CN205529104U - Plating device - Google Patents

Plating device Download PDF

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Publication number
CN205529104U
CN205529104U CN201620060661.8U CN201620060661U CN205529104U CN 205529104 U CN205529104 U CN 205529104U CN 201620060661 U CN201620060661 U CN 201620060661U CN 205529104 U CN205529104 U CN 205529104U
Authority
CN
China
Prior art keywords
electroplating bath
plating
anode
graduation mark
daughter board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620060661.8U
Other languages
Chinese (zh)
Inventor
龚亨超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiujiang Kesheng Electronic Technology Co Ltd
Original Assignee
Jiujiang Kesheng Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiujiang Kesheng Electronic Technology Co Ltd filed Critical Jiujiang Kesheng Electronic Technology Co Ltd
Priority to CN201620060661.8U priority Critical patent/CN205529104U/en
Application granted granted Critical
Publication of CN205529104U publication Critical patent/CN205529104U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a plating device, including plating bath, two positive poles, set up the piece that plates between two positive poles, be carved with the scale mark on the top border lateral surface of plating bath, the plating bath inboard of keeping away from the scale mark be equipped with with the corresponding a plurality of adjustment tanks in scale mark position, the horizontal pole has been erect at the middle part at plating bath top, surrounds and establishes in the positive pole outside and both ends card adjust the protection piece of inslot on the plating bath, protection piece and plate and be equipped with insulating baffle between the piece, insulating baffle is formed by connecting a plurality of insulating daughter boards, and the lower half of insulating daughter board is equipped with the through -hole array. The beneficial effect of the utility model: through the adjustment tank can be accurate adjustment positive pole an apart from distance of plating, improve the quality of electroplating, the capable distance of insulating baffle extension electric field wire -wound makes balanced exerting in plating an electric field strength on surface, can effectively improve the degree of consistency of plating a metallic coating, reduces anode material consume, extension anodal life through set up protection piece outside the positive pole.

