CN203498498U - PCB (Printed Circuit Board) electroplating device - Google Patents
PCB (Printed Circuit Board) electroplating device Download PDFInfo
- Publication number
- CN203498498U CN203498498U CN201320598639.5U CN201320598639U CN203498498U CN 203498498 U CN203498498 U CN 203498498U CN 201320598639 U CN201320598639 U CN 201320598639U CN 203498498 U CN203498498 U CN 203498498U
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- China
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- pcb
- plating solution
- electroplanting device
- insulation barrier
- anode
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Abstract
The utility model discloses a PCB (Printed Circuit Board) electroplating device which comprises a plating liquor cylinder and at least one anode arranged on the inner face of two opposite sides of the plating liquor cylinder, wherein an insulating baffle parallel to the anodes is arranged inside each anode. According to the PCB electroplating device disclosed by the utility model, the insulating baffle is arranged between the anode and the PCB to prolong the surrounding distance of an electric field line, so that the uniformity of the PCB metal plating layer is effectively improved and the production cost is effectively controlled due to the electric field intensity applied to the surface of the PCB in a balanced manner.
Description
Technical field
The utility model relates to PCB electroplating technology field, is specifically related to a kind of PCB electroplanting device.
Background technology
Plating is that pcb board is manufactured one of central important procedure of process, by the process of electrolysis process formation of deposits coating on base material, conventionally take coated metal as anode, pcb board is negative electrode, the two is parallel, be dipped vertically in electroplate liquid and just can complete electroplating process.But in plating is overweight, because field intensity in electric field is inhomogeneous, the metal layer thickness that PCB margin and center is coated with is also inconsistent.The homogeneity of electroplating for improving PCB, common way installs metal additional at PCB seat right-hand member while being plating accompanies plating plate, to disperse the concentration of metal ions in PCB edge plating solution, thereby makes the thickness of coating of PCB margin and center even.But use metal to accompany plating plate conventionally can attract the metal ion in plating solution, thereby increase the consumption of coated metal, make production cost be difficult to reduce.
Summary of the invention
In view of this, the utility model discloses a kind of electroplanting device that can reduce production costs, improve PCB coating uniformity coefficient.
The purpose of this utility model is achieved through the following technical solutions: a kind of PCB electroplanting device, and comprise plating solution cylinder and be arranged at least one anodes of plating solution cylinder two relative edge's inner faces, the inner side of described each anode is equipped with parallel with it insulation barrier.
Insulation barrier has the effect that intercepts electric field, increases the distance that electric field line detours, and avoiding electroplating is that to put on the strength of electric field at PCB edge too high, thereby improves the uniformity coefficient of PCB coating.In addition, the metal ion in electroplating process in plating solution can't be insulated baffle plate and adsorb, i.e. the use of insulation barrier can't increase the consumption of coated metal, thus effective production control cost.Described insulation barrier can be used arbitrary material to make.
The highest plating solution position of the high plating solution cylinder in described insulation barrier upper end.
Described insulation barrier Lower Half is provided with via-hole array.
Cause is in the bottom of plating solution cylinder, and strength of electric field is conventionally lower, and for balance puts on the strength of electric field on PCB, the utility model spy is provided with via-hole array in the Lower Half of insulation barrier, for electric field and metal ion, passes through.
In described via-hole array, the spacing of each through hole is 5cm.
In described via-hole array, the aperture of through hole is 1-2cm.
Through designer, repeatedly study discovery, when through-hole spacing is 5cm, when aperture is 1-2cm, can make PCB bottom receive enough electric field strengths, and can not make it too higher than the electric field strength that puts on the acceptance of PCB top.
Described insulation barrier is removably formed by connecting side by side by several piece insulation daughter board.
The utility model can be adjusted the quantity of insulation daughter board according to the area of PCB and annode area, and insulation daughter board is spliced into and can just blocks the insulation barrier of anode size.
Described insulation daughter board both sides are provided with the buckle that can be connected with adjacent insulation daughter board.
Described insulation barrier top is provided with the hook that can hang on plating solution cylinder edge.
The described plating solution inside wall of cylinder is provided with the fixedly groove of PCB; Set up for hanging the cross bar of PCB at described plating solution cylinder top.
In actual production, can on cross bar, hang side by side several piece PCB, it is electroplated simultaneously, thereby enhance productivity.
The PCB electroplanting device that the utility model provides, extends by insulation barrier is set between anode and PCB the distance that electric field line detours, and makes balance put on the strength of electric field on PCB surface, can effectively improve uniformity coefficient and the production control cost of PCB metal plating.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of the utility model insulation barrier.
Embodiment
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail:
Embodiment 1
The present embodiment provides a kind of PCB electroplanting device, as depicted in figs. 1 and 2, comprises plating solution cylinder 1 and is separately positioned on an anode 2 of 1 liang of relative edge's inner face of plating solution cylinder, and the inner side of described each anode 2 is equipped with parallel with it insulation barrier 3.Described insulation barrier 3 upper ends are higher than the highest plating solution position of plating solution cylinder 1.Described insulation barrier 3 Lower Halves are provided with through hole 31 arrays.
