CN113166967A - Coating rack for obtaining uniform coating - Google Patents

Coating rack for obtaining uniform coating Download PDF

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Publication number
CN113166967A
CN113166967A CN201980076691.4A CN201980076691A CN113166967A CN 113166967 A CN113166967 A CN 113166967A CN 201980076691 A CN201980076691 A CN 201980076691A CN 113166967 A CN113166967 A CN 113166967A
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CN
China
Prior art keywords
plating
rack
hanger
coated
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980076691.4A
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Chinese (zh)
Inventor
哈桑·阿古路
阿里·阿卡亚
扎希德·欧塔斯·卡普兰
布柯特·吉美姿
叶纳·乌三玛兹
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A Plas
A Plas General Motors Products Industry And Trade Co ltd
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A Plas General Motors Products Industry And Trade Co ltd
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Publication of CN113166967A publication Critical patent/CN113166967A/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to a plating rack (10) that provides a uniform plating by equalizing high and low current regions by varying the distance from the anode to the part connection (17) holding the material (15) to be coated.

Description

Coating rack for obtaining uniform coating
Technical Field
The present invention relates to a plating rack for plating (electro) parts in the electro-plating (Galvano) industry.
In particular, the present invention relates to a plating rack that provides uniform plating at a balance of high and low current regions by varying the distance from the anode to the component connection that holds the component thereon.
Background
The first experiment of electroplating, which we know today, was carried out in 1805 by the well-known italian chemist Luigi brugnalli. He used a recently discovered battery in the gold plating process. This process was developed by John Wright and he used potassium cyanide, a more useful electrolyte for gold and silver plating, while providing good adhesion and plating thickness. Up to the middle of the 19 th century, electrodeposition was the main field of application for polishing of jewelry and decorative items (Endres, MacFarlane and Abbott, 2007).
Boettper performed a first nickel plating with a bath of nickel sulfate and ammonium sulfate. In 1849, nickel plating began to be commercially applied for the first time (Berk, 2004). In parallel with the electrochemical development in the 50's of the 19 th century, the use of metals such as zinc, nickel, tin and brass began to grow in popularity. The development of plating solution chemistry and materials in the early 20 th century indicates the application of components used in the electronics industry. Later, in the war time, the gold plating for electronic parts was also increasing. Low-hazard plating solutions have begun to be used. This trend continues with increased control of environmentally hazardous materials. The development of solution compositions and power source technology has led to a proliferation and rapid development of applications in the field of plating. Research continues on the substitution of metals such as chromium, nickel and cadmium. Corrosion and wear resistant coatings have begun to have an excellent market in the electroplating industry (Endres et al, 2007). Commercially available metals are Cr, Ni, Au, Ag, Zn, Cd, Cu and various alloy (Zn-Ni, Zn-Co, Zn-Fe, etc.) coatings. The production area of the entire electroplating industry is based on aqueous solutions.
The need that has arisen in parallel with the development of plastic technology and the widespread use of plastic materials has led to a metal plating process on plastics. Today, plastic plating is widely used in almost every industry (automobiles, large household appliances, sanitary wares, armatures, cosmetics, textiles, furniture, etc.). Compared to the high cost of competitors, i.e., metals such as zamak zinc-based die cast alloys, yellow castings, and aluminum, plastics are indispensable for plating because they can be easily processed. With the increasing use of plastics in every industry sector, chromium plating on plastics is the forefront. The process of chrome plating on the plastic increases additional visibility of the plated product, but the life of the plating material is one of the main reasons for the plating process.
For these reasons, the design of plating hangers used in chrome plating processes on plastic materials is an important factor in plating uniformity. Electrolytic plating is the process of depositing a metal from a chemical medium onto the surface of a material with the aid of electrical energy. The plating bath is a solution containing dissolved metal salts or compounds. In addition to the conductive dissolved metal salt or compound, there are two electrodes, an anode and a cathode, for conducting electrical energy to the solution. Here, the anode is the coating material, i.e. the wear side, and the electrode is connected to the positive (+) pole of the energy source. On the other hand, the cathode is the coated side, i.e., the coating material, and is connected to the negative (-) pole of the energy source. In the above basic principle of plating, the distance to the anode and the current density are two important variables of plating uniformity. Knowing the current density is very important because it affects the amount and nature of the plating that occurs at the cathode. Important in the plating is the ampere per square decimeter (A/dm) applied2). The amperage divided by the surface area is expressed as the current density. In the plating, the table area was calculated. Provided that the value of the current applied to one of two equal parts having the same surface area is twice that applied to the other, the bimetal is plated on the surface of the part to which a high current value is applied compared to the other.
In this sense, the greatest factor in the appearance of the plating rack according to the invention is the need to provide uniform plating by eliminating the excess current density that forms on the material to be coated. In all R & D studies, the current map was prepared by using an analysis program, and after these programmed experiments and applications, the necessity of redesigning the plating rack emerged.
In the prior art there are known patent applications relating to plating processes and apparatus used in such processes. In particular, patent applications relating to hangers used in the plating process can be cited as proof of the importance of the subject matter. For example, application CN207608651 by the national viai ELECTROPLATING CO LTD discloses the novelty of a plating hanger. In another chinese application (CN207391591), further improvements to plating hangers are described.
The plating hangers used in the art are typically designed in such a way that their parts are equidistant from the anode in a flat frame. Thus, the component in the central region of the pylon is less coated as it remains in the low current region, while the edge region has a greater coating thickness as it remains in the high current region. Also in the art, the current connection points of the pylon cause the parts in the corner/edge regions of the pylon to be coated more, since the current prefers the shortest path in the current distribution. However, since the skeleton of the prior art pylon is designed as a bridge structure, low current regions and high current regions are formed since the current prefers the shortest path.
In the case of an examination of the patent applications and some practices in the prior art given above by way of example only, and of all documents and patent applications, no plating rack for uniform plating of the material to be coated as described in detail below was found.
