KR20100131279A

KR20100131279A - Plating rack for uniform thickness plating of l0w amperage part

Info

Publication number: KR20100131279A
Application number: KR1020090050089A
Authority: KR
Inventors: 문굉근
Original assignee: (주)코선
Priority date: 2009-06-05
Filing date: 2009-06-05
Publication date: 2010-12-15

Abstract

PURPOSE: A rack for making the plating thickness of a low current part uniform is provided to enable plating to be uniformly done on a target since an anode bar is installed to be adjacent to a cathode bar and an auxiliary anode is located in the target. CONSTITUTION: A rack for making the plating thickness of a low current part uniform consists of a cathode bar(20) and an anode bar(40). A support(30) is installed on the cathode bar. The support supports a target. The cathode bar is connected to cathode power supply. The anode bar is insulated from the cathode bar. The anode bar is arranged close to the cathode bar. The anode bar comprises an extending bar(50) and an auxiliary anode(60). The extending bar is extended to the cathode bar. The auxiliary anode is connected to the extending bar.

Description

Rack for uniform plating thickness of low current part {PLATING RACK FOR UNIFORM THICKNESS PLATING OF L0W AMPERAGE PART}

The present invention relates to a rack for uniform plating thickness of the low current portion, and more particularly, to be formed in a three-dimensional shape, such as automobile parts, in the electroplating of a product having a relatively high height, located at a distance from the anode The present invention relates to a rack for uniform plating thickness of the low current portion, which can be plated with a uniform thickness throughout the product by preventing a problem of plating failure caused by low current in the portion.

In general, plating is performed by electrodepositing metal ions such as gold, silver, copper, chromium and nickel on the surface of a product formed of a metal or a non-metal so that a plating layer is formed on the surface of the product, thereby improving the surface state of the product. In addition, the electroplating mainly applied to such plating is a metal to be electrodeposited using a metal product (base material) to be plated as a cathode and a metal to be electrolytically deposited as a positive electrode. It is a method in which metal ions of an electroprecipitated material are electrodeposited on the surface of a metal product by being energized in an electrolyte solution containing ions of.

Meanwhile, as shown in FIG. 1, a rack 100 for supporting the plating target product 1 in the electrolytic solution is used for such electroplating. Such a rack 100 is fixed with a connecting bar 120 in a state in which the vertical cathode bar 110 is disposed on the left and right sides, and the plated product 1 is fixed to the front and rear sides of each cathode bar 110. It is configured by installing the fixture 130. In addition, both cathode bars 110 are formed in a structure in which an upper end is coupled to a busbar (not shown) installed in a plating bath, and the rest of the cathode bar 110 is coated with an insulating resin.

Regarding such electroplating, Korean Laid-Open Patent Publication No. 1999-0068420 "Rack for Plating Apparatus" includes a rectangular frame made of stainless material; In the rack for plating apparatus consisting of a tank coupling portion formed in a hook form on one side of the frame, the frame is composed of a horizontal, vertical coupling member, the horizontal coupling member is composed of two members each long along its length direction It is formed so that it can be mutually adjusted by the gap adjusting screw coupled in this long hole, the vertical coupling member is a contact plate having a predetermined curvature from the upper and lower ends thereof is rotatably coupled through the pins The contact plate can be fixed to each clamp of the one-touch lever mounted at the center of the vertical coupling member by one-touch method, so that the plating time can be shortened by facilitating the joining and disassembly of the plating object and the uniformity of the coating layer after plating. On the other hand, it is possible to plate a large amount of articles at a time, and is almost limited by the specifications of the plating target. It is proposed a technique related to a rack for a plating apparatus.

And, Utility Model Registration No. 20-0406388 "Plating rack assembly" is a rack body having two frame parts spaced at regular intervals, and is fixed to the outer circumferential surface is wrapped in each frame part It is possible to separate the grounding rod, the grounding part which is located in each frame part so that the grounding rods can be energized, and the contacting part is made in two places corresponding to the grounding mounting parts of the printed circuit board, and the printed circuit board can be separated in the ground state in each frame part. Including a fixing portion for fastening, it is proposed a technique for a rack assembly for plating that can prevent the ground failure by fixing the substrate in a ground state by a double contact method.

