CN102605397A - Electroplating system and electroplating method - Google Patents
Electroplating system and electroplating method Download PDFInfo
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- CN102605397A CN102605397A CN2011100245202A CN201110024520A CN102605397A CN 102605397 A CN102605397 A CN 102605397A CN 2011100245202 A CN2011100245202 A CN 2011100245202A CN 201110024520 A CN201110024520 A CN 201110024520A CN 102605397 A CN102605397 A CN 102605397A
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- marginarium
- circuit card
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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Abstract
The invention discloses an electroplating system which comprises an electroplating bath, a power supply device, an anode bar, an electroplating anode, a cathode bar, a hanging rack, an auxiliary cathode bar and an auxiliary cathode shield, wherein the anode bar, the cathode bar and the auxiliary cathode bar are connected to the power supply device; the electroplating anode is fixed on the anode bar; the hanging rack is fixed on the cathode bar, and provided with a plurality of conductive pinch points for fixing a circuit board; the auxiliary cathode shield is fixed on the auxiliary cathode bar, opposite to the hanging rack, and arranged between the hanging rack and the electroplating anode; the auxiliary cathode shield comprises a shield body which is dead against the circuit board; the shield body comprises a peripheral area and a central area; the plurality of conductive pinch points are opposite to the peripheral area; the peripheral area is provided with a first through hole, and the central area is provided with a second through hole; and the first and second through holes are used for controlling the density distribution of metal ions precipitated from the electroplating anode after passing through the auxiliary cathode shield. The invention also provides an electroplating method using the electroplating system above.
Description
Technical field
The present invention relates to electroplating technology, particularly a kind of electroplating system and electro-plating method.
Background technology
Along with the develop rapidly of electronic industry, seem more and more important as the manufacturing technology of the circuit card of electronic product basic building block.Circuit card generally by copper-clad base plate through cut, hole, electroplate, make public, series of process such as development, etching, pressing, printing, moulding is made.Specifically can consult people such as C.H.Steer at Proceedings of the IEEE, " Dielectric characterization of printed circuit board substrates " literary composition that Vol.39, No.2 delivered in (in August, 2002).
Wherein, plating is an important manufacture craft of circuit board making, and it mainly uses electroplating system that circuit board surface is carried out selectivity copper facing and in the copper facing of through hole hole wall.The existing plating system comprises plating tank, electric supply installation, anode rod, galvanic anode, cathode rod and a hanger.Be mounted with electroplate liquid in the etching bath, be used for circuit card is electroplated.The positive and negative electrode of electric supply installation is electrically connected with anode rod and cathode rod respectively.Galvanic anode is connected in anode rod, and hanger is connected in cathode rod.Galvanic anode and hanger all be arranged in the plating tank and the electroplate liquid of immersion plating groove in.Galvanic anode respectively with hanger relatively.Hanger is used to hang the fixedly circuit card of electroplated, thereby makes the surface of circuit card relative with this galvanic anode.After the electric supply installation energising, the metals ion that galvanic anode is separated out is plated on this circuit card in the effect deposit of electric current, and at this moment, this circuit card is equivalent to negative electrode.Yet, import because the electric current of circuit card is a conductive clip point through hanger, so cause circuit card to be plated higher near two fringe region current densities of conductive clip point, and lower away from the current density of the central zone of the circuit card of conductive clip point.And; Because the deposition of metals ion is directly proportional with current density, thereby two sedimentary metals of fringe region that circuit card is connected with conductive clip point are thicker, and the sedimentary metal in the central zone of circuit card is thinner; Cause the uneven thickness of metal deposition, influence galvanized quality.
Therefore,, be necessary to provide a kind of metal deposition thickness evenness that improves circuit card when electroplating, thereby promote the electroplating system and the electro-plating method of electroplating quality to the problems referred to above.
Summary of the invention
To a kind of electroplating system and electro-plating method be described with specific embodiment below.
A kind of electroplating system is used at least one circuit card is electroplated.This electroplating system comprises plating tank, electric supply installation, anode rod, galvanic anode, cathode rod, hanger, an auxiliary cathode bar and an auxiliary cathode cover.This plating tank is mounted with electroplate liquid.This electric supply installation has positive pole and negative pole.This anode rod is connected in this positive pole, and this cathode rod is connected in this negative pole.This galvanic anode and hanger all be arranged in this plating tank and immersion plating liquid in.This galvanic anode is fixed on this anode rod, and this galvanic anode is used for the supply circuit plate and electroplates required metals ion.This hanger is fixed on this cathode rod and relative with this galvanic anode, and this hanger has a plurality of conductive clip points.These a plurality of conductive clip points are used to grip this at least one circuit card and give this at least one circuit card power supply to electroplate.This auxiliary cathode bar is connected in this negative pole.This auxiliary cathode cover is fixed on this auxiliary cathode bar.This auxiliary cathode cover and this hanger are relatively and between this hanger and this galvanic anode.This auxiliary cathode cover comprises at least one cover body, this at least one cover body and this at least one circuit card over against.This at least one cover body comprises first marginarium, second marginarium and central section, and this central location is between first marginarium and second marginarium.A plurality of conductive clip points of this hanger are relative with second marginarium with this first marginarium.First marginarium of this at least one cover body and second marginarium all offer a plurality of first through holes.The bore of these a plurality of first through holes is along with increasing with reducing of central section distance.The central section of this at least one cover body offers one second through hole, and the bore of this second through hole is greater than the bore of arbitrary first through hole.
