TW475004B - Stepping electroplating method - Google Patents

Stepping electroplating method Download PDF

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TW475004B
TW475004B TW87102523A TW87102523A TW475004B TW 475004 B TW475004 B TW 475004B TW 87102523 A TW87102523 A TW 87102523A TW 87102523 A TW87102523 A TW 87102523A TW 475004 B TW475004 B TW 475004B
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plating
electroplating
plated
patent application
scope
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TW87102523A
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Chinese (zh)
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Shuei-Wen Jang
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Unimicron Technology Corp
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Abstract

This invention provides a stepping electroplating method which includes a plural number of electroplating tanks with the same electroplating solution and individual anode electrodes. A workpiece connecting to a cathode electrode is immersed into every electroplating tank in sequence so that the electroplating process takes place until the workpiece is completely electroplated.

Description

475004 2527twf.doc./006 A7 B7 i_I_I_ 經濟部中央標準局員工消費合作社印製 發明説明(f ) 本發明是有關於一種電鍍(Electroplating)的方法,且 特別是有關於一種分段式電鍍(Stepping Electroplating)的 方法。 電鍍是指將一金屬以電化學的方法,鍍於另一金屬或非 金屬的表面,其具有保護、美觀、增加表面光亮度、增加 機械強度等功能。 傳統式電鍍法是將欲電鍍之物品置於垂直式電镀槽 中,在所需求之電鍍金屬層的厚度下,調整可變的電鍍時 間,並且配合適當的電流密度(即單位面積所通過的電 流),而置於單一固定之電鍍槽內進行電鍍。 第1圖是繪示傳統式電鎞方法的剖面示意圖。 請參照第1圖,於一盛有電鍍溶液且配置陽極電極102 的電鍍槽1〇〇中,浸入一連接於陰極電極104的電鍍物體 106 (如第1圖中之11〇),調整至一合適的電流密度,且 經一段時間爲t之總電鍍時間後,將完成電鍍之電鍍物體 10 6自電鑛彳谷液取出(第1圖中之111 )’此即完成傳統式 之電鍍的程序。 請參照表一,表一中分別列出以傳統式電鍍方法對一系 列電鑛物體(11〜30)進行電鍍時,電鍍物體表面電鍍金屬 厚度的最大値和最小値,與電鍍厚度之一致性 (Uniformity)的百分比。由表一中的數據可以發現:當電 鍍物體(Π〜30)表面電鑛金屬厚度的最大値和最小値相差 越小時’表不電鑛物體(11〜3 0 )表面電鑛金屬的平整性越 佳,亦即其一致性越好。同樣地,當表一中之一致性的百 3 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 公釐) 475004 A7 2527twf.doc./006 ____ B7 五、發明説明(2) 分比越大時,即表示電鍍物體(11〜30)表面電鍍金屬的平 整性越佳。反之,當電鍍物體(Π〜30)表面電鍍金屬厚度 的最大値和最小値相差越大時,或一致性的百分比越小 時’即表示電鍍物體(11〜30)表面電鍍金屬的平整性越差, 亦即其一致性越不好。 (請先閲讀背面之注意事項再填寫本頁)475004 2527twf.doc./006 A7 B7 i_I_I_ Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economy Printed Invention Description (f) The present invention relates to a method of electroplating, and in particular to a stepping method (Stepping Electroplating). Electroplating refers to the electroplating of one metal on the surface of another metal or non-metal. It has the functions of protection, aesthetics, increasing surface brightness, and increasing mechanical strength. The traditional plating method is to place the item to be plated in a vertical plating bath, adjust the variable plating time under the thickness of the required plating metal layer, and cooperate with the appropriate current density (that is, the unit area passed Current), and placed in a single fixed plating bath for plating. FIG. 1 is a schematic cross-sectional view showing a conventional electric method. Referring to FIG. 1, in a plating bath 100 containing a plating solution and configured with an anode electrode 102, immerse a plating object 106 (such as 11 in FIG. 1) connected to the cathode electrode 104, and adjust it to a Appropriate current density, and after a period of time t of the total plating time, the plated object 10 6 that has been plated is taken out of the electric mine ore grain solution (111 in the first figure). This is the completion of the traditional plating process . Please refer to Table 1. Table 1 lists the maximum thickness and minimum thickness of the plating metal thickness on the surface of the plating object when plating a series of electro-mineral bodies (11 ~ 30) by the traditional plating method, which are consistent with the plating thickness. (Uniformity). According to the data in Table 1, it can be found that the smaller the difference between the maximum and minimum thicknesses of the thickness of the electro-deposited metal on the surface of the electroplated object (Π ~ 30) is, the smaller the surface area of the electro-deposited metal (11 ~ 30) is. The better, the better the consistency. In the same way, when the consistency of the three hundred in table one (please read the notes on the back before filling this page) This paper size applies the Chinese National Standard (CNS) A4 specification (210X mm) 475004 A7 2527twf.doc./ 006 ____ B7 V. Description of the invention (2) The larger the ratio, the better the flatness of the plated metal on the surface of the plated object (11 ~ 30). Conversely, when the difference between the maximum and minimum thicknesses of the thickness of the plated metal on the surface of the plated object (Π ~ 30) is larger, or the smaller the percentage of consistency is, it means that the flatness of the plated metal on the surface of the plated object (11 ~ 30) is worse. That is, the less consistent it is. (Please read the notes on the back before filling this page)