In addition, Korean Patent Laid-Open Publication No. 10-2009-0022504 "Plating Rack Assembly" is a rack body having two support bars spaced apart from each other, and two support bars formed on the ground to enable a circuit board for manufacturing a thin film circuit board. A grounding portion consisting of grounding pins for supporting in a state, two pivoting arms having a pressing portion corresponding to the grounding portion and fixed by a hinge coupling on the side of the rack body to rotate about an axis, and pressing the grounding portion with the pressing portion Operation lever for turning the pivoting arm while pushing or pulling in one direction to release the pressed state, and the rack main body while being detachably caught in the operation section of the operation lever when pushing or pulling the operation lever. It includes a fixing means for fixing one side of the operation lever to the side or releasing the fixed state to cross the substrate in one-touch operation. It is fixed on or off state, while the fixed proposed a technique relating to a plating rack assembly for loading the loading or unloading.

However, such a rack for electroplating according to the prior art has a problem that a plating failure occurs in plating a product having a three-dimensional shape. That is, as shown in Fig. 2, the depth of the surface to be plated to the parts of the vehicle (as shown in Fig. 2, the anode 200 to which the cathode (-) is connected to the anode 200 is connected to the anode (+) The thickness of the product to be plated therebetween is generally referred to as 'anode bag', and the portion H located at a long distance from the anode 200, that is, the portion close to the cathode bar 110, has a low current. This causes a problem that the thickness of the plating is less than the reference thickness. And, in order to prevent this conventionally, a method of increasing the strength of the current is applied, but in this case, the plating thickness of the high current portion is relatively increased, which causes a problem in that a defect occurs.

Accordingly, the present invention has been proposed to solve the problems of the prior art, and is formed in a three-dimensional shape such as an automobile part, so that the part located at a distance from the anode in electroplating a product having a relatively high height. It is an object of the present invention to provide a rack for uniform plating thickness of the low current portion, which can prevent the plating problem caused by the low current in the plating to ensure that the product to be plated with a uniform thickness as a whole.

In particular, the present invention is to install the anode bar in a position close to the cathode bar on which the product to be plated, the auxiliary anode for additionally supplying positive (+) power to the inside of the product to be plated, the anode ( Rack for uniform plating thickness of low current part that can prevent plating problem caused by low current at the part far away from anode back so that the target product can be plated with uniform thickness as a whole. The purpose is to provide.

According to a feature of the present invention for achieving the above object, the plating target product 1 is supported at a position corresponding to the anode 200 to which the anode (+) is connected, and is charged into a plating bath in which an electrolyte is accommodated. In a rack for performing a plating process for the product to be plated (1), the support 30 for supporting the product to be plated (1) is provided, the cathode connected to the negative (-) power source Bar 20 and; An anode bar (40) insulated from the cathode bar (20) and disposed close to the cathode bar (20) and connected to a positive (+) power source; The anode bar 40 is coupled to the anode bar 40 and extends to the cathode bar 20. The extension bar 50 is disposed inside the product to be plated 1 and the extension bar 50. It has a secondary anode 60 coupled to.

In the rack for uniform plating thickness of the low current portion according to the present invention, one side of the cathode bar 20 and the anode bar 40 is fixed to the cathode bar 20 and the other side of the anode bar 40. It can be coupled by a support bar 22 fixed to.

According to another feature of the present invention for achieving the above object, the plating target product 1 is supported at a position corresponding to the anode 200 to which the anode (+) is connected, and charged into a plating bath in which an electrolyte is accommodated. In the rack for allowing the plating process for the product to be plated 1 to be carried out, the support holes 30 for supporting the product to be plated (1) are installed at regular intervals in the vertical direction at the front and rear sides, respectively. A pair of cathode bars 20 connected to the cathode (-) power source and spaced apart from the left and right sides; An anode bar (40) disposed between the pair of cathode bars (20) and connected to a positive (+) power source; And a support bar 22 for allowing the pair of cathode bars 20 to be insulated while the pair of cathode bars 20 are energized so that the pair of cathode bars 20 and the anode bars 40 are coupled; The anode bar 40 is coupled to the anode bar 40 and extends to the pair of cathode bars 20, respectively, extending to the bar 50 and the plating target product 1 disposed inside the extension bar. And an auxiliary anode 60 coupled to 50.

In the rack for uniform plating thickness of the low current portion according to the present invention, the support bar 22 is formed of a conductor, and interposed between the insulating ring 24 formed of an insulator between the coupling portion with the anode bar 40. It can be coupled to the anode bar 40.

In the rack for uniform plating thickness of the low current portion according to the present invention, the auxiliary anode 60 may be formed of any one insoluble anode metal material selected from the group consisting of platinum, silver, and iridium.

