CN201924097U - Electroplating device - Google Patents
Electroplating device Download PDFInfo
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- CN201924097U CN201924097U CN2010206970085U CN201020697008U CN201924097U CN 201924097 U CN201924097 U CN 201924097U CN 2010206970085 U CN2010206970085 U CN 2010206970085U CN 201020697008 U CN201020697008 U CN 201020697008U CN 201924097 U CN201924097 U CN 201924097U
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Abstract
The utility model discloses an electroplating device, which relates to the technical field of electroplating. The technical problem that the yield rate of products is lower as the thickness difference of a coating electroplated by using the existing electroplating method in different areas is large is solved. The electroplating device comprises a power supply, a container, a metal ion source article, an article to be plated and an electric-power line adjusting device; an electroplating solution is stored in the container; the metal ion source article as an anode is soaked in the electroplating solution; the article to be plated as a cathode is soaked in the electroplating solution; metal ions are attached on the article to be plated under the action of an electric-power line between the metal ion source article and the article to be plated and form a coating; and the electric-power line adjusting device is used for adjusting the distribution of the electric-power line from the metal ion source article to the article to be plated. The electroplating device is applied to the electroplating of the coating.
Description
Technical field
The utility model relates to the electroplating technology field, is specifically related to a kind of electroplanting device.
Background technology
(English is: Electroplating) being exactly to utilize electrolysis principle to plate the process of other metal or alloy of skim on some metallic surface, is to utilize electrolytic action to make the technology of the surface attachment layer of metal film of metal or other material product in plating.
At present, electro-plating method mainly contains gantry according to the difference of its processing step and processing units and electroplates, vertically electroplates and level is electroplated three kinds, wherein, electroplate at gantry is a kind of comparatively traditional plating mode, has advantage with low cost, so use comparatively extensively, for example: in circuit card manufacturing field, widely-used gantry is electroplated and is carried out graphic plating.
As shown in Figure 1, existing application gantry electro-plating method carries out the electroplanting device of graphic plating, and comprise power Vcc, deposit copper cylinder 40, the titanium basket 8 of electroplate liquid and the anode baffle 6 that offers window 61, wherein:
Copper ball 11 is electrically connected with the positive pole of power Vcc, and circuit card 20 is connected with the negative electricity of power Vcc;
Pass window 61 on the anode baffle 6 at copper ball 11 to power line 3 between the copper layer of circuit card 20;
The cupric ion that the ionization of copper ball 11 and electroplate liquid goes out is attached on the circuit card 20 to the effect of power line 3 between the copper layer of circuit card 20 and forms the coating of copper product at copper ball 11.
In the prior art, adopt copper ball 11 as anode, copper ball 11 can be dissolved in the electroplate liquid in electroplating process and produce cupric ion, in the copper ball 11 dissolved processes, the anodic surface-area also is in the variation always, and the surface-area of negative electrode also can change in electroplating process, but the amplitude that the surface-area of negative electrode changes is very little, usually can ignore, and the anodic surface-area changes greatly, thus usually in the electroplating process ratio of negative electrode and anodic surface-area can change always.
The inventor finds that there is following problem at least in prior art in realizing process of the present utility model:
Because when the ratio of negative electrode and anodic surface-area changes in the electroplating process, to be copper ball 11 also can change to the density of power line 3 between the copper layer of circuit card 20 anode to as shown in Figure 1 the density of power line 3 between the negative electrode, simultaneously, because the cupric ion that the ionization of copper ball 11 and electroplate liquid goes out is to be attached to the effect of power line 3 between the copper layer of circuit card 20 on the copper layer of circuit card 20 and to form the coating of copper product at copper ball 11, so copper ball 11 is big more to the density of power line 3 between a certain zone of copper layer of circuit card 20, the thickness of this zone coating also can be thick more, when the surface-area of negative electrode is excessive with respect to the anodic surface-area is that the ratio of negative electrode and anodic surface-area is when big, too much power line 3 accumulates in the border area of negative electrode, and (this situation is commonly referred to: fringing effect), the thickness of border area that causes negative electrode (circuit card 20) is much larger than the central region of negative electrode, and the thickness difference of circuit card coating on different zones is when big, can have a strong impact on circuit card 20 follow-up processing and use, so thickness evenness is the especially important indicator of graphic plating of coating, thickness of coating homogeneity missionary society directly causes the product good article rate lower.