、1T #1. 經濟部中央標準局員工消費合作社印製 4 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) 475004 五、發明説明(3) 表一 經濟部中央標準局員工消費合作社印製 電鍍物體編號 厚度最大値 厚度最小値 一致性(%) 11 1.44 1.03 0.643 12 1.38 1.04 0.714 13 1.51 1.16 0.735 14 1.53 1.14 0.709 15 1.43 1.01 0.653 16 1.61 0.93 0.447 17 1.42 0.97 0.622 18 1.6 1.02 0.532 19 1.4 0.87 0.537 10 1.4 1.15 0.82 21 1.37 1.03 0.719 22 1.45 1.05 0.685 23 1.3 1.05 0.795 24 1.5 1.12 0.68 25 1.3 0.93 0.673 26 1.5 1.1 0.667 27 1.48 0.91 0.537 28 1.7 0.93 0.419 29 1.35 0.81 0.509 30 1.42 1 0.638 (請先閱讀背面之注意事項再填寫本頁) 、11 5 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 475004 A7 B7 2527twf.doc./006 五、發明説明(苹) 此外,由表一中之一致性的百分比之總和,可以算出其 一致性的百分比之平均値約爲0.637。 如上所述,傳統式電鍍法所得之電鍍物體,其電鑛後所 得之品質特性不理想,亦即其電鍍表面之電鍍金屬厚度的 一致性不佳,故以傳統式電鍍法進行電鍍後所得之電鍍物 體的表面,通常無法獲得較佳平整性之電鍍厚度,所以無 法滿足嚴格之厚度均勻性的要求。 有鑑於此,本發明的主要目的就是在提供一種分段式電 鍍的方法,藉由將傳統式單一固定之電鍍槽中進行電鍍, 改爲在相同時間內,於多個相同電鍍槽中進行電鍍,進而 提高電鍍表面之電鍍金屬厚度的一致性。 根據本發明的主要目的,提出一種分段式電鍍的方法, 包括:提供數個裝有相同電鍍液,且均配置一陽極電極的 電鍍槽。其次,將一連接於陰極電極的電鍍物體,依序浸 入於每一個電鍍槽中,以進行電鍍,直至電鍍物體完成電 鍍爲止 爲讓本發明之上述和其他目的、特徵、和優點能更明顯 易懂,下文特舉一較佳實施例,並配合所附圖式,作詳細 說明如下: 圖式之簡單說明: 第1圖係繪示傳統式電鍍方法的剖面示意圖;以及 第2圖係繪示根據本發明之一較佳實施例,一種分段式 電鍍的方法的剖面示意圖。 圖式之標記說明: 6 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 衣 訂 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 經濟部中央標準局員工消費合作社印製 475004 2527twf.doc./006 β? 五、發明説明(Γ ) 100, 200 電鍍槽 102, 202 陽極電極 104, 204 陰極電極 106, 206 電鍍物體 110,210 浸入 111, 211 取出 實施例 第2圖係繪示根據本發明之一較佳實施例,一種分段式 電鍍的方法的剖面示意圖。 請參照第2圖,於一系列均盛有相同電鍍溶液,且均配 置陽極電極202的n個電鍍槽200中(其中n爲大於1的 正整數),將一連接於陰極電極204的電鍍物體206浸入 於第一個電鍍槽200(1)中(如第2圖中之210),調整至一 合適的電流密度,且經一段時間爲t/n (t爲總電鍍時間) 之電鍍時間後,接著將電鍍物體206自第一個電鍍槽200(1) 中取出,並且再浸入於第二個電鍍槽200(2)中,調整至一 合適的電流密度(與第一個電鍍槽之電流密度相等),且 經一段時間同樣爲爲t/n之電鍍時間後,再將電鍍物體206 自第二個電鍍槽200(2)中取出,並且再浸入於第三個電鍍 槽200(3)中,如此重複進行下去,直至最後一個電鍍槽200(n) 爲止’再將完成電鍍之電鍍物體206自電鍍溶液取出(如 第2圖中之211),此即完成本發明之分段式電鍍的程序。 請參照表二,表二中分別列出以本發明實施例之電鍍分 段式方法對一系列電鍍物體(31〜44)進行電鍍時,電鍍物 體表面電鍍金屬厚度的最大値和最小値,與電鍍厚度之一 致性的百分比。 7 本紙張尺ϋ用中國國家標準(CNS ) A4規格(210x7^^--- I-------•衣------1Τ------ (請先閱讀背面之注意事項再填寫本頁) 475004 2527twf.doc./006 五、發明説明(6) A7 B7、 1T # 1. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 4 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 475004 V. Description of the invention (3) Table 1 Staff consumption of the Central Bureau of Standards of the Ministry of Economic Affairs Cooperative printed plated object number thickness maximum thickness minimum thickness consistency (%) 11 1.44 1.03 0.643 12 1.38 1.04 0.714 13 1.51 1.16 0.735 14 1.53 1.14 0.709 15 1.43 1.01 0.653 16 1.61 0.93 0.447 17 1.42 0.97 0.622 18 1.6 1.02 0.532 19 1.4 0.87 0.537 10 1.4 1.15 0.82 21 1.37 1.03 0.719 22 1.45 1.05 0.685 23 1.3 1.05 0.795 24 1.5 1.12 0.68 25 1.3 0.93 0.673 26 1.5 1.1 0.667 27 1.48 0.91 0.537 28 1.7 0.93 0.419 29 1.35 0.81 0.509 30 1.42 1 0.638 (please first Read the notes on the reverse side and fill out this page), 11 5 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 475004 A7 B7 2527twf.doc./006 5. Description of the invention (Apple) In addition, by The sum of the percentages of agreement in Table 1 can be calculated as the average of the percentages of agreement is about 0.637. As mentioned above, the quality characteristics of the electroplated objects obtained by the conventional electroplating method are not ideal, that is, the consistency of the thickness of the electroplated metal on the electroplated surface is not good. The surface of the plated object usually cannot obtain a better plated thickness, so it cannot meet the strict thickness uniformity requirements. In view of this, the main object of the present invention is to provide a method