CN101054701A - Method of increasing electroplating evenness - Google Patents
Method of increasing electroplating evenness Download PDFInfo
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- CN101054701A CN101054701A CN 200710037328 CN200710037328A CN101054701A CN 101054701 A CN101054701 A CN 101054701A CN 200710037328 CN200710037328 CN 200710037328 CN 200710037328 A CN200710037328 A CN 200710037328A CN 101054701 A CN101054701 A CN 101054701A
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- baffle plate
- electronplate
- rib
- coating
- power line
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Abstract
According to the process for improving electroplating homogeneity, the object to be electrically plated is regarded as cathode and put to the plating solution in the electroplating bath, an anode opposing to the cathode is put also into the plating solution in the electroplating bath, a baffle plate having an open window and a baffle side is put between the surface to be electrically plated of the object to be electrically and the anode, wherein the baffle side of the baffle plate is used for blocking-up the electric line of force bypassing the ward plate edges and eliminating the electric plating edge effect to improve the thickness homogeneity of electroplated layers.
Description
Technical field
The present invention relates to a kind of method that improves electroplating evenness, be specially adapted to improve the homogeneity of the galvanization coating thickness of printed circuit board.
Background technology
The homogeneity of plated metal layer thickness is one of Key Performance Indicator of weighing electroplating quality.It is an important indicator that directly influences the subsequent machining technology quality of printed circuit board.Such as for common printed circuit board, have good copper electroplating layer thickness evenness and can access more uniform etching performance.Therefore, help the making of fine-line; And for encapsulating carrier plate, electroplate as final surface-treated nickel metal layer, the electrolytic coating thickness with excellent homogeneity can obtain reliable welding property, also could improve the yield rate of product.
In the prior art, there is several different methods to be used to improve the homogeneity of electrolytic coating thickness.Such as, 1. adopt little electric current electric plating method, be to electroplate the raising that realizes electroplating evenness for a long time by reducing sedimentation rate.But this method has two shortcomings: the one, because electroplating time is longer, coating turns black easily, influences exterior quality; On the other hand, little electric current is electroplated significantly limit production ability, reduces production efficiency.
2. adopt the method for putting baffle plate to improve the homogeneity of electrolytic coating thickness, it need not reduce current density, and therefore, it has overcome the defective of the little electric current electro-plating method of above-mentioned employing, is the method for generally using in the current industrial production.The baffle plate that adopts is to make with insulating material, is placed between the anode and cathode in the interior electroplate liquid of plating tank, by blocking a part of power line in order to reach the uniform distribution of power line, improves the homogeneity of electrolytic coating with this.This baffle plate is near more from negative electrode (by electronplate), and is big more to the electric force lines distribution influence.In using the electroplating process of baffle plate, its coating inhomogeneous is mainly derived from power line by the result who concentrates the fringing effect that is brought at electronplate (printed board) edge.Common baffle plate is usually designed to planar shaped, then according to reality by the area size of electronplate (printed board), hollow out goes out to be slightly less than by the window of electronplate (printed board) area on baffle plate, prolonging power line with this arrives by the distance at electronplate edge, reduction is reached the purpose that weakens fringing effect by the power line intensity at electronplate edge for this reason.
In production application, when adopting the planar shaped baffle plate, thick partially easily by the coating of electronplate (printed board) lower part.Reason is when adopting the planar shaped baffle plate, can be by electronplate (printed board) top near liquid level, and also the height of baffle plate generally surpasses liquid level, therefore, do not have power line to walk around baffle plate top and concentrates on by the top of electronplate; And the bottom of baffle plate is bigger from liquid bottom surface distance, so the base that power line can be walked around baffle plate concentrates on by the bottom of electronplate, thereby makes by the coating of electronplate bottom thick partially.As shown in Figure 1, negative electrode is by electronplate among Fig. 1, is the two sides galvanization coating by electronplate, and two baffle plates are seated in the both sides of negative electrode (by electronplate) respectively, clearly shows the base arrival negative electrode (by electronplate) that power line is walked around baffle plate from Fig. 1.Therefore, thicker by the thickness of coating of electronplate bottom than the thickness of top coating.For improvement, though can be by the lengthening baffle plate avoiding or to reduce the power line of walking around the baffle plate base, behind the baffle plate lengthening to this problem, can increase the difficulty of installing, and when the size of baffle plate increases, the bottom that makes the base of baffle plate run into plating tank easily, will influence (or can't) plating.