Objects and brief description of the invention
In order to overcome the drawbacks of the applications of the prior art, it is an object of the present invention to provide a coating hanger for obtaining a uniform coating.
It is another object of the present invention to produce coated parts with a more uniform thickness on the hanger. For this purpose, the design of the pylon connection body (pylon head) is changed in a first stage. In previous designs of pylon connection bodies, the outer frame of the pylon constitutes the high current region and, since the top left component is the first component into which current enters, it is coated much thicker than the other region components. With these changes in the hanger head, significant differences were observed in the coating thickness measurements.
It is another object of the present invention to provide a curved hanger structure to replace the flat hanger application of the prior art. Thickness differences were observed after simulating a flat suspension in a plating analysis program, and two curved surfaces were designed to eliminate these differences. With this design, the part-to-anode distance is changed. In this way, the parts may be coated more evenly than flat hangers.
It is another object of the invention to provide less anode consumption.
It is another object of the present invention to provide energy savings by achieving a desired thickness in a shorter period of time.
In order to achieve the above object, there is provided a plating hanger for ensuring uniform plating of a material to be coated by immersion, and having at least one hanger frame and a hanger main body having a part connector to hold the material to be coated thereon, characterized in that the length of the part connector to which the material to be coated is attached in a low current region of the plating hanger is kept long and thus close to an anode, and the length of the part connector to which the material to be coated is attached in a high current region is kept short and kept away from the anode.
To the accomplishment of all the advantages described above and understood from the following detailed description, the invention, then, provides numerous advantages in view of the features described.
The structural and characteristic features and all the advantages of the present invention will become more apparent from the following drawings and detailed description made with reference to the same, and therefore, the drawings and the detailed description thereof should be evaluated.
Drawings
Figure 1 shows a graphical representation of plating density when using an old hanger head.
Fig. 2 shows the output of a simulation program of plating density when using a hanger head according to the invention.
Fig. 3 shows a perspective view of a plating rack according to the present invention.
Fig. 4 shows a front view of a plating rack according to the invention.
Fig. 5 shows a side view of a plating rack according to the invention.
Reference numerals
10. Plating hanger
11. Hanger main body
12. Hanger frame
13. Bus bar
14. Hanging rack head
14.1 hanger head bus bar connection terminal
14.2 hanger head frame connecting body
14.2.1. Long edge
14.2.2. Short edge
15. Material (part) to be coated
16. Component (material to be coated) connecting terminal
17. Component connector
Direction of current flow of CD
High plating Density
Low plating density LPD
Detailed Description
In this detailed description, all the technical features and structures of a plating hanger (10) developed to ensure the chrome plating of the material (15) to be coated with chrome by immersion in a uniform manner will be explained in detail. Fig. 3, 4 and 5 show views of a plating rack (10) according to the invention.
During the plating process, the material (15) to be coated in the central region of the plating rack (10) is less coated as it remains in the low current region, while the edge regions have a greater plating thickness as it remains in the high current region.
The high and low current zones are balanced by varying the distance from the part connection (17) holding the material (15) to be coated on the coating rack (10) to the anode. Therefore, the distance and angle of the part connection end (17) holding the material (15) to be coated to the hanger main body (11) are changed, thereby changing the distance of the material (15) to be coated to the anode.
In this way, the material (15) to be coated in the low current region of the plating rack (10) is brought closer to the anode, while the material (15) to be coated in the high current region thereof is kept away from the anode, thereby obtaining a more uniform plating. This is achieved by varying the length of the part connection (17). The distance of the component connection terminals (16) to the hanger body (11) is changed, whereby the component connections (17) on the side are chosen shorter and those on the middle component are chosen longer so as to form a convex form. Thus, a uniform plating is obtained by varying the distance of the material to be coated (15) from the anode according to the current density of the material to be coated (15). The views of fig. 3 and 5 show selected lengths of the component connection (17). The uniform plating obtained by the curved (convex) form formed on both surfaces of the plating rack (10) according to the present invention is fixed by all experimental data.
In a preferred embodiment of the invention, the hanger body (11) within the hanger frame (12) on which the material (15) to be coated is hung is monolithic and filled with an electrically conductive plate. Therefore, the current flowing to the material to be coated (15) on the coating rack (10) is uniformly distributed, and the thickness of the coating layer on the material to be coated (15) is uniform.
In the plating rack of the present invention, the design of the rack head (14) providing the current path by attaching the plating rack (10) to the bus bar (13) is different from the prior art application. The results obtained by the hanger head (14) will be more clearly understood by examining the views of fig. 1 and 2. Fig. 1 shows the output of a simulation program of plating density using an old hanger head. Fig. 2 shows the output of a simulation program of plating density using a hanger head (14) in connection with a plating hanger (10) according to the invention. In the previous embodiment shown in fig. 1, the outer frame of the pylon constitutes the high current region, even further since the top left member is the first member into which current enters, it is coated much thicker than the members in the other regions. When using the hanger head (14) of the plating hanger (10) according to the invention (see fig. 2), a more uniform plating is obtained. The rail-head bus bar connection terminal (14.1) is designed in a U-shape and determines the direction of the current flow. Furthermore, the pylon head frame connection body (14.2) has two long edges (14.2.1) extending at an angle towards the upper right and left corners of the pylon frame (12) and a short edge (14.2.2) extending parallel towards the pylon frame (12), such as from the middle of the two long edges (14.2.1) to the other edge (14.2.1), in order to distribute current to the pylon frame (12) with equal density. With this developed form, the material (15) to be coated in the corner/edge region of the pylon is prevented from being subjected to excessive currents, being coated thinly and burnt.
The plating rack (10) according to the invention can have different dimensions in alternative application areas. Therefore, dimensional changes are not emphasized in the description.