According to the rack for uniform plating thickness of the low current portion according to the present invention, the anode bar 40 is installed at a position close to the cathode bar 20 on which the object to be plated 1 is placed, and the object to be plated 1 Auxiliary anode (60) for additionally supplying positive (+) power is located in the inside of the) so that it is formed in a three-dimensional shape, such as automobile parts, the anode (anode) when electroplating a product having a relatively high height This prevents the problem of plating failure caused by low current in the part located far away from the back) so that the product to be plated is plated with uniform thickness as a whole.

3 is a view for explaining a rack for uniform plating thickness of the low current portion according to the technical idea of the present invention. At this time, Figure 3 (a) is a view showing the basic configuration of the rack 10 for uniform plating thickness of the low current portion from the front, Figure 3 (b) is an auxiliary anode 50 for the product to be plated (1) In order to explain the positional relationship of), it is a side view showing the main configuration. And, Figure 6 is a view for explaining the operation of the rack for uniform thickness of the low current portion according to a preferred embodiment of the present invention.

3 and 6, the rack 10 for uniformizing the low current portion plating thickness according to the present invention includes an anode bar 40 having a cathode bar 20, an extension bar 50, and an auxiliary anode 60. It is made of a three-dimensional shape like the parts of an automobile so that a product with a relatively high height is plated with a uniform thickness throughout the product.

In order to achieve the above effect, the rack 10 for uniformizing the thickness of the low current portion according to the present invention is disposed such that the anode bar 40 is insulated from the cathode bar 20 and close to the cathode bar 20, and the anode (+ ) And the extension bar 50 of the anode bar 40 is coupled to the anode bar 40 and extends to the cathode bar 20, and the auxiliary anode 60 is inside the plating target product 1. Disposed on and coupled to the extension bar 50. That is, the rack 10 for uniform plating thickness of the low current portion according to the present invention, as shown in Figure 6, so as to increase the strength of the current in the region (H) where plating failure occurs due to low current By making the auxiliary anode 60 to be installed, it is possible to obtain the same plating thickness as other parts (parts relatively close to the anode 200). The auxiliary anode 60 is made of an insoluble anode metal having excellent electrical conductivity, such as platinum, silver, and iridium.

At this time, the cathode bar 20 is provided with a support 30 for supporting the product to be plated (1), and is connected to the negative (-) power supply.

Such a rack 10 for uniform plating thickness of the low current portion according to the present invention, as shown in a preferred embodiment of the present invention, will be applicable to a form commonly used in this field, but the technique of the present invention It can be changed in various forms under the idea. For example, in the preferred embodiment of the present invention, the anode bar 40 is arranged between the pair of cathode bars 20 to be integrated by the support bar 22, but the number of cathode bars 20, anode bars ( The number of 40, the coupling form of the cathode bar 20 and the anode bar 40 can be variously modified under the spirit of the present invention according to the needs of the designer or user. And, in the present invention, the term bar used when referring to the cathode bar 20, the support bar 22 and the anode bar 40 is limited to terms limiting the shape of each element according to the present invention. I can't.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, FIGS. 4 to 6, and like reference numerals denote like elements for performing the same functions in FIGS. 3 to 6. On the other hand, in each drawing, the principle and process of electroplating in general, and the basic principle and configuration of the rack that is supported in the electrolytic plating to be loaded in the electrolytic solution when carrying out the electroplating, such as parts of the commonly known to those in the field Are omitted, and the parts related to the present invention are shown.

4 is a perspective view of a rack for uniformizing the low current portion plating thickness according to a preferred embodiment of the present invention, Figure 5 is a partially exploded perspective view for explaining the coupling relationship of the rack for low current portion plating thickness uniformity shown in FIG. 6 is a view for explaining the operation of the rack for uniform thickness of the low current portion according to a preferred embodiment of the present invention.

4 to 6, the rack 10 for uniform plating thickness of the low current portion in accordance with a preferred embodiment of the present invention comprises a pair of cathode bar 20, extension bar 50 and the auxiliary anode 60 It is provided with an anode bar 40 and a support bar 22 to have the plating target product 1 supported at a position corresponding to the anode 200 to which the positive electrode (+) is connected, and into the plating bath in which the electrolyte is accommodated. It is charged so that the plating process for the plating target product 1 proceeds.