Summary of the invention
The objective of the invention is to the defective that exists in the above-mentioned prior art, a kind of method that improves thickness uniformity of electroplated layers is provided, adopt a kind of new shape baffle plate, neither increase the difficulty of operation, can reduce the baffle edge effect effectively again, raising is improved by the performance of electronplate product by the homogeneity of electronplate galvanization coating.
The present invention to achieve the above object, the technical scheme that is adopted is: will be placed electroplate liquid in the plating tank as negative electrode by electronplate, put the anode relative in the electroplate liquid in plating tank with negative electrode, by on the electronplate by surfacing and anode between put one and have the baffle plate of windowing, on the edge of baffle plate, put the rib that connects together with baffle plate, eliminate the power line of walking around baffle edge with rib.
As above-mentioned method of the present invention, had rib by electronplate on the baffle plate before the surfacing because be seated in, this rib has been blocked the power line that can walk around baffle edge, has eliminated the plating fringing effect, makes consistent with the thickness of coating of other parts by the thickness of coating on the surfacing edge.Therefore, improve integral body by the homogeneity of surfacing thickness of coating.Support plate with a 16*20 inch is an example, and the gauge control of electroless nickel layer is at 10 microns, and criterion of acceptability is the 5-15 micron, and the poorest error is no more than 10 microns.As above-mentioned planar shaped baffle plate used in the prior art, after electroplating, the thickness distribution of nickel coating is between the 6-17 micron, and error is 11 microns, has exceeded the limit of error of criterion of acceptability; After adopting the baffle plate that has rib of the inventive method, utilize identical plating condition to electroplate, the thickness distribution of its nickel coating is in the 8-13 micron, and error only is 5 microns, meets qualified standard fully.Obviously, adopt method of the present invention to improve the homogeneity of galvanization coating, improved by the product performance of electronplate and yield rate.
Description of drawings
Fig. 1 is the distribution plan of power line in the prior art plating tank;
Fig. 2 is the distribution plan of power line in the plating tank of the present invention;
Fig. 3 be in the inventive method the shape synoptic diagram of the baffle plate that adopts one embodiment;
Fig. 4 is the sectional view of Fig. 3 A-A face;
Fig. 5 is the shape synoptic diagram that adopts another embodiment of baffle plate in the inventive method;
Fig. 6 is the sectional view of Fig. 5 B-B face.
Embodiment
As shown in Figure 1, 2, in the present embodiment, requirement is two-sided coating by electronplate (printed circuit board), place in the plating tank intermediary electroplate liquid as negative electrode, put two anodes in the electroplate liquid of surfacing with respect to two, put the baffle plate of windowing between two anodes and two are by surfacing respectively, what power line passed that windowing of baffle plate be mapped to negative electrode is formed coating on the surfacing;
Fig. 1 is the trend of power line when formerly technology is electroplated, expose liquid level by demonstrating baffle plate top among Fig. 1 (or Fig. 2), do not have power line and walk around baffle edge and be mapped to problem on the negative electrode, cause by the problem of surfacing top coating thickening yet with regard to not existing because of fringing effect; But on the liquid bottom surface, at this moment, the lower surface that power line is walked around baffle plate is mapped on the bottom of negative electrode in the lower surface of baffle plate, has caused by the thickening of the coating of surfacing bottom, makes that the thickness evenness of coating is relatively poor;
Fig. 2 is the trend of the inventive method power line when electroplating, and the plating condition is described identical with Fig. 1.But the baffle plate that is adopted is equipped with the rib that links together with baffle plate on the base, demonstrates obviously from Fig. 2, does not have power line to walk around under the lower surface of baffle plate, because the rib on the baffle plate base has been blocked power line.Therefore, just do not exist by the coating of surfacing because the ununiformity that fringing effect caused of baffle plate yet.