of segmented plating, by performing plating in a traditional single fixed plating bath, instead of performing plating in multiple same plating baths at the same time. , Thereby improving the consistency of the thickness of the plated metal on the plated surface. According to the main purpose of the present invention, a segmented plating method is provided, which includes: providing a plurality of plating tanks equipped with the same plating solution and each configured with an anode electrode. Second, a plating object connected to the cathode electrode is sequentially immersed in each plating bath to perform plating until the plating object completes the plating. In order to make the above and other objects, features, and advantages of the present invention more obvious and easier Understand that a preferred embodiment is described below in detail with the accompanying drawings as follows: Brief description of the drawings: Figure 1 is a schematic cross-sectional view of a conventional electroplating method; and Figure 2 is a schematic view According to a preferred embodiment of the present invention, a schematic cross-sectional view of a segmented plating method. Description of drawing marks: 6 This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm). Clothes Binding (Please read the notes on the back before filling this page). The Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, Printing Economy Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of 475004 2527twf.doc./006 β? V. Description of the invention (Γ) 100, 200 Plating tank 102, 202 Anode electrode 104, 204 Cathode electrode 106, 206 Plating object 110, 210 Immersion 111, 211 Taking out the embodiment, FIG. 2 is a schematic cross-sectional view showing a segmented plating method according to a preferred embodiment of the present invention. Referring to FIG. 2, in a series of n electroplating tanks 200 each containing the same electroplating solution and configured with the anode electrode 202 (where n is a positive integer greater than 1), an electroplating object connected to the cathode electrode 204 206 is immersed in the first plating tank 200 (1) (such as 210 in the second figure), adjusted to a suitable current density, and after a period of time t / n (t is the total plating time) plating time Then, take the plating object 206 out of the first plating tank 200 (1), and then immerse it in the second plating tank 200 (2) to adjust to a suitable current density (the current of the first plating tank Density), and after a period of time that is also t / n, the plating object 206 is removed from the second plating tank 200 (2), and then immersed in the third plating tank 200 (3) In this way, the process is repeated until the last electroplating tank 200 (n). Then, the electroplated object 206 is removed from the electroplating solution (such as 211 in FIG. 2), and the segmented electroplating of the present invention is completed. program of. Please refer to Table 2. Table 2 lists the maximum thickness and minimum thickness of the plating metal thickness on the surface of the plated object when a series of plated objects (31 to 44) are plated by the plating segmented method according to the embodiment of the present invention. The percentage of plating thickness consistency. 7 This paper size is in accordance with Chinese National Standard (CNS) A4 (210x7 ^^ --- I ------- • clothing ------ 1T ------ (Please read the Note for this page, please fill in this page) 475004 2527twf.doc./006 V. Description of the invention (6) A7 B7