Description

A kind of electroplanting device
Technical field
This utility model relates to electroplating technology field, it particularly relates to a kind of electroplanting device.
Background technology
Plating refers to use electrolysis unit, utilizes principle of oxidation and reduction that the anode metal ion reduction in the salt electroplate liquid including anode metal becomes metal simple-substance, and makes metal simple-substance be deposited on a kind of method of surface finish of surface of the work to be electroplated formation coating.Described electrolysis unit includes negative electrode that the anode being connected with positive source is connected with power cathode and for containing the electroplating bath of electroplate liquid.Generally, described anode is anode metal rod.Described anode metal rod is immersed in electroplate liquid, is used for the anode metal ion concentration generating in anode metal ion, and supplementary electroplate liquid, thus maintains the anode metal ion concentration in electroplate liquid to be in preset range.
Plating is one of important procedure in the middle of PCB plate manufacturing process, it it is the process being formed coating by electrolytic method at deposited on substrates, generally with coated metal as anode, PCB plate is negative electrode, the two is parallel, be dipped vertically in electroplate liquid and just can complete electroplating process.But in plating is overweight, owing in electric field, field intensity is uneven, the metal layer thickness that PCB margin and center is coated with is not consistent, and the loss of the most existing electroplanting device Anodic is the biggest, and the coating bath that processing uses at present can not accurately regulate control cathode and anode spacing.
For the problem in correlation technique, effective solution is the most not yet proposed.
Utility model content
The purpose of this utility model is to provide a kind of electroplanting device, to overcome currently available technology above shortcomings.
For realizing above-mentioned technical purpose, the technical solution of the utility model is achieved in that
A kind of electroplanting device, including electroplating bath, the electroplate liquid with suitable metal cation conducting power being contained in electroplating bath, immerse that electroplate liquid is parallel is provided with two anodes electrically connected with positive source, the plating piece electrically connected with power cathode it is provided with between said two anode, the top sides of described electroplating bath is carved with graduation mark along lateral surface, graduation mark with in the middle part of electroplating bath as zero point, and increase successively to both sides, away from being provided with the some regulating tanks corresponding with graduation mark position inside the electroplating bath of graduation mark, in addition, the middle part at described electroplating bath top sets up the cross bar for hanging plating piece, it is enclosed in outside anode and guard member that two ends are fastened on described electroplating bath in regulating tank, it is provided with between guard member with plating piece and the insulation barrier that the anode in guard member is paralleled and two ends are fastened on described electroplating bath in regulating tank;Described insulation barrier is insulated by some pieces, and daughter board is the most detachably connected to be formed, and, the lower half of insulation daughter board is provided with via-hole array, and described electroplate liquid liquid level floods the through hole that described insulation daughter board is provided with and the top edge being less than described insulation daughter board.
Further, between a diameter of 5mm to 10mm of described through hole, additionally, the spacing between adjacent through hole is between 25mm to 35mm.
Further, the increment of described graduation mark is 5cm.
Further, described electroplating bath is processed by resistant material.
Further, described electroplating bath top sides is provided with along middle part and sets the card of cross bar for card and set part.
The beneficial effects of the utility model: the anode distance away from plating piece can be adjusted accurately by regulating tank; improve the quality of plating; insulation barrier extends the distance that electric field line detours; balance is made to put on the electric field intensity on plating piece surface; the uniformity of the plating piece coat of metal can be effectively improved; reduce anode material consume by arranging guard member outside anode, extend the service life of anode.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in describing below is only embodiments more of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation according to the electroplanting device described in this utility model embodiment.
In figure:
1, electroplating bath;2, anode;3, plating piece;4, guard member;5, insulation barrier;6, cross bar;7, regulating tank;8, insulation daughter board;9, through hole;10, card sets part.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art are obtained, broadly fall into the scope of this utility model protection.
nullAs shown in Figure 1,According to a kind of electroplanting device described in embodiment of the present utility model,Including electroplating bath 1,The electroplate liquid with suitable metal cation conducting power being contained in electroplating bath 1,Immerse that electroplate liquid is parallel is provided with two anodes electrically connected with positive source 2,The plating piece 3 electrically connected with power cathode it is provided with between said two anode 2,The top sides of described electroplating bath 1 is carved with graduation mark along lateral surface,Graduation mark with in the middle part of electroplating bath 1 as zero point,And increase successively to both sides,Away from being provided with the some regulating tanks 7 corresponding with graduation mark position inside the electroplating bath 1 of graduation mark,In addition,The middle part at described electroplating bath 1 top sets up the cross bar 6 for hanging plating piece 3,It is enclosed in outside anode 2 and guard member 4 that two ends are fastened on described electroplating bath 1 in regulating tank 7,It is provided with between guard member 4 with plating piece 3 and the insulation barrier 5 that the anode 2 in guard member 4 is paralleled and two ends are fastened on described electroplating bath 1 in regulating tank 7;Described insulation barrier 5 is insulated by some pieces, and daughter board 8 is the most detachably connected to be formed, and, the lower half of insulation daughter board 8 is provided with through hole 9 array, and described electroplate liquid liquid level floods the through hole 9 that described insulation daughter board 5 is provided with and the top edge being less than described insulation daughter board 5.
Between a diameter of 5mm to 10mm of described through hole 9, additionally, the spacing between adjacent through hole 9 is between 25mm to 35mm.
The increment of described graduation mark is 5cm.
Described electroplating bath 1 is processed by resistant material.
Described electroplating bath 1 top sides is provided with along middle part and sets the card of cross bar 6 for card and set part 10.
Understand technique scheme of the present utility model for convenience, below by way of in specifically used mode, technique scheme of the present utility model is described in detail.
When specifically used, described guard member 4 and described insulation barrier 5 two ends all can be fastened in described regulating tank 7, adjust the described anode 2 distance away from described plating piece 3 according to graduation mark, make distance rationally, improve the quality of plating;Described insulation barrier 5 extends the distance that electric field line detours, and makes balance put on the electric field intensity on described plating piece 3 surface, it is possible to be effectively improved the uniformity of described plating piece 3 coat of metal;Described guard member 4 is set outside described anode 2 and reduces described anode 2 material deterioration inside, extend the service life of described anode 2.
In sum; by means of technique scheme of the present utility model; the anode 2 distance away from plating piece 3 can be adjusted accurately by regulating tank 7; improve the quality of plating; insulation barrier 5 extends the distance that electric field line detours, and makes balance put on the electric field intensity on plating piece 3 surface, it is possible to be effectively improved the uniformity of plating piece 3 coat of metal; reduce anode 2 material deterioration inside by arranging guard member 4 outside anode 2, extend the service life of anode 2.
The foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model; all within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. made, within should be included in protection domain of the present utility model.