A kind of electro-plating method comprises step: at least one circuit card and aforesaid electroplating system are provided, and this at least one circuit card has the first surface of electroplated; Utilize a plurality of conductive clips this at least one circuit card of naming a person for a particular job to grip to the electroplate liquid of hanger and immersion plating groove, make first surface relative with this auxiliary cathode cover; And electric supply installation is given galvanic anode, hanger and the power supply of auxiliary cathode cover; So that galvanic anode precipitating metal ion, a plurality of first through holes and one second through hole and reduce deposition that the metals ion that galvanic anode is separated out passes the auxiliary cathode cover at first surface so that this at least one circuit card is electroplated.
A kind of electroplating system is used at least one circuit card is electroplated.This electroplating system comprises plating tank, electric supply installation, anode rod, galvanic anode, cathode rod, hanger, two auxiliary cathode bars and two auxiliary cathode covers.This plating tank is mounted with electroplate liquid.This electric supply installation has positive pole and negative pole.This anode rod is connected in this positive pole, and this cathode rod is connected in this negative pole.This galvanic anode and hanger all be arranged in this plating tank and immersion plating liquid in.This galvanic anode is fixed on this anode rod, and this galvanic anode is used for the supply circuit plate and electroplates required metals ion.This hanger is fixed on this cathode rod and relative with this galvanic anode.This hanger has a plurality of conductive clip points, and these a plurality of conductive clip points are used to grip this at least one circuit card and give this at least one circuit card power supply to electroplate.These two auxiliary cathode bars are connected to this negative pole.These two auxiliary cathode covers are separately fixed at this two auxiliary cathode bars.The number of this galvanic anode is two, and these two galvanic anodes are separately positioned on the relative both sides of this hanger.These two auxiliary cathode covers are separately positioned on the relative both sides of this hanger, and each auxiliary cathode cover is between this hanger and galvanic anode.Each auxiliary cathode cover comprises at least one cover body, this at least one cover body and this at least one circuit card over against.This at least one cover body comprises first marginarium, second marginarium and central section, and this central location is between first marginarium and second marginarium.A plurality of conductive clip points of this hanger are relative with second marginarium with this first marginarium.First marginarium of this at least one cover body and second marginarium all offer a plurality of first through holes.The bore of these a plurality of first through holes is along with increasing with reducing of central section distance.The central section of this at least one cover body offers one second through hole, and the bore of this second through hole is greater than the bore of arbitrary first through hole.
A kind of electro-plating method comprises step: at least one circuit card and aforesaid electroplating system are provided, and this at least one circuit card has the first surface and the second surface of electroplated; Utilize a plurality of conductive clips this at least one circuit card of naming a person for a particular job to grip to the electroplate liquid of hanger and immersion plating groove, make first surface and second surface relative with these two auxiliary cathode covers respectively; And electric supply installation is given two galvanic anodes, hanger and two auxiliary cathode cover power supplies; So that these two galvanic anode precipitating metal ions, a plurality of first through holes and one second through hole and the reduce deposition that the metals ion that galvanic anode is separated out passes these two auxiliary cathode covers at first surface and second surface so that this at least one circuit card is electroplated.
A kind of electroplating system is used at least one circuit card is electroplated.This electroplating system comprises plating tank, electric supply installation, anode rod, galvanic anode, cathode rod, hanger, auxiliary cathode bar and auxiliary cathode cover.This plating tank is mounted with electroplate liquid.This electric supply installation has positive pole and negative pole.This anode rod is connected in this positive pole, and this cathode rod is connected in this negative pole.This galvanic anode and hanger all be arranged in this plating tank and immersion plating liquid in.This galvanic anode is fixed on this anode rod, and this galvanic anode is used for the supply circuit plate and electroplates required metals ion.This hanger is fixed on this cathode rod and relative with this galvanic anode.This hanger has a plurality of conductive clip points.These a plurality of conductive clip points are used to grip this at least one circuit card and give this at least one circuit card power supply to electroplate.This auxiliary cathode bar is connected in this negative pole, and this auxiliary cathode cover is fixed on this auxiliary cathode bar.This auxiliary cathode cover is between this hanger and this galvanic anode.This auxiliary cathode cover comprises at least one cover body, this at least one cover body and this at least one circuit card over against.This at least one cover body comprises surrounding zone and central section, and a plurality of conductive clip points of this surrounding zone and this hanger are relative.The surrounding zone of this at least one cover body offers a plurality of first through holes, and the bore of these a plurality of first through holes is along with reducing with the increase of central section distance.A plurality of second through holes are offered in this central section, and the ratio that the totalling of the cross-sectional area of these a plurality of second through holes accounts for the cross-sectional area of this central section accounts for the ratio of the cross-sectional area of this surrounding zone greater than the totalling of the cross-sectional area of a plurality of first through holes.