The utility model content
The utility model embodiment provides a kind of electroplanting device, and having solved the existing plating method, to electroplate the thickness difference of coating on different zones that forms bigger, causes the lower technical problem of product good article rate.
For achieving the above object, embodiment of the present utility model adopts following technical scheme:
This electroplanting device comprises:
Power supply;
Deposit the container of electroplate liquid;
As anodic metal ion source object, it is soaked in the described electroplate liquid and with the positive pole of described power supply and is electrically connected;
As the object to be plated of negative electrode, it is soaked in the described electroplate liquid and with the negative electricity of described power supply and is connected; Wherein, metal ion is attached on the described object to be plated under the effect of the power line of described metal ion source object between the described object to be plated and forms coating;
The power line setting device is used to adjust the distribution of described metal ion source object to the power line of described object to be plated.
Compared with prior art, the utility model provides and has following advantage in the technique scheme at least:
Because among the utility model embodiment, the power line setting device can be adjusted the distribution density of metal ion source object to the power line between the object to be plated, make the metal ion source object more even to the distribution density of the power line between the object to be plated, when the metal ion source object is even to the electric force lines distribution density between the object to be plated, power line is to be gathered in edge that object to be plated is a negative electrode or elsewhere, so no matter how to change as anodic metal ion source object and as the surface-area of the object to be plated of negative electrode, the number of the metal ion on the surperficial different zones that is attached to object to be plated under the effect of metal ion source object power line between the object to be plated also is identical or essentially identical, so the thickness of formed coating also is identical or essentially identical on the surperficial different zones that is attached to object to be plated under the effect of metal ion source object power line between the object to be plated, to electroplate the thickness difference of coating on different zones that forms bigger so solved the existing plating method, causes the lower technical problem of product good article rate.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the synoptic diagram of the working process of the existing plating device of application traditional electrical electroplating method;
The synoptic diagram of the electroplanting device of the electro-plating method using embodiment of the present utility model and provide is provided Fig. 2;
The synoptic diagram of the annexation between support and conductor adapting piece, object to be plated and the power supply is provided in the electroplanting device of Fig. 3 for the electro-plating method using embodiment of the present utility model and provide;
Fig. 4 is the schematic flow sheet of a kind of embodiment of the electro-plating method that embodiment of the present utility model provided;
Fig. 5 is the schematic flow sheet of another embodiment of the electro-plating method that embodiment of the present utility model provided;
Fig. 6 is the schematic flow sheet of another embodiment of the electro-plating method that embodiment of the present utility model provided;
Fig. 7 is the schematic flow sheet of another embodiment of the electro-plating method that embodiment of the present utility model provided.
Embodiment
The coating uniformity that the utility model embodiment provides a kind of plating to form is good, yield rate is high, and electroplanting device with low cost and electro-plating method.
The electroplanting device that the utility model embodiment provides comprises:
Power supply;
Deposit the container of electroplate liquid;
As anodic metal ion source object, it is soaked in the described electroplate liquid and with the positive pole of described power supply and is electrically connected;
As the object to be plated of negative electrode, it is soaked in the described electroplate liquid and with the negative electricity of described power supply and is connected; Wherein, metal ion is attached on the described object to be plated under the effect of the power line of described metal ion source object between the described object to be plated and forms coating;
The power line setting device is used to adjust the distribution of described metal ion source object to the power line of described object to be plated.
Preferably, in each embodiment of the present utility model, described power line setting device is made by insulating material, and between described metal ion source object and described object to be plated, and offer at least two through holes on it, described metal ion source object is to the described through hole of described power line process between the described object to be plated, and the position of described through hole and/or aperture and/or spacing are adjustable or nonadjustable.
Preferably, in each embodiment of the present utility model, described power line setting device comprises power line adjustment plate.
Preferably, in each embodiment of the present utility model, described power line setting device has at least one following feature:
The material of described power line setting device is PVC, and/or,
The gauge of described power line setting device is between 1～20mm, and/or,
The aperture of described through hole is between 3～10mm, and/or,
Spacing between the adjacent described through hole is between 5～20mm.
Preferably, in each embodiment of the present utility model, described electroplanting device also comprises at least two conductor adapting pieces, and the negative pole of wherein said power supply is electrically connected position with the conductive metal layer of described object to be plated at least two by described conductor adapting piece and is connected.