電鑛物體編號 厚度最大値 厚度最小値 一致性(%) 31 1.4 1.12 0.78 32 1.37 1.1 0.782 33 1.38 1.31 0.948 34 1.36 1.25 0.915 35 1.43 1.21 0.835 36 1.35 1.29 0.954 37 1.44 1.29 0.89 38 1.43 1.3 0.904 39 1.44 1.29 0.89 40 1.43 1.28 0.89 41 1.45 1.34 0.92 42 1.42 1.28 0.896 43 1.51 1.29 0.839 44 1.53 1.22 0.77 (請先閱讀背面之注意事項再填寫本頁} 經濟部中央標準局員工消費合作社印製 由表二中的數據可以發現:當電鎞物體(31〜44)表面 電鍍金屬厚度的最大値和最小値相差越小時,表示電鍍物 體(31〜44)表面電鍍金屬的平整性越佳,亦即其一致性越 好。同樣地,當表二中之一致性的百分比越大時,即表示 電鍍物體(31〜44)表面電鍍金屬的平整性越佳。反之,當 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 475004 A7 B7 2527twf.doc./006 五、發明説明(7) 電鍍物體(31〜44)表面電鍍金屬厚度的最大値和最小値相 差越大時,或一致性的百分比越小時,即表示電鍍物體 (31〜44)表面電鑛金屬的平整性越差,亦即其一致性越不 好。 由表二中之一致性的百分比之總和,可以算出本發明實 施例中分段式電鑛方法一致性的百分比之平均値約爲 0.872,比傳統式電鍍方法一致性的百分比之平均値約爲 0.637要好,故本發明之分段式電鍍方法要比傳統式電鍍方 法優良。 雖然在本發明之較佳實施例是在每一電鍍槽中,以相同 的電流密度進行電鍍,並且經相同之電鍍時間,然而,任 何熟習此方面之技藝者,由上述之較佳實施例可以得知: 每一電鍍槽的電流密度可以相異,且在每一電鍍槽中的電 鍍時間亦可以是不同的,惟總電鍍時間不變。 綜上所述,本發明的特徵在於:本發明在相同之電鍍總 時間內(t),將傳統式單一固定電鍍槽的電鍍方式,改良 爲分段式電鍍的方式,此分段式電鍍方式在各個電鍍槽 中,進行電鍍時間的總和與單一固定電鍍槽的電鍍時間相 同,亦即將電鍍槽當作可變動之操作因素,以同一陰極在 多個相同陽極之垂直式電鍍槽中進行重複且累積的電鍍。 如此一來,除了可以分散在單一固定電鍍槽進行電鍍所累 積之誤差外,還可以在不增加電鍍所需時間的前提下,使 電鍍物體表面電鍍金屬厚度的一致性大爲提高。 因此,本發明所提出之分段式電鑛的方法,可以大大地 9 ^紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐了 丨 衣 訂 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 475004 2527twf.doc./006 A7 B7 五、發明説明(y) 改善傳統式單一固定電鍍槽的電鍍方法中所存在之電鍍金 屬厚度一致性不佳的缺點。 雖然本發明已以一較佳實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍內,當可作各種之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者爲準。 --------衣-- (請先閱讀背面之注意事項再填寫本頁)Electric mineral body number maximum thickness, minimum thickness, consistency (%) 31 1.4 1.12 0.78 32 1.37 1.1 0.782 33 1.38 1.31 0.948 34 1.36 1.25 0.915 35 1.43 1.21 0.835 36 1.35 1.29 0.954 37 1.44 1.29 0.89 38 1.43 1.3 0.904 39 1.44 1.29 0.89 40 1.43 1.28 0.89 41 1.45 1.34 0.92 42 1.42 1.28 0.896 43 1.51 1.29 0.839 44 1.53 1.22 0.77 (Please read the notes on the back before filling out this page} The data from Table 2 is printed by the Employee Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs It can be found that the smaller the difference between the maximum and minimum thicknesses of the plated metal thickness on the surface of the electric object (31 ~ 44), the better the flatness of the plated metal on the surface of the plated object (31 ~ 44), that is, the better the consistency . Similarly, when the percentage of consistency in Table 2 is greater, it means that the flatness of the electroplated metal on the surface of the plated object (31 ~ 44) is better. On the contrary, when this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 475004 A7 B7 2527twf.doc./006 V. Description of the invention (7) The maximum thickness of plated metal on the surface of the plated object (31 ~ 44) The larger the difference from the minimum 値, or the smaller the percentage of consistency, the worse the flatness of the electro-mineral metal on the surface of the plated object (31 ~ 44), that is, the worse the consistency. From Table 2 The percentage of the consistency of the segmented electric ore method in the embodiment of the present invention can be calculated to be about 0.872, which is better than the average of the consistency of the traditional electroplating method to be about 0.637. Therefore, the present invention The segmented plating method is better than the traditional plating method. Although in the preferred embodiment of the present invention, the plating is performed at the same current density and the same plating time in each plating bath, however, any familiarity Those skilled in the art can know from the above-mentioned preferred embodiments that the current density of each plating bath can be different, and the plating time in each plating bath can be different, but the total plating time is unchanged. In summary, the present invention is characterized in that: in the same total plating time (t), the present invention improves the traditional single fixed plating bath to a segmented type In this segmented plating method, the sum of the plating time in each plating tank is the same as the plating time of a single fixed plating tank, that is, the plating tank is regarded as a variable operating factor, and the same cathode is used in multiple identical anodes. Repeated and accumulated plating was performed in a vertical plating bath. In this way, in addition to being able to disperse the accumulated errors of plating in a single fixed plating bath, the uniformity of the thickness of the plated metal on the surface of the plated object can be greatly improved without increasing the time required for plating. Therefore, the method of segmented electric ore proposed by the present invention can greatly adapt to 9 ^ paper size applicable to China National Standard (CNS) A4 specifications (210X297 mm) 丨 clothing order (please read the precautions on the back before filling in this Page) Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 475004 2527twf.doc./006 A7 B7 V. Description of the invention (y) Improving the consistency of the thickness of the plated metal in the traditional single fixed plating bath plating method Disadvantages. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application. -------- Clothing-(Please read the precautions on the back before filling this page)