Described insulation barrier can adopt any insulating material to make.In the present embodiment, select PVC as the material of manufacturing insulation barrier.
In described via-hole array, the spacing of each through hole 31 is 5cm.
In described via-hole array, the aperture of through hole 31 is 1.5cm.
Described insulation barrier is removably formed by connecting side by side by 3 insulation daughter boards 34.
The utility model can be adjusted the quantity of insulation daughter board according to the area of PCB and annode area, and insulation daughter board is spliced into and can just blocks the insulation barrier of anode size.
Described insulation daughter board 34 both sides are provided with the buckle 32 that can be connected with adjacent insulation daughter board.
Described insulation barrier 3 tops are provided with the hook 33 that can hang on plating solution cylinder 1 edge.
The described plating solution inside wall of cylinder is provided with the fixedly groove 5 of PCB; Set up for hanging the cross bar 4 of PCB at described plating solution cylinder top.
In the present embodiment, can on cross bar, hang side by side 3 PCB, it be electroplated simultaneously, thereby enhance productivity.
Embodiment 2
The present embodiment provides a kind of PCB electroplanting device, comprises as shown in Figures 1 and 2 plating solution cylinder 1 and is arranged on an anode 2 of plating solution cylinder 1 limit, two opposite sides inner face, and the inner side of described each anode 1 is equipped with parallel with it insulation barrier 3.The highest plating solution position of the described insulation barrier 3 high plating solution cylinders 1 in upper end.Described insulation barrier Lower Half is provided with through hole 31 arrays.
Described insulation barrier 3 can adopt any insulating material to make.In the present embodiment, select PC as the material of manufacturing insulation barrier.
In described through hole 31 arrays, the spacing of each through hole 31 is 5cm.
In described through hole 31 arrays, the aperture of through hole 31 is 2cm.
Described insulation barrier 3 is removably formed by connecting side by side by 3 insulation daughter boards 34.
The utility model can be adjusted the quantity of insulation daughter board according to the area of PCB and annode area, and insulation daughter board is spliced into and can just blocks the insulation barrier of anode size.
Described insulation daughter board 34 both sides are provided with the buckle 32 that can be connected with adjacent insulation daughter board.
Described insulation barrier top is provided with the hook 33 that can hang on plating solution cylinder edge.
The described plating solution inside wall of cylinder is provided with the fixedly groove 5 of PCB; Set up for hanging the cross bar 4 of PCB at described plating solution cylinder top.
In the present embodiment, can on cross bar, hang side by side 4 PCB, it be electroplated simultaneously, thereby enhance productivity.
Be more than wherein specific implementation of the present utility model, it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these apparent replacement forms all belong to protection domain of the present utility model.
Claims (9)
1. a PCB electroplanting device, comprises plating solution cylinder (1) and is arranged at least one anode (2) of plating solution cylinder (1) two relative edge's inner face, it is characterized in that: the inner side of described anode (2) is equipped with parallel with it insulation barrier (3).
2. PCB electroplanting device according to claim 1, is characterized in that: described insulation barrier (3) Lower Half is provided with through hole (31) array.
3. PCB electroplanting device according to claim 2, is characterized in that: described insulation barrier (3) upper end is higher than the highest plating solution position of plating solution cylinder (1).
4. PCB electroplanting device according to claim 3, is characterized in that: in described via-hole array, the spacing of each through hole (31) is 5cm.
5. PCB electroplanting device according to claim 4, is characterized in that: the aperture of through hole in described via-hole array (31) is 1-2cm.
6. according to the PCB electroplanting device described in claim 1-5 any one, it is characterized in that: described insulation barrier (3) is removably formed by connecting side by side by several piece insulation daughter board (34).
7. PCB electroplanting device according to claim 6, is characterized in that: described insulation daughter board (34) both sides are provided with the buckle (32) that can be connected with adjacent insulation daughter board.
8. PCB electroplanting device according to claim 7, is characterized in that: described insulation barrier (3) top is provided with the hook (33) that can hang on plating solution cylinder (1) edge.
9. PCB electroplanting device according to claim 8, is characterized in that: described plating solution cylinder (1) inwall is provided with the fixedly groove of PCB (5); The cross bar (4) for hanging PCB is set up at described plating solution cylinder top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320598639.5U CN203498498U (en) | 2013-09-27 | 2013-09-27 | PCB (Printed Circuit Board) electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320598639.5U CN203498498U (en) | 2013-09-27 | 2013-09-27 | PCB (Printed Circuit Board) electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203498498U true CN203498498U (en) | 2014-03-26 |
Family
ID=50329493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320598639.5U Expired - Fee Related CN203498498U (en) | 2013-09-27 | 2013-09-27 | PCB (Printed Circuit Board) electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203498498U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105297119A (en) * | 2015-11-30 | 2016-02-03 | 成都市天目电子设备有限公司 | Electroplating production line |
-
2013
- 2013-09-27 CN CN201320598639.5U patent/CN203498498U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105297119A (en) * | 2015-11-30 | 2016-02-03 | 成都市天目电子设备有限公司 | Electroplating production line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140326 Termination date: 20210927 |