CN214529301U - High-quality anode copper electroplating device - Google Patents
High-quality anode copper electroplating device Download PDFInfo
- Publication number
- CN214529301U CN214529301U CN202023220599.XU CN202023220599U CN214529301U CN 214529301 U CN214529301 U CN 214529301U CN 202023220599 U CN202023220599 U CN 202023220599U CN 214529301 U CN214529301 U CN 214529301U
- Authority
- CN
- China
- Prior art keywords
- electroplating
- anode
- positive pole
- copper
- hanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to a high quality positive pole copper electroplating device, including plating bath, electroplating positive pole, power and electroplating hanger the plating bath intussuseption is filled with the plating solution, electroplating positive pole links to each other with the positive pole for electroplating the power of power supply, the negative pole of power with electroplating hanger links to each other, and the copper spare of treating processing is fixed on the electroplating hanger form the electroplating electric field between copper spare and the electroplating positive pole, wherein, electroplating positive pole wholly is convex, and protruding face orientation electroplating hanger. Electroplating anode has adopted the arc structure in this application, has constituted the characteristics that the intermediate distance is short, is drawn far gradually to both sides distance between electroplating anode and the copper spare, so make the global distribution of power line more even, electroplate under this power line distribution as far as possible even electroplating environment, copper spare surface electroplates more unanimously for whole electroplating effect is better.
Description
Technical Field
The utility model relates to the technical field of electroplating processing equipment, in particular to a high-quality anode copper electroplating device.
Background
Circuit boards, wafers, or liquid panels are usually processed by an electrolytic copper plating process to form conductive copper bodies on the surfaces thereof. In the copper electroplating process, inert materials are used for manufacturing anodes, such as iridium-tantalum anodes, titanium-coated copper anodes and the like, and copper oxide powder or other copper salts are dissolved to form electroplating solution as a copper source so as to ensure the quantity of copper ions in the electroplating solution. In the electroplating process, according to the distribution characteristics of the power lines, the edge and tip effects of the electroplating anode cause the power lines between the electroplating anode and the copper piece to be electroplated to be denser at the corners, namely the power lines are not distributed uniformly, so that the electroplating effect on the surface of the copper piece is different.
Therefore, how to adjust the distribution of the power lines to improve the electroplating effect is a technical problem which is urgently needed to be solved at present.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high quality positive pole copper electroplating device, it has improved the distribution of power line, has optimized the electroplating effect.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a high quality positive pole copper electroplating device, including plating bath, electroplating positive pole, power and electroplating hanger the plating bath intussuseption is filled with the plating solution, electroplating positive pole links to each other with the positive pole for the power of electroplating the power supply, the negative pole of power with electroplating hanger links to each other, and the copper spare of treating processing is fixed on the electroplating hanger form the electroplating electric field between copper spare and the electroplating positive pole, wherein, electroplating positive pole wholly is convex, and protruding face orientation electroplating hanger.
For the above technical solution, the applicant has further optimization measures.
Optionally, at least one layer of polyester fiber cloth for separating the electroplating anode from the electroplating hanger is arranged in the electroplating tank and close to the electroplating anode.
Optionally, the distance between the polyester fiber cloth and the electroplating anode is 2-5 mm.
Optionally, the electroplating anode is any one of an iridium tantalum anode, a platinum titanium anode or a titanium-clad copper anode.
Optionally, the copper piece is any one of a circuit board, a wafer, or a glass panel.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model discloses a high quality positive pole copper electroplating device, wherein electroplate the positive pole and adopted the arc structure, constituted the characteristics that the intermediate distance is short, zoom out gradually to the both sides distance between electroplating positive pole and the copper spare, so make the bulk distribution of power line more even, electroplate under this power line distribution electroplating environment as far as possible even, copper spare surface is electroplated more unanimously for whole electroplating effect is better.
Drawings
Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
FIG. 1 is a schematic view showing the overall structure of a high-quality anodic electrolytic copper plating apparatus according to an embodiment of the present invention.