With respect to prior art; The electroplating system of present technique scheme and electro-plating method; The quantity that the metals ion of first through hole and second through hole is passed in its auxiliary cathode cover control capable of using; Make metals ion comparatively even, improve the homogeneity that is deposited on the metal layer thickness on the circuit card, thereby promote the electroplating quality of circuit card through the density distribution behind this auxiliary cathode cover.
Description of drawings
Fig. 1 is the synoptic diagram of the electroplating system that provides of present technique scheme first embodiment.
Fig. 2 is the synoptic diagram of the hanger of the electroplating system that provides of present technique scheme first embodiment.
Fig. 3 is the synoptic diagram of the auxiliary cathode cover of the electroplating system that provides of present technique scheme first embodiment.
Fig. 4 is the sectional view of the auxiliary cathode cover of Fig. 3 along the IV-IV direction.
Fig. 5 is the synoptic diagram of the auxiliary cathode cover of the electroplating system that provides of present technique scheme second embodiment.
Fig. 6 is the synoptic diagram of the auxiliary cathode cover of the electroplating system that provides of present technique scheme the 3rd embodiment.
Fig. 7 is the synoptic diagram of the auxiliary cathode cover of the electroplating system that provides of present technique scheme the 4th embodiment.
Fig. 8 is the schema of the electro-plating method that provides of present technique scheme first embodiment.
Fig. 9 is the schema of the electro-plating method that provides of present technique scheme second embodiment.
The main element nomenclature
Galvanic anode 14
Diapire 111
The first side wall 112
Anodal 121
Montant 161
Hook 163
Cover body 182,282,382,482
The 3rd marginarium 1823,2823,4823
The 4th marginarium 1834,2824
First through hole 102,402
Second through hole 103,403
Embodiment
To combine accompanying drawing and embodiment that the electroplating system and the electro-plating method of present technique scheme are done further explain below.
See also Fig. 1 to Fig. 2, present technique scheme first embodiment provides a kind of electroplating system 10, is used at least one circuit card 20 is electroplated.This electroplating system 10 comprises plating tank 11, electric supply installation 12, anode rod 13, galvanic anode 14, cathode rod 15, hanger 16, auxiliary cathode bar 17 and auxiliary cathode cover 18.This galvanic anode 14, hanger 16 and auxiliary cathode cover 18 all are arranged in the plating tank 11.This auxiliary cathode cover 18 is between this galvanic anode 14 and this hanger 16.
Particularly, this plating tank 11 has diapire 111, the first side wall 112 and second sidewall 113.This first side wall 112 and second sidewall 113 are vertically connected at this diapire 111 respectively.This first side wall 112 is parallel relative with second sidewall 113.This plating tank 11 is mounted with electroplate liquid 101.
This electric supply installation 12 has positive pole 121 and negative pole 122.This electric supply installation 12 is used to provide circuit card 20 to electroplate required direct current.
This anode rod 13 is connected in the positive pole 121 of this electric supply installation 12.This cathode rod 15 and this auxiliary cathode bar 17 all are connected in the negative pole 122 of this electric supply installation 12.
This galvanic anode 14 is fixed on this anode rod 13, thereby electric supply installation 12 can give galvanic anode 14 power supplies through anode rod 13.In the electroplate liquid 101 of these galvanic anode 14 immersion plating grooves 11.This galvanic anode 14 is used for supply circuit plate 20 and electroplates required metals ion, for example cupric ion.In the present embodiment, the number of galvanic anode 14 is two, and these two galvanic anodes 14 the first side wall 112 with plating tank 11 respectively are parallel relative with second sidewall 113.It is understandable that in the time only need electroplating a surface of circuit card 20, the number of this galvanic anode 14 also can be one, this galvanic anode 14 is relative with the first side wall 112 of plating tank 11.
This hanger 16 is fixed on this cathode rod 15 and relative with this galvanic anode 14, and this electric supply installation 12 can give hanger 16 power supplies through cathode rod 15.This hanger 16 is between second sidewall 113 of this galvanic anode 14 and this plating tank 11.This hanger 16 immerses in the electroplate liquid 101 of this plating tank 11.In the present embodiment, these two galvanic anodes 14 are separately positioned on the relative both sides of this hanger 16.