The baffle plate of windowing that is adopted in the method for the present invention is to put at the baffle plate of windowing to put the rib that connects together with baffle plate on the edge in the electroplate liquid.So, can be to put at baffle plate to put a rib that connects together with baffle plate on the base in the electroplate liquid, shown in Fig. 3,4, the longitudinal cross-section of baffle plate is L-shaped in this embodiment, as shown in Figure 3.
When the width of baffle plate during, in order to eliminate the power line of walking around the baffle plate dual-side, prevent to cause by the thickening of surfacing both sides coating, so that cause the ununiformity of thickness of coating because of the plating fringing effect of baffle plate dual-side less than the width of plating tank.The baffle plate that is adopted puts at baffle plate and puts the rib that connects together with baffle plate on base in the electroplate liquid and the dual-side, and shown in Fig. 5,6, the cross section of baffle plate is Qian shape, as shown in Figure 6.
Because it is the power line of walking around baffle edge in order to block that the present invention adopts the baffle plate that has rib, so the height of rib is as the criterion can block power line.Under the common situation, select rib height can less than, or equal, or greater than by the distance of surfacing to baffle surface.And under the common situation, the angle between selection rib and the baffle plate can be arbitrarily angled between 0 °-180 °.
Claims (4)
1. method that improves electroplating evenness, be to be placed electroplate liquid in the plating tank by electronplate as negative electrode, put the anode relative in the electroplate liquid in plating tank with negative electrode, by on the electronplate by surfacing and anode between put one and have the baffle plate of windowing, it is characterized in that on the edge of baffle plate, putting the rib that connects together with baffle plate, eliminate the power line of walking around baffle edge with rib.
2. the method for raising electroplating evenness according to claim 1 is characterized in that the baffle plate that is adopted is to put at baffle plate to put the rib that connects together with baffle plate on the edge in the electroplate liquid.
3. the method for raising electroplating evenness according to claim 2 is characterized in that the baffle plate that is adopted is to put at baffle plate to put the rib that connects together with baffle plate on the base in the electroplate liquid.
4. the method for raising electroplating evenness according to claim 2 is characterized in that the baffle plate that is adopted is to put at baffle plate to put the rib that connects together with baffle plate on base in the electroplate liquid and the side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100373280A CN101054701B (en) | 2007-02-08 | 2007-02-08 | Method of increasing electroplating evenness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100373280A CN101054701B (en) | 2007-02-08 | 2007-02-08 | Method of increasing electroplating evenness |
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| Publication Number | Publication Date |
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| CN101054701A true CN101054701A (en) | 2007-10-17 |
| CN101054701B CN101054701B (en) | 2010-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007100373280A Active CN101054701B (en) | 2007-02-08 | 2007-02-08 | Method of increasing electroplating evenness |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101275252B (en) * | 2007-12-26 | 2011-02-16 | 梧州三和新材料科技有限公司 | Device for continuous plating and use thereof |
| CN102296336A (en) * | 2011-09-06 | 2011-12-28 | 奥特斯维能源（太仓）有限公司 | Solar cell electroplating equipment capable of improving electroplating uniformity |
| CN102383169A (en) * | 2011-10-31 | 2012-03-21 | 东莞生益电子有限公司 | Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate |
