437-21-574437

(17) 82 絕緣體 90 薄片 92 絕緣體 94 導電區域 96 關節形連接裝置(17) 82 insulator 90 sheet 92 insulator 94 conductive area 96 articulation

-22--twenty two-

Claims (1)

*-------------— 修正 補充 利申請案 Θ替換本(92年10月) 拾、申請專利範圍 1· 一種在基板(12)上用於電解一電傳導層之電解裝置 (10),其包含一在其中安排有一陽極裝置(30)及至少— 接觸-接通單元(16)之電解液槽(1句,每一接觸-接通單 元(16)具有多個電傳導區域(20),在每一情況中至少多 個之電傳導區域之一個成陰極及陽極之連接。 2·如申請專利範圍第1項之電解裝置,其特徵為多個之電 傳導區域(20),可同時成陰極或陽極之連接。 3.如申請專利範圍第1項或第2項之電解裝置,其特徵為 接觸-接通單元(16)之每一電傳導區域(20)可成如同陰 極或陽極之連接。 4·如申請專利範圍第1項之電解裝置,其特徵為將在電傳 導區域(20)鄰近安排之連接成如同陽極般之接觸·接通 單元(16)之電傳導區域(20)連接成如陰極及形成一補助 之陽極。 5. 如申請專利範圍第1項之電解裝置,其特徵為接觸-接 通單元(16)為圓筒形設計。 6. 如申請專利範圍第5項之電解裝置,其特徵為電傳導區 域(20)在圓筒形之接觸-接通單元(16)之側向面上,自對 向另一基本面之一基本面處延伸。 7 ·如申請專利範圍第6項之電解裝置,其特徵為電傳導區 域(20)為互相分隔且按波形、据齒或斜坡之形狀運動。 O:\81\81279-921(X)2.DOO 8 申請年 利範圍飧頁: 裝置,其特徵為成陰極之 從陽極裝置(30)處加以遮 8 ·如申請專利範圍第7項之電解 連接之電傳導區域(20)之地區 蔽0 9·如申請專利範圍第i項之電解裝置,其特徵為有一將基 板(12)壓在至少一個接觸,接通單元(I。上之固定器。 10·如申請專利範圍第9項之電解裝置,其特徵為固定器為 一進一步 &lt; 接觸-接通單元(16)或一不導電之滾輪(18)。 1L如申印專利範圍第1項之電解裝置,其特徵為接觸-接通 單元(16)具有意欲與進行電解之基板(12)之區域做成接 觸之滑片。 12·如申請專利範圍第}項之電解裝置,其特徵為接觸-接通 單7C (16)具有關於一底板(34)之可移動且按要求能做不 同的活動之栓(36),該栓視其位置而定可為陰極或陽極 之連接。 &lt; 13·如申請專利範圍第12項之電解裝置,其特徵為底板(34) 為二個層之架構,且第一層(38)成陽極之連接及第二層 (40)成陰極之連接。 14· 一種具有至少一如申請專利範圍1至10項中任何一項 之電解裝置(10)之電解系統,其包含,一將一進行電解 之基板(12)饋送至至少一電解裝置(1〇)之饋送裝置(42) 及一接收該已完成電解之基板(丨2)之接收裝置。 15·如申請專利範圍第14項之電解系統,其特徵為將基板 (12)按環狀形式饋送至至少一電解裝置(1〇)。 16.如申請專利範圍第14或15項中之電解系統,其特徵為將 -2- O:\81\81279-921002.DOO 9 574437 電解裝置(10)安排在一收集器(46)中, 有具電解液之電解液槽(14),過濾之電 槽溢流,使得在電解槽液(14)中呈現出 電解液。 17.如申請專利範圍弟14項之電解系統’ 個利用相同之電解液或利用不同之電 裝置(10)成串聯之連接。 申請專利範Λ績頁1 收集容器内放置 解液可自電解液 有一自我補充之 其特徵為至少二 解液操作之電解 0:\81 \81279-921002.DOQ 9* -------------— Amendment of Supplementary Benefit Application Θ Replacement (October 1992) Pick up and apply for patent scope 1. A kind of electrolysis-electrically conductive layer on the substrate (12) An electrolysis device (10) comprising an electrolyte device (30) in which an anode device (30) is arranged and at least a contact-connection unit (16) (1 sentence, each contact-connection unit (16) has multiple Each of the electrically conductive areas (20), in each case at least one of the electrically conductive areas becomes the connection between the cathode and the anode. 2. If an electrolytic device according to item 1 of the patent application scope is characterized by a plurality of electrically conductive areas The area (20) can be connected to the cathode or anode at the same time. 3. If the electrolysis device of the first or second item of the patent application scope is characterized by each electrically conductive area (20) of the contact-connection unit (16) ) Can be connected like a cathode or anode. 4. The electrolytic device according to item 1 of the scope of patent application is characterized by connecting the contacts arranged in the vicinity of the electrically conductive area (20) as an anode-like contact and connection unit (16 ) 'S electrically conductive area (20) is connected as a cathode and forms a supplementary anode. 5. If applied The electrolytic device according to item 1 of the utility model is characterized in that the contact-connection unit (16) has a cylindrical design. 6. If the electrolytic device in the application item 5 of the patent application is characterized by the electric conduction area (20) in a circle The side surface of the cylindrical contact-connection unit (16) extends from the opposite to one of the other basic surfaces. 7 · If the electrolytic device of the scope of patent application No. 6 is characterized by an electric conduction area (20) It is separated from each other and moves in the shape of a wave, a tooth or a slope. O: \ 81 \ 81279-921 (X) 2.DOO 8 Apply for the annual profit range title page: Device, which is characterized as a slave anode device that becomes a cathode (30) 8) If the area of the electrically conductive area (20) of the electrolytic connection (7) in the scope of the patent application is covered by the area 0 9 · If the electrolytic device of the scope (i) of the patent application is covered, it is characterized by a ) Press down on at least one contact and turn on the holder of the unit (I.) 10. If the electrolytic device of the scope of patent application item 9 is characterized in that the holder is a further &lt; contact-on-unit (16) or A non-conducting roller (18). 1L electrolysis as described in the first patent application scope It is characterized in that the contact-connecting unit (16) has a sliding sheet intended to make contact with the area of the substrate (12) where electrolysis is performed. 12. If an electrolytic device according to item} of the patent application, it is characterized by contact- The connection sheet 7C (16) has a movable bolt (36) on a base plate (34) that can perform different activities as required, and the bolt can be a cathode or anode connection depending on its position. &Lt; 13 · For example, the electrolytic device of the scope of application for patent No. 12 is characterized in that the bottom plate (34) is a two-layer structure, and the first layer (38) is connected to the anode and the second layer (40) is connected to the cathode. 14. An electrolysis system having at least one electrolysis device (10) as claimed in any one of claims 1 to 10, comprising: feeding a substrate (12) for electrolysis to at least one electrolysis device (1〇 ) A feeding device (42) and a receiving device for receiving the electrolyzed substrate (丨 2). 15. The electrolytic system according to item 14 of the scope of patent application, characterized in that the substrate (12) is fed to the at least one electrolytic device (10) in a ring form. 16. The electrolytic system according to item 14 or 15 of the scope of patent application, characterized in that the -2- O: \ 81 \ 81279-921002.DOO 9 574437 electrolytic device (10) is arranged in a collector (46), There is an electrolytic solution tank (14) with an electrolytic solution, and the filtered electric tank overflows, so that the electrolytic solution appears in the electrolytic solution (14). 17. According to the scope of the patent application, 14 electrolytic systems are connected in series using the same electrolyte or different electrical devices (10). Application for patent application page 1 The solution placed in the collection container can be self-replenished by the electrolyte and has a self-replenishing feature which is characterized by at least two electrolytic operations for the solution operation 0: \ 81 \ 81279-921002.DOQ 9
TW91124513A 2001-10-25 2002-10-23 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive TW574437B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458859B (en) * 2007-03-28 2014-11-01 Toray Industries Method for feeding electricity, electricity feeding device, electrolytic and plating device for web, and a web with a plating film
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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10323660A1 (en) * 2003-05-15 2004-12-02 Gebr. Schmid Gmbh & Co. Device for treating objects, in particular electroplating for printed circuit boards
DE10342512B3 (en) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region
NL1025446C2 (en) * 2004-02-09 2005-08-10 Besi Plating B V Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric support as well as dielectric support.
DE102004029894B3 (en) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Apparatus and method for the electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of flat material to be treated
US8253035B2 (en) 2005-03-15 2012-08-28 Fujifilm Corporation Plating processing method, light transmitting conductive film and electromagnetic wave shielding film
RU2008145105A (en) * 2006-04-18 2010-05-27 Басф Се (De) METHOD AND DEVICE FOR ELECTRICAL COATING
JP2009534527A (en) * 2006-04-18 2009-09-24 ビーエーエスエフ ソシエタス・ヨーロピア Electrolytic coating apparatus and electrolytic coating method
DE502006005186D1 (en) * 2006-06-08 2009-12-03 Bct Coating Technologies Ag Device for galvanic deposition of surfaces and electroplating system
DE102008004592A1 (en) 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Belt electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip
US9725817B2 (en) * 2011-12-30 2017-08-08 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts
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CN114790565A (en) * 2022-05-26 2022-07-26 江苏启威星装备科技有限公司 Conductive device and horizontal electroplating equipment