This hanger 16 comprises two montants 161, two cross bars 162, hook 163 and a plurality of conductive clip points 164.These two montants 161 are parallel to each other; These two cross bars 162 are parallel to each other and are movably connected in the two ends of these two montants 161 respectively; So that the spacing of these two montants 161 can regulate through these two cross bars 162, thereby clamping has the circuit card 20 of different size.This hook 163 can be connected this montant 161 or cross bar 162.In the present embodiment, the number of hook 163 is two, and these two hooks 163 are fixedly connected on this two montants 161 respectively.These a plurality of conductive clip points 164 are arranged on these two montants 161.These a plurality of conductive clip points 164 are used to grip this at least one circuit card 20 and give these at least one circuit card 20 power supplies to electroplate.
This auxiliary cathode cover 18 is fixed on this auxiliary cathode bar 17.This auxiliary cathode cover 18 and this hanger 16 is relatively and between this hanger 16 and this galvanic anode 14.The number of this auxiliary cathode bar 17, this auxiliary cathode cover 18 all can be one or two.In the present embodiment, the number of this auxiliary cathode bar 17, this auxiliary cathode cover 18 is two, and these two auxiliary cathode covers 18 are separately fixed at this two auxiliary cathode bars 17.These two auxiliary cathode covers 18 are separately positioned on the relative both sides of this hanger 16, and each auxiliary cathode cover 18 is between this hanger 16 and galvanic anode 14.
Please consult Fig. 3 and Fig. 4 in the lump, each auxiliary cathode cover 18 comprises at least one cover body 182.This at least one cover body 182 and this at least one circuit card 20 over against.The shape of this cover body 182 is corresponding with the shape of circuit card 20, and this at least one cover body 182 comprises first marginarium 1821, second marginarium 1822 and central section 1825.This central section 1825 is between first marginarium 1821 and second marginarium 1822.Two montants 161 of this hanger 16 are relative with this first marginarium 1821, second marginarium 1822 respectively, that is to say, a plurality of conductive clip points 164 of this hanger 16 are relative with this first marginarium 1821, second marginarium 1822 respectively.In the present embodiment, this cover body 182 be shaped as rectangle.
First marginarium 1821 of this at least one cover body 182 and second marginarium 1822 all offer a plurality of first through holes 102.The bore of these a plurality of first through holes 102 is along with increasing with central section 1825 reducing of distance, and the bore that promptly is positioned at first marginarium 1821 and second marginarium, 1822 intermediary, first through hole 102 is maximum.And the central section 1825 of this at least one cover body 182 offers one second through hole 103.In the present embodiment, this second through hole 103 is positioned at the center of central section 1825.The bore of this second through hole 103 is greater than the bore of arbitrary first through hole 102.The shape of this first through hole 102 and second through hole 103 all can be circle, ellipse, square, rectangle, Polygons or other are irregularly shaped.
In the present embodiment, the shape of this first through hole 102 and second through hole 103 is circle.A kind of set-up mode of the diameter of this first through hole 102 is following: establishing this cover body 182 is directions X in the direction perpendicular to the montant 161 of hanger 16, is the Y direction in the direction that is parallel to montant 161.This cover body 182 is X in the length of directions X
0, be Y in the length of Y direction
0This cover body 182 is divided into five equal portions in the length of directions X, every part length X
1Be X
0/ 5.This cover body 182 offers nine row, first through hole 102 that is parallel to directions X.First through hole 102 of each row has nine.The diameter that is positioned at first marginarium 1821 and second marginarium, 1822 outermost two first through holes 102 in these nine first through holes 102 is A1; From this diameter is that the diameter of inside three couples, first through hole 102 of two first through holes 102 of A1 is followed successively by A2, A3 and A4; The aperture of one first through hole 102 of intermediary is A5, and A1=0.2X
1, A2=1.2A1, A3=1.2A2, A4=1.2A3, A5=1.2A4.
Further, this cover body 182 also comprises the 3rd relative marginarium 1823 and the 4th marginarium 1824.This first marginarium 1821, the 3rd marginarium 1823, second marginarium 1822 are connected with the 4th marginarium 1824 successively, and around this central section 1825.The material of this first marginarium 1821, second marginarium 1822, the 3rd marginarium 1823 and the 4th marginarium 1824 is a metal, and the material of this central section 1825 is nonmetal.This central section 1825 be shaped as circle.This circular central section 1825 gradually changes with the distance of circuit card 20, and the distance of the circumference of central section 1825 and circuit card 20 is less than the center of circle of central section 1825 and the distance of circuit card 20.
Preferably, this auxiliary cathode cover 18 is a rectangle, and the edge of this auxiliary cathode cover 18 extends to form a kink 184 to the direction near circuit card 20 respectively.The development length of this kink 184 is 10 millimeters to 20 millimeters.This kink 184 is 2 millimeters to 5 millimeters with the distance of the circuit card 20 of electroplated.In the present embodiment, the development length of this kink 184 is 15 millimeters.This kink 184 is 5 millimeters with the distance of the circuit card 20 of electroplated.