Preferably, in each embodiment of the present utility model, the electrical connection position of described conductor adapting piece is uniformly distributed in described conductive metal layer along the direction of described object to be plated from the top side to the bottom side or from the left side to the right side;
Preferably, in each embodiment of the present utility model, the electrical connection position of described conductor adapting piece is distributed in the edge of described conductive metal layer.
Preferably, in each embodiment of the present utility model, described conductor adapting piece is the clip that conductor material is made.
Preferably, in each embodiment of the present utility model, described electroplanting device also comprises: anode baffle, and it is between described metal ion source object and described object to be plated, and offering window, the through-hole alignment of described window and described power line setting device also makes described power line pass.
Preferably, in each embodiment of the present utility model, described electroplanting device also comprises: anode baffle, and it is between described metal ion source object and described object to be plated, and offering window, the through-hole alignment of described window and described power line setting device also makes described power line pass.
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skills are obtained under the prerequisite of not paying creative work belongs to the scope that the utility model is protected.
As shown in Figures 2 and 3, the electroplanting device that the utility model embodiment is provided comprises
Power Vcc;
Deposit the container 4 of electroplate liquid;
As anodic metal ion source object 1, it is soaked in the electroplate liquid and with the positive pole of power Vcc and is electrically connected;
As the object to be plated 2 of negative electrode, it is soaked in the electroplate liquid and with the negative electricity of power Vcc and is connected; Wherein, metal ion is attached on the object to be plated to the effect of the power line between the object 2 to be plated and forms coating at metal ion source object 1;
Power line setting device 5 is used to adjust the distribution of metal ion source object 1 to the power line 3 of object 2 to be plated.
Because among the utility model embodiment, power line setting device 5 can be adjusted the distribution density of metal ion source object 1 to the power line 3 between the object 2 to be plated, make metal ion source object 1 more even to the distribution density of the power line 3 between the object 2 to be plated, when metal ion source object 1 is even to power line 3 distribution densities between the object 2 to be plated, power line 3 is edge that can not to be gathered in object 2 to be plated be negative electrode or elsewhere, so no matter how to change as anodic metal ion source object 1 and as the surface-area of the object to be plated 2 of negative electrode, the number that is attached to the metal ion on the surperficial different zones of object 2 to be plated at metal ion source object 1 to the effect of power line 3 between the object 2 to be plated also is identical or essentially identical, so being attached to the thickness of formed coating on the surperficial different zones of object 2 to be plated to the effect of power line 3 between the object 2 to be plated at metal ion source object 1 also is identical or essentially identical, to electroplate the thickness difference of coating on different zones that forms bigger so solved the existing plating method, causes the lower technical problem of product good article rate.
Among the utility model embodiment, power line setting device 5 can be made by insulating material, and between metal ion source object 1 and object to be plated 2, and offer at least two through holes 52 on it, metal ion source object 1 is to the 3 process through holes 52 of the power line between the object 2 to be plated, and preferably the position of through hole 52 and/or aperture and/or spacing are adjustable.
Because power line setting device 5 is made for insulating material, insulating material can stop that power line 3 penetrates, simultaneously, the through hole of being offered on the power line setting device 5 52 can play the effect of dispersion, shunting power line 3, so the power line 3 that penetrates out from through hole 52 for directly from metal ion source object 1 to the power line 3 between the object 2 to be plated, distributes can more even, dispersion.
In each embodiment of the utility model, power line setting device 5 comprises power line adjustment plate 51.
Power line adjust plate 51 not only under the identical situation of employed material active area bigger, the scope of the power line 3 that can regulate is bigger, and is convenient to offer through hole 52.Certainly, power line setting device 5 also can be adjusted the device with power line 3 regulating effects that other insulating material outside the plate 51 are made for power line in the present embodiment, and for example: the power line that offers through hole 52 is adjusted piece, power line is adjusted frame etc.
In each embodiment of the utility model, electroplanting device can also comprise: anode baffle 6, and it and offers window 61 between metal ion source object 1 and object to be plated 2, and window 61 is aimed at the through hole 52 of power line setting device 5 and is made power line 3 pass.
Power line setting device 5 is preferably to run through and is arranged on the window 61; The axial direction due of window 61 and/or through hole 52 is relative with metal ion source object 1 and object to be plated 2 positions respectively.Because metal ion source object 1 to the power line 3 of the overwhelming majority between the object 2 to be plated all can pass through window 61, so power line setting device 5 run through is arranged on the window 61, and window 61 is aimed at the through hole 52 of power line setting device 5 and when making that power line 3 passes, through hole 52 can play the effect of the most power lines 3 of shunting.