Claims (7)

1. A plating hanger (10) for ensuring uniform plating of a material (15) to be coated by immersion, and having at least one hanger frame (12) and a hanger body (11) with a component connection (17) to hold the material (15) to be coated thereon, characterized in that the length of the component connection (17) to which the material (15) to be coated is attached in low current regions of the plating hanger is kept long and thereby close to the anode, and the length of the component connection (17) to which the material (15) to be coated is attached in high current regions is kept short and kept away from the anode.
2. The plating hanger (10) according to claim 1, characterized in that both sides of the plating hanger have a convex form from its edge part towards its middle part.
3. The plating rack (10) according to claim 1, characterized in that the rack body (11) within the rack frame (12) on which the material to be coated (15) is hung is monolithic and filled with an electrically conductive plate.
4. The plating rack (10) according to claim 1, characterized in that it comprises a rack head (14) enabling attachment to a bus bar (13) and determining the direction and density of the current.
5. The plating rack (10) according to claims 1 and 4, characterized in that the rack head (14) comprises at least one rack head bus bar connection terminal (14.1) designed in a U-shape in order to determine the direction of the current flow.
6. The plating rack (10) according to claims 1 and 4, characterized in that the rack head (14) comprises a rack head frame connection body (14.2) for distributing the current on the rack frame (12) with equal density.
7. The plating hanger (10) according to claims 1 and 6, characterized in that the hanger head frame connection body (14.2) has two long edges (14.2.1) extending at an angle towards the upper right and left corners of the hanger frame (12) and a short edge (14.2.2) extending towards the hanger frame (12), such as extending in parallel from the middle of the two long edges (14.2.1) to the other edge (14.2.1), in order to distribute the current to the hanger frame (12) with equal density.
CN201980076691.4A 2018-11-22 2019-10-16 Coating rack for obtaining uniform coating Pending CN113166967A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TR2018/17664 2018-11-22
TR201817664 2018-11-22
PCT/TR2019/050874 WO2020106253A2 (en) 2018-11-22 2019-10-16 A plating hanger for obtaining homogeneous plating