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
DE3325316A1 (en) * 1983-07-13 1985-01-31 Maschinenfabrik Kaspar Walter GmbH & Co KG, 8000 München Metal-coating process and device, in particular for copper-plating cylindrical bodies
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
DE4229403C2 (en) * 1992-09-03 1995-04-13 Hoellmueller Maschbau H Device for electroplating thin plastic films provided with a conductive coating on one or both sides
DE4344387C2 (en) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper and arrangement for carrying out the process
DE4413149A1 (en) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Device for treating objects, in particular electroplating device for printed circuit boards
US6471848B1 (en) * 1998-02-17 2002-10-29 Canon Kabushiki Kaisha Electrodeposition method of forming an oxide film
US6294060B1 (en) * 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
DE10007435A1 (en) * 2000-02-18 2001-08-23 Enthone Omi Deutschland Gmbh Process for electroplating a workpiece coated with an electrically conductive polymer
DE10013339C1 (en) * 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Process for regulating the concentration of metal ions in an electrolyte liquid comprises feeding part of the liquid through an auxiliary cell consisting of an insoluble auxiliary anode and an auxiliary cathode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458859B (en) * 2007-03-28 2014-11-01 Toray Industries Method for feeding electricity, electricity feeding device, electrolytic and plating device for web, and a web with a plating film
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