In each embodiment of the utility model, the density of each regional power line 3 of process power line setting device 5 is inversely proportional to the distribution density of each the regional through hole 52 on the power line setting device 5 with not adjusting before through power line setting device 5, that is to say, density through each regional power line 3 of power line setting device 5 before adjusting through power line setting device 5 is big more, and number that then should zone through hole 52 is few more.
When through the density of each regional power line 3 of power line setting device 5 when big more, with the distribution density of each the regional through hole 52 on the power line setting device 5 be provided with more little, like this, the number of the power line 3 that each zone finally passes through of on average getting off should be a basically identical, so can make that the distribution of power line 3 is more even.Certainly, the position of through hole 52 and/or aperture and/or spacing all are adjustable among each embodiment of the utility model, not only can use the method for insulating material blocking portion through hole 52 to reduce the number of through hole 52 in the present embodiment, also can adopt the method for changing the different power line setting device 5 of through hole 52 to change the number of through hole 52 on the power line setting device 5.
In each embodiment of the utility model, the material of power line setting device 5 is PVC (Polyvinylchloride, a polyvinyl chloride), and/or, the gauge of power line setting device 5 is between 1～20mm, be preferably 10mm, and/or the aperture of through hole 52 is between 3～10mm, be preferably 6mm, and/or the spacing between the adjacent through hole 52 is 5～20mm, is preferably between the 12mm.The PVC material has lovely luster, corrosion-resistant, firm and durable and chemical property stable properties, so be suitable for being applied in the electroplating process.
When the gauge of power line setting device 5 is between 1～20mm the time, the intensity that not only can guarantee power line setting device 5 can guarantee that also the direction of the power line 3 of process through hole 52 can access certain correction, thereby plays the effect that disperses and proofread and correct power line 3.Facts have proved: the aperture of through hole 52 is between 3～10mm, when the spacing between the adjacent through hole 52 is 5～20mm, and through hole 52 can play preferably the effect that disperses, shunts to power line 3.
As shown in Figure 3, in each embodiment of above-mentioned the utility model, electroplanting device also comprises at least two conductor adapting pieces 7, and the negative pole of power Vcc is electrically connected position with the conductive metal layer of object 2 to be plated at least two by conductor adapting piece 7 and is electrically connected.
The number of conductor adapting piece 7 is many more, and the number that then is electrically connected the position between the conductive metal layer of the negative pole of power Vcc and object 2 to be plated is also many more.The number that is electrically connected the position is many more, and it is more even then to flow on the conductive metal layer of object 2 to be plated the number of the density of electric current everywhere and received power line 3 everywhere from the negative pole of power Vcc, and then the thickness of coating is also more even everywhere.
In each embodiment of the utility model, the electrical connection position of conductor adapting piece 7 is uniformly distributed in conductive metal layer along the direction of object 2 to be plated from the top side to the bottom side or from the left side to the right side; Be preferably: the electrical connection position of conductor adapting piece 7 is uniformly distributed in conductive metal layer along the direction of object 2 to be plated from the top side to the bottom side; Preferably the electrical connection position of conductor adapting piece 7 is distributed in the edge of conductive metal layer.
Because in electroplating process, metal ion source object (for example copper ball) 1 is provided with a plurality of usually as shown in Figure 2, and a plurality of metal ion source object 1 stacks are positioned in the titanium basket, during plating, metal ion source object 1 can be dissolved in electroplate liquid gradually, the volume of metal ion source object 1 also can reduce gradually in the dissolved process, entering metal ion source object 1 its position can descend in the titanium basket gradually, when descending gradually, the position of metal ion source object 1 can cause of the distribution density decline of the metal ion source object 1 on titanium basket top to the power line 3 between the object 2 to be plated, when so the electrical connection position of conductor adapting piece 7 is uniformly distributed in conductive metal layer along the direction of object 2 to be plated from the top side to the bottom side or from the left side to the right side, can be so that the distribution density of the received power line 3 of the direction of conductive metal layer from the top side to the bottom side or from the left side to the right side be more even, so the metal ion source object 1 that can overcome titanium basket top in the electroplating process to a certain extent to the distribution density of the power line 3 between the object 2 to be plated descend and power line 3 distribution densities problem of uneven distribution on the depth direction of electroplate liquid of causing.When the electrical connection position of conductor adapting piece 7 is distributed in the edge of conductive metal layer, can have influence on the circuit card central region and electroplate formation coating.