Wherein the reference numerals are as follows:
1. the electroplating device comprises an electroplating bath 2, an electroplating anode 3, a power supply 4, an electroplating hanger 5, a copper piece to be electroplated 6, polyester fiber cloth 7 and a placing rack.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
This embodiment describes a high-quality anodic electrolytic copper plating device, as shown in fig. 1, comprising an electroplating bath 1, an electroplating anode 2, a power supply 3 and an electroplating hanger 4, wherein the electroplating bath 1 is filled with electroplating solution, the electroplating anode 2 is connected with an anode of the power supply 3 for supplying power for electroplating, a cathode of the power supply 3 is connected with the electroplating hanger 4, a copper piece 5 to be processed is fixed on the electroplating hanger 4, and an electroplating electric field is formed between the copper piece 5 and the electroplating anode 2, wherein the electroplating anode 2 is in an arc shape as a whole, and a convex surface faces the electroplating hanger 4. The electroplating anode 2 is any one of an iridium tantalum anode, a platinum titanium anode or a titanium-clad copper anode, and the copper piece 5 is any one of a circuit board, a wafer or a glass panel.
It can be understood that the electroplating anode 2 adopts an arc-shaped structure, and the characteristics of short middle distance and gradual distance extension to both sides are formed between the electroplating anode 2 and the copper part 5, so that the overall distribution of the power line is more uniform, electroplating is carried out in the electroplating environment with the power line distributed as uniform as possible, and the surface electroplating of the copper part 5 is more uniform, so that the overall electroplating effect is better.
At least one layer of polyester fiber cloth 6 for separating the electroplating anode 2 and the electroplating hanger 4 is arranged in the electroplating tank 1 and close to the electroplating anode 2. In the actual production process, a large amount of oxygen radical negative ions are generated near the plating anode 2 due to ionization, and most of the oxygen radical negative ions are separated out as free oxygen. The oxygen radical negative ions and the oxygen gas can oxidize and decompose the brightener, so that the consumption of the brightener is increased. The polyester cloth 6 separates oxygen from the brightener by its own barrier properties, thereby avoiding the above-mentioned problems. On the other hand, the polyester fiber cloth 6 is different from an ion exchange membrane used in the traditional electroplating process, and cannot influence the distribution of electric lines in electroplating solution, so that the uniformity of the thickness of the plating layer of the pre-plated copper part 5 is ensured. Theoretically, the smaller the distance between the polyester fiber cloth 6 and the electroplating anode 2 is, the better the distance is, and the adjustment can be specifically performed according to the actual situation, and because the arc-shaped electroplating anode 2 is adopted in the embodiment, the distance between the polyester fiber cloth 6 and the closest point of the electroplating anode 2 is preferably 2-5 mm.
Certainly, in order to be suitable for the arc-shaped electroplating anode 2, an arc-shaped placing frame 7 is arranged outside the polyester fiber cloth 6, so that the polyester fiber cloth 6 surrounds the electroplating anode 2, the placing frame 7 can be placed in the electroplating bath 1 body in a pulling and inserting mode, the polyester fiber cloth 6 is fixed on the placing frame 7, the placing frame 7 and the electroplating anode 2 are in a suitable arc shape, namely the radius of the placing frame 7 is the same as that of the electroplating anode 2, but the radian of the placing frame 7 is larger than that of the electroplating anode 2, and the polyester fiber cloth 6 is tightened and flattened in the placing frame 7. Through adopting above-mentioned technical scheme to set up, simplified polyester fiber cloth 6's installation flow greatly, and avoided it to take place to fold in the use, the problem of extension face unevenness appears, in addition, can trade new operation fast when it breaks down as the accident takes place.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. The utility model provides a high quality positive pole electro-coppering device, its characterized in that includes plating bath, electroplating positive pole, power and electroplating hanger the plating solution is filled to the plating bath internal packing, electroplating positive pole links to each other with the positive pole for the power of electroplating power supply, the negative pole of power with electroplating hanger links to each other, and the copper spare of treating processing is fixed on the electroplating hanger copper spare and electroplating positive pole between form the electroplating electric field, wherein, electroplating positive pole wholly is convex, and protruding face towards electroplating hanger.