Claims (5)

  1. null1. an electroplanting device,Including electroplating bath (1),It is contained in the electroplate liquid with suitable metal cation conducting power in electroplating bath (1),Immerse that electroplate liquid is parallel is provided with two anodes electrically connected with positive source (2),The plating piece (3) electrically connected with power cathode it is provided with between said two anode (2),It is characterized in that,The top sides of described electroplating bath (1) is carved with graduation mark along lateral surface,Graduation mark is with electroplating bath (1) middle part as zero point,And increase successively to both sides,It is provided with the some regulating tanks (7) corresponding with graduation mark position in electroplating bath (1) inner side away from graduation mark,In addition,The middle part at described electroplating bath (1) top sets up the cross bar (6) for hanging plating piece (3),It is enclosed in anode (2) outside and two ends and is fastened on the guard member (4) in the upper regulating tank (7) of described electroplating bath (1),It is provided with between guard member (4) with plating piece (3) and parallels with the anode (2) in guard member (4) and two ends are fastened on the insulation barrier (5) in the upper regulating tank (7) of described electroplating bath (1);Described insulation barrier (5) is insulated by some pieces, and daughter board (8) is the most detachably connected to be formed, and, the lower half of insulation daughter board (8) is provided with through hole (9) array, and described electroplate liquid liquid level floods the through hole (9) that described insulation daughter board (8) is provided with and the top edge being less than described insulation daughter board (8).
  2. Electroplanting device the most according to claim 1, it is characterised in that between a diameter of 5mm to 10mm of described through hole (9), additionally, the spacing between adjacent through hole (9) is between 25mm to 35mm.
  3. Electroplanting device the most according to claim 1, it is characterised in that the increment of described graduation mark is 5cm.
  4. Electroplanting device the most according to claim 1, it is characterised in that described electroplating bath (1) is processed by resistant material.
  5. Electroplanting device the most according to claim 1, it is characterised in that described electroplating bath (1) top sides is provided with along middle part and sets the card of cross bar (6) for card and set part (10).
CN201620060661.8U 2016-01-22 2016-01-22 Plating device Expired - Fee Related CN205529104U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620060661.8U CN205529104U (en) 2016-01-22 2016-01-22 Plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620060661.8U CN205529104U (en) 2016-01-22 2016-01-22 Plating device

Publications (1)

Publication Number Publication Date
CN205529104U true CN205529104U (en) 2016-08-31

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620060661.8U Expired - Fee Related CN205529104U (en) 2016-01-22 2016-01-22 Plating device

Country Status (1)

Country Link
CN (1) CN205529104U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107190308A (en) * 2017-07-12 2017-09-22 信丰迅捷兴电路科技有限公司 Circuit board electroplating production system
CN113737260A (en) * 2021-09-30 2021-12-03 京东方科技集团股份有限公司 Anode assembly for electrochemical deposition and electrochemical deposition apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107190308A (en) * 2017-07-12 2017-09-22 信丰迅捷兴电路科技有限公司 Circuit board electroplating production system
CN113737260A (en) * 2021-09-30 2021-12-03 京东方科技集团股份有限公司 Anode assembly for electrochemical deposition and electrochemical deposition apparatus

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160831

Termination date: 20180122

CF01 Termination of patent right due to non-payment of annual fee