In addition, as shown in Figure 3, electroplanting device can also comprise the electrical connection framework (or claiming to fly crust) 9 of rectangular frame shape among each embodiment of the utility model, the negative pole of power Vcc be electrically connected framework 9 and be electrically connected, a plurality of conductor adapting pieces 7 are arranged at respectively and are electrically connected on two relative long limits of framework 9 positions, can connect a plurality of circuit cards in the electrical connection framework, at this moment, when the electrical connection position of conductor adapting piece 7 is distributed in the edge of conductive metal layer, especially uniformly be distributed in the top of conductive metal layer and bottom sides along the time, circuit card is convenient to be electrically connected with being electrically connected framework 9, and is connected with the negative electricity of power Vcc by being electrically connected framework 9.
In each embodiment of the utility model, metal ion source object 1 is preferably copper ball as shown in Figure 2, can use the bigger copper ball of diameter dimension to enlarge the anodic surface-area, otherwise, also can use the less copper ball of diameter dimension to reduce the anodic surface-area.
In each embodiment of the utility model, the conductive metal layer that is provided with on relative two the maximum extended planar in position on the circuit card outside surface is an object 2 to be plated, conductive metal layer on two maximum extended planar of circuit card is all relative with container 4 positions of depositing electroplate liquid, and the conductive metal layer on two maximum extended planar of circuit card is provided with power line setting device 5 respectively with between the container of depositing electroplate liquid 4 relative with its position.
This design can utilize the metal ion in the electroplate liquid more fully, simultaneously all electroplating coating on the conductive metal layer on two maximum extended planar of circuit card, so help to improve electroplating efficiency.
For the thickness that guarantees coating each several part zone more consistent, can also certain interval of time in electroplating process, vertically rotate (for example Rotate 180 °) object 2 to be plated, thereby make that each regional thickness of coating is more even on depth direction.
Conductive metal layer is preferably the copper layer in the present embodiment.Copper product has good conductivity, is suitable for as object 2 to be plated.
The clip that conductor adapting piece 7 is made for conductor material in the present embodiment.The clip that conductor material is made can use the mode of clamping to be electrically connected in the mode that contacts with object 2 to be plated, the mode of clamping and the electrical connection that forms is not only easy to connect, simple to operate, and also the reliability that is electrically connected is also relatively good.
As Fig. 2 and shown in Figure 4, the electro-plating method that the utility model embodiment is provided may further comprise the steps:
S1, will be electrically connected in power Vcc anodal metal ion source object 1 and the object to be plated that the is electrically connected to the power Vcc negative pole 2 equal immersion plating liquid as anodic as negative electrode;
S2, adjust of the distribution of metal ion source objects 1, make the metal ion that goes out from 1 ionization of metal ion source object be attached to the conductive metal layer of object 2 to be plated and form coating along power line to the power line 3 of object 2 to be plated by power line setting device 5.
Because the electro-plating method that the utility model embodiment is provided has identical technical characterictic with the electroplanting device that above-mentioned the utility model embodiment is provided, so also can produce identical technique effect, solve identical technical problem, so no longer repeat to set forth herein.
As Fig. 2 and shown in Figure 6, in each embodiment of the utility model, electro-plating method may further comprise the steps:
The position of S20, at least two through holes 52 by changing power line setting device 5 and/or aperture and/or spacing are adjusted the distribution of metal ion source object 1 to the power line of object 2 to be plated.
The position of through hole 52 and/or aperture and/or spacing are not simultaneously on the power line setting device 5, the distribution density of through hole 52 is just inequality, when the density of each regional power line 3 of adjusting plate 51 through power line is big more, power line is adjusted more little that the distribution density of each the regional through hole 52 on the plate 51 is provided with, like this, the number of the power line 3 that each zone finally passes through of on average getting off should be a basically identical, so can make that the distribution of power line 3 is more even.Can use the method for insulating material blocking portion through hole 52 to reduce the distribution density of through hole 52 in a certain zone in the present embodiment, the method that also can change or switch the different power line adjustment plate 51 of through hole 52 distribution densities changes the distribution density of through hole 52 in a certain zone temporarily.