It is understandable that in other embodiments, this auxiliary cathode cover can also be designed to other structures.Specific as follows:
In a second embodiment, see also Fig. 5, auxiliary cathode cover 28 comprises at least one cover body 282.The difference of the cover body 182 among this cover body 282 and first embodiment is; This cover body 282 gradually changes with the distance of circuit card, and the distance of first marginarium 2821, second marginarium 2822, the 3rd marginarium 2823 and the 4th marginarium 2824 and circuit card is less than the distance of central section 2825 with circuit card.
In the 3rd embodiment, see also Fig. 6, auxiliary cathode cover 38 comprises at least one cover body 382.The difference of the cover body 182 among this cover body 382 and first embodiment is, this cover body 382 gradually changes with the distance of circuit card, and the distance of first marginarium 3821, second marginarium 3822 and circuit card is less than the distance of central section 3825 with circuit card.
In the 4th embodiment, see also Fig. 7, auxiliary cathode cover 48 comprises at least one cover body 482.The difference of the cover body 182 among this cover body 482 and first embodiment is that this cover body 482 comprises surrounding zone 4821 and central section 4825.This surrounding zone 4821 is relative with a plurality of conductive clip points of hanger.The surrounding zone 4821 of this cover body 482 offers a plurality of first through holes 402.The bore of these a plurality of first through holes 402 is along with reducing with the increase of central section 4825 distances.The central section 4825 of this cover body 482 is a tabular.A plurality of second through holes 403 are offered in this central section 4825.The ratio that the totalling of the cross-sectional area of these a plurality of second through holes 403 accounts for the cross-sectional area of this central section 4825 accounts for the ratio of the cross-sectional area of this surrounding zone 4821 greater than the totalling of the cross-sectional area of a plurality of first through holes 402.
Please further consult Fig. 8, present technique scheme implementation example also provides a kind of 10 pairs of circuit cards of above-mentioned electroplating system 20 that utilize to carry out galvanized electro-plating method, and when this circuit card 20 only need be electroplated one of them surface, this electro-plating method may further comprise the steps:
Step 110 provides at least one circuit card 20 and aforesaid electroplating system 10, and this at least one circuit card 20 has the first surface 21 of electroplated.
Particularly, each circuit card 20 has opposite first 21 and second surface 22.Wherein, this first surface 21 is the surface of electroplated.At this moment, this electroplating system 10 can only comprise that a galvanic anode 14, an auxiliary cathode bar 17 and an auxiliary cathode cover 18 get final product.
Step 120 is utilized a plurality of conductive clips to select 164 this at least one circuit card 20 is gripped to the electroplate liquid 101 of hanger 16 and immersion plating groove 11, makes first surface 21 relative with this auxiliary cathode cover 18.
Particularly, can earlier this at least one circuit card 20 be gripped to hanger 16 through conductive clip point 164; Then, auxiliary cathode cover 18 is fixed on the auxiliary cathode bar 17, this auxiliary cathode cover 18 is relative with the first surface 21 of this at least one circuit card 20; Then, in the electroplate liquid 101 with this hanger 16, at least one circuit card 20 and auxiliary cathode cover 18 immersion plating grooves 11.At this moment, this auxiliary cathode cover 18 is relative with galvanic anode 14, and this auxiliary cathode cover 18 is between this galvanic anode 14 and this hanger 16.
Step 130; Electric supply installation 12 is given galvanic anode 14, hanger 16 and 18 power supplies of auxiliary cathode cover; So that galvanic anode 14 precipitating metal ions, a plurality of first through holes 102 and one second through hole 103 and reduce deposition that the metals ion that galvanic anode 14 is separated out passes auxiliary cathode cover 18 at first surface 21 so that this at least one circuit card 20 is electroplated.
Particularly, the positive pole 121 of electric supply installation 12 feeds positive electricity for galvanic anode 14, and negative pole 122 feeds negative electricity for hanger 16 and auxiliary cathode cover 18.Galvanic anode 14 is immersed in the electroplate liquid 101 and the precipitating metal ion, and metals ion moves to auxiliary cathode cover 18 and hanger 16 directions from galvanic anode 14 under the effect of electric current.Metals ion passes first through hole 102 and second through hole 103 of auxiliary cathode cover 18 with electroplate liquid 101, and the first surface 21 that is deposited on circuit card 20 then forms electrolytic coatings.
After electroplating completion, just can this at least one circuit card 20 be taken out from plating tank 11.Particularly, hanger 16 and at least one circuit card 20 of being fixed on the hanger 16 are taken out from plating tank 11, then, this at least one circuit card 20 is taken off from this hanger 16 again, this circuit card 20 is just accomplished plating.After electroplating completion, circuit card 20 gets into following one production process and proceeds to make.