2. A high quality anode copper electroplating apparatus according to claim 1, wherein at least one polyester cloth is provided in the electroplating tank at a position close to the electroplating anode for separating the electroplating anode from the electroplating hanger.
3. The high-quality anodic electrolytic copper plating device according to claim 2, characterized in that the distance between the polyester fiber cloth and the plating anode is 2-5 mm.
4. The high quality anodic electrolytic copper plating apparatus according to any one of claims 1 to 3, characterized in that the plating anode is any one of an iridium tantalum anode, a platinum titanium anode or a titanium clad copper anode.
5. The high quality anodized copper plating apparatus of any one of claims 1 to 3, wherein the copper piece is any one of a circuit board, a wafer, or a glass panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023220599.XU CN214529301U (en) | 2020-12-28 | 2020-12-28 | High-quality anode copper electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023220599.XU CN214529301U (en) | 2020-12-28 | 2020-12-28 | High-quality anode copper electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214529301U true CN214529301U (en) | 2021-10-29 |
Family
ID=78297883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023220599.XU Active CN214529301U (en) | 2020-12-28 | 2020-12-28 | High-quality anode copper electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214529301U (en) |
-
2020
- 2020-12-28 CN CN202023220599.XU patent/CN214529301U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101054701B (en) | Method of increasing electroplating evenness | |
| US4043891A (en) | Electrolytic cell with bipolar electrodes | |
| US8926820B2 (en) | Working electrode design for electrochemical processing of electronic components | |
| TW490510B (en) | Method and apparatus for producing electrolytic copper foil | |
| CN102605414A (en) | Device and method for improving uniformity of plating layer of PCB (printed circuit board) vertical plating line | |
| CN102534733B (en) | Electroplanting device and electro-plating method | |
| KR20150026728A (en) | Electroplating apparatus for manufacturing flexible printed circuit board | |
| CN214529301U (en) | High-quality anode copper electroplating device | |
| JP3352081B2 (en) | Printed circuit board copper plating equipment | |
| WO2015008564A1 (en) | Continuous manufacturing method for electrolytic metal foil and continuous manufacturing device for electrolytic metal foil | |
| JP2016156084A (en) | Electrolytic plating apparatus | |
| JP2510422B2 (en) | Copper plating method for printed circuit boards | |
| CN104404591B (en) | Micro-arc oxidation device for improving film thickness evenness and energy utilizing rate based on separate type compensation cathode | |
| CN205529104U (en) | Plating device | |
| CN101054696B (en) | Electrolyzing machine for manufacturing metal foil capable of reducing transverse deviation of weight | |
| KR100516484B1 (en) | Plating apparatus having a plurality of power supply and plating method using the same | |
| TWM577020U (en) | Insoluble anode electroplating copper equipment | |
| JP2022536258A (en) | Electrode assembly for electrochemical processes | |
| CN214694432U (en) | Anode structure, electrode mechanism and electroplating system | |
| KR100727270B1 (en) | Plating electrode structure for manufacturing printed circuit board and electroplating device thereof | |
| KR20150087502A (en) | Electroplating apparatus and processing method thereof | |
| CN215925131U (en) | Titanium blue and titanium blue assembly for film plating machine and film plating machine | |
| JP2019178351A (en) | Electrolytic tank, electrolytic device, electrolytic method, and metal indium | |
| JP6893849B2 (en) | Plating equipment for printed wiring boards and metal jigs | |
| CN213680938U (en) | Processing device for improving uniformity of electroplating film layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou, Jiangsu 215300 Patentee after: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou, Jiangsu 215300 Patentee before: KUNSHAN CHENGGONG ENVIRONMENTAL PROTECTION TECHNOLOGY CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221129 Address after: No. 323, Jinchuan Road, Nantong Hi tech Industrial Development Zone, Nantong, Jiangsu 226399 Patentee after: Jiangsu Sizhi Semiconductor Technology Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou, Jiangsu 215300 Patentee before: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. |
|
| TR01 | Transfer of patent right |