| CN102477576A (en) * | 2010-11-30 | 2012-05-30 | 加贺开发科技有限公司 | Electroplating device and electrode plate structure in electroplating bath thereof |
| CN102605397A (en) * | 2011-01-20 | 2012-07-25 | 富葵精密组件(深圳)有限公司 | Electroplating system and electroplating method |
| CN102828211A (en) * | 2012-08-30 | 2012-12-19 | 东莞市五株电子科技有限公司 | Electroplating method |
| CN103205786A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A cathode baffle plate and a production method thereof, and a mask plate electroforming device |
| CN106011982A (en) * | 2015-03-27 | 2016-10-12 | 南茂科技股份有限公司 | Electrochemical reaction apparatus |
| CN106149033A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
| CN108588800A (en) * | 2007-12-04 | 2018-09-28 | 株式会社荏原制作所 | Electroplanting device and electro-plating method |
| CN109518260A (en) * | 2017-09-18 | 2019-03-26 | 先丰通讯股份有限公司 | Accessory plate and the electroplating system using it is electroplated |
| CN112593267A (en) * | 2020-11-13 | 2021-04-02 | 吴勇军 | Electroplating equipment |
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| CN103215618A (en) * | 2012-01-18 | 2013-07-24 | 昆山允升吉光电科技有限公司 | Method for adjusting shape of open pore of electroformed anode baffle plate |
| CN106341939A (en) * | 2016-08-31 | 2017-01-18 | 景旺电子科技(龙川)有限公司 | Multi-layer line board structure and manufacturing method thereof |
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| JP4368543B2 (en) * | 2001-07-25 | 2009-11-18 | シャープ株式会社 | Plating method and plating apparatus |
| JP4700406B2 (en) * | 2005-05-13 | 2011-06-15 | 日本メクトロン株式会社 | Sheet product plating method |
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- 2007-02-08 CN CN2007100373280A patent/CN101054701B/en active Active
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| CN108588800B (en) * | 2007-12-04 | 2020-07-07 | 株式会社荏原制作所 | Electroplating device and electroplating method |
| CN108588800A (en) * | 2007-12-04 | 2018-09-28 | 株式会社荏原制作所 | Electroplanting device and electro-plating method |
| CN101275252B (en) * | 2007-12-26 | 2011-02-16 | 梧州三和新材料科技有限公司 | Device for continuous plating and use thereof |
| CN102477576A (en) * | 2010-11-30 | 2012-05-30 | 加贺开发科技有限公司 | Electroplating device and electrode plate structure in electroplating bath thereof |
| CN102605397A (en) * | 2011-01-20 | 2012-07-25 | 富葵精密组件(深圳)有限公司 | Electroplating system and electroplating method |
| CN102296336B (en) * | 2011-09-06 | 2014-04-23 | 奥特斯维能源（太仓）有限公司 | Solar cell electroplating equipment capable of improving electroplating uniformity |
| CN102296336A (en) * | 2011-09-06 | 2011-12-28 | 奥特斯维能源（太仓）有限公司 | Solar cell electroplating equipment capable of improving electroplating uniformity |
| CN102383169A (en) * | 2011-10-31 | 2012-03-21 | 东莞生益电子有限公司 | Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate |
| CN103205786A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A cathode baffle plate and a production method thereof, and a mask plate electroforming device |
| CN103205786B (en) * | 2012-01-16 | 2016-01-27 | 昆山允升吉光电科技有限公司 | Cathode baffle and preparation method thereof, mask plate electroforming apparatus |
| CN102828211A (en) * | 2012-08-30 | 2012-12-19 | 东莞市五株电子科技有限公司 | Electroplating method |
| CN102828211B (en) * | 2012-08-30 | 2016-05-04 | 东莞市五株电子科技有限公司 | Electro-plating method |
| CN106011982A (en) * | 2015-03-27 | 2016-10-12 | 南茂科技股份有限公司 | Electrochemical reaction apparatus |
| CN106149033A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of electroplating cell body for strengthening pcb board electroplating evenness |
| CN109518260A (en) * | 2017-09-18 | 2019-03-26 | 先丰通讯股份有限公司 | Accessory plate and the electroplating system using it is electroplated |
| CN112593267A (en) * | 2020-11-13 | 2021-04-02 | 吴勇军 | Electroplating equipment |
| CN112593267B (en) * | 2020-11-13 | 2022-04-29 | 吴勇军 | Electroplating equipment |
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| CN101054701B (en) | 2010-12-08 |
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