、1T #1 經濟部中央標準局員工消費合作社印製 10 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐)、 1T # 1 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs. 10 This paper size applies to China National Standard (CNS) A4 specifications (210 × 297 mm).

Claims (1)

475004 1 2527twfdoc./006 A8 B8 C8 D8 六、申請專利範圍 1. 一種分段式電鍍的方法,包括下列步驟= (請先閱讀背面之注意事項再填寫本頁) 提供複數個電鍍槽,該些電鍍槽內裝有相同之電鍍液, 並且均配置一陽極電極; 將一電鍍物體與一陰極電極作電性連接;以及 將該電鍍物體依序地浸入每一該些電鍍槽中以進行電 鍍,直至該電鍍物體完成電鍍。 2. 如申請專利範圍第1項所述之方法,其中該些電鍍槽 在進行電鍍時之電流密度相等。 3. 如申請專利範圍第1項所述之方法,其中該電鍍物體 在每一該些電鍍槽之中,進行電鍍所經過之電鍍時間均相 等。 4. 如申請專利範圍第1項所述之方法,其中該些電鍍槽 在進行電鍍時之電流密度不相等。 5. 如申請專利範圍第1項所述之方法,其中該電鍍物體 在每一該些電鍍槽之中,進行電鍍所經過之電鍍時間不相 等。 經濟部中央標準局員工消費合作社印製 11 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)475004 1 2527twfdoc./006 A8 B8 C8 D8 6. Scope of patent application 1. A method of segmented plating, including the following steps = (Please read the precautions on the back before filling this page) Provide a number of plating tanks, these The same electroplating bath is installed in the electroplating bath, and all are provided with an anode electrode; an electroplating object is electrically connected with a cathode electrode; and the electroplating object is sequentially immersed in each of the electroplating baths for electroplating, Until the plated object is plated. 2. The method according to item 1 of the scope of patent application, wherein the current densities of the electroplating baths during the electroplating are equal. 3. The method as described in item 1 of the scope of the patent application, wherein the plating object has equal plating time in each of the plating baths. 4. The method described in item 1 of the scope of patent application, wherein the current densities of the plating baths during plating are not equal. 5. The method as described in item 1 of the scope of patent application, wherein the plating objects in each of the plating baths have different plating time. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 11 This paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm)
TW87102523A 1998-02-23 1998-02-23 Stepping electroplating method TW475004B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102605397A (en) * 2011-01-20 2012-07-25 富葵精密组件(深圳)有限公司 Electroplating system and electroplating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102605397A (en) * 2011-01-20 2012-07-25 富葵精密组件(深圳)有限公司 Electroplating system and electroplating method

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