Please further consult Fig. 9; Present technique scheme implementation example also provides second kind to utilize 10 pairs of circuit cards of above-mentioned electroplating system 20 to carry out galvanized electro-plating method; When these circuit card 20 two relative surfaces all need be electroplated, this electro-plating method may further comprise the steps:
Step 210 provides at least one circuit card 20 and aforesaid electroplating system 10, and this at least one circuit card 20 has the first surface 21 and second surface 22 of electroplated.
Particularly, each circuit card 20 has opposite first 21 and second surface 22.Wherein, this first surface 21 and second surface 22 are the surface of electroplated.At this moment, this electroplating system 10 comprises two galvanic anodes 14, two auxiliary cathode bars 17 and two auxiliary cathode covers 18.
Step 220 is utilized a plurality of conductive clips to select 164 this at least one circuit card 20 is gripped to the electroplate liquid 101 of hanger 16 and immersion plating groove 11, makes first surface 21 relative with these two auxiliary cathode covers 18 respectively with second surface 22.
Particularly, can earlier this at least one circuit card 20 be gripped to hanger 16 through conductive clip point 164; Then, these two auxiliary cathode covers 18 are separately fixed on these two auxiliary cathode bars 17, these two auxiliary cathode covers 18 first surface 21 with this at least one circuit card 20 respectively are relative with second surface 22; Then, in the electroplate liquid 101 with this hanger 16, at least one circuit card 20 and two auxiliary cathode cover 18 immersion plating grooves 11.At this moment, these two auxiliary cathode covers 18 are relative with these two galvanic anodes 14 respectively, and this each auxiliary cathode cover 18 is between a galvanic anode 14 and this hanger 16.
Particularly, the positive pole 121 of electric supply installation 12 feeds positive electricity for these two galvanic anodes 14, and negative pole 122 feeds negative electricity for two auxiliary cathode covers of this hanger 16 and this 18.These two galvanic anodes 14 are immersed in the electroplate liquid 101 and the precipitating metal ion, and metals ion moves to two auxiliary cathode cover 18 directions respectively from two galvanic anodes 14 under the effect of electric current.Metals ion passes first through hole 102 and second through hole 103 of two auxiliary cathode covers 18 with electroplate liquid 101, and the first surface 21 that is deposited on circuit card 20 then respectively forms electrolytic coatings with second surface 22.
After electroplating completion, at least one circuit card 20 after electroplating is taken out from plating tank 11.Particularly, hanger 16 and at least one circuit card 20 of being fixed on the hanger 16 are taken out from plating tank 11, then, this at least one circuit card 20 is taken off from this hanger 16 again, this circuit card 20 is just accomplished plating.After electroplating completion, circuit card 20 gets into following one production process and proceeds to make.
With respect to prior art; The electroplating system of present technique scheme and electro-plating method; The quantity that the metals ion of these a plurality of first through holes and one second through hole is passed in its auxiliary cathode cover control capable of using; Make metals ion comparatively even, improve the homogeneity that is deposited on the metal layer thickness on the circuit card, thereby promote the electroplating quality of circuit card through the density distribution behind this auxiliary cathode cover.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these change the protection domain that all should belong to present technique scheme claim with distortion according to the technical conceive of present technique scheme.
Claims (15)
1. an electroplating system is used at least one circuit card is electroplated, and this electroplating system comprises plating tank, electric supply installation, anode rod, galvanic anode, cathode rod and hanger; This plating tank is mounted with electroplate liquid, and this electric supply installation has positive pole and negative pole, and this anode rod is connected in this positive pole; This cathode rod is connected in this negative pole, and this galvanic anode and hanger all are arranged in this plating tank and in the immersion plating liquid, this galvanic anode is fixed on this anode rod; This galvanic anode is used for the supply circuit plate and electroplates required metals ion; This hanger is fixed on this cathode rod and relative with this galvanic anode, and this hanger has a plurality of conductive clip points, and these a plurality of conductive clip points are used to grip this at least one circuit card and give this at least one circuit card power supply to electroplate; It is characterized in that; This electroplating system also comprises an auxiliary cathode bar and an auxiliary cathode cover, and this auxiliary cathode bar is connected in this negative pole, and this auxiliary cathode cover is fixed on this auxiliary cathode bar; This auxiliary cathode cover and this hanger are relatively and between this hanger and this galvanic anode; This auxiliary cathode cover comprises at least one cover body, this at least one cover body and this at least one circuit card over against, this at least one cover body comprises first marginarium, second marginarium and central section; This central location is between first marginarium and second marginarium; A plurality of conductive clip points of this hanger are relative with second marginarium with this first marginarium, and first marginarium of this at least one cover body and second marginarium all offer a plurality of first through holes, and the bore of these a plurality of first through holes is along with increasing with reducing of central section distance; The central section of this at least one cover body offers one second through hole, and the bore of this second through hole is greater than the bore of arbitrary first through hole.
2. electroplating system as claimed in claim 1; It is characterized in that; This at least one cover body also comprises the 3rd relative marginarium and the 4th marginarium, and this first marginarium, the 3rd marginarium, second marginarium and the 4th marginarium are connected successively, and all around this central section; The material of this first marginarium, second marginarium, the 3rd marginarium and the 4th marginarium is a metal, and the material of this central section is nonmetal.