As Fig. 2 and shown in Figure 5, in each embodiment of the utility model, electro-plating method can also may further comprise the steps:
S3, the electric current of the negative pole output of power Vcc is inputed on the conductive metal layer of object 2 to be plated uniformly.
The area of object 2 conducting metal laminar surfaces to be plated is the surface-area of negative electrode, and received power line 3 distribution densities in each zone also are directly related with object 2 each regional size that go up electric current to be plated on the object 2 to be plated, negative electrode is when each regional electric current is even more on the object 2 to be plated, received power line 3 distribution densities are gone up in object to be plated 2 each zone also can be even more, and object 2 each regional received power line 3 distribution density to be plated are even more, the difference of object 2 each regional upward gauge of coating to be plated is also more little, so when the electric current of the negative pole of power Vcc output inputs on the surface of object 2 to be plated uniformly in the present embodiment, can further reduce object to be plated 2 each zone and go up the thickness difference of coating, and then make that the gauge of object 2 each regional upward coating to be plated is more even.
As Fig. 2 and shown in Figure 6, in each embodiment of the utility model, make the electric current of the negative pole output of power Vcc input to method on the conductive metal layer of object 2 to be plated uniformly, may further comprise the steps:
The negative pole of S30, power Vcc is electrically connected the position at least two and is electrically connected with the conductive metal layer of object 2 to be plated.
Electrical connection section bits number between the negative pole of power Vcc and the object to be plated 2 is many more, and distributes when even more, and negative electrode is that each regional electric current is even more on the object 2 to be plated, and then can be so that to go up the gauge of coating more even in object to be plated 2 each zone.
In each embodiment of the utility model, be electrically connected the position is uniformly distributed in object 2 to be plated along the direction of object 2 to be plated from the top side to the bottom side or from the left side to the right side conductive metal layer; Preferably the electrical connection position of conductor adapting piece 7 is distributed in the edge of metal level.
Because in electroplating process, metal ion source object (for example copper ball) 1 is provided with a plurality of usually as shown in Figure 2, and a plurality of metal ion source object 1 stacks are positioned in the titanium basket, during plating, metal ion source object 1 can be dissolved in electroplate liquid gradually, the volume of metal ion source object 1 also can reduce gradually in the dissolved process, entering metal ion source object 1 its position can descend in the titanium basket gradually, when descending gradually, the position of metal ion source object 1 can cause of the distribution density decline of the metal ion source object 1 on titanium basket top to the power line 3 between the object 2 to be plated, when so the electrical connection position of conductor adapting piece 7 is uniformly distributed in conductive metal layer along the direction of object 2 to be plated from the top side to the bottom side or from the left side to the right side, can be so that the distribution density of the received power line 3 of the direction of conductive metal layer from the top side to the bottom side or from the left side to the right side be more even, so the metal ion source object 1 that can overcome titanium basket top in the electroplating process to a certain extent to the distribution density of the power line 3 between the object 2 to be plated descend and power line 3 distribution densities problem of uneven distribution on the depth direction of electroplate liquid of causing.When the electrical connection position of conductor adapting piece 7 is distributed in the edge of conductive metal layer, can have influence on the circuit card central region and electroplate formation coating.
As Fig. 2 and shown in Figure 7, the electro-plating method that present embodiment provided, further comprising the steps of:
S4, the ratio of the area on the surface of the area on object to be plated 2 surfaces and metal ion source object 1 is adjusted to 1: 20～between 2: 3.
Facts have proved: when the ratio of the area on the surface of the area on object to be plated 2 surfaces and metal ion source object 1 is between 1: 20～2: 3 the time, on the one hand, metal ion source object 1 is more even to the distribution density of the power line 3 between the object 2 to be plated, on the other hand, the metal ion that can utilize the metal ion that produced in metal ion source object 1 dissolution process and electroplate liquid internal ionization to go out fully.
In the present embodiment ratio of the area on the surface of the area on object to be plated 2 surfaces and metal ion source object 1 is preferably and is adjusted to 1: 10～between 1: 2.
At this moment, not only metal ion source object 1 is more even to the distribution density of the power line 3 between the object 2 to be plated, and the metal ion that metal ion that is produced in metal ion source object 1 dissolution process and electroplate liquid internal ionization go out also can be plated on more fully on the object 2 to be plated and form coating.