More specifically, the pair of cathode bars 20 in the rack 10 for uniform plating thickness of the low current portion according to the preferred embodiment of the present invention support 30 for supporting the plating target product (1) Are installed at regular intervals in the vertical direction at the front and rear sides, and are connected to the negative power supply (-) and spaced apart from the left and right sides. The anode bar 40 is disposed between the pair of cathode bars 20 and is connected to the positive (+) power source. The pair of cathode bars 20 and the anode bars 40 are coupled by a support bar 22 which insulates the anode bars 40 while allowing the pair of cathode bars 20 to be energized. In this case, the extension bar 50 of the anode bar 40 is coupled to the anode bar 40 and extends to the pair of cathode bars 20, respectively, and the auxiliary anode 60 is disposed inside the object to be plated 1. And is coupled to the extension bar 50.

At this time, as shown in Figure 4, the pair of cathode bar 20 and the anode bar 40 is coated with an insulating material except the upper portion. Of course, such a coating process is made in the same way as a conventional electroplating rack, a detailed description thereof will be omitted.

On the other hand, in the rack 20 for uniform plating thickness of the low current portion according to the present embodiment, the support bar 22 is formed of a conductor, the insulating ring 24 formed of an insulator between the coupling portion and the anode bar 40 By being coupled to the anode bar 40 via the, the pair of cathode bar 20 and the anode bar 40 is insulated from each other. In this way, by connecting the pair of cathode bars 20 to the support bars 22 of the conductors, both cathode bars 20 are coupled to a busbar installed in the plating bath to supply power. This is to ensure that the plating conditions are maintained by keeping the power supply of (20) in the same condition.

As shown in FIG. 6, the rack 10 for uniform plating thickness of the low current portion according to the present embodiment may include platinum, to increase the strength of the current in the region H where plating failure occurs due to low current. Since the auxiliary anode 60 formed of a metal material having excellent electrical conductivity, such as silver and iridium, is provided, it is possible to obtain a plating thickness like the other part (part relatively close to the anode 200).

As described above, the rack for uniformizing the thickness of the low current portion according to the preferred embodiment of the present invention is shown in accordance with the above description and drawings, but this is only an example and is not limited to the scope of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope.

1 is a perspective view for explaining a rack used in the conventional electroplating;

2 is a view for explaining the problems of the prior art;

3 is a view for explaining a rack for uniform plating thickness of the low current portion according to the spirit of the present invention;

4 is a perspective view of a rack for uniformizing the low current portion plating thickness according to a preferred embodiment of the present invention;

FIG. 5 is a partially exploded perspective view illustrating a coupling relationship of a rack for uniform plating thickness of the low current portion shown in FIG. 4; FIG.

6 is a view for explaining the operation of the rack for uniform plating thickness of the low current portion according to an embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

1: Target product for plating

10: Rack for uniform plating thickness of low current part

20: cathode bar

22: support bar

24: insulation ring

30: support

40: anode bar

50: extension bar

60: secondary anode

200: anode

Claims

The plating target product 1 is supported at a position corresponding to the anode 200 to which the anode is connected, and the plating target is charged into the plating vessel in which the electrolyte is accommodated so that the plating process for the plating target product 1 proceeds. In the rack to

A cathode bar 20 for supporting the plating target product 1, and connected to a cathode (-) power source;

An anode bar (40) insulated from the cathode bar (20) and disposed close to the cathode bar (20) and connected to a positive (+) power source;

The anode bar 40 is coupled to the anode bar 40, the extension bar 50 extending to the cathode bar 20,

And a secondary anode (60) disposed inside the plating target product (1) and coupled to the extension bar (50).

The method of claim 1,

The cathode bar 20 and the anode bar 40 are one side is fixed to the cathode bar 20, the other side is coupled by a support bar 22 is fixed to the anode bar 40 Rack for uniform plating thickness of low current part.

A pair of cathode bars installed at regular intervals in the vertical direction on the front and rear sides, respectively, for supporting the plating target product 1 and connected to the negative (-) power source and spaced apart from the left and right sides ( 20);

An anode bar (40) disposed between the pair of cathode bars (20) and connected to a positive (+) power source;

And a support bar 22 for allowing the pair of cathode bars 20 to be insulated while the pair of cathode bars 20 are energized so that the pair of cathode bars 20 and the anode bars 40 are coupled;

The anode bar 40 is coupled to the anode bar 40, the extension bar 50 which extends to the pair of cathode bars 20, respectively,

The method of claim 3, wherein

The support bar 22 is formed of a conductor and is coupled to the anode bar 40 via an insulating ring 24 formed of an insulator between the coupling part with the anode bar 40. Rack for equalizing sub plating thickness.

The method according to any one of claims 1 to 4,

The auxiliary anode (60) is a rack for uniform thickness of the low current portion, characterized in that formed of any one of the insoluble anode metal material selected from the group consisting of platinum, silver, and iridium.