Publications (1)

Publication Number Publication Date
CN113166967A true CN113166967A (en) 2021-07-23

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Application Number Title Priority Date Filing Date
CN201980076691.4A Pending CN113166967A (en) 2018-11-22 2019-10-16 Coating rack for obtaining uniform coating

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Country Link
US (1) US20210371999A1 (en)
EP (1) EP3884084A4 (en)
CN (1) CN113166967A (en)
MX (1) MX2021005524A (en)
WO (1) WO2020106253A2 (en)

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US2129868A (en) * 1936-10-03 1938-09-13 Western Electric Co Article supporting rack for plating
WO1996024707A1 (en) * 1995-02-11 1996-08-15 Atotech Deutschland Gmbh Method and device for galvanizing plate-shaped products in horizontal continuous plants
WO2003014424A1 (en) * 2001-08-10 2003-02-20 Gramm Gmbh & Co. Kg Device and method for galvanic surface treatment of work pieces
WO2007118810A2 (en) * 2006-04-18 2007-10-25 Basf Se Electroplating device and method
US20080277286A1 (en) * 2007-05-11 2008-11-13 Richardson Trevor W Method and apparatus for racking articles for surface treatment
CN201753369U (en) * 2010-03-29 2011-03-02 富葵精密组件(深圳)有限公司 Electroplating device
CN102605397A (en) * 2011-01-20 2012-07-25 富葵精密组件(深圳)有限公司 Electroplating system and electroplating method
CN205443496U (en) * 2015-12-28 2016-08-10 南京萨特科技发展有限公司 Electroplating hanging frame
CN205576338U (en) * 2016-04-19 2016-09-14 扬州虹扬科技发展有限公司 Stores pylon for electroplating
CN205616979U (en) * 2016-04-05 2016-10-05 苏州市美能五金镀饰有限公司 Simple and convenient electroplating rack
CN206927955U (en) * 2017-07-12 2018-01-26 宁波速捷自动化科技有限公司 A kind of hanger
CN207259623U (en) * 2017-08-31 2018-04-20 宣城托新精密科技有限公司 Auto parts and components plating hanging mould

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KR101557050B1 (en) * 2015-03-10 2015-10-06 (주) 메코텍티타늄 Rack for Anodizing Treatment
CN105970267B (en) * 2016-07-18 2017-11-21 浙江富丽华铝业有限公司 A kind of oxidation aluminium hanger
CN207391591U (en) 2017-10-24 2018-05-22 河南森源重工有限公司 A kind of Electropolating hangers
CN207608651U (en) 2017-12-19 2018-07-13 临海市伟星电镀有限公司 Electropolating hangers and plating hook
CN108385152B (en) * 2018-04-04 2020-08-21 北京理工大学珠海学院 Automatic change hanger machine for system lock

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WO1996024707A1 (en) * 1995-02-11 1996-08-15 Atotech Deutschland Gmbh Method and device for galvanizing plate-shaped products in horizontal continuous plants
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CN205443496U (en) * 2015-12-28 2016-08-10 南京萨特科技发展有限公司 Electroplating hanging frame
CN205616979U (en) * 2016-04-05 2016-10-05 苏州市美能五金镀饰有限公司 Simple and convenient electroplating rack
CN205576338U (en) * 2016-04-19 2016-09-14 扬州虹扬科技发展有限公司 Stores pylon for electroplating
CN206927955U (en) * 2017-07-12 2018-01-26 宁波速捷自动化科技有限公司 A kind of hanger
CN207259623U (en) * 2017-08-31 2018-04-20 宣城托新精密科技有限公司 Auto parts and components plating hanging mould

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EP3884084A4 (en) 2022-08-24
MX2021005524A (en) 2021-11-04
US20210371999A1 (en) 2021-12-02
WO2020106253A3 (en) 2020-07-30
EP3884084A2 (en) 2021-09-29
WO2020106253A2 (en) 2020-05-28

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