3. electroplating system as claimed in claim 2 is characterized in that, this central section be shaped as circle, the distance of this central section and circuit card gradually changes, and the distance of the circumference of central section and circuit card is less than the center of circle of central section and the distance of circuit card.
4. electroplating system as claimed in claim 2 is characterized in that the distance of this cover body and circuit card gradually changes, and the distance of this first marginarium, second marginarium, the 3rd marginarium and the 4th marginarium and circuit card is less than the distance of central section and circuit card.
5. electroplating system as claimed in claim 1 is characterized in that the distance of this cover body and circuit card gradually changes, and the distance of this first marginarium and second marginarium and circuit card is less than the distance of central section and circuit card.
6. electroplating system as claimed in claim 1 is characterized in that, this auxiliary cathode cover is a rectangle, and the edge of this auxiliary cathode cover extends to form a kink to the direction near circuit card respectively.
7. electroplating system as claimed in claim 6 is characterized in that, the development length of this kink is 10 millimeters to 20 millimeters, and the spacing of the circuit card of this kink and electroplated is 2 millimeters to 5 millimeters.
8. electro-plating method comprises step:
At least one circuit card and electroplating system as claimed in claim 1 are provided, and this at least one circuit card has the first surface of electroplated;
Utilize a plurality of conductive clips this at least one circuit card of naming a person for a particular job to grip to the electroplate liquid of hanger and immersion plating groove, make first surface relative with this auxiliary cathode cover; And
Electric supply installation is given galvanic anode, hanger and the power supply of auxiliary cathode cover; So that galvanic anode precipitating metal ion, a plurality of first through holes and one second through hole and reduce deposition that the metals ion that galvanic anode is separated out passes the auxiliary cathode cover at first surface so that this at least one circuit card is electroplated.
9. an electroplating system is used at least one circuit card is electroplated, and this electroplating system comprises plating tank, electric supply installation, anode rod, galvanic anode, cathode rod and hanger; This plating tank is mounted with electroplate liquid, and this electric supply installation has positive pole and negative pole, and this anode rod is connected in this positive pole; This cathode rod is connected in this negative pole, and this galvanic anode and hanger all are arranged in this plating tank and in the immersion plating liquid, this galvanic anode is fixed on this anode rod; This galvanic anode is used for the supply circuit plate and electroplates required metals ion, and this hanger is fixed on this cathode rod and relative with this galvanic anode, and this hanger has a plurality of conductive clip points; These a plurality of conductive clip points are used to grip this at least one circuit card and give this at least one circuit card power supply to electroplate; It is characterized in that this electroplating system also comprises two auxiliary cathode bars and two auxiliary cathode covers, these two auxiliary cathode bars are connected to this negative pole; These two auxiliary cathode covers are separately fixed at this two auxiliary cathode bars; The number of this galvanic anode is two, and these two galvanic anodes are separately positioned on the relative both sides of this hanger, and these two auxiliary cathode covers are separately positioned on the relative both sides of this hanger; And each auxiliary cathode cover is between this hanger and galvanic anode; Each auxiliary cathode cover comprises at least one cover body, this at least one cover body and this at least one circuit card over against, this at least one cover body comprises first marginarium, second marginarium and central section; This central location is between first marginarium and second marginarium; A plurality of conductive clip points of this hanger are relative with second marginarium with this first marginarium, and first marginarium of this at least one cover body and second marginarium all offer a plurality of first through holes, and the bore of these a plurality of first through holes is along with increasing with reducing of central section distance; The central section of this at least one cover body offers one second through hole, and the bore of this second through hole is greater than the bore of arbitrary first through hole.
10. electroplating system as claimed in claim 9; It is characterized in that; This at least one cover body also comprises the 3rd relative marginarium and the 4th marginarium, and this first marginarium, the 3rd marginarium, second marginarium and the 4th marginarium are connected successively, and all around this central section; The material of this first marginarium, second marginarium, the 3rd marginarium and the 4th marginarium is a metal, and the material of this central section is nonmetal.
11. electroplating system as claimed in claim 10 is characterized in that, this central section be shaped as circle, the distance of this central section and circuit card gradually changes, and the distance of the circumference of central section and circuit card is less than the center of circle of central section and the distance of circuit card.
12. electroplating system as claimed in claim 9 is characterized in that, this auxiliary cathode cover is a rectangle, and the edge of this auxiliary cathode cover extends to form a kink to the direction near circuit card respectively.
13. electroplating system as claimed in claim 12 is characterized in that, the development length of this kink is 10 millimeters to 20 millimeters, and the spacing of the circuit card of this kink and electroplated is 2 millimeters to 5 millimeters.