The above; it only is embodiment of the present utility model; but protection domain of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain of claim.
Claims (10)
1. electroplanting device is characterized in that: comprising:
Power supply;
Deposit the container of electroplate liquid;
As anodic metal ion source object, it is soaked in the described electroplate liquid and with the positive pole of described power supply and is electrically connected;
As the object to be plated of negative electrode, it is soaked in the described electroplate liquid and with the negative electricity of described power supply and is connected; Wherein, metal ion is attached on the described object to be plated under the effect of the power line of described metal ion source object between the described object to be plated and forms coating;
The power line setting device is used to adjust the distribution of described metal ion source object to the power line of described object to be plated.
2. electroplanting device according to claim 1, it is characterized in that: described power line setting device is made by insulating material, and between described metal ion source object and described object to be plated, and offer at least two through holes on it, described metal ion source object is to the described through hole of described power line process between the described object to be plated, and the position of described through hole and/or aperture and/or spacing are adjustable or nonadjustable.
3. electroplanting device according to claim 2 is characterized in that: described power line setting device comprises power line adjustment plate.
4. electroplanting device according to claim 2 is characterized in that: described power line setting device has at least one following feature:
The material of described power line setting device is PVC, and/or,
The gauge of described power line setting device is between 1～20mm, and/or,
The aperture of described through hole is between 3～10mm, and/or,
Spacing between the adjacent described through hole is between 5～20mm.
5. according to the arbitrary described electroplanting device of claim 1 to 4, it is characterized in that: described electroplanting device also comprises at least two conductor adapting pieces, and the negative pole of wherein said power supply is electrically connected position with the conductive metal layer of described object to be plated at least two by described conductor adapting piece and is connected.
6. electroplanting device according to claim 5 is characterized in that: the electrical connection position of described conductor adapting piece is uniformly distributed in described conductive metal layer along the direction of described object to be plated from the top side to the bottom side or from the left side to the right side;
7. electroplanting device according to claim 6 is characterized in that: the electrical connection position of described conductor adapting piece is distributed in the edge of described conductive metal layer.
8. according to claim 6 or 7 described electroplanting devices, it is characterized in that: described conductor adapting piece is the clip that conductor material is made.
9. according to the arbitrary described electroplanting device of claim 1 to 4, it is characterized in that: described electroplanting device also comprises: anode baffle, it is between described metal ion source object and described object to be plated, and offering window, the through-hole alignment of described window and described power line setting device also makes described power line pass.
10. electroplanting device according to claim 5, it is characterized in that: described electroplanting device also comprises: anode baffle, it is between described metal ion source object and described object to be plated, and offering window, the through-hole alignment of described window and described power line setting device also makes described power line pass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206970085U CN201924097U (en) | 2010-12-24 | 2010-12-24 | Electroplating device |
Applications Claiming Priority (1)
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534733A (en) * | 2010-12-24 | 2012-07-04 | 北大方正集团有限公司 | Electroplating device and electroplating method |
| CN102808211A (en) * | 2012-03-20 | 2012-12-05 | 昆山元茂电子科技有限公司 | Improved printed circuit board (PCB) electroplating production line |
| CN106304665A (en) * | 2016-08-30 | 2017-01-04 | 江门全合精密电子有限公司 | The manufacture method of 10 ounce's copper printed circuit board (PCB)s |
| CN112888169A (en) * | 2020-12-30 | 2021-06-01 | 深圳市迅捷兴科技股份有限公司 | Current shunting method for pattern electroplating |
-
2010
- 2010-12-24 CN CN2010206970085U patent/CN201924097U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534733A (en) * | 2010-12-24 | 2012-07-04 | 北大方正集团有限公司 | Electroplating device and electroplating method |
| CN102534733B (en) * | 2010-12-24 | 2016-01-06 | 北大方正集团有限公司 | Electroplanting device and electro-plating method |
| CN102808211A (en) * | 2012-03-20 | 2012-12-05 | 昆山元茂电子科技有限公司 | Improved printed circuit board (PCB) electroplating production line |
| CN106304665A (en) * | 2016-08-30 | 2017-01-04 | 江门全合精密电子有限公司 | The manufacture method of 10 ounce's copper printed circuit board (PCB)s |
| CN112888169A (en) * | 2020-12-30 | 2021-06-01 | 深圳市迅捷兴科技股份有限公司 | Current shunting method for pattern electroplating |
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