14. an electro-plating method comprises step:
At least one circuit card and electroplating system as claimed in claim 9 are provided, and this at least one circuit card has the first surface and the second surface of electroplated;
Utilize a plurality of conductive clips this at least one circuit card of naming a person for a particular job to grip to the electroplate liquid of hanger and immersion plating groove, make first surface and second surface relative with these two auxiliary cathode covers respectively; And
Electric supply installation is given two galvanic anodes, hanger and two auxiliary cathode cover power supplies; So that these two galvanic anode precipitating metal ions, a plurality of first through holes and one second through hole and the reduce deposition that the metals ion that galvanic anode is separated out passes these two auxiliary cathode covers at first surface and second surface so that this at least one circuit card is electroplated.
15. an electroplating system is used at least one circuit card is electroplated, this electroplating system comprises plating tank, electric supply installation, anode rod, galvanic anode, cathode rod and hanger; This plating tank is mounted with electroplate liquid, and this electric supply installation has positive pole and negative pole, and this anode rod is connected in this positive pole; This cathode rod is connected in this negative pole, and this galvanic anode and hanger all are arranged in this plating tank and in the immersion plating liquid, this galvanic anode is fixed on this anode rod; This galvanic anode is used for the supply circuit plate and electroplates required metals ion, and this hanger is fixed on this cathode rod and relative with this galvanic anode, and this hanger has a plurality of conductive clip points; These a plurality of conductive clip points are used to grip this at least one circuit card and give this at least one circuit card power supply to electroplate; It is characterized in that this electroplating system also comprises auxiliary cathode bar and auxiliary cathode cover, this auxiliary cathode bar is connected in this negative pole; This auxiliary cathode cover is fixed on this auxiliary cathode bar; This auxiliary cathode cover is between this hanger and this galvanic anode, and this auxiliary cathode cover comprises at least one cover body, this at least one cover body and this at least one circuit card over against; This at least one cover body comprises surrounding zone and central section; A plurality of conductive clip points of this surrounding zone and this hanger are relative, and the surrounding zone of this at least one cover body offers a plurality of first through holes, and the bore of these a plurality of first through holes is along with reducing with the increase of central section distance; A plurality of second through holes are offered in this central section, and the ratio that the totalling of the cross-sectional area of these a plurality of second through holes accounts for the cross-sectional area of this central section accounts for the ratio of the cross-sectional area of this surrounding zone greater than the totalling of the cross-sectional area of a plurality of first through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100245202A CN102605397A (en) | 2011-01-20 | 2011-01-20 | Electroplating system and electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100245202A CN102605397A (en) | 2011-01-20 | 2011-01-20 | Electroplating system and electroplating method |
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| CN102605397A true CN102605397A (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100245202A Pending CN102605397A (en) | 2011-01-20 | 2011-01-20 | Electroplating system and electroplating method |
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| CN (1) | CN102605397A (en) |
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| CN103628120A (en) * | 2012-08-27 | 2014-03-12 | 郭明宏 | Electroplating assisting plate, and electroplating apparatus using it |
| CN104988571A (en) * | 2015-06-30 | 2015-10-21 | 苏州华日金菱机械有限公司 | Vertically-vibrating electroplating rack with inclined fixing rods |
| CN105040081A (en) * | 2015-06-30 | 2015-11-11 | 苏州华日金菱机械有限公司 | Use method of electroplating rack with obliquely arranged fixed rods and capable of vibrating up and down |
| CN105040079A (en) * | 2015-06-30 | 2015-11-11 | 苏州华日金菱机械有限公司 | Electroplating rack |
| CN105040082A (en) * | 2015-06-30 | 2015-11-11 | 苏州华日金菱机械有限公司 | Electroplating rack with two rectangular frames |
| CN107761158A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of electroplating device and electro-plating method |
| CN110846698A (en) * | 2018-08-21 | 2020-02-28 | 财团法人工业技术研究院 | Panel to be electroplated, electroplating manufacturing process using same and wafer manufactured by same |
| CN112593276A (en) * | 2020-12-07 | 2021-04-02 | 娄底市安地亚斯电子陶瓷有限公司 | Nickel plating process based on different thicknesses of metal layers at different positions of same ceramic |
| CN113166967A (en) * | 2018-11-22 | 2021-07-23 | A-Plas通用汽车产品工贸股份公司 | Coating rack for obtaining uniform coating |
| CN115233279A (en) * | 2022-09-23 | 2022-10-25 | 晟盈半导体设备(江苏)有限公司 | Integrated wafer electroplating equipment and electroplating method |
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| CN112593276A (en) * | 2020-12-07 | 2021-04-02 | 娄底市安地亚斯电子陶瓷有限公司 | Nickel plating process based on different thicknesses of metal layers at different positions of same ceramic |
| CN115233279A (en) * | 2022-09-23 | 2022-10-25 | 晟盈半导体设备(江苏)有限公司 | Integrated wafer electroplating equipment and electroplating method |
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Application publication date: 20120725 |